CN110695550A - Method and system for laser drilling and chamfering of glass - Google Patents
Method and system for laser drilling and chamfering of glass Download PDFInfo
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- CN110695550A CN110695550A CN201911058177.6A CN201911058177A CN110695550A CN 110695550 A CN110695550 A CN 110695550A CN 201911058177 A CN201911058177 A CN 201911058177A CN 110695550 A CN110695550 A CN 110695550A
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- glass
- chamfer
- straight hole
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- chamfering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
Abstract
The invention provides a method and a system for laser drilling and chamfering of glass, and belongs to the technical field of glass drilling. The glass laser drilling and chamfering method comprises the following steps: measuring the position coordinates of a processing part of the glass to be processed; calculating and adjusting the initial processing position of the galvanometer according to the position coordinates; arranging a chamfer angle with a processed glass hole and a straight hole figure file; dividing the picture file: layering the chamfer and the straight hole drawing file according to the straight hole and the chamfer; respectively setting the punching parameters of each layer; and respectively carrying out spiral cutting on the chamfer and the straight hole according to the set punching parameters. The invention has the beneficial effects that: the damage to the material can be reduced to the minimum, and the product percent of pass reaches more than 99 percent.
Description
Technical Field
The invention relates to the technical field of glass drilling, in particular to a method and a system for laser drilling and chamfering of glass.
Background
Traditional glass punches and chamfer and adopts the cnc engraving and milling machine to process glass, adopts the high-speed rotation of diamond bistrique, and the tool that the cooperation was designed can realize trompil, upper and lower chamfer etc. to glass.
However, the conventional processing method has the following disadvantages:
①, an upper drill bit and a lower drill bit are needed to realize one-time chamfering, and the maintenance cost is high;
② for glass with thickness less than 2mm, the yield of the traditional drilling process is seriously reduced;
③ the glass has edge explosion and scratch phenomena;
④, a proper jig needs to be designed, and the flexibility is poor;
⑤ the deviation of the upper and lower drilling positions is large and the connection of the inner surface of the hole is not smooth.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a method and a system for laser drilling and chamfering of glass.
The glass laser drilling and chamfering method comprises the following steps:
s1: measuring the position coordinates of a processing part of the glass to be processed;
s2: calculating and adjusting the initial processing position of the galvanometer according to the position coordinates;
s3: arranging a chamfer angle with a processed glass hole and a straight hole figure file;
s4: dividing the picture file: layering the chamfer and the straight hole drawing file according to the straight hole and the chamfer;
s5: respectively setting the punching parameters of each layer;
s6: and respectively carrying out spiral cutting on the chamfer and the straight hole according to the set punching parameters.
The invention is further improved, in step S6, during the cutting process, the method further comprises a blowing step: and blowing the cutting part by using a blowing device.
In step S4, the number of layers is three, namely, an upper chamfer layer, a straight hole layer and a lower chamfer layer.
The invention is further improved in that in step S6, the lower chamfer layer and the straight hole layer are respectively spirally cut from bottom to top according to the set parameters, and then the upper chamfer layer is spirally cut from top to bottom.
The present invention is further improved, in step S1, by measuring with a laser displacement sensor.
In step S5, the drilling parameters include laser power, frequency, drilling speed, number of spiral loops, pitch of spiral loops, layer thickness, and layer number.
The invention also provides a system for realizing the glass laser drilling and chamfering method, which comprises the following steps: a measurement module: the device is used for measuring the position coordinates of a processing part of glass to be processed; a calculation module: the processing device is used for calculating and adjusting the initial processing position of the galvanometer according to the position coordinate; a first setting module: the device is used for arranging chamfer angles and straight hole drawing files with machined glass holes; a graph file splitting module: the straight hole drawing file is used for layering the chamfer and the straight hole drawing file according to the straight hole and the chamfer; a second setting module: the punching parameters of each layer are respectively set; cutting the module: and the spiral cutting device is used for respectively carrying out spiral cutting on the chamfer and the straight hole according to the set punching parameters.
The invention is further improved, and the invention also comprises an air blowing module: used for blowing air to the cutting part during the cutting process.
Compared with the prior art, the invention has the beneficial effects that: the damage to the material can be reduced to the minimum by non-contact processing, the product percent of pass reaches more than 99 percent, and the productivity of a client is improved; the maintenance cost is lower, and the long-term operation is stable.
Drawings
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a schematic of the layering of the present invention;
FIG. 3 is a schematic view of a lower chamfer and a straight hole helix;
FIG. 4 is a schematic view of an upper chamfer helix;
fig. 5 is a plan view of fig. 4.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
The invention uses the laser drilling and chamfering processing technology which has lower maintenance cost and long-term stable operation, accelerates the industrial transformation and accelerates the industrial automation process.
As shown in figure 1, the invention adopts a combination mode of software control, laser and a displacement sensor to realize the purposes of glass punching and chamfering. The specific implementation method of the invention is as follows:
s1: measuring the position coordinates of the lower surface of the glass to be processed
The method comprises the following steps: and accurately finding a Z-axis coordinate Z1 corresponding to the lower surface of the glass to be processed by the laser displacement sensor. The laser displacement sensor in this example is a sensor that uses laser technology for measurement. It consists of laser, laser detector and measuring circuit. The laser sensor is a novel measuring instrument, can accurately measure the changes of the position, the displacement and the like of a measured object in a non-contact way, and can measure the precise geometric measurements of the displacement, the thickness, the vibration, the distance, the diameter and the like. The laser has the excellent characteristic of good straightness, and the laser displacement sensor has higher precision compared with the known ultrasonic sensor.
S2: transmitting, calculating and adjusting the initial processing position of the galvanometer
And transmitting the Z-axis coordinate value Z1 measured by the laser displacement sensor to glass punching software through serial port communication. The software calculates the starting position coordinates of the glass processing surface.
The calculation method comprises the following steps: when the Z-axis origin is calibrated, the focus of the laser light source is consistent with the Z-axis coordinate when the Z-axis coordinate is equal to 0 through hardware debugging, so that the difference value of the Z axis can be calculated through the Z-axis coordinate which is actually obtained, the compensation value of the Z axis is obtained, the initial position of the three-dimensional module is adjusted through the compensation value of the Z axis, the consistency of the focal plane is ensured, and the processing effect of a product is ensured. The two steps ensure that the working surfaces of the product processing are consistent by means of the laser displacement sensor and software operation.
S3-S5: generating a model to be processed by introducing chamfer and straight hole drawing files into software
As shown in FIG. 2, the punching chamfer of the glass to be processed is divided into three layers, wherein ①②③ marked in FIG. 2 is provided with ①②③ parts of punching parameters respectively, including parameters such as laser power, frequency, punching speed, spiral line ring number, spiral line ring spacing, layer thickness and layer number.
Because ①②③ layers have different processing principles, before laser processing, ①②③ layers of punching parameters need to be set independently to achieve the best effect and the fastest efficiency, and because of the difference of the processing principles, the punching parameter setting of the embodiment is shown in table 1.
| Layer(s) | Speed (mm/s) | Number of rings | Interannular distance (mm) | Layer thickness (mm) |
| ① | 4000 | 10 | 0.02 | 0.1 |
| ② | 4000 | 5 | 0.04 | 0.04 |
| ③ | 2000 | 10 | 0.005 | 0.005 |
TABLE 1 perforation parameters
In order to ensure the hole cutting effect and ensure that the glass can smoothly fall off, when the initial processing point is set, the embodiment is provided with a processing allowance, the starting point coordinate of the Z axis for starting processing of the lower surface needs to move downwards for a certain distance, namely the processing starting point is lower than the lower surface, and the specific numerical value is determined according to the hole punching effect. The total processing thickness is larger than the thickness of the glass, and the Z-axis coordinate of the processed upper surface is higher than one point of the upper surface, namely the processing termination point is higher than the upper surface.
S6: combining with three-dimensional dynamic module to perform spiral cutting on each layer
As shown in fig. 3-5, in each layer, the laser cuts in a spiral manner, and the processing path may be from inside to outside or from outside to inside, and the number of turns and the pitch of the spiral are adjusted according to the requirements of chamfering, as shown in fig. 5.
As shown in fig. 3, the laser beam of this example completes ①② two-layer processing from bottom to top according to the model path generated by the introduction, i.e., completes the lower surface chamfering and the via hole processing, and finally the laser beam completes the upper surface chamfering from top to bottom according to the model path of ③ layers, as shown in fig. 4.
In order to ensure the punching and chamfering effects, the thickness of each layer is not too large, otherwise, the edge breakage amount is too large, and the chamfering effect is affected.
Preferably, when each layer, especially ③ layers are processed, the blowing device is additionally arranged to blow off the ablated glass powder, and simultaneously, the temperature of the glass is reduced, so that the purpose of reducing the edge breakage amount is achieved.
The method has wide application range, is suitable for processing glass with different components, different thicknesses and different materials and different industries, and can adjust the size of the chamfer and the processing thickness according to the requirements.
The invention has the following advantages:
1. the one-stop glass laser drilling chamfering scheme is provided, and the problem of a processing station in the traditional process is solved;
2. by using the laser chamfering processing technology which has lower maintenance cost and runs stably for a long time, the problem of abrasion of the diamond drill bit in the traditional process is solved, and the cost of maintenance and vulnerable devices is reduced;
3. the industrial transformation in the glass processing field is promoted, and the industrial automation process is accelerated;
4. the laser processing is non-contact processing, the damage to the material can be reduced to the minimum, the product percent of pass reaches more than 99 percent, and the productivity of customers is improved.
The above-described embodiments are intended to be illustrative, and not restrictive, of the invention, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (8)
1. A method for laser drilling and chamfering of glass is characterized by comprising the following steps:
s1: measuring the position coordinates of a processing part of the glass to be processed;
s2: calculating and adjusting the initial processing position of the galvanometer according to the position coordinates;
s3: arranging a chamfer angle with a processed glass hole and a straight hole figure file;
s4: dividing the picture file: layering the chamfer and the straight hole drawing file according to the straight hole and the chamfer;
s5: respectively setting the punching parameters of each layer;
s6: and respectively carrying out spiral cutting on the chamfer and the straight hole according to the set punching parameters.
2. The method of claim 1, wherein the laser drilling and chamfering of glass comprises: in step S6, in the cutting process, the method further includes the step of blowing: and blowing the cutting part by using a blowing device.
3. The method of laser drilling and chamfering glass according to claim 1 or 2, wherein: in step S4, the number of layers is three, which are an upper chamfer layer, a straight hole layer, and a lower chamfer layer.
4. The method of claim 3, wherein the laser drilling and chamfering the glass comprises: in step S6, the lower chamfer layer and the straight hole layer are first spirally cut from bottom to top, respectively, according to the set parameters, and then the upper chamfer layer is spirally cut from top to bottom.
5. The method of laser drilling and chamfering glass according to claim 1 or 2, wherein: in step S1, the measurement is performed by a laser displacement sensor.
6. The method of laser drilling and chamfering glass according to claim 1 or 2, wherein: in step S5, the drilling parameters include laser power, frequency, drilling speed, spiral loop number, spiral loop pitch, layer thickness, and layer number.
7. A system for implementing the method for laser drilling and chamfering glass according to any one of claims 1 to 6, comprising:
a measurement module: the device is used for measuring the position coordinates of a processing part of glass to be processed;
a calculation module: the processing device is used for calculating and adjusting the initial processing position of the galvanometer according to the position coordinate;
a first setting module: the device is used for arranging chamfer angles and straight hole drawing files with machined glass holes;
a graph file splitting module: the straight hole drawing file is used for layering the chamfer and the straight hole drawing file according to the straight hole and the chamfer;
a second setting module: the punching parameters of each layer are respectively set;
cutting the module: and the spiral cutting device is used for respectively carrying out spiral cutting on the chamfer and the straight hole according to the set punching parameters.
8. The system of claim 7, wherein: still include the module of blowing: used for blowing air to the cutting part during the cutting process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911058177.6A CN110695550A (en) | 2019-10-29 | 2019-10-29 | Method and system for laser drilling and chamfering of glass |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911058177.6A CN110695550A (en) | 2019-10-29 | 2019-10-29 | Method and system for laser drilling and chamfering of glass |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111590197A (en) * | 2020-05-11 | 2020-08-28 | 苏州优快激光科技有限公司 | Ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method |
| CN114131220A (en) * | 2021-11-04 | 2022-03-04 | 江苏大学 | Method for processing small holes in transparent hard and brittle material based on laser pulse control |
| CN114289895A (en) * | 2021-12-28 | 2022-04-08 | 苏州大族松谷智能装备股份有限公司 | Triaxial laser cutting method for chamfer of groove |
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| CN114131220A (en) * | 2021-11-04 | 2022-03-04 | 江苏大学 | Method for processing small holes in transparent hard and brittle material based on laser pulse control |
| CN114289895A (en) * | 2021-12-28 | 2022-04-08 | 苏州大族松谷智能装备股份有限公司 | Triaxial laser cutting method for chamfer of groove |
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