CN110719383A - Camera module and manufacturing method thereof - Google Patents

Camera module and manufacturing method thereof Download PDF

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Publication number
CN110719383A
CN110719383A CN201810772125.4A CN201810772125A CN110719383A CN 110719383 A CN110719383 A CN 110719383A CN 201810772125 A CN201810772125 A CN 201810772125A CN 110719383 A CN110719383 A CN 110719383A
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CN
China
Prior art keywords
frame
circuit board
camera module
photosensitive element
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810772125.4A
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Chinese (zh)
Inventor
罗川
刘华
陆志勇
祁松
刘军
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TDK Corp
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TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to CN201810772125.4A priority Critical patent/CN110719383A/en
Publication of CN110719383A publication Critical patent/CN110719383A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention relates to a camera module and a manufacturing method thereof, wherein the camera module comprises a circuit board, a photosensitive element, a rubber frame, a bracket and an optical filter arranged on the bracket; the photosensitive element is arranged on the circuit board and is in electrical signal connection with the circuit board, the rubber frame is formed by solidifying bonding rubber on the circuit board, the rubber frame is arranged around the photosensitive element and covers the edge of the photosensitive element, the support is arranged on the rubber frame and is bonded on the circuit board through the rubber frame, and the circuit board, the rubber frame, the support and the optical filter form a closed space for surrounding the photosensitive element; the camera module further comprises a plastic package frame formed on the circuit board through injection molding, the plastic package frame is formed after the closed space is formed, and the plastic package frame and the support form a whole. The camera module can reduce the size of the camera module, reduce the risk of particle pollution inside the camera module and increase the reliability of the camera module.

Description

Camera module and manufacturing method thereof
Technical Field
The present invention relates to a camera device, and more particularly, to a miniaturized camera module and a method of manufacturing the same.
Background
With the development of the technology, the imaging capability of the camera module is gradually improved, the size is gradually reduced, and the camera module is widely applied to the fields needing to acquire images, such as personal consumer electronics, automobiles, monitoring, medicine and the like. The camera module generally includes a photosensitive element, a circuit board, a holder, a filter, and a lens assembly. The photosensitive element is mounted on the circuit board through Die Bond and Wire Bond processes, the optical filter and the support are mounted above the photosensitive element on the circuit board, the lens assembly is mounted on the support, and the optical filter is located between the lens assembly and the photosensitive element and mounted in the middle of the support. However, the size of the camera module with the structure is large, the camera module is not consistent with the light, thin and small development trend of current electronic products, the risk of particle contamination in the camera exists, and the product reliability is yet to be further enhanced.
In order to reduce the size of the camera module, a molding process is introduced into the field of the camera module, by which a holder is integrally formed on a circuit board. In this way, the size of the camera module can be reduced, but during the injection molding process, there is still a risk of contamination because the photosensitive element is exposed.
Disclosure of Invention
The invention aims to provide a camera module and a manufacturing method thereof, so as to reduce the size of the camera module and reduce the risk of particle pollution inside the camera module.
On one hand, the invention provides a camera module which comprises a circuit board, a photosensitive element, a rubber frame, a support and an optical filter arranged on the support; the photosensitive element is arranged on the circuit board and is in electrical signal connection with the circuit board, the rubber frame is formed by solidifying bonding rubber on the circuit board, the rubber frame surrounds the photosensitive element and covers the edge of the photosensitive element, the support is arranged on the rubber frame and is bonded on the circuit board through the rubber frame, and the circuit board, the rubber frame, the support and the optical filter form a closed space for surrounding the photosensitive element; the camera module further comprises a plastic package frame formed on the circuit board through injection molding, the plastic package frame is formed after the closed space is formed, and the plastic package frame and the support form a whole.
In an embodiment of the camera module, the plastic frame is formed outside the bracket and integrated with the circuit board, the photosensitive element, the plastic frame, the bracket and the optical filter.
In an embodiment of the camera module, a filling space is formed by a part of the bracket exceeding the rubber frame, a part of the circuit board exceeding the rubber frame and the outer side of the rubber frame, and an injection molding material fills the filling space when the plastic package frame is injection molded.
In an embodiment of the camera module, an exhaust channel is disposed on a side surface of the bracket, and the exhaust channel is filled with adhesive before the plastic package frame is injection molded.
In an embodiment of the camera module, the plastic package frame covers an upper surface of the bracket.
In an embodiment of the camera module, the photosensitive element and the circuit board form an electrical signal connection through a lead, and the bonding glue forming the glue frame covers the lead, so that the lead is embedded into the glue frame formed after the bonding glue is cured.
In an embodiment of the camera module, the circuit board is provided with electronic components, and the electronic components are arranged around the photosensitive element and are covered by the plastic package frame.
In an embodiment of the camera module, the adhesive forming the adhesive frame covers a portion of the electronic component, and the adhesive frame is located on a portion of the electronic component.
In an embodiment of the camera module of the present invention, the camera module further includes a lens assembly disposed above the bracket or above the plastic package frame.
In another aspect, the present invention provides a method for manufacturing a camera module, including at least the following steps:
arranging a photosensitive element on the circuit board;
dispensing adhesive on the circuit board, wherein the adhesive is arranged around the photosensitive element and covers the edge of the photosensitive element;
placing a support with an optical filter on the adhesive, and solidifying the adhesive to form a rubber frame, wherein the circuit board, the rubber frame, the support and the optical filter form a closed space which surrounds the photosensitive element;
and placing the circuit board with the support into an injection mold, and forming a plastic package frame on the circuit board through injection molding, wherein the plastic package frame and the support form a whole.
In an embodiment of the method for manufacturing a camera module according to the present invention, the plastic frame is formed outside the support and is integrated with the circuit board, the photosensitive element, the plastic frame, the support, and the optical filter.
In an embodiment of the method for manufacturing a camera module, a filling space is formed by a part of the bracket exceeding the rubber frame, a part of the circuit board exceeding the rubber frame and the outer side of the rubber frame, and an injection molding material fills the filling space when the plastic package frame is injection molded.
In an embodiment of the method for manufacturing a camera module according to the present invention, an exhaust channel is disposed on a side surface of the bracket, and the exhaust channel is filled with an adhesive before the plastic package frame is injection molded.
In an embodiment of the method for manufacturing a camera module according to the present invention, the photosensitive element and the circuit board are connected by an electrical signal through a lead, and the adhesive forming the adhesive frame covers the lead, so that the lead is embedded into the adhesive frame formed by curing the adhesive.
In an embodiment of the method for manufacturing a camera module according to the present invention, the adhesive is thermosetting adhesive.
The camera module and the manufacturing method thereof have the following beneficial effects: according to the camera module, the circuit board, the rubber frame, the support and the optical filter form a closed space for surrounding the photosensitive element before the plastic package frame is subjected to injection molding, so that the size of the camera module is reduced, particles can be prevented from polluting the photosensitive element during injection molding of the plastic package frame, and the risk of damage to the photosensitive element due to compression can be avoided.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic perspective view of a camera module according to an embodiment of the invention;
FIG. 2 is a schematic front view of the camera module shown in FIG. 1;
FIG. 3 is a schematic sectional view taken along line A-A in FIG. 2;
FIG. 4 is a schematic cross-sectional view taken along line B-B of FIG. 2;
FIG. 5 is an exploded view of one embodiment of a camera module according to the present invention;
FIG. 6 is a schematic cross-sectional view of one embodiment of a camera module according to the invention;
FIG. 7 is another schematic cross-sectional view of one embodiment of a camera module according to the invention;
FIG. 8 is a schematic diagram of a camera module according to the present invention after a photosensitive element is disposed on a circuit board;
FIG. 9 is a schematic diagram of a camera module according to the present invention after glue is applied to the circuit board;
fig. 10 is a schematic view of the bracket of the camera module according to the present invention after being mounted on the adhesive;
fig. 11 is a schematic view after a mold frame of a camera module according to the present invention is formed on a circuit board;
fig. 12 is a schematic view of an injection molding process of a plastic frame of a camera module according to the present invention.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
Reference will now be made in detail to embodiments of the camera module and method of manufacturing the same of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout.
In the description of the camera module and the method of manufacturing the same of the present invention, it is to be understood that the terms "front", "rear", "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, which are merely for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a" and "an" should be interpreted as meaning that at least one "or" one or more "of the elements are present in one embodiment, and that the number of elements is plural in other embodiments, and the terms" a "and" an "should not be interpreted as limiting the number.
Fig. 1 to 4 are schematic views illustrating a camera module according to an embodiment of the invention. In this embodiment, the camera module includes a circuit board 1, a photosensitive element 2, a rubber frame 4, a holder 5, and a filter 7 provided on the holder 5. In the present embodiment, the photosensitive element 2 is attached to the circuit Board 1 by Surface Mount Technology (SMT) and Chip On Board (COB) processes, the photosensitive element 2 forms an electrical signal connection with the circuit Board 1 by a lead 8, and the lead 8 is preferably a gold wire, but may be other wires such as a silver wire and a copper wire. The adhesive frame 4 is formed by dispensing an adhesive on the circuit board 1 by a dispensing process and then curing the adhesive, wherein the adhesive may be a thermosetting adhesive, such as epoxy resin, or other thermosetting adhesives or photo-curing adhesives. In this embodiment, the adhesive paste is continuously deposited on the circuit board 1 around the photosensitive element 2 such that the paste frame 4 formed after curing of the adhesive paste is disposed around the photosensitive element 2 and covers the edge 23 of the photosensitive element 2 and the area 11 of the circuit board 1 surrounding the photosensitive element 2. The photosensitive element 2 comprises a photosensitive area 21 at the middle part and a non-photosensitive area 22 at the edge part, and an edge 23 covered by the rubber frame 4 is positioned in the non-photosensitive area 22. The optical filter 7 is firstly pasted on the bracket 5, the adhesive glue is dotted on the circuit board 1, the bracket is pasted on the adhesive glue, and then after the adhesive glue is solidified, the bracket 5 is pasted on the circuit board through the glue frame 4 to form a semi-finished product. Because gluey frame 4 on the circuit board 1 forms half confined space, when assembling support 5 to circuit board 1, the atmospheric pressure in the space that circuit board 1, gluey frame 4, support 5 and light filter 7 formed can strengthen, during subsequent technology, because be heated, inside air inflation also has the risk that leads to gluey frame 4 to split, for overcoming this problem, can be equipped with exhaust passage 51 in the side of support 5 to when support 5 assembles on circuit board 1, and follow-up gluey frame 4 toasts the exhaust when solidifying. The provision of the air vent channel 51 on the side of the holder rather than on the top avoids the risk of adhesive flowing onto the photosensitive component 2 during subsequent filling of the air vent channel 51 with adhesive.
In this embodiment, the camera module further includes a plastic frame 3 formed on the circuit board 1 by injection molding, the plastic frame 3 is formed after the enclosed space 24 is formed, and the plastic frame 3 covers at least a portion of the bracket 5. Specifically, the plastic frame 3 is formed by loading the semi-finished product formed above into an injection mold, and injection molding materials are formed on the upper side of the circuit board 1 and the outer side of the bracket 5 through an injection molding process, the plastic frame 3 and the bracket 5 form a whole, and the plastic frame 3 can wrap a part of the bracket 5. After the plastic package frame 3 is injection molded, the plastic package frame 3, the circuit board 1, the photosensitive element 2, the plastic frame 4, the bracket 5 and the optical filter 7 form a whole. The injection molding material can be thermosetting plastic, and after the plastic package frame 3 is injection molded, the plastic package frame 3 is completely cured through a thermosetting process.
Before the semi-finished product is placed into an injection molding mold, the exhaust channel 51 needs to be filled with adhesive, at this time, the circuit board 1, the rubber frame 4, the support 5 and the optical filter 7 form a closed space 24 surrounding the photosensitive element 2, and as the photosensitive element 2 is closed in the closed space 24, in the subsequent injection molding process of the plastic package support 3, the photosensitive element 2 can be prevented from being polluted by particles, or damaged due to pressure, for example, damaged slightly to cause functional damage or other problems when a reliability experiment is performed.
In this embodiment, the part of the bracket 5 beyond the rubber frame 4, the part of the circuit board 1 beyond the rubber frame 4, and the outer side of the rubber frame 4 form a filling space 41, and the filling space 41 is filled with an injection molding material when the plastic frame 3 is injection molded. The mold frame 3 may cover the upper surface of the support 5, and of course, in another embodiment, the mold frame 3 may not cover the upper surface of the support 5.
In this embodiment, the photosensitive element 2 and the circuit board 1 form an electrical signal connection through the lead 8, and the adhesive glue forming the glue frame 4 covers the lead when dispensing, so that the lead is embedded into the glue frame 4 formed after the adhesive glue is cured, the lead 8 can be protected after the glue frame 4 is cured, and the electrical signal connection between the photosensitive element 2 and the circuit board 1 is ensured to be reliable. The electronic components 6 are arranged on the circuit board 1, the electronic components 6 are arranged around the photosensitive element 2, the electronic components 6 are coated by the injection molding material when the plastic package frame 3 is subjected to injection molding, and the plastic package frame 3 formed after the injection molding material is solidified coats the electronic components 6 therein, so that the electronic components 6 can be protected, and the reliability of the camera module is improved. When the electronic components 6 are relatively close to the light-sensing element 2, the adhesive glue forming the glue frame 4 also covers a part of the electronic components 6, and the glue frame 4 formed in this way covers a part of the electronic components 6.
In this embodiment, the camera module further includes a lens assembly 9 disposed above the bracket 5 or above the plastic package frame 3, and the lens assembly 9 may be a zoom lens or a fixed focus lens.
Fig. 5 to 7 are schematic views of a camera module according to an embodiment of the invention. It should be understood that the exploded schematic view of the camera module shown in fig. 5 is only for illustrating the structure of the camera module, and in fact, after the rubber frame 4 is cured, the support 5 and the circuit board 1 are bonded together by the rubber frame 4 and are not detachable, and after the plastic frame 3 is cured, the plastic frame 3, the circuit board 1, the photosensitive element 2, the rubber frame 4, the support 5 and the optical filter 7 form an integral body and are also not detachable.
In the camera module, the bracket 5 is bonded on the circuit board 1 through the rubber frame 4 and is wrapped by the plastic package frame 3, and the supporting leg is not required to be contacted with the circuit board 1, so that the size of the camera module can be reduced. Before the plastic package frame 3 is injection molded, a closed space 24 is formed above the photosensitive element 2 by the circuit board 1, the rubber frame 4, the bracket 5 and the optical filter 7, and the photosensitive element 2 is closed in the closed space 24, so that the photosensitive element 2 is prevented from being polluted by particles or damaged due to pressure during the injection molding of the plastic package frame 3. The plastic package frame 3 is formed by injection molding, so that the flatness of the camera module can be better controlled, and a good heat dissipation effect can be obtained due to the tight combination of the plastic package frame 3, the bracket 5 and the circuit board 1.
In the invention, besides the camera module, a manufacturing method of the camera module is also provided. The manufacturing method of the camera module at least comprises the following steps:
disposing the photosensitive element 2 on the circuit board 1;
dispensing adhesive on the circuit board 1, the adhesive being disposed around the photosensitive element 2 and covering the edge 23 of the photosensitive element 2;
placing the support 5 with the optical filter 7 on the adhesive, and solidifying the adhesive to form the adhesive frame 4, wherein the circuit board 1, the adhesive frame 4, the support 5 and the optical filter 7 form a closed space 24 which surrounds the photosensitive element 2;
the circuit board 2 with the support 5 is placed into an injection mold, a plastic package frame 3 is formed on the circuit board 1 through injection molding, the plastic package frame 3 and the support 5 form a whole, and the plastic package frame 3 can wrap at least one part of the support 5.
Specifically, the photosensitive element 2 is attached to the circuit Board 1 by Surface Mount Technology (SMT) and Chip On Board (COB) processes, the photosensitive element 2 is electrically connected to the circuit Board 1 by a lead 8, and the lead 8 is preferably a gold wire, but may be other wires such as a silver wire and a copper wire. Fig. 8 shows a schematic view after the photosensitive element 2 is mounted on the circuit board 1.
After the photosensitive element 2 is mounted on the circuit board 1, glue is dispensed around the photosensitive element 2 by a dispensing process. The bonding glue covers the lead 8 connecting the photosensitive element 2 and the circuit board 1, and the lead 8 is embedded into the glue frame 4 formed by curing the bonding glue after the bonding glue is cured. Specifically, can put circuit board 1 on mounting fixture, the regional thermosetting bonding glue of point around photosensitive chip 2 on circuit board 1, the material of bonding glue can be epoxy, and the glue viscosity is about 4000 ~ 80000 mpa.s. The width occupied by the adhesive after dispensing can be 0.05-0.2 mm, and the height can be 0.2-0.8 mm. The glue needs to be continuous without breaking and the glue does not overflow into the photosensitive area 21 of the photosensitive element 2. The circuit board 1 after dispensing the glue is shown in fig. 9.
After the adhesive is arranged on the circuit board 1 through a dispensing process, the bracket 5 provided with the optical filter 7 is placed on the adhesive, the bracket 5 can be a plastic bracket, and a certain distance is kept between the bracket 5 and the circuit board 1. After the support 5 is placed, the step of baking and curing the bonding glue is carried out, wherein the baking temperature is 50-150 ℃, and the baking time is 10-100 minutes. And curing the bonding glue after baking to form a glue frame 4, so as to obtain a semi-finished product of the camera module. Because gluey frame 4 on the circuit board 1 forms half confined space, when assembling support 5 to circuit board 1, the atmospheric pressure in the space that circuit board 1, gluey frame 4, support 5 and light filter 7 formed can strengthen, during subsequent technology, because be heated, inside air inflation also has the risk that leads to gluey frame 4 to split, for overcoming this problem, can be equipped with exhaust passage 51 in the side of support 5 to when support 5 assembles on circuit board 1, and follow-up gluey frame 4 toasts the exhaust when solidifying. The provision of the air vent channel 51 on the side of the holder rather than on the top avoids the risk of adhesive flowing onto the photosensitive component 2 during subsequent filling of the air vent channel 51 with adhesive. Before the above-mentioned semi-finished product is placed in the injection mold 10, the vent passage 51 needs to be filled with adhesive glue. The rubber frame 4, the support 5, the filter 7 and the circuit board 1 form an enclosed space 24, and the photosensitive element 2 is enclosed in the enclosed space 24. Fig. 10 shows the stent 5 placed on the glue, after the glue has cured.
Then, the formed semi-finished product is placed into an injection mold 10, an injection material is heated and melted and then injected into a mold cavity, a plastic package frame 3 is formed through injection molding, and the process of forming the plastic package frame 3 through injection molding is shown in fig. 12. And taking out the plastic package frame 3 after molding, then placing the plastic package frame in an oven, and baking for a period of time to completely cure the injection molding material forming the plastic package frame 3. After the plastic frame 3 is cured, the plastic frame 3, the circuit board 1, the photosensitive element 2, the plastic frame 4, the support 5, and the optical filter 7 form a whole, as shown in fig. 11.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (15)

1. A camera module is characterized by comprising a circuit board, a photosensitive element, a rubber frame, a bracket and an optical filter arranged on the bracket; the photosensitive element is arranged on the circuit board and is in electrical signal connection with the circuit board, the rubber frame is formed by solidifying bonding rubber on the circuit board, the rubber frame surrounds the photosensitive element and covers the edge of the photosensitive element, the support is arranged on the rubber frame and is bonded on the circuit board through the rubber frame, and the circuit board, the rubber frame, the support and the optical filter form a closed space for surrounding the photosensitive element; the camera module further comprises a plastic package frame formed on the circuit board through injection molding, the plastic package frame is formed after the closed space is formed, and the plastic package frame and the support form a whole.
2. The camera module according to claim 1, wherein the plastic frame is formed outside the holder and integrated with the circuit board, the photosensitive element, the plastic frame, the holder, and the optical filter.
3. The camera module according to claim 1, wherein a filling space is formed by a portion of the bracket exceeding the rubber frame, a portion of the circuit board exceeding the rubber frame, and an outer side of the rubber frame, and the filling space is filled with an injection molding material during injection molding of the plastic frame.
4. The camera module according to claim 1, wherein a side surface of the bracket is provided with an exhaust channel, and the exhaust channel is filled with adhesive before the plastic frame is injection molded.
5. The camera module according to claim 1, wherein the plastic frame covers an upper surface of the bracket.
6. The camera module according to claim 1, wherein the photosensitive element and the circuit board are electrically connected by a lead, and the adhesive forming the frame covers the lead, so that the lead is embedded into the frame formed after the adhesive is cured.
7. The camera module according to claim 1, wherein the circuit board is provided with electronic components, and the electronic components are disposed around the photosensitive element and covered by the plastic frame.
8. The camera module according to claim 7, wherein the adhesive glue forming the glue frame covers a portion of the electronic component, and the glue frame is located on a portion of the electronic component.
9. The camera module of claim 1, further comprising a lens assembly disposed over the bracket or over the plastic frame.
10. A camera module manufacturing method is characterized by at least comprising the following steps:
arranging a photosensitive element on the circuit board;
dispensing adhesive on the circuit board, wherein the adhesive is arranged around the photosensitive element and covers the edge of the photosensitive element;
placing a support with an optical filter on the adhesive, and solidifying the adhesive to form a rubber frame, wherein the circuit board, the rubber frame, the support and the optical filter form a closed space which surrounds the photosensitive element;
and placing the circuit board with the support into an injection mold, and forming a plastic package frame on the circuit board through injection molding, wherein the plastic package frame and the support form a whole.
11. The method of claim 10, wherein the frame is formed outside the frame and integrated with the circuit board, the photosensitive element, the frame, and the filter.
12. The method for manufacturing a camera module according to claim 10, wherein a filling space is formed by a portion of the bracket that exceeds the rubber frame, a portion of the circuit board that exceeds the rubber frame, and an outer side of the rubber frame, and the filling space is filled with an injection molding material when the plastic frame is injection molded.
13. The method for manufacturing a camera module according to claim 10, wherein an exhaust channel is formed on a side surface of the bracket, and the exhaust channel is filled with adhesive before the plastic frame is injection-molded.
14. The method for manufacturing a camera module according to claim 10, wherein the photosensitive element and the circuit board are electrically connected by a lead, and the adhesive forming the frame covers the lead so that the lead is embedded in the frame formed by curing the adhesive.
15. The method for manufacturing a camera module according to claim 10, wherein the adhesive is a thermosetting adhesive.
CN201810772125.4A 2018-07-13 2018-07-13 Camera module and manufacturing method thereof Pending CN110719383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810772125.4A CN110719383A (en) 2018-07-13 2018-07-13 Camera module and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810772125.4A CN110719383A (en) 2018-07-13 2018-07-13 Camera module and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN110719383A true CN110719383A (en) 2020-01-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810772125.4A Pending CN110719383A (en) 2018-07-13 2018-07-13 Camera module and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN110719383A (en)

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