CN110727375A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN110727375A CN110727375A CN201911001052.XA CN201911001052A CN110727375A CN 110727375 A CN110727375 A CN 110727375A CN 201911001052 A CN201911001052 A CN 201911001052A CN 110727375 A CN110727375 A CN 110727375A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000005538 encapsulation Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
- 239000011147 inorganic material Substances 0.000 claims description 8
- 229920000620 organic polymer Polymers 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 269
- 238000005452 bending Methods 0.000 abstract description 25
- 239000011229 interlayer Substances 0.000 abstract description 2
- 229920001621 AMOLED Polymers 0.000 description 13
- 229910004205 SiNX Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
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- 229910052581 Si3N4 Inorganic materials 0.000 description 2
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- 229920002457 flexible plastic Polymers 0.000 description 2
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- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
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- 125000005462 imide group Chemical group 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application relates to a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a display module and a touch module which are arranged in a stacked mode. The touch module comprises a first inorganic layer, a first metal layer, a first organic buffer layer, a second inorganic layer and a second metal layer. The first organic buffer layer is added into the touch module, so that the bending stress resistance of the touch module is further improved. When the display panel is bent, the first organic buffer layer can relieve the interlayer stress between the first inorganic layer and the second inorganic layer, and the touch module is prevented from being broken due to bending stress.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
Active matrix organic light emitting diode or active matrix organic light emitting diode, abbreviated as AMOLED, english: an Active-matrix organic light-emitting diode. The AMOLED has the advantages of low power consumption, low cost and large size, and the display panel of the AMOLED is mainly used for smart phones. With the continuous development of the display screen of the folding mobile phone, the folded AMOLED is one of the main application directions in the future. When fabricating folded AMOLEDs, there can be large bending stresses.
Disclosure of Invention
Accordingly, it is necessary to provide a display panel, a method for manufacturing the same, and a display device, in order to solve the problem that the display panel has a large bending stress.
A display panel, comprising: the display module comprises a substrate, a display module and a touch module which are sequentially stacked;
wherein, touch module includes:
the first inorganic layer is arranged above the display module group far away from the substrate;
the first metal layer is arranged above the first inorganic layer far away from the display module;
the first organic buffer layer covers the exposed upper parts of the first metal layer and the first inorganic layer;
the second inorganic layer is arranged above the first organic buffer layer far away from the first inorganic layer;
and the second metal layer is partially arranged above the second inorganic layer at intervals.
As a preferred embodiment, in an embodiment, a plurality of buffer holes are disposed at intervals in the first organic buffer layer, and the plurality of buffer holes are through holes penetrating through the first organic buffer layer, or the plurality of buffer holes are blind holes disposed in the first organic buffer layer.
As a preferred embodiment, in one embodiment, the plurality of buffer holes are filled with an inorganic material or an organic polymer material.
As a preferred implementation manner, in an embodiment, the touch module further includes:
the second organic buffer layer covers the exposed upper parts of the second metal layer and the second inorganic layer;
preferably, the first organic buffer layer and the second organic buffer layer are organic glue.
As a preferred implementation, in one embodiment, the display module includes:
the driving array is arranged above the substrate;
the light emitting layer is arranged above the driving array far away from the substrate; and
the packaging layer is arranged above the light-emitting layer far away from the driving array;
the display panel further includes: a third organic buffer layer disposed between the encapsulation layer and the first inorganic layer.
In one embodiment, the second metal layer penetrates through the second inorganic layer, the first organic buffer layer, the first inorganic layer and the encapsulation layer, and is electrically connected to the driving array.
A display device, comprising: the display panel of any of the above.
A preparation method of a display panel comprises the following steps:
providing a substrate;
preparing a display module above the substrate;
preparing a first inorganic layer above the display module far away from the substrate;
preparing a first metal layer above the first inorganic layer far away from the display module, wherein the first metal layer comprises a plurality of first metal blocks arranged at intervals;
preparing a first organic buffer layer between the first metal layer and the first inorganic layer, so that the first organic buffer layer covers the exposed upper parts of the first metal block and the first inorganic layer;
preparing a second inorganic layer over the first organic buffer layer, distal from the first inorganic layer;
and forming a second metal layer on the second inorganic layer far away from the first organic buffer layer.
As a preferred embodiment, in an embodiment, the step of preparing the second inorganic layer on the first organic buffer layer far from the first inorganic layer further comprises:
punching the first organic buffer layer to form a plurality of buffer holes arranged at intervals in the first organic buffer layer;
and filling an inorganic material or an organic polymer material into the buffer hole.
As a preferred embodiment, in an embodiment, the step of preparing the display module above the substrate includes:
preparing a driving array above the substrate;
preparing a light emitting layer above the driving array far away from the substrate;
preparing an encapsulation layer above the light emitting layer away from the driving array;
before the step of preparing the first inorganic layer above the display module far away from the substrate, the method further includes:
and preparing a third organic buffer layer above the packaging layer far away from the light-emitting layer, wherein the third organic buffer layer is formed between the packaging layer and the first inorganic layer.
The application provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a display module and a touch module which are arranged in a stacked mode. The touch module comprises a first inorganic layer, a first metal layer, a first organic buffer layer, a second inorganic layer and a second metal layer. The first organic buffer layer is added into the touch module, so that the bending stress resistance of the touch module is further improved. When the display panel is bent, the first organic buffer layer can relieve the interlayer stress between the first inorganic layer and the second inorganic layer, and the touch module is prevented from being broken due to bending stress.
Drawings
Fig. 1 is a structural diagram of a display panel provided in an embodiment of the present application;
FIG. 2 is a block diagram of a display panel provided in an embodiment of the present application;
FIG. 3 is a block diagram of a display panel provided in one embodiment of the present application;
FIG. 4 is a block diagram of a display panel provided in one embodiment of the present application;
fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure.
The reference numbers illustrate:
Drive array 201
Light emitting layer 202
Encapsulation layer 203
Touch control film set 300
First inorganic layer 310
First organic buffer layer 320
Second inorganic layer 330
Second organic buffer layer 340
Third organic buffer layer 360
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Folding is one of the main application directions of the AMOLED in the future, but when the touch module is manufactured by using the inorganic film as the insulating layer, the film is easily broken due to excessive stress of the touch module during bending. Therefore, if the AMOLED is applied to bending in a large scale in the future, it is an improvement to reduce the film stress during bending.
A typical On-Cell TP AMOLED (touch screen display) uses an inorganic film such as SiNxThe insulating layer is used as an insulating layer in a touch module. Thus, thicker SiN can be generated in the touch modulexStacked together. Due to SiNxSelf-stress is greater if SiNxStacking leads to stress increase of the whole touch module, and metal leads are distributed in the SiNxOn the layerIt is also subjected to large stresses.
The inventor researches and discovers that the use of organic materials to replace the existing inorganic film layer is one of the directions for reducing the stress of the film layer. However, in the actual development process, the temperature of the touch process required in the AMOLED manufacturing process is generally less than 85 ℃, and the baking temperature of the organic material is only less than 85 ℃. However, the transparent organic materials cured at low temperature are not mature at present, and the chemical resistance and the bombardment resistance are poor, so that the transparent organic materials cannot be directly applied to replace inorganic film layers. The inventor finds that if the organic material is placed between the two film layers with larger stress, the bending stress applied to the touch module during bending can be reduced, and the touch module is prevented from being broken due to the bending stress.
In view of the above, referring to fig. 1, the present application provides a display panel 10. The display panel 10 has a touch module 300 with strong bending resistance. The display panel 10 of the present application includes: the display module comprises a substrate 100, a display module 200 and a touch module 300 which are sequentially stacked. Specifically, the substrate 100 may be a flexible plastic substrate, a glass substrate, or a quartz substrate, and the specific type of the substrate 100 is not limited in this application, which is determined according to the actual situation.
The touch module 300 includes: a first inorganic layer 310, a first metal layer 350, a first organic buffer layer 320, a second inorganic layer 330, and a second metal layer 370.
The first inorganic layer 310 is disposed above the display module 200 away from the substrate 100. The first inorganic layer 310 may be silicon oxide, silicon nitride, or other inorganic material. The first metal layer 350 is disposed above the first inorganic layer 310 away from the display module 200. The first organic buffer layer 320 covers the exposed upper portions of the first metal layer 350 and the first inorganic layer 310. The second inorganic layer 330 is disposed above the first organic buffer layer 320 far from the first inorganic layer 310. The second metal layer 370 is partially disposed above the second inorganic layer 330 at an interval, wherein a touch capacitor is formed between the first metal layer 350 and the second metal layer 370.
In this embodiment, the first organic buffer layer 320 is added to the touch module 300, so that the bending stress resistance of the touch module 300 is further improved. The first organic buffer layer 320 is disposed between the first inorganic layer 310 and the second inorganic layer 330, and when the display panel 10 is bent, the first organic buffer layer 320 can prevent the touch module 300 from being broken due to bending stress.
Referring to fig. 2 and 3, in one embodiment, a plurality of buffer holes 321 are formed at intervals in the first organic buffer layer 320. The plurality of buffer holes 321 are through holes penetrating the first organic buffer layer 320. Or the plurality of buffer holes 321 are blind holes disposed in the first organic buffer layer 320.
In this embodiment, the plurality of buffer holes 321 disposed in the first organic buffer layer 320 can better release the stress applied to the first organic buffer layer 320. Specifically, the buffer holes 321 are through holes or blind holes, which can be set according to the bending requirement of the display panel 10.
In one embodiment, the plurality of buffer holes 321 are filled with an inorganic material or an organic polymer material. In this embodiment, the buffer hole 321 may be filled with a polyester elastomer. For example, the buffer hole 321 may be filled with polyimide (PI, which is a polymer having an imide group in the main chain), Polydimethylsiloxane (PDMS), or polyethylene terephthalate (PET).
In one embodiment, the touch module 300 further includes a second organic buffer layer 340.
The second organic buffer layer 340 covers the second metal layer 370 and the second inorganic layer 330 on the exposed side. Specifically, the second organic buffer layer 340 may be an organic glue (OC glue). The second organic buffer layer 340 may play a certain role in encapsulation, and may prevent the second metal layer 370 from being corroded.
In one embodiment, the thickness of the first organic buffer layer 320 is not particularly limited. In the stacking direction of the substrate 100, the display module 200, and the touch module 300, the thickness of the first organic buffer layer 320 may be greater than or equal to the thickness of the second organic buffer layer 340. The first organic buffer layer 320 functions as a buffer stress. The second organic buffer layer 340 plays a role of a certain buffer stress while playing a role of encapsulating the second metal layer 370. Since the first organic buffer layer 320 is disposed between the first inorganic layer 310 and the second inorganic layer 330, the first organic buffer layer 320 is thicker, which can perform a better buffering function.
The first organic buffer layer 320 and the second organic buffer layer 340 may be flexible organic. In one embodiment, the first organic buffer layer 320 and the second organic buffer layer 340 are both organic glue. In this embodiment, when the display panel 10 is bent, the organic glue may further reduce the internal stress of the touch film 300, so as to improve the bending resistance of the display panel 10.
The inventors of the present application have also found that the encapsulation layer of an On-Cell TP AMOLED is mostly encapsulated with an inorganic layer such as SiNx. SiN of touch modulexSiN with the encapsulation layerxThey are stacked together. SiN due to encapsulation layerxThe thickness of the material is about 1um, and the stress is large. SiN of touch layerxSiN with the encapsulation layerxThe direct stacking leads to further increase of stress of the entire display panel, and once the display panel is bent, the display panel is easily broken.
Based on the above observation, referring to fig. 4, the inventor proposes that in one embodiment, the display module 200 includes a driving array 201, a light emitting layer 202 and an encapsulation layer 203, which are stacked.
The driving array 201 is disposed above the substrate 100. The light emitting layer 202 is disposed above the driving array 201 away from the substrate 100. The encapsulation layer 203 is disposed above the light emitting layer 202 away from the driving array 201. The encapsulation layer 203 is disposed close to the touch module 300. The array layer 201 is used to generate control logic or driving logic to control the light emitting layer 202 to emit light. The light emitting layer 202 specifically includes an anode, a hole injection layer, a hole transport layer, a light emitting material layer, an electron transport layer, an electron injection layer, and a cathode. The light emitting layer 202 may further include an electron blocking layer and a hole blocking layer respectively disposed on both sides of the light emitting material layer. The encapsulating layer 203 is used for encapsulating the light emitting layer 202 to prevent moisture and the like from invading the light emitting layer 202, which affects the service life of the whole display panel.
The display panel 10 further includes a third organic buffer layer 360. The third organic buffer layer 360 is disposed between the encapsulation layer 203 and the first inorganic layer 310.
In this embodiment, the third organic buffer layer 360 is disposed between the encapsulation layer 203 and the first inorganic layer 310, so as to reduce concentrated stress caused by the encapsulation layer 203 (generally including an inorganic film layer) during bending, prevent the touch module 300 from breaking, and improve the bending performance of the display panel 10. On the other hand, the third organic buffer layer 360 (which may be OC glue) is added between the encapsulation layer 203 and the first inorganic layer 310, so that the distance between the first metal layer 350 and the second metal layer 370 and the cathode of the OLED in the display module 200 can be increased, and the touch capacitive load and the signal interference can be reduced.
In one embodiment, the second metal layer 370 penetrates the second inorganic layer 330, the first organic buffer layer 320, the first inorganic layer 310, and the encapsulation layer 203, and is electrically connected to the driving array 201. In this embodiment, the second metal layer 370 is electrically connected to the driving array 201 for transmitting the touch capacitance between the first metal layer 350 and the second metal layer 370 to the driving array 201.
The first inorganic layer 310 and the second inorganic layer 330 in the present application may be a silicon oxide layer or a silicon nitride layer. The first organic buffer layer 320, the second organic buffer layer 340, and the third organic buffer layer 360 may all be organic glue. The material of the first metal layer 350 and the second metal layer 370 may be metallic silver or Indium Tin Oxide (ITO).
The present application also provides a display device, including: the display panel 10 of any of the above. In the present application, the display device manufactured by using any of the above display panels 10 has a strong bending resistance.
Referring to fig. 5, the present application provides a method for manufacturing a display panel, including the following steps:
the substrate 100 is provided, specifically, the substrate 100 may be a flexible plastic substrate, a glass substrate, or a quartz substrate, and the specific type of the substrate 100 is not limited in this application, which is determined according to the actual situation.
A display module 200 is prepared above the substrate 100. The display module 200 may include a driving array 201, a light emitting layer 202, and an encapsulation layer 203 stacked together.
A first inorganic layer 310 is prepared on the display module 200 away from the substrate 100.
A first metal layer 350 is prepared on the first inorganic layer 310 away from the display module 200, and the first metal layer 350 includes a plurality of first metal blocks arranged at intervals.
A first organic buffer layer 320 is prepared on the first metal layer 350 and the first inorganic layer 310 such that the first organic buffer layer 320 covers the exposed upper portions of the first metal block and the first inorganic layer 310.
A second inorganic layer 330 is prepared over the first organic buffer layer 320, remote from the first inorganic layer 310.
A second metal layer 370 is formed on the second inorganic layer 330 away from the first organic buffer layer 320, and a touch capacitor is formed between the first metal layer 350 and the second metal layer 370.
In this embodiment, the first organic buffer layer 320 is added to the touch module 300, so that the bending stress resistance of the touch module 300 is further improved. The first organic buffer layer 320 is disposed between the first inorganic layer 310 and the second inorganic layer 330, and when the display panel 10 is bent, the first organic buffer layer 320 can prevent the touch module 300 from being broken due to bending stress. In the present application, for example, "the second inorganic layer 330 is formed over the first organic buffer layer 320 away from the first inorganic layer 310" may be understood as "the second inorganic layer 330 is formed directly on the surface of the first organic buffer layer 320 away from the first inorganic layer 310" or "the second inorganic layer 330 is formed over the first organic buffer layer 320 away from the first inorganic layer 310 with a certain layer or layers interposed therebetween".
In one embodiment, the step of preparing the second inorganic layer 330 on the first organic buffer layer 320 far from the first inorganic layer 310 further comprises:
the first organic buffer layer 320 is perforated, and a plurality of buffer holes 321 are formed in the first organic buffer layer 320 at intervals. The buffer hole 321 is filled with an inorganic material or an organic polymer material.
Specifically, a through hole may be opened when the first organic buffer layer 320 is punched, or after a first portion of the first organic buffer layer 320 is deposited, the first organic buffer layer 320 is punched, and then a second portion of the first organic buffer layer 320 is deposited, so as to form a blind hole in the first organic buffer layer 320 and fill a buffer material in the blind hole.
In this embodiment, the plurality of buffer holes 321 disposed in the first organic buffer layer 320 can better release the stress applied to the first organic buffer layer 320. Specifically, the buffer holes 321 are through holes or blind holes, which can be set according to the bending requirement of the display panel 10. The buffer hole 321 may or may not have a filler therein. The buffer hole 321 is filled with an inorganic material or an organic polymer material.
In one embodiment, the step of preparing the display module 200 above the substrate 100 includes: a driving array 201 is prepared above the substrate 100.
A light emitting layer 202 is prepared over the driving array 201 away from the substrate 100.
An encapsulation layer 203 is prepared over the light emitting layer 202 away from the drive array 201.
Before the step of preparing the first inorganic layer 310 on the display module 200 away from the substrate 100, the method further includes:
a third organic buffer layer 360 is prepared above the encapsulation layer 203 away from the light emitting layer 202, the third organic buffer layer 360 being formed between the encapsulation layer 203 and the first inorganic layer 310.
In this embodiment, the third organic buffer layer 360 is disposed between the encapsulation layer 203 and the first inorganic layer 310, so as to reduce concentrated stress caused by the encapsulation layer 203 (generally including an inorganic film layer) during bending, prevent the touch module 300 from breaking, and improve the bending performance of the display panel 10. On the other hand, the third organic buffer layer 360 (which may be OC glue) is added between the encapsulation layer 203 and the first inorganic layer 310, so that the distance between the first metal layer 350 and the second metal layer 370 and the cathode of the OLED in the display module 200 can be increased, and the touch capacitive load and the signal interference can be reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display panel, comprising: the display module comprises a substrate (100), a display module (200) and a touch module (300) which are sequentially stacked;
wherein, the touch module (300) comprises:
the first inorganic layer (310) is arranged above the display module (200) far away from the substrate (100);
the first metal layer (350) is arranged above the first inorganic layer (310) far away from the display module (200);
a first organic buffer layer (320) covering the first metal layer (350) and the first inorganic layer (310);
a second inorganic layer (330) disposed over the first organic buffer layer (320) away from the first inorganic layer (310);
a second metal layer (370) partially spaced above the second inorganic layer (330).
2. The display panel according to claim 1, wherein the first organic buffer layer (320) is provided with a plurality of buffer holes (321) at intervals, the plurality of buffer holes (321) are through holes penetrating through the first organic buffer layer (320), or the plurality of buffer holes (321) are blind holes provided in the first organic buffer layer (320).
3. The display panel according to claim 2, wherein the plurality of buffer holes (321) are filled with an inorganic material or an organic polymer material.
4. The display panel according to claim 3, wherein the touch module (300) further comprises:
a second organic buffer layer (340) covering the exposed upper sides of the second metal layer (370) and the second inorganic layer (330);
preferably, the first organic buffer layer (320) and the second organic buffer layer (340) are organic glues.
5. The display panel according to claim 4, wherein the display module (200) comprises:
a drive array (201) disposed above the substrate (100);
a light emitting layer (202) disposed above the driving array (201) away from the substrate (100); and
an encapsulation layer (203) disposed over the light emitting layer (202) away from the drive array (201);
the display panel (10) further comprises: a third organic buffer layer (360) disposed between the encapsulation layer (203) and the first inorganic layer (310).
6. The display panel of claim 5, wherein the second metal layer (370) extends through the second inorganic layer (330), the first organic buffer layer (320), the first inorganic layer (310), and the encapsulation layer (203) and is electrically connected to the driving array (201).
7. A display device, comprising: the display panel (10) of any one of claims 1-6.
8. A preparation method of a display panel is characterized by comprising the following steps:
providing a substrate (100);
preparing a display module (200) above the substrate (100);
preparing a first inorganic layer (310) above the display module (200) away from the substrate (100);
preparing a first metal layer (350) above the first inorganic layer (310) far away from the display module (200), wherein the first metal layer (350) comprises a plurality of first metal blocks arranged at intervals;
preparing a first organic buffer layer (320) between the first metal layer (350) and the first inorganic layer (310) such that the first organic buffer layer (320) covers the first metal block and the exposed upper side of the first inorganic layer (310);
preparing a second inorganic layer (330) over the first organic buffer layer (320) remote from the first inorganic layer (310);
forming a second metal layer (370) over the second inorganic layer (330) away from the first organic buffer layer (320).
9. The method of claim 8, wherein the step of forming a second inorganic layer (330) over the first organic buffer layer (320) and away from the first inorganic layer (310) is preceded by the step of:
perforating the first organic buffer layer (320), and forming a plurality of buffer holes (321) arranged at intervals on the first organic buffer layer (320);
and filling an inorganic material or an organic polymer material into the buffer hole (321).
10. The method of claim 9, wherein the step of preparing the display module (200) above the substrate (100) comprises:
preparing a drive array (201) over the substrate (100);
preparing a light emitting layer (202) over the drive array (201) remote from the substrate (100);
preparing an encapsulation layer (203) over the light emitting layer (202) away from the drive array (201);
before the step of preparing the first inorganic layer (310) on the display module (200) far away from the substrate (100), the method further comprises:
preparing a third organic buffer layer (360) above the encapsulation layer (203) away from the light emitting layer (202), the third organic buffer layer (360) being formed between the encapsulation layer (203) and the first inorganic layer (310).
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| CN201911001052.XA CN110727375A (en) | 2019-10-21 | 2019-10-21 | Display panel, preparation method thereof and display device |
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| CN201911001052.XA CN110727375A (en) | 2019-10-21 | 2019-10-21 | Display panel, preparation method thereof and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584745A (en) * | 2020-05-13 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method for manufacturing the same |
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