CN110639762A - Multi-head glue dispensing device for packaging integrated circuit - Google Patents
Multi-head glue dispensing device for packaging integrated circuit Download PDFInfo
- Publication number
- CN110639762A CN110639762A CN201910748751.4A CN201910748751A CN110639762A CN 110639762 A CN110639762 A CN 110639762A CN 201910748751 A CN201910748751 A CN 201910748751A CN 110639762 A CN110639762 A CN 110639762A
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- Prior art keywords
- dispensing
- glue
- head
- piston
- storage box
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0295—Floating coating heads or nozzles
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- Coating Apparatus (AREA)
Abstract
The invention discloses a multi-head glue dispensing device for packaging an integrated circuit, which comprises a workbench, a placing plate, a portal frame, a glue dispensing mechanism and a controller, wherein the portal frame is movable on the workbench, the glue dispensing mechanism and the controller are arranged on the portal frame, the placing plate is fixedly arranged on the upper part of the workbench, the glue dispensing mechanism is sleeved on the portal frame in the horizontal direction and is in sliding connection with the portal frame, the controller is in control connection with a glue dispensing mechanism, and the glue dispensing mechanism comprises a driving assembly, a glue storage box, a glue guide pipe and a plurality of glue dispensing heads. The controller controls the dispensing mechanism to perform dispensing operation, the motor drives the screw nut to transmit to serve as a driving assembly inside the dispensing mechanism, the piston is made to do drawing movement in the glue storage box, so that glue inside the glue storage box is extruded and conveyed to the dispensing heads to perform dispensing operation on the packaging circuit, the lower end of the glue storage box is connected with a glue guide pipe, the dispensing heads are connected through the glue guide pipe, and the dispensing heads work simultaneously, so that the working efficiency of circuit packaging can be effectively improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a multi-head glue dispensing device for integrated circuit packaging.
Background
The glue dispensing is to smear, encapsulate and drip electronic glue, oil and the like to specific positions of products, so that the products achieve the effects of pasting, encapsulating, insulating, fixing, smooth surface and the like, and an integrated circuit is a novel semiconductor device developed in the later 60 of the 50 th century. It is made up through such technological steps as oxidation, photoetching, diffusion, epitaxy and aluminium evaporation, and integrates the semiconductor, resistor and capacitor elements and connecting wires between them, which are all needed by a circuit with certain functions, on a small silicon chip, and then welding the electronic devices in a tube. The packaging shell has various forms such as round shell type, flat type or dual in-line type. The integrated circuit technology comprises a chip manufacturing technology and a chip design technology, and is mainly embodied in the capabilities of processing equipment, a processing technology, packaging test, batch production and design innovation, the existing integrated circuit packaging abandons a welding packaging form and adopts a glue dispensing technology, but a glue dispensing device adopts single-head glue dispensing, the working efficiency is low, the quick packaging of the integrated circuit cannot be met, and the phenomenon of needle damage is easily caused when a needle head and a part are in rigid touch during glue dispensing.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present invention is to provide a multi-head dispensing device for packaging an integrated circuit, wherein a glue guiding tube is connected to a lower end of a glue storage box, a plurality of dispensing heads are connected to the glue guiding tube, and the plurality of dispensing heads work simultaneously to effectively improve the working efficiency of circuit packaging.
The invention provides a multi-head glue dispensing device for packaging an integrated circuit, which comprises a workbench, a placing plate, a portal frame, a glue dispensing mechanism and a controller, wherein the portal frame is movable on the workbench, the glue dispensing mechanism and the controller are arranged on the portal frame, the placing plate is fixedly arranged on the upper part of the workbench, the glue dispensing mechanism is sleeved on the portal frame in the horizontal direction and is in sliding connection with the portal frame, the controller is in control connection with the glue dispensing mechanism, the glue dispensing mechanism comprises a driving assembly, a glue storage box, a glue guide pipe and a plurality of glue dispensing heads, a piston is connected between the driving assembly and the glue storage box, the controller controls the driving assembly to act to drive the piston to perform drawing movement in the glue storage box, the glue guide pipe is communicated with the glue storage box and is in rotating connection with the bottom of the glue storage box through a bearing, and the glue dispensing heads are uniformly arranged in the length direction of the.
Preferably, the driving assembly is located inside the dispensing mechanism and comprises a motor, a lead screw is connected to the power end of the motor in a driving mode, a nut is sleeved outside the lead screw and is in threaded connection with the lead screw, and one side of the nut is fixedly connected with the piston.
Preferably, the piston consists of a piston rod and a piston head, the upper end of the piston rod extends into the dispensing mechanism and is fixedly connected with one side of the nut, the lower end of the piston rod extends into the glue storage box and is fixedly connected with the piston head, and the piston head is positioned in the glue storage box and is in sealing sliding connection with the inner wall of the glue storage box.
Preferably, a linear slide rail is arranged on the other side of the nut inside the dispensing mechanism, and the nut is connected with the linear slide rail in a sliding fit manner.
Preferably, the upper part of the glue storage box is fixedly connected with the glue dispensing mechanism through a connecting rod, a glue inlet is formed in the side wall of the glue storage box, the outside of the glue inlet is communicated with a glue inlet pipe, and the glue inlet pipe is connected with a glue inlet valve.
Preferably, the dispensing head comprises a dispensing tube communicated with a dispensing tube, the dispensing tube is internally connected with a sliding block in a sliding mode along a dispensing direction, a needle head is arranged inside the sliding block, the upper end of the needle head is communicated with the dispensing tube, the lower end of the needle head extends out of the dispensing tube downwards, a first spring is connected between the upper portion of the sliding block and the inner wall of the upper portion of the dispensing tube, a second spring is connected between the lower portion of the sliding block and the inner wall of the bottom of the dispensing tube, and the second spring is sleeved on the needle head.
Preferably, the portal frame is erected by two supports and a crossbeam and forms, the upper ends of two supports are pegged graft with the both ends of crossbeam respectively to the crossbeam can slide along two support length directions, the bottom of two supports respectively with the both sides swing joint of workstation.
Preferably, the sliding grooves are formed in the two sides of the workbench, and the support is connected with the workbench in a sliding fit mode through the sliding grooves.
In the invention, a controller controls a dispensing mechanism to perform dispensing operation, a motor is adopted in the dispensing mechanism to drive a lead screw nut to transmit as a driving assembly, a piston is made to do drawing motion in a glue storage box, so that glue in the glue storage box is extruded and conveyed to a dispensing head to perform dispensing operation on a packaging circuit, a glue guide pipe is connected to the lower end of the glue storage box, a plurality of dispensing heads are connected through the glue guide pipe, the working efficiency of circuit packaging can be effectively improved by the simultaneous working of the plurality of dispensing heads, the glue guide pipe and the glue storage box adopt a rotary connection mode to enable the dispensing heads to rotate, the flexibility and the dispensing operation range of the dispensing heads are effectively improved, a sliding block is connected in the dispensing heads in a sliding mode along the dispensing direction, and the sliding block can slightly move under the action of a first spring and a second spring during the dispensing operation, so that the phenomenon that the needle head touches the needle 172 to be damaged due to the rigid circuit packaging can be avoided, the service life of the needle is prolonged.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of an overall structure of a multi-head dispensing device for packaging an integrated circuit according to the present invention;
FIG. 2 is a schematic diagram of an internal structure of a dispensing mechanism of a multi-head dispensing device for packaging an integrated circuit according to the present invention;
FIG. 3 is a schematic structural view of a side view of the inside of a dispensing mechanism of the multi-head dispensing device for packaging an integrated circuit according to the present invention;
fig. 4 is a schematic view of an internal structure of a dispensing head of a multi-head dispensing device for packaging an integrated circuit according to the present invention.
In the figure: 1. a work table; 2. placing the plate; 3. a support; 4. a chute; 5. a cross beam; 6. a glue dispensing mechanism; 7. a controller; 8. a glue storage box; 9. a rubber guide tube; 10. a motor; 11. a lead screw; 12. a connecting rod; 13. a piston rod; 14. a piston head; 15. a glue inlet; 16. a bearing; 17. dispensing a glue head; 171. dispensing a rubber tube; 172. a needle head; 173. a slider; 174. a first spring; 175. a second spring; 18. a nut; 19. a linear slide rail.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-4, a multi-head dispensing device for packaging integrated circuits comprises a workbench 1, a placing plate 2, a portal frame movable on the workbench 1, a dispensing mechanism 6 and a controller 7 arranged on the portal frame, wherein the placing plate 2 is fixedly arranged on the upper portion of the workbench 1, the dispensing mechanism 6 is sleeved on the portal frame in the horizontal direction and is in sliding connection with the portal frame, the controller 7 is in control connection with the dispensing mechanism 6, the dispensing mechanism 6 comprises a driving component, a glue storage box 8, a glue guide tube 9 and a plurality of dispensing heads 17, a piston is connected between the driving component and the glue storage box 8, the controller 7 controls the driving component to move to drive the piston to draw and pull in the glue storage box 8, the glue guide tube 9 is communicated with the glue storage box 8 and is in rotating connection with the bottom of the glue storage box 8 through a bearing 16, the plurality of dispensing heads 17 are uniformly arranged in the length direction of the glue guide tube 9 and are communicated with the inside of the glue guide tube, according to the invention, the controller 7 controls the driving assembly to enable the piston to do drawing motion in the glue storage box 8, so that glue in the glue storage box 8 is extruded and conveyed to the glue dispensing head 17 to perform glue dispensing operation on a packaging circuit, the glue guide pipe 9 is rotatably connected with the glue storage box 8, the working range of the glue dispensing head 17 can be enlarged, and the glue dispensing heads 17 work simultaneously, so that the working efficiency of circuit packaging can be effectively improved.
In the embodiment, the driving assembly is located inside the glue dispensing mechanism 6 and comprises a motor 10, a power end of the motor 10 is connected with a lead screw 11 in a driving mode, a nut 18 is sleeved outside the lead screw 11, the nut 18 is in threaded connection with the lead screw 11, one side of the nut 18 is fixedly connected with a piston, the driving assembly receives signal action sent by the controller 7, the motor 10 rotates to drive the lead screw 11 to rotate, due to the fact that the nut 18 is in threaded fit with the lead screw 11, the nut 18 converts the rotating motion of the lead screw 11 into linear motion, and the nut 18 moves linearly on the lead screw 11 to drive the piston to move downwards to extrude glue inside the glue storage box 8;
specifically, in the embodiment, the piston is composed of a piston rod 13 and a piston head 14, the upper end of the piston rod 13 extends into the dispensing mechanism 6 and is fixedly connected with one side of a nut 18, the lower end of the piston rod 13 extends into the glue storage box 8 and is fixedly connected with the piston head 14, the piston head 14 is positioned in the glue storage box 8 and is in sealed sliding connection with the inner wall of the glue storage box 8, the nut 18 moves linearly on a lead screw 11 to drive the piston rod 13 and the piston head 14 to move downwards to squeeze glue in the glue storage box 8, and the plug head 14 is in sealed connection with the inner wall of the glue storage box 8, so that the glue can be conveyed into the glue guide tube 9;
in order to ensure that the piston rod 13 keeps linear motion, a linear slide rail 19 is arranged at the other side of the nut 18 in the dispensing mechanism 6, the nut 18 is connected with the linear slide rail 19 in a sliding fit manner, and the piston rod 13 is matched with the linear slide rail 19 when sliding, so that the piston rod 13 is prevented from inclining to cause the piston head 14 and the inner wall of the glue storage box 8 to generate transverse acting force to wear the piston head;
the glue storage box 8 can be designed in an integrated manner with the glue dispensing mechanism 6, and can also be fixed through a connecting device, in the embodiment, the upper part of the glue storage box 8 is fixedly connected with the glue dispensing mechanism 6 through a connecting rod 12, a glue inlet 15 is formed in the side wall of the glue storage box 8, a glue inlet pipe is communicated with the outside of the glue inlet 15, and is connected with a glue inlet valve;
as shown in fig. 4, the dispensing head 17 comprises a dispensing tube 171 communicated with a rubber guide tube 9, a slider 173 is slidably connected inside the dispensing tube 171 along a dispensing direction, a needle 172 is arranged inside the slider 173, the upper end of the needle 172 is communicated with the rubber guide tube 9, the lower end of the needle 172 extends downwards to the outside of the dispensing tube 171, a first spring 174 is connected between the upper part of the slider 173 and the inner wall of the upper part of the dispensing tube 171, a second spring 175 is connected between the lower part of the slider 173 and the inner wall of the bottom of the dispensing tube 171, and the second spring 175 is sleeved on the needle 172, the extruded glue enters each dispensing tube 171 through the glue guiding tube 9, when the needle 172 and the integrated circuit package are rigidly touched during the dispensing operation, the slider 173 inside the dispensing head 17 can be slightly moved by the first spring 174 and the second spring 175, therefore, the damage phenomenon of the needle 172 caused by rigid touch of the needle 172 and the circuit package can be avoided;
the portal frame in the embodiment is formed by erecting two supports 3 and a cross beam 5, the upper ends of the two supports 3 are respectively inserted into two ends of the cross beam 5, the cross beam 5 can slide along the length direction of the two supports 3, and the bottom ends of the two supports 3 are respectively movably connected with two sides of the workbench 1; spout 4 has all been seted up to the both sides of workstation 1, and support 3 is connected with 1 sliding fit of workstation through spout 4, and integrated circuit places on placing board 2 the back, and the staff slides through removing support 3 in spout 4 and changes the position on the 6 horizontal planes of dispensing mechanism, promotes crossbeam 5 and adjusts dispensing mechanism 6's height, and it is fixed after adjusting dispensing mechanism 6 to suitable position through both cooperations, makes things convenient for personnel to carry out the operation of gluing to integrated circuit.
During operation, the dispensing mechanism 6 is moved and adjusted to a proper position through the portal frame, the dispensing mechanism 6 is fixed, the motor 10 is started through the controller 7, the motor 10 operates to drive the lead screw 11 to rotate, the nut 18 moves linearly on the lead screw 11 to drive the piston to move downwards to extrude glue inside the glue storage box 8 into the glue guide tube 9, the glue passing through the glue guide tube 9 enters each dispensing head 17 respectively, the integrated circuit is dispensed by each dispensing head 17 at the same time, the position of the dispensing head 17 can be changed by rotating the glue guide tube 9, dispensing operation is carried out on other places on the integrated circuit, in the dispensing process, the sliding block 173 inside the dispensing head 17 can move slightly under the action of the first spring 174 and the second spring 175, and accordingly damage to the needle 172 can be avoided.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (8)
1. Multi-head glue dispensing device for packaging integrated circuit, which is characterized in that: including the workstation, place the board, mobilizable portal frame on the workstation to and point gum machine structure and the controller of setting on the portal frame, place board fixed mounting in the upper portion of workstation, point gum machine constructs along the horizontal direction cover and establishes on the portal frame and rather than sliding connection, controller and point gum machine construct control connection, point gum machine constructs including drive assembly, stores up and glues box, leads rubber tube and number point and glues the head, drive assembly and storage are connected with the piston between gluing the box, and controller control drive assembly action drive piston is in storing up and is pull motion in gluing the box, it is linked together and is connected with storing up the box bottom rotation with gluing the box through the bearing to lead the rubber tube, the several point is glued the head and evenly arranges and all is linked together with leading rubber tube inside along leading rubber tube length direction.
2. The multi-head dispensing device for packaging integrated circuits according to claim 1, wherein: the drive assembly is located the inside of point gum machine and constructs, and it includes the motor, the power end drive of motor is connected with the lead screw, and the outside cover of lead screw is equipped with the nut, nut and lead screw threaded connection, one side and piston fixed connection of nut.
3. The multi-head dispensing device for packaging integrated circuits according to claim 2, wherein: the piston is composed of a piston rod and a piston head, the upper end of the piston rod extends into the interior of the glue dispensing mechanism and is fixedly connected with one side of the nut, the lower end of the piston rod extends into the interior of the glue storage box and is fixedly connected with the piston head, and the piston head is located in the interior of the glue storage box and is in sealing sliding connection with the inner wall of the glue storage box.
4. The multi-head dispensing device for packaging integrated circuits according to claim 2, wherein: and a linear slide rail is arranged on the other side of the dispensing mechanism, which is positioned at the nut, and the nut is connected with the linear slide rail in a sliding fit manner.
5. The multi-head dispensing device for packaging integrated circuits according to claim 1, wherein: store up gluey box upper portion and pass through connecting rod and point gum machine and construct fixed connection, store up and seted up on gluey box's the lateral wall and advance gluey mouth, should advance gluey mouthful outside intercommunication and have into the rubber tube, it is connected with into gluey valve on the rubber tube to advance.
6. The multi-head dispensing device for packaging integrated circuits according to claim 1, wherein: the dispensing head comprises a dispensing tube communicated with a dispensing tube, a sliding block is connected to the inside of the dispensing tube in a sliding mode along the dispensing direction, a needle head is arranged inside the sliding block, the upper end of the needle head is communicated with the dispensing tube, the lower end of the needle head extends out of the dispensing tube downwards, a first spring is connected between the upper portion of the sliding block and the inner wall of the upper portion of the dispensing tube, a second spring is connected between the lower portion of the sliding block and the inner wall of the bottom of the dispensing tube, and the second spring is sleeved on the needle head.
7. The multi-head dispensing device for packaging integrated circuits according to claim 1, wherein: the portal frame is erected by two supports and a crossbeam and forms, the upper end of two supports is pegged graft with the both ends of crossbeam respectively to the crossbeam can be followed two support length direction and slided, the bottom of two supports respectively with the both sides swing joint of workstation.
8. The multi-head dispensing device for packaging integrated circuits according to claim 7, wherein: the spout has all been seted up to the both sides of workstation, the wet handkerchief box that the extraction of being convenient for is connected through spout and workstation sliding fit to the support, its characterized in that: four corners at the bottom of the box body are respectively connected with a sucker.
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CN201910748751.4A CN110639762A (en) | 2019-08-14 | 2019-08-14 | Multi-head glue dispensing device for packaging integrated circuit |
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CN201910748751.4A CN110639762A (en) | 2019-08-14 | 2019-08-14 | Multi-head glue dispensing device for packaging integrated circuit |
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CN116372306A (en) * | 2023-03-13 | 2023-07-04 | 无锡昌鼎电子有限公司 | Chip fixing device and method for semiconductor production |
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CN117810093A (en) * | 2023-12-11 | 2024-04-02 | 四川华尔科技有限公司 | Integrated circuit packaging device and packaging process based on SiP technology |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140000613A (en) * | 2012-06-22 | 2014-01-03 | 주식회사 탑 엔지니어링 | Apparatus for discharging liquid |
US20160114348A1 (en) * | 2014-10-28 | 2016-04-28 | Flextronics Ap, Llc | Motorized adhesive dispensing module |
CN205308725U (en) * | 2016-01-26 | 2016-06-15 | 郭凤 | Novel dedicated rubber coating in industrial design modelling device |
CN106824672A (en) * | 2017-04-16 | 2017-06-13 | 上海山泰柯电子有限公司 | Intelligent circuit board point gum machine |
CN107185776A (en) * | 2017-06-21 | 2017-09-22 | 成都市鸥威光电科技有限责任公司 | A kind of mobile lens protection sheetmolding with storing up point gum machine of nodding glue amount self-monitoring more |
CN207463559U (en) * | 2017-11-13 | 2018-06-08 | 无锡凹凸自动化科技有限公司 | A kind of Portable Automatic dispenser |
CN207680934U (en) * | 2017-11-22 | 2018-08-03 | 安徽晨阳橡塑股份有限公司 | A kind of sealing strip installation spot gluing equipment |
CN108452990A (en) * | 2018-02-05 | 2018-08-28 | 浙江欧导自动化设备有限公司 | A kind of motor housing spray painting drying unit |
CN208142134U (en) * | 2018-03-21 | 2018-11-23 | 吴泽榕 | A kind of Special multi-head glue dispensing device for integrated circuit package |
-
2019
- 2019-08-14 CN CN201910748751.4A patent/CN110639762A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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