CN110744450B - 一种抛光垫的修整器及修整方法 - Google Patents
一种抛光垫的修整器及修整方法 Download PDFInfo
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- CN110744450B CN110744450B CN201911002359.1A CN201911002359A CN110744450B CN 110744450 B CN110744450 B CN 110744450B CN 201911002359 A CN201911002359 A CN 201911002359A CN 110744450 B CN110744450 B CN 110744450B
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- section
- trimming
- dressing
- dresser
- polishing pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911002359.1A CN110744450B (zh) | 2019-10-21 | 2019-10-21 | 一种抛光垫的修整器及修整方法 |
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CN201911002359.1A CN110744450B (zh) | 2019-10-21 | 2019-10-21 | 一种抛光垫的修整器及修整方法 |
Publications (2)
Publication Number | Publication Date |
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CN110744450A CN110744450A (zh) | 2020-02-04 |
CN110744450B true CN110744450B (zh) | 2021-11-26 |
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CN201911002359.1A Active CN110744450B (zh) | 2019-10-21 | 2019-10-21 | 一种抛光垫的修整器及修整方法 |
Country Status (1)
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CN (1) | CN110744450B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114012605B (zh) * | 2022-01-05 | 2022-05-17 | 杭州众硅电子科技有限公司 | 一种抛光垫修整装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690544A (en) * | 1995-03-31 | 1997-11-25 | Nec Corporation | Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad |
JPH11123658A (ja) * | 1997-10-21 | 1999-05-11 | Speedfam Co Ltd | ドレッサ及びドレッシング装置 |
JP2000343406A (ja) * | 1999-06-02 | 2000-12-12 | Sumitomo Metal Ind Ltd | 試料研磨方法及び試料研磨装置 |
CN102814738A (zh) * | 2011-06-08 | 2012-12-12 | 株式会社荏原制作所 | 用于护理研磨垫的方法和设备 |
CN107553262A (zh) * | 2017-09-14 | 2018-01-09 | 嘉善惠龙金属制品有限公司 | 一种紧固件打磨装置 |
CN208514310U (zh) * | 2018-06-04 | 2019-02-19 | 湖南省新化县鑫星电子陶瓷有限责任公司 | 单双面研磨抛光机 |
CN209319540U (zh) * | 2018-11-25 | 2019-08-30 | 醴陵市东方电子有限公司 | 一种电力半导体器件加工用双面研磨机 |
-
2019
- 2019-10-21 CN CN201911002359.1A patent/CN110744450B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690544A (en) * | 1995-03-31 | 1997-11-25 | Nec Corporation | Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad |
JPH11123658A (ja) * | 1997-10-21 | 1999-05-11 | Speedfam Co Ltd | ドレッサ及びドレッシング装置 |
JP2000343406A (ja) * | 1999-06-02 | 2000-12-12 | Sumitomo Metal Ind Ltd | 試料研磨方法及び試料研磨装置 |
CN102814738A (zh) * | 2011-06-08 | 2012-12-12 | 株式会社荏原制作所 | 用于护理研磨垫的方法和设备 |
CN107553262A (zh) * | 2017-09-14 | 2018-01-09 | 嘉善惠龙金属制品有限公司 | 一种紧固件打磨装置 |
CN208514310U (zh) * | 2018-06-04 | 2019-02-19 | 湖南省新化县鑫星电子陶瓷有限责任公司 | 单双面研磨抛光机 |
CN209319540U (zh) * | 2018-11-25 | 2019-08-30 | 醴陵市东方电子有限公司 | 一种电力半导体器件加工用双面研磨机 |
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CN110744450A (zh) | 2020-02-04 |
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Effective date of registration: 20211026 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |