CN110653498B - Sapphire glass laser processing platform and laser cutting equipment - Google Patents
Sapphire glass laser processing platform and laser cutting equipment Download PDFInfo
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- CN110653498B CN110653498B CN201810685545.9A CN201810685545A CN110653498B CN 110653498 B CN110653498 B CN 110653498B CN 201810685545 A CN201810685545 A CN 201810685545A CN 110653498 B CN110653498 B CN 110653498B
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- sapphire glass
- lifting
- processing platform
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The embodiment of the invention relates to the technical field of laser cutting, and discloses a sapphire glass laser processing platform and laser cutting equipment. The sapphire glass laser processing platform includes one or more processing stations. The processing station includes: an installation body, a lifting part and a workpiece adsorption part; the lifting part and the workpiece adsorption part are assembled on the mounting body. The mounting body is provided with a mounting groove and a vacuum cavity; the lifting part comprises a jacking assembly and a lifting structure; the jacking assembly is arranged in the mounting groove and acts on the lifting structure; the workpiece adsorption part comprises a sealing unit and one or more adsorption pieces; the sealing unit is used for sealing the vacuum cavity; the suction member is assembled with the sealing unit and communicates with the vacuum chamber. The sapphire glass laser processing platform and the laser cutting equipment in the embodiment of the invention can keep the glass and the excess materials at the cutting path on the sapphire glass in a suspended state, and prevent laser beams from damaging the sapphire glass laser processing platform in the laser cutting process.
Description
Technical Field
The embodiment of the invention relates to the technical field of laser cutting, and discloses a sapphire glass laser processing platform and laser cutting equipment.
Background
With the rapid development of laser cutting technology, the application range of laser cutting equipment is wider and wider, and the precision and the efficiency of laser cutting are higher and higher.
When the sapphire glass is cut by adopting laser cutting equipment, the sapphire glass is generally fixed or limited by a processing platform, in order to avoid the damage of a laser beam to the processing platform in the laser cutting process, the sapphire glass needs to be supported, and the glass and the excess materials at the cutting path on the sapphire glass keep a suspended state. The sapphire glass is fed to the machining platform or is discharged from the machining platform, the machining platform is required to be kept flat, and therefore the sapphire glass is convenient to position and clear excess materials after cutting.
In the process of researching the invention, the inventor finds that the processing platform in the prior art cannot keep the glass and the residual materials at the cutting path of the sapphire glass in a suspended state.
Disclosure of Invention
The embodiment of the invention discloses a sapphire glass laser processing platform and laser cutting equipment, which can keep glass and excess materials at a cutting path on sapphire glass in a suspended state.
One or more embodiments of the present invention disclose a sapphire glass laser processing platform that includes one or more processing stations. The processing station includes: an installation body, a lifting part and a workpiece adsorption part; the lifting unit and the work sucking unit are assembled to the mounting body. The mounting body is provided with a mounting groove and a vacuum cavity; the lifting part comprises a jacking assembly and a lifting structure; the jacking assembly is arranged in the mounting groove and acts on the lifting structure; the workpiece adsorption part comprises a sealing unit and one or more adsorption pieces; the sealing unit is used for sealing the vacuum cavity; the suction member is assembled with the sealing unit and communicates with the vacuum chamber.
In one or more embodiments of the invention, the jacking assembly comprises: the jacking push rod, the rotating shaft and the connecting piece; a strip-shaped groove is formed in the jacking push rod, one end of the rotating shaft is arranged in the strip-shaped groove, the other end of the rotating shaft is arranged on the connecting piece, and the connecting piece is connected with the lifting structure.
In one or more embodiments of the present invention, the jacking assembly further includes a resetting unit, and the resetting unit acts on the jacking push rod to reset the jacking push rod.
In one or more embodiments of the present invention, the reset unit includes an elastic member and a fixing member; the elastic piece is clamped and pressed between the jacking push rod and the fixed piece; the fixing piece is arranged on the mounting body and used for fixing the position of the elastic piece.
In one or more embodiments of the present invention, the jacking assembly further includes an adjusting unit, and the adjusting unit is configured to adjust a position of the jacking rod in the mounting groove, so as to adjust a position of the rotating shaft in the strip-shaped groove.
In one or more embodiments of the present invention, the lifting structure includes: the device comprises a transmission frame, a lifting plate and a plurality of sliding units; the transmission frame is connected with the jacking assembly, the lifting plate is arranged on the transmission frame, and the plurality of sliding units are arranged between the transmission frame and the installation body; the jacking assembly drives the transmission frame, and the transmission frame drives the lifting plate.
In one or more embodiments of the present invention, one or more through holes are formed on the lifting plate, and the adsorption member is received in the through holes.
In one or more embodiments of the present invention, the sliding unit includes a slide rail and a slider; the slide rail is installed on the installation body, the slider is installed on the transmission frame, the installation body with pass through between the transmission frame the slide rail with the slider produces the slip.
In one or more embodiments of the present invention, the sealing unit includes a sealing ring and a sealing plate; a sealing groove is formed on the mounting body, and the sealing ring is arranged in the sealing groove; the sealing plate is fastened on the mounting body and used for covering the vacuum cavity and pressing the sealing ring.
One or more embodiments of the present invention disclose a laser cutting apparatus including any one of the above sapphire glass laser processing platforms.
Compared with the prior art, the technical scheme disclosed by the invention mainly has the following beneficial effects:
in an embodiment of the present invention, the sapphire glass laser processing platform includes one or more processing stations. The processing station includes: an installation body, a lifting part and a workpiece adsorption part; the lifting unit and the work sucking unit are assembled to the mounting body. The mounting body is provided with a mounting groove and a vacuum cavity; the lifting part comprises a jacking assembly and a lifting structure; the jacking assembly is arranged in the mounting groove and acts on the lifting structure; the workpiece adsorption part comprises a sealing unit and one or more adsorption pieces; the sealing unit is used for sealing the vacuum cavity; the suction member is assembled with the sealing unit and communicates with the vacuum chamber. In the embodiment of the invention, the jacking assembly drives the lifting structure to ascend, so that a structure for bearing the sapphire glass in the lifting structure is flush with the top surface of the adsorption piece, namely, the processing station is kept flat. The lifting assembly drives the lifting structure to descend, so that a structure for bearing the sapphire glass in the lifting structure is lower than the top surface of the adsorption piece, and at the moment, the glass and the excess materials at the cutting path on the sapphire glass adsorbed by the adsorption piece are kept in a suspended state. The vacuum adsorption device is characterized in that the adsorption piece is of a hollow structure, the top surface of the adsorption piece can be in close contact with the sapphire glass, and the sapphire glass is adsorbed on the top surface of the adsorption piece by generating negative pressure in the vacuum cavity. In the embodiment of the invention, the sapphire glass laser processing platform drives the lifting structure to ascend through the jacking assembly, so that a structure for bearing sapphire glass in the lifting structure is flush with the top surface of the adsorption piece, namely, the processing station is kept flat. In the embodiment of the invention, the sapphire glass laser processing platform drives the lifting structure to descend through the jacking assembly, so that a structure for bearing the sapphire glass in the lifting structure is lower than the top surface of the adsorption piece, and the glass and the residual materials at the cutting path on the sapphire glass adsorbed by the adsorption piece are kept in a suspended state. In the embodiment of the invention, the sapphire glass laser processing platform can not only be subjected to loading and unloading without being influenced by the adsorption piece, but also the glass and the excess materials at the cutting path on the sapphire glass are kept in a suspended state, so that the laser beam is prevented from damaging the sapphire glass laser processing platform in the laser cutting process. Sapphire glass laser processing platform is favorable to improving sapphire glass's cutting quality, can adopt the multistation moreover, and then is favorable to improving sapphire glass's cutting efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
FIG. 1 is a perspective view of a sapphire glass laser processing platform in an embodiment of the present invention;
FIG. 2 is a structural view of a mounting body in an embodiment of the present invention;
FIG. 3 is an exploded view of the sapphire glass laser processing platform in an embodiment of the present invention;
FIG. 4 is a diagram illustrating the construction of the jacking-pushing rod according to an embodiment of the present invention;
FIG. 5 is a view showing the construction of the rotary shaft and the connecting member according to an embodiment of the present invention;
FIG. 6 is a diagram illustrating the structure of the reset unit according to an embodiment of the present invention;
FIG. 7 is a configuration diagram of the adjusting unit according to an embodiment of the present invention;
FIG. 8 is a view showing the construction of a first driving plate of the driving frame according to an embodiment of the present invention;
FIG. 9 is a view showing the construction of a second driving plate of the driving frame according to an embodiment of the present invention;
FIG. 10 is a view showing the construction of a third driving plate of the driving frame according to the embodiment of the present invention;
FIG. 11 is a structural view of the lifter plate according to an embodiment of the present invention;
FIG. 12 is a configuration view of the sliding unit according to an embodiment of the present invention;
fig. 13 is a schematic diagram of a product and a remainder after the sapphire glass is cut by the laser cutting apparatus according to an embodiment of the present invention.
Description of reference numerals:
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The invention discloses a sapphire glass laser processing platform in one embodiment, which comprises one or more processing stations. The sapphire glass laser processing platform is applied to laser cutting equipment. In one possible use scenario, the sapphire glass laser processing platform is used to adsorb sapphire glass. When the laser cutting equipment cuts the sapphire glass, the sapphire glass laser processing platform enables the glass and the excess materials at the cutting path on the sapphire glass to be kept in a suspended state. Sapphire glass is loaded to sapphire glass laser processing platform or is followed when sapphire glass laser processing platform unloading, need sapphire glass laser processing platform keeps leveling to clear away the clout after accomplishing sapphire glass fixes a position and the cutting.
Referring to fig. 1, 2 and 3, fig. 1 is a perspective view of a sapphire glass laser processing platform according to an embodiment of the present invention, fig. 2 is a structural view of a mounting body 1 according to an embodiment of the present invention, and fig. 3 is an exploded view of the sapphire glass laser processing platform according to an embodiment of the present invention.
As illustrated in fig. 1, the sapphire glass laser processing platform includes two identically configured processing stations. One of the processing stations comprises: the mounting body 1, the lifting unit 2, and the work sucking unit 3. The lifting unit 2 and the work sucking unit 3 are assembled to the mounting body 1. After the lifting part 2 is lifted, the sapphire glass laser processing platform can be kept flat, so that sapphire glass can be conveniently fed to the sapphire glass laser processing platform and then positioned. In addition, when the sapphire glass laser processing platform is used for blanking, the lifting part 2 is also lifted so as to remove the residual material after the cutting of the sapphire glass is finished. The workpiece adsorption part 3 is used for adsorbing sapphire glass in the laser cutting process, and after the sapphire glass is cut, the workpiece adsorption part 3 still adsorbs a product obtained by cutting.
As illustrated in fig. 2 and 3, the installation body 1 is formed with an installation groove 11 and a vacuum chamber 12. The lifting part 2 comprises a jacking assembly 21 and a lifting structure 22. Jacking subassembly 21 is installed in mounting groove 11, jacking subassembly 21 acts on elevation structure 22. The work suction portion 3 includes a sealing unit 31 and one or more suction members 32. The sealing unit 31 is used to seal the vacuum chamber 12. The suction member 32 is assembled with the sealing unit 31 and communicates with the vacuum chamber 12. In the embodiment of the present invention, the lifting assembly 21 drives the lifting structure 22 to ascend, so that the structure for bearing the sapphire glass in the lifting structure 22 is flush with the top surface of the adsorption member 32, that is, the processing station is kept flat. The lifting assembly 21 drives the lifting structure 22 to descend, so that a structure for bearing the sapphire glass in the lifting structure 22 is lower than the top surface of the adsorption piece 32, and at the moment, the glass and the excess materials at the cutting path on the sapphire glass adsorbed by the adsorption piece 32 keep a suspended state. The adsorbing member 32 has a hollow structure, and the top surface of the adsorbing member 32 can be in close contact with the sapphire glass, so that the sapphire glass is adsorbed on the top surface of the adsorbing member 32 by generating a negative pressure in the vacuum chamber 12.
In the above embodiment, the sapphire glass laser processing platform drives the lifting structure 22 to ascend through the jacking assembly 21, so that the structure for bearing sapphire glass in the lifting structure 22 is flush with the top surface of the adsorption piece 32, that is, the processing station is kept flat. The sapphire glass laser processing platform in the above embodiment drives the lifting structure 22 to descend through the jacking assembly 21, so that the structure for bearing the sapphire glass in the lifting structure 22 is lower than the top surface of the adsorption piece 32, and at this time, the glass and the excess material at the cutting path on the sapphire glass adsorbed by the adsorption piece 32 are kept in a suspended state. The sapphire glass laser processing platform in the above embodiment can not only prevent the feeding and the discharging from being affected by the adsorption piece 32, but also prevent the laser beam from damaging the sapphire glass laser processing platform because the glass and the excess materials at the cutting path on the sapphire glass are in a suspended state. Sapphire glass laser processing platform is favorable to improving sapphire glass's cutting quality, can adopt the multistation moreover, and then is favorable to improving sapphire glass's cutting efficiency.
With further reference to fig. 3, the jacking assembly 21 comprises: jacking push rod 211, rotating shaft 212 and connecting piece 213. The rotating shaft 212 is assembled with the jacking push rod 211 and the connecting piece 213. When the jacking push rod 211 is pushed, the rotating shaft 212 moves relative to the jacking push rod 211, and the connecting piece 213 is driven to ascend or descend by the jacking push rod 211.
Referring to fig. 3, 4 and 5, fig. 4 is a structural view of the jacking push rod 211 according to an embodiment of the present invention, and fig. 5 is a structural view of the rotating shaft 212 and the connecting member 213 according to an embodiment of the present invention. As illustrated in fig. 4 and 5, a strip-shaped groove 211a is formed on the jacking push rod 211, one end of the rotating shaft 212 is installed in the strip-shaped groove 211a, the other end of the rotating shaft 212 is installed on the connecting member 213, and the connecting member 213 is connected to the lifting structure 22. In the embodiment of the present invention, the strip groove 211a is inclined to the lifting direction of the connecting member 213. When the jacking push rod 211 is pushed, the rotating shaft 212 slides along the strip-shaped groove 211 a. The moving direction of the rotating shaft 212 may be decomposed into a moving direction opposite to the moving direction of the jacking push rod 211 and a moving direction perpendicular to the moving direction of the jacking push rod 211. Because the rotating shaft 212 is connected to the connecting member 213 and the connecting member 213 is connected to the lifting structure 22, when the lifting push rod 211 is pushed, the rotating shaft 212 drives the connecting member 213 and the lifting structure 22 to ascend. When the jacking push rod 211 is reset, the rotating shaft 212 drives the connecting piece 213 and the lifting structure 22 to descend.
With further reference to fig. 3, the jacking assembly 21 further includes a resetting unit 214, and the resetting unit 214 acts on the jacking push rod 211 to reset the jacking push rod 211. When the jacking push rod 211 is pushed, the reset unit 214 will react to the jacking push rod 211. When the acting force for pushing the jacking push rod 211 disappears, the reset unit 214 resets the jacking push rod 211. The jacking push rod 211 drives the connecting piece 213 and the lifting structure 22 to descend through the rotating shaft 212 in the resetting process.
Referring to fig. 3 and fig. 6, fig. 6 is a structural diagram of the reset unit 214 according to an embodiment of the present invention. As illustrated in fig. 3 and 6, the reset unit 214 includes an elastic member 214a and a fixed member 214 b. The elastic member 214a is clamped between the jacking push rod 211 and the fixing member 214 b. The fixing member 214b is mounted on the mounting body 1 for fixing the position of the elastic member 214 a. The elastic member 214a includes, but is not limited to, a spring.
With further reference to fig. 3, the jacking assembly 21 further comprises an adjustment unit 215. The adjusting unit 215 is used for adjusting the position of the jacking push rod 211 in the mounting groove 11, and further adjusting the position of the rotating shaft 212 in the strip-shaped groove 211 a. Through adjusting unit 215 can adjust the initial height of elevation structure 22, and then adjust elevation structure 22 with the maximum difference in height of the top surface of absorption piece 32 is favorable to sapphire glass laser processing platform adapts to the sapphire glass of different thickness to the requirement of maximum difference in height.
Referring to fig. 3 and 7, fig. 7 is a structural diagram of the adjusting unit 215 according to an embodiment of the present invention. As illustrated in fig. 3 and 7, the adjusting unit 215 includes an adjusting lever 215a and a stopper 215 b. One end of the adjusting rod 215a is connected with the jacking push rod 211, and the other end of the adjusting rod 215a is fixed with the limiting block 215 b. A portion of the adjustment lever 215a passes through the mounting body 1 and is screw-coupled with the mounting body 1.
Please refer to fig. 3, fig. 4 and fig. 7. As illustrated in fig. 4, an end of the lift-up push rod 211 facing the adjusting unit 215 is formed with a mounting hole 211 b. One end of the adjusting lever 215a is installed in the installation hole 211b of the adjusting unit 215 such that the adjusting lever 215a is connected with the lift-up push rod 211.
With further reference to fig. 3, the lifting structure 22 comprises: a transmission frame 221, a lifting plate 222, and a plurality of sliding units 223. The transmission frame 221 is connected to the jacking assembly 21, the lifting plate 222 is mounted on the transmission frame 221, and the plurality of sliding units 223 are mounted between the transmission frame 221 and the mounting body 1. The jacking assembly 21 drives the transmission frame 221, and the transmission frame 221 drives the lifting plate 222. The transmission frame 221 is configured to act on the lifting plate 222 under the driving of the connection member 213, so that the lifting plate 222 ascends or descends. The lifting plate 222 is used for bearing sapphire glass. After the lifting plate 222 is lifted, the top surface of the lifting plate can be flush with the top surface of the adsorption piece 32, so that loading and unloading are facilitated, and sapphire glass can be positioned conveniently. After the lifting plate 222 descends, the top surface thereof is lower than the top surface of the adsorbing member 32, and at this time, the glass and the excess material at the cutting path on the sapphire glass adsorbed by the adsorbing member 32 can be kept in a suspended state.
Referring to fig. 3, 8, 9 and 10, fig. 8 is a structural view of a first driving plate 221a of the driving frame 221 according to an embodiment of the present invention, fig. 9 is a structural view of a second driving plate 221b of the driving frame 221 according to an embodiment of the present invention, and fig. 10 is a structural view of a third driving plate 221c of the driving frame 221 according to an embodiment of the present invention. The transmission frame 221 includes: a first transmission plate 221a, a second transmission plate 221b, and a third transmission plate 221 c. One end of the first driving plate 221a is connected to the second driving plate 221b, and the other end of the first driving plate 221a is connected to the third driving plate 221 c. The connection member 213 is connected to the first driving plate 221a, and drives the first driving plate 221a, the second driving plate 221b, and the third driving plate 221c to ascend and descend.
Referring to fig. 3 and 8, a connection hole a1 is formed in the first driving plate 221a, and an end of the connection member 213 is installed in the connection hole a 1.
Referring to fig. 3 and 9, a hole B1 is formed on the second driving plate 221B, and the adjusting rod 215a and the limiting block 215B can freely pass through the hole B1. The duct B1 facilitates the installation of the adjustment lever 215a and the stopper 215B, and also facilitates the screwing of the adjustment lever 215a and the stopper 215B.
Referring to fig. 3 and 10, a groove C1 is formed on the third driving plate 221C, and the jacking rod 211 can freely pass through the groove C1. The groove C1 is convenient for the jacking push rod 211 to move and external force to act on the jacking push rod 211.
Referring to fig. 3 and 11, fig. 11 is a structural view of the lifting plate 222 according to an embodiment of the present invention. As illustrated in fig. 3 and 11, one or more through holes 222a are formed in the lifting plate 222, and the suction member 32 is received in the through holes 222 a. The suction member 32 can freely pass through the through hole 222 a. When the lifting plate 222 is lifted to a certain height, the top surface of the lifting plate 222 is flush with the top surface of the suction member 32. After the lifting plate 222 descends, a height difference is formed between the top surface of the lifting plate 222 and the top surface of the adsorption piece 32, so that the glass and the excess materials on the sapphire glass at the cutting path are kept in a suspended state.
Referring to fig. 3 and 12, fig. 12 is a configuration diagram of the sliding unit 223 in an embodiment of the present invention. As illustrated in fig. 3 and 12, the sliding unit 223 includes a slide rail 223a and a slider 223 b. The slide rail 223a is installed on the installation body 1, the slide block 223b is installed on the transmission frame 221, and the installation body 1 and the transmission frame 221 slide through the slide rail 223a and the slide block 223 b. Through the slide rail 223a and the slide block 223b, the ascending and descending of each part of the whole transmission frame 221 are balanced, and the work is more stable.
With further reference to fig. 3, the sealing unit 31 includes a sealing ring 311 and a sealing plate 312. A sealing groove 13 is formed on the mounting body 1, and the sealing ring 311 is installed in the sealing groove 13. The sealing plate 312 is fastened to the mounting body 1, and covers the vacuum chamber 12 and presses the sealing ring 311.
With further reference to fig. 3, the mounting body 1 is further provided with a gas pipe connector 14, and the gas pipe connector 14 is communicated with the vacuum chamber 12. A device capable of generating vacuum such as an air pump is externally connected through the air pipe joint 14.
Referring to fig. 3, the mounting body 1 is further provided with a pressing block 15, and the pressing block 15 is located on the jacking push rod 211 to limit the movement of the jacking push rod 211 in the mounting groove 11, so as to prevent the jacking push rod 211 from being dislocated.
Fig. 13 is a schematic diagram of a product 10 and a remainder 20 after the sapphire glass is cut by the laser cutting apparatus according to an embodiment of the present invention. As illustrated in fig. 13, a plurality of products 10 are cut from a piece of sapphire glass. In the process of cutting the sapphire glass by the laser cutting equipment, the plurality of adsorption pieces 32 adsorb the sapphire glass at the positions of the plurality of products 10 all the time, and the glass and the remainder 20 at the cutting path on the sapphire glass are kept suspended.
In one embodiment of the invention, a laser cutting device is disclosed, which is used for cutting sapphire glass. The laser cutting apparatus includes one or more sapphire glass laser machining platforms.
Referring to fig. 1-12, the sapphire glass laser machining platform includes one or more machining stations. The processing station includes: a mounting body 1, an elevating section 2, and a work adsorbing section 3; the lifting unit 2 and the work sucking unit 3 are assembled to the mounting body 1; the mounting body 1 is provided with a mounting groove 11 and a vacuum cavity 12; the lifting part 2 comprises a jacking assembly 21 and a lifting structure 22; the jacking component 21 is arranged in the mounting groove 11, and the jacking component 21 acts on the lifting structure 22; the work suction part 3 includes a sealing unit 31 and one or more suction members 32; the sealing unit 31 is used for sealing the vacuum chamber 12; the suction member 32 is assembled with the sealing unit 31 and communicates with the vacuum chamber 12.
Further, the jacking assembly 21 includes: jacking push rod 211, rotating shaft 212 and connecting piece 213; a strip-shaped groove 211a is formed on the jacking push rod 211, one end of the rotating shaft 212 is arranged in the strip-shaped groove 211a, the other end of the rotating shaft 212 is arranged on the connecting piece 213, and the connecting piece 213 is connected with the lifting structure 22.
Further, the jacking assembly 21 further comprises a resetting unit 214, and the resetting unit 214 acts on the jacking push rod 211 to reset the jacking push rod 211.
Further, the reset unit 214 includes an elastic member 214a and a fixing member 214 b; the elastic piece 214a is clamped between the jacking push rod 211 and the fixing piece 214 b; the fixing member 214b is mounted on the mounting body 1 for fixing the position of the elastic member 214 a.
Further, the jacking assembly 21 further includes an adjusting unit 215, and the adjusting unit 215 is used for adjusting the position of the jacking push rod 211 in the mounting groove 11, and further adjusting the position of the rotating shaft 212 in the strip-shaped groove 211 a.
Further, the lifting structure 22 includes: a transmission frame 221, a lifting plate 222, and a plurality of sliding units 223; the transmission frame 221 is connected with the jacking assembly 21, the lifting plate 222 is mounted on the transmission frame 221, and the plurality of sliding units 223 are mounted between the transmission frame 221 and the mounting body 1; the jacking assembly 21 drives the transmission frame 221, and the transmission frame 221 drives the lifting plate 222.
Further, one or more through holes 222a are formed on the lifting plate 222, and the suction member 32 is accommodated in the through holes 222 a.
Further, the sliding unit 223 includes a slide rail 223a and a slider 223 b; the slide rail 223a is installed on the installation body 1, the slide block 223b is installed on the transmission frame 221, and the installation body 1 and the transmission frame 221 slide through the slide rail 223a and the slide block 223 b.
Further, the sealing unit 31 includes a sealing ring 311 and a sealing plate 312; a sealing groove 13 is formed on the mounting body 1, and the sealing ring 311 is mounted in the sealing groove 13; the sealing plate 312 is fastened to the mounting body 1, and covers the vacuum chamber 12 and presses the sealing ring 311.
Referring to fig. 1 to 13, the process of cutting a plurality of products on sapphire glass by the laser cutting apparatus will be briefly described as follows: the jacking rod 211 is pushed by an external force (e.g. an air cylinder), and in the process that the jacking rod 211 moves into the installation body 1, the connecting member 213, the transmission frame 221 and the lifting plate 222 are driven by the rotating shaft 212 to ascend, so that the top surface of the lifting plate 222 is flush with the top surfaces of the plurality of adsorption members 32. Then, the sapphire glass is placed on the top surface of the lifting plate 222, and the plurality of adsorption members 32 adsorb the sapphire glass after the sapphire glass is positioned. The resetting unit 214 pushes the jacking push rod 211 to reset, and the jacking push rod 211 drives the connecting piece 213, the transmission frame 221 and the lifting plate 222 to descend through the rotating shaft 212 in the resetting process, so that the glass and the excess materials 20 at the cutting path on the sapphire glass are kept suspended. The laser cutting apparatus outputs laser to cut a plurality of products 10 on the sapphire glass, and the remnants 20 fall onto the lifting plate 222. The jacking push rod 211 is pushed by external force again, and the jacking push rod 211 drives the connecting piece 213, the transmission frame 221 and the lifting plate 222 to ascend through the rotating shaft 212 in the process of moving towards the inside of the installation body 1, so that excess materials can be removed and the product 10 can be taken down.
When the techniques in the various embodiments described above are implemented using software, the computer instructions and/or data to implement the various embodiments described above may be stored on a computer-readable medium or transmitted as one or more instructions or code on a readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that a computer can store. Taking this as an example but not limiting: computer-readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Further, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, Digital Subscriber Line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium.
Finally, it should be noted that: the above examples are only for illustrating the technical solutions of the present application, and are not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (8)
1. A sapphire glass laser processing platform, including one or more processing stations, characterized in that the processing station includes: an attachment body (1), a lifting unit (2), and a work suction unit (3); the lifting part (2) and the workpiece adsorption part (3) are assembled on the mounting body (1);
the mounting body (1) is provided with a mounting groove (11) and a vacuum cavity (12); the lifting part (2) comprises a jacking assembly (21) and a lifting structure (22); the jacking component (21) is arranged in the mounting groove (11), and the jacking component (21) acts on the lifting structure (22); the workpiece adsorption part (3) comprises a sealing unit (31) and one or more adsorption pieces (32); the sealing unit (31) is used for sealing the vacuum cavity (12); the suction member (32) is assembled with the sealing unit (31) and communicates with the vacuum chamber (12);
the lifting structure (22) comprises: a transmission frame (221), a lifting plate (222) and a plurality of sliding units (223); the transmission frame (221) is connected with the jacking assembly (21), the lifting plate (222) is arranged on the transmission frame (221), and the plurality of sliding units (223) are arranged between the transmission frame (221) and the installation body (1);
the jacking assembly (21) drives the transmission frame (221), and the transmission frame (221) drives the lifting plate (222);
one or more through holes (222a) are formed in the lifting plate (222), and the adsorption piece (32) is accommodated in the through holes (222 a).
2. The sapphire glass laser processing platform of claim 1, wherein the lift-off assembly (21) comprises: the lifting push rod (211), the rotating shaft (212) and the connecting piece (213); a strip-shaped groove (211a) is formed in the jacking push rod (211), one end of the rotating shaft (212) is installed in the strip-shaped groove (211a), the other end of the rotating shaft (212) is installed on the connecting piece (213), and the connecting piece (213) is connected with the lifting structure (22).
3. The sapphire glass laser processing platform of claim 2, wherein the jacking assembly (21) further comprises a resetting unit (214), and the resetting unit (214) acts on the jacking push rod (211) to reset the jacking push rod (211).
4. The sapphire glass laser processing platform of claim 3, wherein the reset unit (214) comprises a resilient member (214a) and a fixed member (214 b); the elastic piece (214a) is clamped between the jacking push rod (211) and the fixing piece (214 b); the fixing piece (214b) is arranged on the mounting body (1) and used for fixing the position of the elastic piece (214 a).
5. The sapphire glass laser processing platform of claim 2, wherein the jacking assembly (21) further comprises an adjusting unit (215), and the adjusting unit (215) is used for adjusting the position of the jacking push rod (211) in the mounting groove (11), so as to adjust the position of the rotating shaft (212) in the strip-shaped groove (211 a).
6. The sapphire glass laser processing platform of claim 1, wherein the slide unit (223) comprises a slide rail (223a) and a slider (223 b); the slide rail (223a) is installed on the installation body (1), the slider (223b) is installed on the transmission frame (221), and the installation body (1) and the transmission frame (221) slide through the slide rail (223a) and the slider (223 b).
7. The sapphire glass laser processing platform of claim 1, wherein the sealing unit (31) includes a sealing ring (311) and a sealing plate (312); a sealing groove (13) is formed in the mounting body (1), and the sealing ring (311) is arranged in the sealing groove (13); the sealing plate (312) is fastened to the mounting body (1) for covering the vacuum chamber (12) and pressing the sealing ring (311).
8. A laser cutting apparatus comprising the sapphire glass laser processing platform of any one of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810685545.9A CN110653498B (en) | 2018-06-28 | 2018-06-28 | Sapphire glass laser processing platform and laser cutting equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810685545.9A CN110653498B (en) | 2018-06-28 | 2018-06-28 | Sapphire glass laser processing platform and laser cutting equipment |
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| Publication Number | Publication Date |
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| CN110653498A CN110653498A (en) | 2020-01-07 |
| CN110653498B true CN110653498B (en) | 2021-09-21 |
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| CN201810685545.9A Active CN110653498B (en) | 2018-06-28 | 2018-06-28 | Sapphire glass laser processing platform and laser cutting equipment |
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| CN111844473B (en) * | 2020-07-23 | 2021-11-30 | 重庆电子工程职业学院 | Ceramic tile cutting device and cutting method based on computer control |
| CN112620966B (en) * | 2020-10-23 | 2022-05-03 | 中国空气动力研究与发展中心高速空气动力研究所 | Transition tape cutting and bearing device |
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| WO2010027712A2 (en) * | 2008-08-26 | 2010-03-11 | Applied Materials, Inc. | Laser material removal methods and apparatus |
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| CN102468120A (en) * | 2010-11-03 | 2012-05-23 | Qmc株式会社 | Laser processing device and laser processing method using the same |
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