CN110660709A - Thin wafer separation method and apparatus - Google Patents
Thin wafer separation method and apparatus Download PDFInfo
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- CN110660709A CN110660709A CN201910814597.6A CN201910814597A CN110660709A CN 110660709 A CN110660709 A CN 110660709A CN 201910814597 A CN201910814597 A CN 201910814597A CN 110660709 A CN110660709 A CN 110660709A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A thin wafer separating apparatus, comprising: a base unit; a negative pressure unit coupled to the seat unit; the scraper unit is arranged at the top end of the seat body unit; the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two side ends of the base unit to the center of the base unit. The thin wafer separating device is used for supporting two ends of the thin wafer attached to the film body, and then removing the film body positioned at the bottom end of the thin wafer, so that the thin wafer can keep the integrity when the thin wafer and the film body are separated from each other, and further the thin wafer is prevented from being damaged or broken. A thin wafer separation method is also disclosed.
Description
Technical Field
The present invention relates to a method and an apparatus for separating a thin wafer, and more particularly, to a method and an apparatus for separating a thin wafer and a film from each other.
Background
Under the demand of light weight and diversification of various electronic products such as mobile phones, digital cameras or chip cards, manufacturers continuously develop multifunctional substrate circuits and large-capacity memories. However, the volume of the multi-functional substrate circuit or the large-capacity memory is also developed to be light, thin, small and small in response to the current trend.
This trend or demand has made the packaging technology of the substrate circuit very challenging, and for this reason, the thinning of the chip has become a trend of the manufacturers. The thinned wafer is also referred to as a thin wafer.
However, in the conventional wafer processing method, a plurality of wafers are attached to a film body, and the wafers are moved to the next process. If the wafer and the film are to be separated from each other, a thimble is pushed out from the bottom of the film, and the wafer and the film are separated from each other by an upward pushing force.
The above processing method is applied to a wafer with a certain thickness, and the pin ejecting method cannot be applied to the thin wafer, and the thin wafer cannot be damaged or broken due to the fact that the pin ejecting method cannot bear the upward pushing force of the pin, so that various manufacturers do not consider how to damage or break the thin wafer when the thin wafer and the film body are separated from each other.
Therefore, how to solve the above-mentioned deficiencies of the prior art is a problem to be solved by the present invention.
Disclosure of Invention
The invention aims to provide a thin wafer separation method and a thin wafer separation device.
In order to achieve the purpose, the invention adopts the technical scheme that:
a thin wafer separation method comprises the following steps:
a film body, attached with at least one thin wafer, the position of the film body relative to the two ends of the thin wafer is supported by a lifting scraper unit; and
the scraper unit moves from the two ends of the thin wafer to the center of the thin wafer to scrape the film body from the bottom end of the thin wafer, so that the thin wafer and the film body are separated from each other.
The relevant content in the above technical solution is explained as follows:
1. in the above scheme, the film body attached with the thin wafer is located above a supporting seat, the supporting seat is arranged at the top end of a cover body, and a negative pressure unit provides negative pressure gas to the top end of the cover body so as to adsorb the film body on the top end of the cover body.
2. In the above scheme, the scraper unit moves from the two ends of the support seat towards the center of the support seat so as to scrape the film body from the bottom end of the thin wafer; if the thin wafer and the film body are separated from each other, the scraper unit returns to an initial position from the center of the support base, and after returning to the initial position, the scraper unit descends.
3. In the above solution, the scraper unit has two scrapers, which move from two ends of the support base towards the center of the support base, one of the scrapers maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.
In order to achieve the purpose, the invention adopts the technical scheme that:
a thin wafer separating apparatus, comprising:
a base unit;
the negative pressure unit is coupled with the seat body unit; and
the scraper unit is arranged at the top end of the seat body unit;
the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two sides of the base unit towards the center of the base unit.
The relevant content in the above technical solution is explained as follows:
1. in the above scheme, the base unit has a lower base, an upper base and a supporting base, the lower base is arranged between the negative pressure units, the upper base is arranged at the top end of the lower base, the supporting base is arranged at the top end of the upper base, and the scraper units are arranged at two ends of the supporting base.
2. In the above solution, there is a connecting rod, one end of the connecting rod is coupled to a driving unit; the seat body unit is further provided with a connecting rod seat which is coupled with the negative pressure unit and is provided with a connecting rod hole for the other end of the connecting rod to penetrate through; the thin wafer separating device further comprises a cover body, the cover body covers the connecting rod seat, the negative pressure unit, the lower seat, the upper seat, the supporting seat and the scraper unit, and the top end of the cover body is used for accommodating the supporting seat.
3. In the above solution, the driving unit is a cam assembly, a motor unit, a gear box assembly, an oil cylinder assembly, or a pneumatic cylinder assembly.
4. In the above scheme, the seat unit further has a negative pressure seat, the negative pressure seat is arranged between the negative pressure units, and the negative pressure seat is coupled with the other end of the connecting rod; the lower seat is coupled with the top end of the negative pressure seat.
5. In the above scheme, the negative pressure unit is two negative pressure pipes, and the two negative pressure pipes are coupled with a negative pressure device; two ends of the negative pressure seat are respectively provided with a groove for accommodating the two negative pressure tubes; the lower seat is provided with two lower holes, and one end of each negative pressure pipe penetrates through each lower hole; the upper seat is further provided with two upper holes, and one end of each negative pressure pipe penetrates through each upper hole; the top end of the cover body is provided with a plurality of communicated negative pressure grooves which are coupled with one end of a negative pressure pipe.
6. In the scheme, the bottom end of the lower seat is provided with a containing groove, the top end of the lower seat is provided with a power groove, the bottom end of the power groove is provided with a power hole, and the power hole enables the power groove to be communicated with the containing groove; the accommodating groove is internally provided with a power unit, and one end of the power unit extends to the power groove from the power hole; the power groove is internally provided with a linkage unit which is respectively coupled with the scraper unit and one end of the power groove, which extends to the power groove.
7. In the above scheme, the power unit is a motor; the scraper unit is provided with two scrapers; the linkage unit is two racks which are meshed with each other, and each rack is coupled with the corresponding scraper and is coupled with the power unit to extend to one end of the power groove.
8. In the above solution, the supporting seat has at least one guiding hole, and one end of the scraper unit extends from the guiding hole to the lower seat; the top end of the cover body is provided with a seat hole for the support seat to extend into, and the top end of the cover body is further provided with a plurality of communicated negative pressure grooves which are coupled with the negative pressure units.
9. In the above solution, the support base is provided with a film body having a thin wafer, the film body is supported by the raised scraper units relative to the positions of the two ends of the thin wafer, the scrapers move from the two ends of the support base towards the center of the support base, one of the scrapers maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.
The working principle and the advantages of the invention are as follows:
the invention provides a thin wafer separating device, comprising: a base unit; a negative pressure unit coupled to the seat unit; the scraper unit is arranged at the top end of the seat body unit; the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two side ends of the base unit to the center of the base unit. The thin wafer separating device is used for supporting two ends of the thin wafer attached to the film body, and then removing the film body positioned at the bottom end of the thin wafer, so that the thin wafer can keep the integrity when the thin wafer and the film body are separated from each other, and further the thin wafer is prevented from being damaged or broken. A thin wafer separation method is also disclosed.
Drawings
FIG. 1 is a perspective view of a thin wafer separating apparatus according to the present invention;
FIG. 2 is a schematic perspective exploded view of the thin wafer separating apparatus of the present invention;
FIG. 3 is another exploded perspective view of the thin wafer separator of the present invention;
FIG. 4 is a schematic view of a thin wafer separating apparatus and a driving unit according to the present invention;
FIG. 5 is a schematic diagram of the operation of the doctor blade unit of the present invention for supporting a film body having a thin wafer;
FIG. 6 is a schematic view illustrating the operation of the scraper unit of the present invention to scrape the film from the thin wafer;
FIG. 7 is another schematic diagram of the operation of the scraper unit of the present invention to scrape the film from the thin wafer.
In the above drawings: 10. a connecting rod; 11. a connecting rod seat; 110. a connecting rod hole; 12. a negative pressure unit; 120. a negative pressure tube; 13. a negative pressure seat; 14. a lower seat; 140. a containing groove; 141. a power tank; 142. a power aperture; 143. a lower hole; 15. a power unit; 16. an upper seat; 160. an upper hole; 17. a supporting seat; 170. a guide hole; 18. a scraper unit; 180. a scraper; 19. a linkage unit; 190. a rack; 20. a cover body; 200. a seat hole; 201. a negative pressure tank; 30. a drive unit; 40. a thin wafer; 41. a membrane body.
Detailed Description
The invention is further described with reference to the following figures and examples:
example (b): the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure may be shown and described, and which, when modified and varied by the techniques taught herein, can be made by those skilled in the art without departing from the spirit and scope of the disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms "a", "an", "the" and "the", as used herein, also include the plural forms.
As used herein, "connected" or "positioned" refers to two or more elements or devices being in direct physical contact with each other or in indirect physical contact with each other, and may also refer to two or more elements or devices being in operation or acting on each other.
As used herein, the terms "comprising," "including," "having," and the like are open-ended terms that mean including, but not limited to.
As used herein, the term (terms), unless otherwise indicated, shall generally have the ordinary meaning as commonly understood by one of ordinary skill in the art, in this written description and in the claims. Certain words used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the disclosure.
The terms "front", "rear", "upper", "lower", "left" and "right" used herein are directional terms, and are used only for describing the positional relationship between the structures, and are not intended to limit the specific direction of the protective reaction and the practical implementation of the present invention.
Referring to fig. 1 ~ 3, the thin wafer separating apparatus according to the present invention comprises a connecting rod 10, a connecting rod base 11, a negative pressure unit 12, a negative pressure base 13, a lower base 14, a power unit 15, an upper base 16, a supporting base 17, a scraper unit 18, a linkage unit 19 and a cover 20, wherein the connecting rod base 11, the negative pressure base 13, the lower base 14, the upper base 16 and the supporting base 17 can be regarded as a base unit.
Referring to fig. 4, one end of the connecting rod 10 is coupled to a driving unit 30, and the driving unit 30 can be a cam assembly, a motor unit, a gear box assembly, an oil cylinder assembly or a pneumatic cylinder assembly. The other end of the connecting rod 10 passes through the connecting rod seat 11.
The connecting rod base 11 has a connecting rod hole 110 for the other end of the connecting rod 10 to pass through.
The negative pressure unit 12 is disposed at the top end of the connecting rod seat 10, the negative pressure unit 12 is two negative pressure pipes 120, the two negative pressure pipes 120 are coupled to a negative pressure device, and the negative pressure device is an air suction motor.
The negative pressure seat 13 is disposed between the negative pressure units 12, and the negative pressure seat 13 is coupled to the other end of the connecting rod 10. The two ends of the negative pressure seat 13 are respectively provided with a groove 130 for accommodating the negative pressure tube 120.
The lower base 14 is coupled to the top end of the negative pressure base 13, the bottom end of the lower base 14 has a receiving groove 140, the top end of the lower base 14 has a power groove 141, and the bottom end of the power groove 141 has a power hole 142. The power hole 142 communicates the power groove 141 with the pocket 140. The lower seat 14 further has two lower holes 143, and each lower hole 143 is used for one end of each negative pressure tube 120 to penetrate.
The power unit 15 is disposed in the accommodating groove 140, and one end of the power unit 15 extends from the power hole 141 to the power groove 141. The power unit 15 is a motor.
The upper seat 16 is provided at the top end of the lower seat 14. The upper seat 16 further has two upper holes 160, and each upper hole 160 is used for one end of each negative pressure pipe 120 to penetrate.
The supporting base 17 is disposed on the top end of the upper base 17, and the supporting base 17 has at least one guiding hole 170.
The scraper unit 18 has two scrapers 180, the two scrapers 180 are respectively disposed at two ends of the supporting base 17, and one end of each scraper 180 extends to the power groove 141 through the guiding hole 170.
The interlocking unit 19 is disposed in the power groove 141, and the interlocking unit 19 is two racks 190 engaged with each other. Each rack 190 is coupled to its corresponding scraper blade 180. The two racks 190 are further coupled to an end of the power unit 15 extending to the power trough 141.
The cover 20 covers one end of the link 10, the link holder 11, the negative pressure unit 12, the negative pressure holder 13, the lower holder 14, the power unit 15, the upper holder 16, the support holder 17, the scraper unit 18, and the interlocking unit 19. The top end of the cover 20 has a seat hole 200, and the seat hole 200 is used for the support seat 17 to extend into. The top of the cover 20 further has a plurality of communicating negative pressure grooves 201, and the negative pressure grooves 201 are coupled to one end of the negative pressure tube 120.
As shown in fig. 1, 2 and 5, if at least one thin wafer 40 is attached to a film body 41, the film body 41 is disposed on the top end of the cover 20. The negative pressure unit 12 provides a negative pressure, which is distributed in the negative pressure tank 201 to adsorb the membrane body 41. The film body 41 with the thin wafer 40 attached is located above the support base 17.
Referring to fig. 4, 5 and 6, when the driving unit 30 drives the link 10 to lift the scraper unit 18, the two scrapers 180 support the film body 41 with the thin wafer 40 attached thereon. The power unit 15 drives the linkage unit 19 to move the scraper 180 toward the center of the support base 17 from the two ends of the support base 17 and guided by the guide holes 170, so as to scrape the film body 41 from the bottom end of the thin film wafer 40 during the movement of the scraper 180 toward the center of the support base 17, and separate the thin film wafer 41 and the film body 40 from each other.
If the thin wafer 40 and the film body 41 have been separated from each other, the power unit 15 drives the scrapers 180 back to both ends of the supporting base 17. The driving unit 30 returns to the initial position to lower the scraper 180, so that the next operation of scraping the film body 41 can be performed again.
The invention relates to a thin wafer separation method, which comprises the following steps:
referring to fig. 1 and 5, a film 41 is attached with at least one thin chip 40. The membrane 41 is disposed on the top of the cover 20, and the negative pressure unit 12 provides a negative pressure gas to the top of the cover 20 to adhere the membrane 41 to the top of the cover 20.
The film body 41 with the thin wafer 40 attached thereon is positioned above a support base 17, and the support base 17 is provided at the top end of the lid body 20.
As shown in fig. 5 and 6, a scraper unit 18 is raised to support both ends of the film body 41 to which the thin wafer 40 is attached, and the scraper unit 18 is moved from both ends of the support base 17 toward the center of the support base 17 to scrape the film body 41 from the bottom end of the thin wafer 40, so that the thin wafer 40 and the film body 41 are separated from each other.
Referring to fig. 6 again, when the scraper unit 18 moves from the two ends of the supporting base 17 toward the center of the supporting base 17, the film body 41 at the bottom end of the thin wafer 40 begins to drop from the end of the thin wafer 40 toward the center thereof, i.e., the film body 41 begins to separate from the end of the thin wafer 40 toward the center thereof.
Referring to fig. 7 and 2, when the doctor blade unit 18 is located at the center of the supporting base 17, one of the two doctor blades 180 can maintain the original position, and the other doctor blade 180 can be lowered to a position, so that the thin wafer 40 and the film body 41 are separated from each other.
If the thin wafer 40 and the film body 41 are separated from each other, the blade unit 18 is returned to the initial position from the center of the support base 17, and after returning to the initial position, the blade unit 18 is lowered.
In summary, the thin wafer 40 attached to the film body 41 is firstly disposed at the top end of the supporting base 17, the scraper unit 18 supports the thin wafer 40, and then the scraper unit 18 moves from the two ends of the thin wafer 40 toward the center of the thin wafer 40 to scrape the film body 41 at the bottom end of the thin wafer 40.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (14)
1. A thin wafer separation method is characterized in that: the method comprises the following steps:
a film body, attached with at least one thin wafer, the position of the film body relative to the two ends of the thin wafer is supported by a lifting scraper unit; and
the scraper unit moves from the two ends of the thin wafer to the center of the thin wafer to scrape the film body from the bottom end of the thin wafer, so that the thin wafer and the film body are separated from each other.
2. The method of claim 1, wherein: the film body attached with the thin wafer is positioned above a supporting seat, the supporting seat is arranged at the top end of a cover body, and a negative pressure unit provides negative pressure gas to the top end of the cover body so as to adsorb the film body on the top end of the cover body.
3. The method of claim 2, wherein: the scraper unit moves from the two ends of the supporting seat to the center of the supporting seat so as to scrape the film body from the bottom end of the thin wafer; if the thin wafer and the film body are separated from each other, the scraper unit returns to an initial position from the center of the support base, and after returning to the initial position, the scraper unit descends.
4. The method of claim 2, wherein: the scraper unit is provided with two scrapers which move from two ends of the supporting seat to the center of the supporting seat, one of the scrapers maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.
5. A thin wafer separating apparatus, characterized in that: it comprises the following components:
a base unit;
the negative pressure unit is coupled with the seat body unit; and
the scraper unit is arranged at the top end of the seat body unit;
the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two sides of the base unit towards the center of the base unit.
6. The apparatus of claim 5, wherein: the base unit is provided with a lower base, an upper base and a supporting base, the lower base is arranged between the negative pressure units, the upper base is arranged at the top end of the lower base, the supporting base is arranged at the top end of the upper base, and the scraper unit is arranged at two ends of the supporting base.
7. The apparatus of claim 6, wherein: further has a connecting rod, one end of the connecting rod is coupled with a driving unit; the seat body unit is further provided with a connecting rod seat which is coupled with the negative pressure unit and is provided with a connecting rod hole for the other end of the connecting rod to penetrate through; the thin wafer separating device further comprises a cover body, the cover body covers the connecting rod seat, the negative pressure unit, the lower seat, the upper seat, the supporting seat and the scraper unit, and the top end of the cover body is used for accommodating the supporting seat.
8. The apparatus of claim 7, wherein: the driving unit is a cam assembly, a motor unit, a gear box assembly, an oil hydraulic cylinder assembly or a pneumatic cylinder assembly.
9. The apparatus of claim 7, wherein: the seat body unit is further provided with a negative pressure seat which is arranged between the negative pressure units and is coupled with the other end of the connecting rod; the lower seat is coupled with the top end of the negative pressure seat.
10. The apparatus of claim 9, wherein: the negative pressure unit is two negative pressure pipes which are coupled with a negative pressure device; two ends of the negative pressure seat are respectively provided with a groove for accommodating the two negative pressure tubes; the lower seat is provided with two lower holes, and one end of each negative pressure pipe penetrates through each lower hole; the upper seat is further provided with two upper holes, and one end of each negative pressure pipe penetrates through each upper hole; the top end of the cover body is provided with a plurality of communicated negative pressure grooves which are coupled with one end of a negative pressure pipe.
11. The apparatus of claim 6, wherein: the bottom end of the lower seat is provided with a containing groove, the top end of the lower seat is provided with a power groove, the bottom end of the power groove is provided with a power hole, and the power hole enables the power groove to be communicated with the containing groove; the accommodating groove is internally provided with a power unit, and one end of the power unit extends to the power groove from the power hole; the power groove is internally provided with a linkage unit which is respectively coupled with the scraper unit and one end of the power groove, which extends to the power groove.
12. The apparatus of claim 10, wherein: the power unit is a motor; the scraper unit is provided with two scrapers; the linkage unit is two racks which are meshed with each other, and each rack is coupled with the corresponding scraper and is coupled with the power unit to extend to one end of the power groove.
13. The apparatus of claim 6, wherein: the supporting seat is provided with at least one guide hole, and one end of the scraper unit extends to the lower seat from the guide hole; the top end of the cover body is provided with a seat hole for the support seat to extend into, and the top end of the cover body is further provided with a plurality of communicated negative pressure grooves which are coupled with the negative pressure units.
14. The apparatus of claim 12, wherein: the support base is provided with a film body with a thin wafer, the film body is supported by the scraper units which are lifted relative to the positions of the two ends of the thin wafer, the scrapers move from the two ends of the support base towards the center of the support base, one scraper maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910814597.6A CN110660709B (en) | 2019-08-30 | 2019-08-30 | Thin wafer separation method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910814597.6A CN110660709B (en) | 2019-08-30 | 2019-08-30 | Thin wafer separation method and apparatus |
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| CN110660709A true CN110660709A (en) | 2020-01-07 |
| CN110660709B CN110660709B (en) | 2022-03-29 |
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| CN201910814597.6A Active CN110660709B (en) | 2019-08-30 | 2019-08-30 | Thin wafer separation method and apparatus |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150214A (en) * | 2003-11-12 | 2005-06-09 | Renesas Technology Corp | Method for manufacturing semiconductor device, and semiconductor manufacturing equipment used therefor |
| US20140238618A1 (en) * | 2013-02-28 | 2014-08-28 | Samsung Electronics Co., Ltd. | Die ejector and die separation method |
| CN109449108A (en) * | 2018-12-18 | 2019-03-08 | 吉林华微电子股份有限公司 | Membrane removal machine slide holder and silicon wafer processing equipment |
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2019
- 2019-08-30 CN CN201910814597.6A patent/CN110660709B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150214A (en) * | 2003-11-12 | 2005-06-09 | Renesas Technology Corp | Method for manufacturing semiconductor device, and semiconductor manufacturing equipment used therefor |
| US20140238618A1 (en) * | 2013-02-28 | 2014-08-28 | Samsung Electronics Co., Ltd. | Die ejector and die separation method |
| CN109449108A (en) * | 2018-12-18 | 2019-03-08 | 吉林华微电子股份有限公司 | Membrane removal machine slide holder and silicon wafer processing equipment |
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| CN110660709B (en) | 2022-03-29 |
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