CN110690307B - Transparent back plate for photovoltaic module and preparation method thereof - Google Patents
Transparent back plate for photovoltaic module and preparation method thereof Download PDFInfo
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- CN110690307B CN110690307B CN201911044041.XA CN201911044041A CN110690307B CN 110690307 B CN110690307 B CN 110690307B CN 201911044041 A CN201911044041 A CN 201911044041A CN 110690307 B CN110690307 B CN 110690307B
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- polyvinylidene fluoride
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- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 63
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- 239000010410 layer Substances 0.000 claims abstract description 54
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims abstract description 54
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000011247 coating layer Substances 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 35
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- 238000005266 casting Methods 0.000 claims abstract description 28
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- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a transparent back plate for a photovoltaic module and a preparation method thereof. The transparent back plate comprises a hydrophobic modified polyvinylidene fluoride film layer, a first fluorocarbon coating layer, a transparent substrate and a second fluorocarbon coating layer from outside to inside in sequence; the preparation method comprises the following steps: respectively coating a first fluorocarbon coating layer and a second fluorocarbon coating layer on two sides of a transparent substrate to obtain a double-sided coating type transparent base material; coating a hydrophobic modified polyvinylidene fluoride casting solution on the outer layer of the first fluorocarbon coating layer of the double-coated transparent substrate, and forming a hydrophobic modified polyvinylidene fluoride film layer on the outer layer of the double-coated transparent substrate by a phase inversion method through the hydrophobic modified polyvinylidene fluoride casting solution. The invention has the advantages of simple preparation process, economy, environmental protection, good weather resistance, self-cleaning and the like.
Description
Technical Field
The invention belongs to the technical field of photovoltaic cell packaging, and particularly relates to a transparent back plate for a photovoltaic module and a preparation method thereof.
Background
At present, the photovoltaic power generation in China is continuously and rapidly developed, the technical level is continuously improved, the industrial system is continuously improved, particularly, with the development of high-efficiency technology, the power generation power of a photovoltaic module is higher and higher, the era of online low price of industry comes quickly, and the development of new energy industry in China is favorably promoted.
The development of high efficiency technologies such as double-sided components, half-chip technology, large-block components, reduced gap spacing, and the like, fully illustrate the broad prospects of transparent backplanes. As a packaging protective material for the outermost layer of a photovoltaic module, the transparent back sheet needs to satisfy conventional properties such as electrical insulation, water vapor barrier property and the like of a conventional back sheet, and also needs to have high transmittance, good adhesion and good weather resistance, particularly excellent ultraviolet resistance. Generally, there are two types of transparent back panels, namely a glass back panel and a polymer-based transparent back panel, the former has high cost, heavy components and a risk of bursting, the latter has to be tested for weather resistance, pure PET has poor weather resistance, and the composite film layer has problems of large yellowing and high fluorine film cost, but the optimization design of the latter is a better technical development trend.
Chinese patent CN 104842616B discloses a photovoltaic solar cell composite back panel, which is a PET and polyester co-extrusion film, wherein inorganic nano particles are added, and a fluorine-containing polymer is coated on the outer layer of the back panel to serve as an ultraviolet-proof layer, in order to solve the problems of weather resistance, water vapor barrier property, insulativity and weak strength of the back panel of the solar cell back panel. But the weather resistance and self-cleaning ability still need to be improved.
Chinese patent CN 103560162B discloses a solar cell back panel, the outside surface of the PET substrate of this back panel is provided with a polyvinylidene fluoride film layer, and the inside surface of the PET substrate is coated with a fluorocarbon resin coating. But the radiation curing preparation process increases the process cost and the process difficulty.
Disclosure of Invention
In order to solve the problems in the prior art, the invention aims to provide a transparent back sheet for a photovoltaic module and a preparation method thereof. The invention has the advantages of simple preparation process, economy, environmental protection, good weather resistance, self-cleaning and the like.
In order to achieve the purpose, the invention adopts the following technical scheme:
a transparent back plate for a photovoltaic module comprises a hydrophobic modified polyvinylidene fluoride film layer, a first fluorocarbon coating layer, a transparent substrate and a second fluorocarbon coating layer from outside to inside in sequence; the hydrophobic modified polyvinylidene fluoride film layer is prepared by a phase transfer method.
Further, the transparent substrate is a PET film.
Further, the thickness of the hydrophobic modified polyvinylidene fluoride film layer is 5-25 μm, the thickness of the first fluorocarbon coating layer is 1-5 μm, the thickness of the transparent substrate is 200-300 μm, and the thickness of the second fluorocarbon coating layer is 2-20 μm.
Preferably, the thickness of the second fluorocarbon coating layer is 5 to 13 μm.
Preferably, the thickness of the transparent substrate is 240-280 μm.
Further, the hydrophobic modified polyvinylidene fluoride film layer is obtained by adding fumed silica into polyvinylidene fluoride for modification.
Preferably, the addition amount of the fumed silica is 0.05-1% of the mass of the polyvinylidene fluoride.
Preferably, the polyvinylidene fluoride has a viscosity average molecular weight of 70 ten thousand or more.
Further, the first fluorocarbon coating layer and the second fluorocarbon coating layer are mainly composed of fluorocarbon resin, modified resin and inorganic filler.
Preferably, the modified resin is one or more of butanol etherified amino resin, bisphenol A epoxy resin, C5 petroleum resin, bisphenol F epoxy resin, polyphenol glycidyl ether epoxy resin, organic silicon resin and aliphatic glycidyl ether epoxy resin which are mixed according to any proportion.
Preferably, the inorganic filler is one or more of nano titanium dioxide, montmorillonite, transparent powder, scratch-resistant powder, glass fiber powder, ceramic microspheres, silica micropowder, white carbon black, glass powder, nano zinc oxide and matting powder which are mixed according to any proportion; the particle size of the inorganic filler is 50nm-10 um.
The invention also provides a preparation method of the transparent back plate for the photovoltaic module, which comprises the following steps:
(1) respectively coating a first fluorocarbon coating layer and a second fluorocarbon coating layer on two sides of a transparent substrate to obtain a double-coated transparent substrate;
(2) coating a hydrophobic modified polyvinylidene fluoride casting solution on the outer layer of the first fluorocarbon coating layer of the double-coated transparent substrate, and forming a hydrophobic modified polyvinylidene fluoride film layer on the outer layer of the double-coated transparent substrate by a phase inversion method through the hydrophobic modified polyvinylidene fluoride casting solution.
Further, the phase inversion method comprises the following specific steps: coating the casting solution on the first fluorocarbon coating layer of the double-sided coating type transparent substrate, then pre-evaporating the substrate coated with the casting solution in air, rapidly introducing the solidification solution into the substrate coated with the casting solution for precipitation and solidification for a period of time, and finally airing to form a film, wherein the rapid introduction is the time of the substrate coated with the casting solution staying in the air, and within 20 seconds, the preferred precipitation and solidification time is 0.1-10 minutes.
Further, the preparation method of the casting solution comprises the following steps: adding 5-30 parts of polyvinylidene fluoride powder into 100 parts of organic solvent, stirring at low temperature to completely dissolve the polyvinylidene fluoride powder into clear solution, adding fumed silica accounting for 0.05-1% of the mass of the polyvinylidene fluoride, and uniformly stirring to obtain the polyvinylidene fluoride-containing aqueous solution.
Preferably, the organic solvent is one or a combination of acetone, N-methyl pyrrolidone, N-dimethylformamide, dimethylacetamide, dimethyl sulfoxide and tetrahydrofuran.
Preferably, the low-temperature stirring temperature is 20-80 ℃.
Further, the coating method is blade coating, and the thickness of the coating is adjusted by adjusting the position of the blade and the double-coated transparent substrate. The thickness of the coating is basically equivalent to that of the final hydrophobic modified polyvinylidene fluoride membrane layer.
Further, the coagulating liquid is water or a mixture of water and an organic solvent, and the organic solvent is one or a combination of ethanol, propanol, acetone, N-methylpyrrolidone, N-dimethylformamide, dimethylacetamide, dimethyl sulfoxide and tetrahydrofuran.
Further, the drying is natural drying or blast drying through a drying tunnel.
Further, in order to strengthen the hydrophobic modified polyvinylidene fluoride membrane layer, a high-temperature heat treatment step is added after the step (2).
Preferably, the temperature of the high-temperature heat treatment is 100-150 ℃, and the time is 0.5-5 min.
Further, the specific steps of the step (1) are as follows: the fluorocarbon resin, the modified resin, the curing agent, the inorganic filler, the auxiliary agent and the solvent are mixed according to a certain proportion to prepare a transparent fluorocarbon coating, one surface of a transparent substrate is coated and cured at high temperature to obtain a first fluorocarbon coating layer, and then the other surface of the transparent substrate is coated with the coating and cured at high temperature to obtain a second fluorocarbon coating layer.
Preferably, the high-temperature curing temperature is 150-.
The invention has the following technical characteristics:
1. the outermost layer of the transparent back plate is the hydrophobic modified polyvinylidene fluoride film layer prepared by the phase inversion method, the prepared polyvinylidene fluoride film is a thermoplastic film layer, the process is simple and easy to operate, and the used solidification liquid can be recycled and reused, so that the transparent back plate is economic and environment-friendly.
2. The polyvinylidene fluoride membrane prepared by the method belongs to a hydrophobic material, and the hydrophobicity is enhanced by the fumed silica, so that the air side surface of the transparent back plate has larger hydrophobicity, the transparent back plate has a self-cleaning effect due to the high hydrophobicity, the pollution degree of a photovoltaic module in the outdoor use process is effectively reduced, and the better power generation efficiency of the photovoltaic module is ensured.
3. The transparent back plate has outdoor weather resistance of the conventional back plate, the outer layer of the transparent back plate consists of a thin fluorocarbon coating and a thick polyvinylidene fluoride film in sequence from inside to outside, and the two layers are designed in a gradient manner, so that the cost of the transparent back plate is controlled to a certain extent. Furthermore, the method of the present invention is equally applicable to white or black backplanes.
Drawings
Fig. 1 is a schematic structural diagram of a transparent back plate for a photovoltaic module according to the present invention, which sequentially comprises a hydrophobic modified polyvinylidene fluoride film layer 1, a first fluorocarbon coating layer 2, a transparent substrate 3, and a second fluorocarbon coating layer 4 from top to bottom.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.
Fig. 1 is a schematic structural diagram of a transparent back plate for a photovoltaic module, which is composed of a hydrophobic modified polyvinylidene fluoride film layer 1, a first fluorocarbon coating layer 2, a transparent substrate 3 and a second fluorocarbon coating layer 4 from top to bottom in sequence.
The transparent back plate for the photovoltaic module in the specific embodiment of the invention is prepared by the following steps:
(1) respectively coating a first fluorocarbon coating layer and a second fluorocarbon coating layer on two sides of a transparent substrate to obtain a double-coated transparent substrate;
(2) coating a hydrophobic modified polyvinylidene fluoride casting solution on the outer layer of the first fluorocarbon coating layer of the double-coated transparent substrate, and forming a hydrophobic modified polyvinylidene fluoride film layer on the outer layer of the double-coated transparent substrate by a phase inversion method through the hydrophobic modified polyvinylidene fluoride casting solution.
In certain preferred embodiments, the specific steps of step (1) are: the fluorocarbon resin, the modified resin, the curing agent, the inorganic filler, the auxiliary agent and the solvent are mixed according to a certain proportion to prepare a transparent fluorocarbon coating, one surface of a transparent substrate is coated and cured at high temperature to obtain a first fluorocarbon coating layer, and then the other surface of the transparent substrate is coated with the coating and cured at high temperature to obtain a second fluorocarbon coating layer.
In certain preferred embodiments, the fluorocarbon resin is selected from the group consisting of tetrafluoroethylene/vinyl ether copolymers, tetrafluoroethylene/vinyl ester copolymers, tetrafluoroethylene/alkyl vinyl ether copolymers, tetrafluoroethylene/alkyl vinyl ester copolymers; the modified resin is selected from bisphenol A epoxy resin, bisphenol F epoxy resin, alkyl glycidyl ether epoxy resin and butanol etherified amino resin; the curing agent is selected from hexamethylene diisocyanate tripolymer, hexamethylene diisocyanate biuret, diphenylmethane diisocyanate tripolymer, isophorone diisocyanate tripolymer and isophorone diisocyanate prepolymer; the inorganic filler is selected from nano titanium dioxide, transparent powder, scratch-resistant powder, ceramic microspheres, white carbon black, glass powder and matting powder; the auxiliary agent is selected from block copolymer dispersant containing pigment affinity group, polyether modified polysiloxane flatting agent, aralkyl modified polysiloxane flatting agent, polyester modified polysiloxane flatting agent, reaction type polysiloxane flatting agent, 2-hydroxy-4-n-octyloxy benzophenone, 2- (2' -hydroxy-3 ',5' -di-tert-phenyl) -5-chlorinated benzotriazole, bis (1, 2,2,6, 6-pentamethyl-4-piperidyl) -sebacate/mono (1, 2,2,6, 6-pentamethyl-4-piperidyl) sebacate compound, bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate, tetra (3, 5-di-tert-butyl-4-hydroxy) phenylpropionic acid pentaerythritol ester, N-octadecyl beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate; the solvent is selected from xylene, butyl acetate, propylene glycol methyl ether acetate, methyl isobutyl ketone and isopropanol;
in certain preferred embodiments, the high temperature curing temperature is 150 ℃ and 200 ℃ for 1.5-6 min.
Specific examples are as follows, and the parts in the following examples refer to parts by weight:
example 1
Coating a casting solution prepared by dissolving 10 parts of polyvinylidene fluoride powder in 100 parts of N, N-dimethylformamide solvent at 60 ℃ under stirring to obtain a double-coated transparent substrate, adding 0.005 part of fumed silica into the casting solution, precipitating and curing in a water coagulation bath, and drying at 100 ℃ for 3 min. The transparent substrate is a 255 mu m thick PET film, the inner layer of the transparent substrate is 10 mu m thick, the outer layer of the transparent substrate is 2 mu m thick, and the thickness of the coated polyvinylidene fluoride film is 13 mu m.
Example 2
Coating a casting solution prepared by dissolving 8 parts of polyvinylidene fluoride powder in 100 parts of N, N-dimethylformamide solvent at room temperature under stirring to obtain a double-coated transparent substrate, adding 0.01 part of fumed silica into the casting solution, precipitating and curing in a coagulating bath with water/ethanol =10/1, and drying at 120 ℃ for 3 min. The transparent substrate is a 275-micron thick PET film, the inner layer of the transparent substrate is 13 microns thick, the outer layer of the transparent substrate is 3 microns thick, and the thickness of the coated polyvinylidene fluoride film is 15 microns.
Example 3
Coating a casting solution prepared by dissolving 20 parts of polyvinylidene fluoride powder in 100 parts of N, N-dimethylformamide/dimethyl sulfoxide =1/1 solvent at 75 ℃ under stirring to form a double-coated transparent substrate outer layer, adding 0.5 part of fumed silica into the casting solution, then precipitating and curing in a water coagulation bath, and performing baking treatment at 150 ℃ for 2 min. The transparent substrate is a 245 mu m thick PET film, the inner layer of the transparent substrate is 5 mu m thick, the outer layer of the transparent substrate is 5 mu m thick, and the thickness of the coated polyvinylidene fluoride film is 8 mu m.
Example 4
Coating a casting solution prepared by dissolving 30 parts of polyvinylidene fluoride powder in 100 parts of acetone/N, N-dimethylformamide/dimethyl sulfoxide =1/1/2 solvent at 35 ℃ under stirring to form a double-coated transparent substrate outer layer, adding 3 parts of fumed silica into the casting solution, precipitating and curing in a coagulating bath of water/N, N-dimethylformamide =9/1, and airing. The transparent substrate is a 270-micron-thick PET film, the inner layer of the transparent substrate is 7 microns thick, the outer layer of the transparent substrate is 4 microns thick, and the thickness of the coated polyvinylidene fluoride film is 5 microns.
Example 5
Coating a casting solution prepared by dissolving 5 parts of polyvinylidene fluoride powder in 100 parts of acetone/N, N-dimethylformamide/dimethyl sulfoxide =0.5/1/2 solvent at 80 ℃ under stirring to form a double-coated transparent substrate outer layer, adding 0.4 part of fumed silica into the casting solution, then precipitating and curing in a water coagulation bath, and performing baking channel treatment at 135 ℃ for 2.5 min. The transparent substrate is a 265 μm thick PET film, the transparent substrate has an inner layer thickness of 18 μm and an outer layer thickness of 1 μm, and the thickness of the coated polyvinylidene fluoride film is 20 μm.
Comparative example 1
The transparent base material is a double-side coating type transparent base material, a PET film with the thickness of 255um is selected as the transparent base material, the thickness of the inner layer of the transparent base material is 10 mu m, the thickness of the outer layer of the transparent base material is 2 mu m, then a fluorocarbon coating which is 13 mu m and is cured at high temperature and added with fumed silica with the same proportion as that in the casting solution in the embodiment 1 is coated, and the fluorocarbon coating is the fluorocarbon coating used for double-side coating of the transparent base material.
Comparative example 2
The transparent substrate is a double-sided coating type transparent substrate, a 255 mu m thick PET film is selected as the transparent substrate, the inner layer of the transparent substrate is 10 mu m thick, and the outer layer of the transparent substrate is 2 mu m thick.
The performance of the transparent backsheets of examples 1-5 and comparative examples 1-2 was determined and is shown in table 1, with the following specific test and evaluation methods:
1. transmittance and haze: reference is made to ASTM D1003 transparent Plastic light transmittance and haze test method.
2. Water contact angle: refer to GB/T30693-.
3. Yellowing index: refer to GB/T2409 "test method for yellow index of plastics".
4. And the peel strength with EVA: refer to GB/T2790 method for testing 180 DEG peel strength of adhesive for flexible material versus rigid material.
5. Weather resistance test: the test method refers to the standard GB/T2423.3 high and low temperature humid heat test method.
TABLE 1 results of measuring the Properties of transparent backsheets of examples 1 to 5 and comparative examples 1 to 2
As can be seen from Table 1, the sample of the embodiment of the invention has a higher water contact angle, a higher light transmittance and a good peeling strength, and the sample after aging has a small change of the yellowing index, a normal appearance, and a better transmittance and peeling performance. Therefore, the backboard sample designed by the invention has excellent light transmittance and good aging resistance, wherein the transparent backboard has better self-cleaning effect due to larger hydrophobicity. In addition, compared with a comparative example, the preparation of the outer layer of the transparent back plate in the embodiment does not need to prepare 2 thermosetting fluorocarbon coatings, and the preparation process and the environmental protection performance can be better improved.
The above description of the embodiments is only intended to facilitate the understanding of the method of the invention and its core ideas. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, it is possible to make various improvements and modifications to the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. The transparent back plate for the photovoltaic module is characterized by comprising a hydrophobic modified polyvinylidene fluoride film layer, a first fluorocarbon coating layer, a transparent substrate and a second fluorocarbon coating layer from outside to inside in sequence; the hydrophobic modified polyvinylidene fluoride film layer is prepared by a phase transfer method, and is obtained by adding fumed silica into polyvinylidene fluoride for modification.
2. The transparent backsheet for photovoltaic modules according to claim 1, wherein said transparent substrate is a PET film.
3. The transparent backsheet for a photovoltaic module as claimed in claim 1, wherein the thickness of the hydrophobic modified polyvinylidene fluoride film layer is 5-25 μm, the thickness of the first fluorocarbon coating layer is 1-5 μm, the thickness of the transparent substrate is 200-300 μm, and the thickness of the second fluorocarbon coating layer is 2-20 μm.
4. The transparent backsheet for photovoltaic modules according to claim 1, wherein said fumed silica is added in an amount of 0.05 to 1% by mass of the polyvinylidene fluoride.
5. A process for the preparation of a transparent backsheet for photovoltaic modules according to any one of claims 1 to 4, comprising the steps of:
(1) respectively coating a first fluorocarbon coating layer and a second fluorocarbon coating layer on two sides of a transparent substrate to obtain a double-coated transparent substrate;
(2) coating a hydrophobic modified polyvinylidene fluoride casting solution on the outer layer of the first fluorocarbon coating layer of the double-coated transparent substrate, and forming a hydrophobic modified polyvinylidene fluoride film layer on the outer layer of the double-coated transparent substrate by a phase inversion method through the hydrophobic modified polyvinylidene fluoride casting solution.
6. The preparation method according to claim 5, wherein the phase inversion method comprises the following specific steps: coating the casting solution on the outer layer of the first fluorocarbon coating layer of the double-sided coating type transparent substrate, then pre-evaporating the substrate coated with the casting solution in the air, rapidly introducing a solidification solution into the substrate coated with the casting solution within 20s for precipitation and solidification for 0.1-10min, and finally airing to form a film.
7. The method according to claim 5, wherein the casting solution is prepared by: adding 5-30 parts of polyvinylidene fluoride powder into 100 parts of organic solvent, stirring at low temperature to completely dissolve the polyvinylidene fluoride powder into clear solution, adding fumed silica accounting for 0.05-1% of the mass of the polyvinylidene fluoride, and uniformly stirring to obtain the polyvinylidene fluoride-containing aqueous solution.
8. The production method according to claim 6, wherein the coagulating liquid is a mixture of water and an organic solvent.
9. The preparation method according to claim 7, wherein the organic solvent is one or more selected from ethanol, propanol, acetone, N-methylpyrrolidone, N-dimethylformamide, dimethylacetamide, dimethylsulfoxide, and tetrahydrofuran.
10. The method for preparing the polyvinylidene fluoride membrane of claim 5, wherein a high temperature heat treatment step is added after the step (2) in order to strengthen the hydrophobically modified polyvinylidene fluoride membrane layer.
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