CN110641841B - Wafer frame carrier - Google Patents
Wafer frame carrier Download PDFInfo
- Publication number
- CN110641841B CN110641841B CN201810919997.9A CN201810919997A CN110641841B CN 110641841 B CN110641841 B CN 110641841B CN 201810919997 A CN201810919997 A CN 201810919997A CN 110641841 B CN110641841 B CN 110641841B
- Authority
- CN
- China
- Prior art keywords
- wafer frame
- frame carrier
- plate
- opening
- side plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 230000002265 prevention Effects 0.000 claims description 2
- 239000011859 microparticle Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 42
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
- B65D25/107—Grooves, ribs, or the like, situated on opposed walls and between which the articles are located
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/307—Local shock-absorbing elements, e.g. elastic rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer frame carrier, which comprises a box body. The box body is composed of an opening, a top plate, a bottom plate, a back plate and two side plates. Wherein each side plate includes a cassette structure. And a metal anti-collision part is arranged at the rear of each cassette structure to prevent the cassette body from being damaged due to collision when micro particles are generated or the cassette body is placed into the wafer frame.
Description
Technical Field
The present invention relates to a wafer frame carrier, and more particularly to a wafer frame carrier having a metal bump stopper at the rear of a cassette structure.
Background
In the semiconductor transportation industry, the storage or transportation of various semiconductor devices or semiconductor semi-finished products has become a very important issue. In the case of the automated machines that are commonly used, it is necessary to test the properties of the carrier, such as the reduction of particle generation, the anti-static property, and the air-tightness, in order to transport the desired material or semiconductor device to the desired location.
Semiconductor devices that are often required to be stored or transported include wafers, substrates, masks or Wafer frames (Wafer frames), and the like. And the dimensions used in different semiconductor processes are different, carriers of different sizes are derived.
The Wafer Frame (Wafer Frame) may also be called a Tape Frame (Tape Frame), and its main function is to be used as a semiconductor device for fixing during Wafer dicing. And the wafer frame is most likely transported by a special carrier.
However, most of the conventional wafer frame carriers are made of a polymeric box body by integral molding, and when the wafer frame is inserted into the box body, the wafer frame often collides with the stopper. The hardness of metals is generally high upon impact of the metal with the polymer. Therefore, even if the polymer material has high hardness and is wear-resistant, the polymer material is likely to be damaged or fine particles are likely to be generated over time.
Further, the wafer frame itself is a heavy metal. Therefore, when the wafer frame carrier is transported by the overhead traveling crane, the wafer frame carrier is easily deformed due to stress caused by the weight. Once the box body is deformed, the original required air tightness of the box body may disappear.
However, if the supporting member is protruded from the door plate too much, the opening of the wafer frame carrier may be scratched when the robot arm moves the door plate up and down during the door opening operation. Therefore, the conventional wafer frame carrier has many inconveniences in use, and improvement is urgently needed.
Disclosure of Invention
To solve the above-mentioned problems, the present invention provides a wafer frame carrier. The wafer frame carrier mainly comprises a box body, two cassette structures, two metal anti-collision parts and a door plate.
The box body comprises an opening, a top plate, a bottom plate, a rear plate and a containing space formed by the two side plates. The two clamping box structures are arranged on the two side plates in the accommodating space, and the two metal anti-collision parts are sequentially arranged on one side, close to the rear plate, of the rear part of the clamping box structures. And the door plate is covered with the opening. The two metal anti-collision parts are fixed on the two side plates sequentially through a plurality of locking components.
The foregoing summary of the invention is provided to introduce a basic description of several aspects and features of the present invention. This summary is not an extensive overview of the invention, and is intended to neither identify key or critical elements of the invention nor delineate the scope of the invention, but to present some concepts of the invention in a simplified form.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the opened and internal structure of the embodiment of the invention;
FIG. 3 is a schematic diagram of a sustaining structure according to an embodiment of the present invention;
FIG. 4 is a partial schematic view of a sustaining structure according to an embodiment of the present invention;
FIG. 5 is a schematic view of a retaining structure and a door panel with a relatively protruding area according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a cartridge according to an embodiment of the present invention;
FIG. 7 is a schematic view of an embedded structure of a locking assembly according to an embodiment of the present invention.
The reference numbers illustrate:
The bottom plate 103
Rear plate 104
Air-tight rib 1051
Metal bumper 107
Buried assembly 109
Door panel 200
Abutting part 201
Through hole 2012
Clamping assembly 2014
Door latch 202
Securing assembly 301
Carrying handle 500
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through internal communication or interaction of two components, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
First, referring to fig. 1 and fig. 2, fig. 1 is an appearance structure diagram of an embodiment of the present invention; fig. 2 is a schematic diagram of the opened and internal structure of the embodiment of the invention. As shown in fig. 1 and 2, the wafer frame carrier 10 mainly includes a box 100, two cassette structures 106 (another cassette structure 106 not shown in fig. 2 is disposed on the inner side of the side plate 105 opposite to the side plate 106 in fig. 2), two metal anti-collision portions 107 (another metal anti-collision portion 107 not shown in fig. 2 is disposed on the inner side of the side plate 105 opposite to the side plate 106 in fig. 2), and a door panel 200.
The box 100 includes an opening 101, a top plate 102, a bottom plate 103, a back plate 104 and two side plates 105, which together form an accommodating space. And the cassette structure 106 is arranged on the two side plates 105 in the accommodating space. More specifically, the accommodating space is formed on the two side plates 105. The metal anti-collision parts 107 are sequentially arranged on one side of the rear part of the cassette structure 106 close to the rear plate 104. The door panel 200 can cover the opening 101. And the metal anti-collision parts 107 on the left and right sides are sequentially fixed on the two side plates 105 through a plurality of locking assemblies 108.
By the design of the embodiment shown in fig. 1 and 2, the metal bumper portions 107 on the left and right sides can replace the side plates 105 of the entire cassette 100 to withstand the impact of the wafer frame when the cassette structure 106 is placed in the wafer frame. Since the metal bump 107 can be made of high hardness metal such as stainless steel, high speed steel or aluminum alloy, it is further prevented that the wafer frame made of metal collides with the case 100, which may cause damage and further cause poor air tightness or generation of fine particles. For the convenience of the technician to carry, the top plate 102 of the box 100 of the wafer frame carrier 10 of the present embodiment further has at least one handle 500.
In addition, as shown in fig. 2, in the present embodiment, a deformation preventing member 300 is further disposed on a side of the top plate 102 close to the opening. In this embodiment, the deformation preventing member 300 is a metal strip, and a plurality of fixing holes (not shown, passed through by the plurality of fixing elements 301) are formed on the metal strip, and the plurality of fixing elements 301 pass through the plurality of fixing holes to fix the metal strip to the side of the top plate 102 close to the opening 101. The anti-deformation member 300 is mainly designed because the wafer frame carried by the wafer frame carrier 10 is mostly made of heavy metal. Therefore, when the wafer frame carrier 10 is fully loaded, the overhead traveling crane lifts the wafer frame carrier 10, which easily causes deformation of the opening 101.
Once the opening 101 is deformed, the sealing between the box 100 and the door 200 of the wafer frame carrier 10 is not good, and the air-tight effect cannot be achieved. This phenomenon can be effectively minimized by the provision of the deformation preventing member 300. In addition, when the fixing elements 301 pass through the fixing holes to fix the metal strip on the side of the top plate 102 close to the opening 101, the fixing elements 301 do not pass through the top plate 102; but is instead fixed to the top plate 102 in a manner similar to embedding, further ensuring that the airtightness of the box 100 is not compromised.
Due to the different container sizes required by the wafer frames with different sizes, the weight of the wafer frames loaded on the wafer frames is also different. Therefore, in other possible embodiments, the deformation preventing member 300 disposed on the box 100 may be further designed in the form of a metal cage, which surrounds and reinforces the opening 101, the top plate 102, the bottom plate 103, the rear plate 104 or the two side plates 105 on the box 100, so that the box 100 is less prone to deformation, and the invention is not limited thereto. On the other hand, the case 100 may also be designed with a plurality of deformation-preventing ribs in an integrally formed design, so as to further stabilize the structure.
Of course, the door 200 of the present embodiment is provided with a pair of latches 202, which can fix the door 200 on the opening 101 by rotating and locking, so that the box 100 of the wafer frame carrier 10 is airtight.
Referring to fig. 3, fig. 4 and fig. 5, fig. 3 is a schematic diagram of a supporting structure according to an embodiment of the present invention; FIG. 4 is a partial schematic view of a sustaining structure according to an embodiment of the present invention; FIG. 5 is a schematic view of a supporting structure and a door panel with a relatively protruding area according to an embodiment of the invention.
As shown in fig. 3, the inner side of the door panel 200 of the present embodiment is further provided with a supporting portion 201, and the supporting portion 201 includes a main plate 2011. For better understanding of the structure of the abutting portion 201, please refer to the portion of the circular broken line in fig. 3, and the detailed structure of the portion is enlarged with reference to fig. 4. As shown in fig. 4, the supporting portion 201 of the present embodiment includes a main plate 2011, a plurality of through holes 2012, a plurality of supporting members 2013, and a plurality of engaging elements 2014.
The plurality of through holes 2012 are disposed on the main board 2011, and the plurality of through holes 2012 are gourd-shaped. Therefore, the clamping assembly 2014 can slide along the direction shown by the arrow in fig. 4 after passing through the larger hole of the gourd-shaped through hole 2012, so as to clamp the main board 2011 with the smaller hole of the gourd-shaped through hole 2012, and further fix the main board 2011 on the inner surface of the door panel 200, and fix the whole abutting portion 201 on the door panel 200.
The above structure has the advantages of convenient installation, and can allow technicians to replace the supporting part 201 with different configurations according to different requirements. In addition, the engaging element 2014 is not extended out of the door panel 200 and is embedded in the door panel 200, so as to further ensure the air tightness of the box 100 of the wafer frame carrier 10. In a preferred embodiment, the engaging element 2014 may be an integral part of the inner surface of the door panel 200, reducing the cost of the embedding operation.
The plurality of supporters 2013 are disposed on the motherboard 2011 and are mainly responsible for supporting the wafer frame when the door 200 covers the opening 101, so as to prevent the door 200 from being unable to be closed or even damaged due to shaking or vibration impacting the door 200. In the embodiment, the supporting member 2013 is designed to be a racket-shaped structure, and the racket-shaped structure has a concave structure, so as to further bear and reduce the swing amplitude of the wafer frame when the wafer frame swings up and down along the box 100.
The door 200 is often opened by a robot arm before the wafer frame carrier 10 is taken out of or put into the wafer frame. After the door 200 is opened, the door is moved in the vertical direction to expose the opening 101, and then the subsequent wafer frame pick-and-place operation is performed. Therefore, the plurality of supporters 2013 are prevented from scraping the opening 101 when the door panel moves, and further damage is avoided. The plurality of supporters 2013 in this embodiment are designed to protrude from the door 200 by no more than 0.5 cm, as shown in fig. 5. The damage to the plurality of supporters 2013 or the structure near the opening 101 of the box 100 caused by the movement of the door 200 by the robot arm is avoided, so as to avoid the generation of a large amount of micro particles.
Referring to fig. 6 and 7, fig. 6 is a cross-sectional view of a case according to an embodiment of the invention; FIG. 7 is a schematic view of an embedded structure of a locking assembly according to an embodiment of the present invention. As shown in fig. 6, fig. 6 is a cross-sectional view of the embodiment shown in fig. 1 and 2, taken along a plane in which a pair of metal bumper portions 107 are formed. The transparent window 400 provided on the back plate 104 of the present embodiment can be clearly seen from the illustration of fig. 6.
In this embodiment, the transparent window 400 may be selected from glass or plastic doped with metal ions. And the color can be made transparent colorless or orange according to the requirement, and the invention is not limited. And the partial structure shown by the circular broken line in fig. 6 is explained in an enlarged manner in fig. 7.
As shown in fig. 7, in the present embodiment, a plurality of locking assemblies 108 fix the metal bumper 107 through a plurality of embedding assemblies 109 embedded in the two side plates 105. And the metal bumper 107 is further provided with a plurality of airtight ribs 1051 corresponding to the outer surface of the side plate 105. With such a structural design, the metal bumper 107 can be attached while maintaining airtightness and structural stability. The provision of the airtight ribs 1051 can further prevent the risk of the metal bumper 107 falling off due to the deformation of the side plate 105.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A wafer frame carrier, comprising:
the box body comprises an opening, a top plate, a bottom plate, a rear plate and an accommodating space formed by the two side plates;
the two cassette structures are arranged on the two side plates in the accommodating space;
the two metal anti-collision parts are sequentially arranged on one side, close to the rear plate, of the rear part of the cassette structure; and
the door plate is covered with the opening;
the two metal anti-collision parts are fixed on the two side plates sequentially through a plurality of locking components.
2. The wafer frame carrier of claim 1, wherein the door further comprises a retaining portion.
3. The wafer frame carrier of claim 2, wherein the retaining portion comprises:
a main board;
the plurality of through holes are arranged on the main board and are gourd-shaped;
the plurality of supporting pieces are arranged on the main board; and
and the clamping components penetrate through the through holes and then are clamped in a sliding mode, so that the abutting portion is fixed on the door panel.
4. The wafer frame carrier of claim 1, wherein a side of the top plate adjacent to the opening is further provided with a deformation prevention member.
5. The wafer frame carrier as claimed in claim 4, wherein the deformation preventing member is a metal strip, and a plurality of fixing holes are formed on the metal strip, and a plurality of fixing components pass through the fixing holes to fix the metal strip to a side of the top plate close to the opening.
6. The wafer frame carrier of claim 1, wherein the back plate further comprises at least one transparent window.
7. The wafer frame carrier of claim 1, wherein the top plate further comprises at least one handle.
8. The wafer frame carrier of claim 1, wherein the door further comprises at least one latch.
9. The wafer frame carrier of claim 1, wherein the plurality of locking elements secure the two metal bump stops via a plurality of embedded elements embedded in the two side plates.
10. The wafer frame carrier as claimed in claim 9, wherein the two metal bump guards have a plurality of air-tight ribs corresponding to the outer surfaces of the two side plates.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107121980A TWI674644B (en) | 2018-06-27 | 2018-06-27 | Wafer frame carrier |
TW107121980 | 2018-06-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110641841A CN110641841A (en) | 2020-01-03 |
CN110641841B true CN110641841B (en) | 2021-04-20 |
Family
ID=69009175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810919997.9A Active CN110641841B (en) | 2018-06-27 | 2018-08-14 | Wafer frame carrier |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN110641841B (en) |
SG (1) | SG10201808577QA (en) |
TW (1) | TWI674644B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113859723B (en) * | 2021-08-27 | 2023-04-25 | 智新半导体有限公司 | Ring-breaking recovery rack |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63263748A (en) * | 1987-04-22 | 1988-10-31 | Hitachi Ltd | Semiconductor device and manufacture thereof |
CN101685787A (en) * | 2008-09-24 | 2010-03-31 | 家登精密工业股份有限公司 | Front opening type wafer box with pulleys |
CN104520984A (en) * | 2012-04-04 | 2015-04-15 | 信越聚合物株式会社 | Substrate storage container |
CN209177290U (en) * | 2018-06-27 | 2019-07-30 | 家登精密工业股份有限公司 | Wafer frame carrier |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM359532U (en) * | 2008-12-29 | 2009-06-21 | Yeh Hung Plastic Co Ltd | Improved wafer shipping box |
US10217655B2 (en) * | 2014-12-18 | 2019-02-26 | Entegris, Inc. | Wafer container with shock condition protection |
-
2018
- 2018-06-27 TW TW107121980A patent/TWI674644B/en active
- 2018-08-14 CN CN201810919997.9A patent/CN110641841B/en active Active
- 2018-09-28 SG SG10201808577QA patent/SG10201808577QA/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63263748A (en) * | 1987-04-22 | 1988-10-31 | Hitachi Ltd | Semiconductor device and manufacture thereof |
CN101685787A (en) * | 2008-09-24 | 2010-03-31 | 家登精密工业股份有限公司 | Front opening type wafer box with pulleys |
CN104520984A (en) * | 2012-04-04 | 2015-04-15 | 信越聚合物株式会社 | Substrate storage container |
CN209177290U (en) * | 2018-06-27 | 2019-07-30 | 家登精密工业股份有限公司 | Wafer frame carrier |
Also Published As
Publication number | Publication date |
---|---|
TW202002139A (en) | 2020-01-01 |
CN110641841A (en) | 2020-01-03 |
TWI674644B (en) | 2019-10-11 |
SG10201808577QA (en) | 2020-01-30 |
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