CN110610869A - Chip packaging equipment - Google Patents
Chip packaging equipment Download PDFInfo
- Publication number
- CN110610869A CN110610869A CN201911006682.6A CN201911006682A CN110610869A CN 110610869 A CN110610869 A CN 110610869A CN 201911006682 A CN201911006682 A CN 201911006682A CN 110610869 A CN110610869 A CN 110610869A
- Authority
- CN
- China
- Prior art keywords
- chip
- cantilevers
- swing arm
- cantilever
- magazine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 230000003028 elevating effect Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention provides a chip packaging device, which comprises: the device comprises a chip loading table, a conveying arm, a calibration mechanism, a feeding cantilever and a chip supply mechanism; the sheet supply mechanism includes: a plurality of not unidimensional magazine, each magazine is located the feed position at place, and the pay-off cantilever is located and supplies between piece mechanism and the aligning gear, and it includes: swing arm axle, drive swing arm axle elevating movement's cam by a plurality of cantilevers of swing arm axle drive pivot, a plurality of cantilevers distribute around swing arm axle, and be provided with the suction nozzle on arbitrary cantilever, and calibration mechanism includes: the automatic film loading device comprises a correcting table, an industrial camera and a conveying arm, wherein the industrial camera and the conveying arm are arranged above the correcting table, the correcting table rotates and corrects by taking the axis of the correcting table as a rotating shaft, the conveying arm reciprocates in the vertical direction, and a film loading table is positioned on the downstream side of a correcting mechanism. The invention adopts a plurality of material boxes with different sizes and the feeding cantilever, is suitable for feeding a plurality of chips with different sizes and can realize the encapsulation of the chips with different sizes and types by one device.
Description
Technical Field
The invention relates to a chip packaging device, in particular to a device capable of being suitable for packaging chips with different sizes.
Background
The chip is formed by cutting a large-size wafer and has products with various specifications and sizes. The cut chip needs to be processed by a packaging process in the application process. In the current packaging equipment, only a single specification size of chip can be used, and for chips with different size types, the chips are generally packaged on the base of the carrier plate through different equipment. Therefore, a plurality of devices are needed to be matched to finish chips with different sizes and types, the cost is high, and the packaging efficiency is low. Therefore, it is necessary to provide a further solution for how to improve the packaging efficiency of chips of different size types.
Disclosure of Invention
The invention aims to provide a chip packaging device to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a chip packaging apparatus, comprising: the device comprises a chip loading table, a conveying arm, a calibration mechanism, a feeding cantilever and a chip supply mechanism;
the sheet supply mechanism includes: a plurality of not unidimensional magazine, each magazine is located the feed position at place, and arbitrary magazine provides the space that stacks of corresponding size chip, the pay-off cantilever is located supply between piece mechanism and the aligning gear, it includes: swing arm axle, by swing arm axle drives a plurality of cantilevers, the drive of pivot swing arm axle elevating movement's cam, a plurality of cantilevers distribute in swing arm axle all around, and be provided with the suction nozzle on arbitrary cantilever, the cam sets up respectively in the top of getting piece position and the top of dress piece position, calibration mechanism includes: the automatic chip mounting device comprises a correcting table, an industrial camera and a conveying arm, wherein the industrial camera and the conveying arm are arranged above the correcting table, the correcting table rotates and calibrates by taking the axis of the correcting table as a rotating shaft, a suction nozzle is arranged at the lower end of the conveying arm, the conveying arm reciprocates in the vertical direction, a chip mounting table is arranged on the downstream side of a calibrating mechanism, and the table top of the chip mounting table forms a supporting surface for packaging bases with chips of different sizes.
As an improvement of the chip packaging equipment, all the material boxes are conveyed to the corresponding material supply positions by the conveyor belts and are placed according to the position suitable for the material grabbing of the feeding cantilever.
As an improvement of the chip packaging equipment, the number of the cantilevers is four, and the four cantilevers are arranged around the swing arm shaft in a cross shape.
As an improvement of the chip packaging equipment, the suction nozzle on any one cantilever performs pivoting motion by taking the central axis of the suction nozzle as a rotating shaft.
As an improvement of the chip packaging equipment, a small motor is arranged at the end part of any cantilever, and the suction nozzle is driven by the small motor to perform pivoting motion by taking the central axis of the suction nozzle as a rotating shaft.
As an improvement of the chip packaging equipment, the correction position of the correction table is limited by the clockwise direction and the anticlockwise direction, and the motor drives the correction table to rotate to a position limited by the preset clockwise direction or the preset anticlockwise direction.
As an improvement of the chip packaging apparatus of the present invention, the transfer arm is located directly above the correcting stage, and the industrial camera is located on a side of the transfer arm and is disposed toward the correcting stage.
Compared with the prior art, the invention has the beneficial effects that: the chip packaging equipment disclosed by the invention adapts to the feeding of chips with different sizes by adopting the material boxes and the feeding cantilevers with different sizes, and the packaging of the chips with different sizes can be realized by one equipment, so that the packaging cost is reduced, and the packaging efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a chip packaging apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a chip packaging apparatus, which includes: the device comprises a loading platform 1, a calibration mechanism 2, a feeding cantilever 3 and a sheet supply mechanism 4.
The chip supply mechanism 4 is used for supplying chips with different sizes, and specifically comprises: a plurality of different sized magazines 41, each magazine 41 being located in a feeding position. Wherein any one of the magazines 41 provides a stacking space for chips of a corresponding size. In this embodiment, each magazine 41 is conveyed to the corresponding feeding position by the conveyor belt, and preferably, each magazine 41 is placed at a position suitable for the feeding arm 3 to grab, for example, each magazine 41 may be placed at intervals according to the motion track of the feeding arm 3. Therefore, the feeding cantilever 3 can respectively grab the chips in different material boxes 41 for feeding.
The feeding cantilever 3 is positioned between the sheet supply mechanism 4 and the calibration mechanism 2, and comprises: the lifting device comprises a swing arm shaft 31, a plurality of suspension arms 32 driven by the swing arm shaft 31 to pivot, and a cam 33 driving the swing arm shaft 31 to move up and down. One of the cantilevers 32 can correspondingly capture a chip of one size type, so that a corresponding number of cantilevers 32 can be set according to the size type of the chip. In this embodiment, the number of the cantilevers 32 is four, and the four cantilevers 32 are arranged around the swing arm shaft 31 in a cross shape.
Furthermore, a plurality of cantilevers 32 are distributed around the swing arm shaft 31, and a suction nozzle 321 is disposed on any one of the cantilevers 32, and the cantilever 32 can grab the chip in the corresponding magazine 41 through the suction nozzle 321. In order to calibrate the feeding angle of the picked chip for facilitating the subsequent packaging, the suction nozzle 321 of any one of the cantilevers 32 performs a pivoting motion with its central axis as a rotation axis. The cams 33 are independently provided above the chip taking position and above the chip mounting position, respectively, so that when the swing arm shaft 31 moves below the cams 33, the cams 33 act to drive the swing arm shaft 31 to move down to the chip taking position to grab a chip or to move down to the chip mounting position to place the grabbed chip.
Therefore, the suction nozzle 321 can drive the chip to rotate synchronously by pivoting itself, so as to realize the calibration and adjustment of the chip. Specifically, a small-sized motor 34 is provided at an end of any one of the cantilevers 32, and the suction nozzle 321 is driven by the small-sized motor 34 to perform a pivotal motion with its own central axis as a rotation axis. Among them, the small motor 34 may employ a stepping motor to rotate the sucked chip at a desired position. In addition, the feeding cantilever 323 can also have a tank chain drawn between the film supply mechanism 4 and the calibration mechanism 3 for reciprocating motion.
The calibration mechanism 2 is used for performing secondary calibration on the chip to overcome the position error of the feeding cantilever 323 during chip taking, and comprises: a calibration table 21, an industrial camera 22 and a transfer arm 23 arranged above the calibration table 21.
The calibration table 21 receives the chip from the feeding cantilever 323 and can perform rotation calibration by taking the axis thereof as a rotating shaft. Specifically, the calibration position of the calibration table 21 is defined by a clockwise direction and a counterclockwise direction, and a motor 24 drives the calibration table 21 to rotate to a position defined by a preset clockwise direction or counterclockwise direction. The transfer arm 23 is provided at its lower end with a suction nozzle 231, and the transfer arm 23 is reciprocated in the vertical direction, so that the transfer arm 23 changes only the position in the vertical direction when sucking the corrected chip, so that an error occurs in transferring the chip to the mounting table 1. Preferably, the transfer arm 23 is positioned directly above the correction table 21, and the industrial camera 22 is positioned on a side of the transfer arm 23 and is disposed toward the correction table 21. Therefore, during correction, according to the detection result of the industrial camera 22, the motor drives the correction table 21 to rotate clockwise or counterclockwise to reach a position suitable for the second conveying mechanism to accurately take the film. However, the transfer arm 23 sucks the chip to wait for the chip stage 1 to receive the chip.
The chip loading platform 1 is used for realizing the packaging of chips with different sizes, and can be driven by an XY mechanism 5 to move to the position below the conveying arm 23 so as to receive the chips.
Specifically, the stage 1 is located on the downstream side of the alignment mechanism 2, and the stage surface thereof forms a support surface of a base that encapsulates chips of different sizes. Correspondingly, a carrier plate provided with a base is placed on the table-board, and the base is provided with a slot for accommodating chips with different sizes. The XY mechanism 5 is positioned at the bottom of the loading platform 1 and drives the loading platform 1 to move in XY directions. The XY mechanism 5 includes: the base 51, the first guide rail 52 that supplies base 51 to slide along the X direction, supply base 51 to slide along the second guide rail 53 of Y direction.
In conclusion, the chip packaging equipment disclosed by the invention improves the chip packaging capacity and efficiency by adopting double-station chip packaging. Meanwhile, the chip packaging equipment provided by the invention has higher chip mounting precision, and fully meets the chip mounting requirements of modern industrial production.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A chip packaging apparatus, comprising: the device comprises a chip loading table, a conveying arm, a calibration mechanism, a feeding cantilever and a chip supply mechanism;
the sheet supply mechanism includes: a plurality of not unidimensional magazine, each magazine is located the feed position at place, and arbitrary magazine provides the space that stacks of corresponding size chip, the pay-off cantilever is located supply between piece mechanism and the aligning gear, it includes: swing arm axle, by swing arm axle drives a plurality of cantilevers, the drive of pivot swing arm axle elevating movement's cam, a plurality of cantilevers distribute in swing arm axle all around, and be provided with the suction nozzle on arbitrary cantilever, the cam sets up respectively in the top of getting piece position and the top of dress piece position, calibration mechanism includes: the automatic chip mounting device comprises a correcting table, an industrial camera and a conveying arm, wherein the industrial camera and the conveying arm are arranged above the correcting table, the correcting table rotates and calibrates by taking the axis of the correcting table as a rotating shaft, a suction nozzle is arranged at the lower end of the conveying arm, the conveying arm reciprocates in the vertical direction, a chip mounting table is arranged on the downstream side of a calibrating mechanism, and the table top of the chip mounting table forms a supporting surface for packaging bases with chips of different sizes.
2. The chip packaging apparatus according to claim 1, wherein each magazine is conveyed to a corresponding feeding position by a conveyor belt, and each magazine is placed in a position suitable for feeding cantilever-grabbing.
3. The chip packaging apparatus according to claim 1, wherein the number of the cantilevers is four, and four cantilevers are arranged around the swing arm shaft in a cross shape.
4. The chip packaging apparatus according to claim 1, wherein the suction nozzle of any one of the cantilevers performs a pivotal motion about its central axis.
5. The chip packaging apparatus according to claim 4, wherein a small motor is provided at an end of each of the cantilevers, and the suction nozzle is driven by the small motor to perform a pivotal motion about a central axis thereof.
6. The chip packaging apparatus according to claim 1, wherein the calibration position of the calibration stage is defined by a clockwise direction and a counterclockwise direction, and the motor rotates the calibration stage to a position defined by a preset clockwise direction or counterclockwise direction.
7. The chip packaging apparatus according to claim 1, wherein the transfer arm is located directly above the correction stage, and the industrial camera is located at a side of the transfer arm and is disposed toward the correction stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911006682.6A CN110610869A (en) | 2019-10-22 | 2019-10-22 | Chip packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911006682.6A CN110610869A (en) | 2019-10-22 | 2019-10-22 | Chip packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110610869A true CN110610869A (en) | 2019-12-24 |
Family
ID=68893298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911006682.6A Pending CN110610869A (en) | 2019-10-22 | 2019-10-22 | Chip packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110610869A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111415895A (en) * | 2020-02-19 | 2020-07-14 | 苏州艾科瑞思智能装备股份有限公司 | Get piece and chip bonding device and chip bonding machine |
| CN113163702A (en) * | 2021-04-16 | 2021-07-23 | 浙江鸿广科技有限公司 | Chip mounter |
| WO2022198717A1 (en) * | 2021-03-26 | 2022-09-29 | 桂林芯飞光电子科技有限公司 | Multifunctional suction nozzle and operating method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035864A (en) * | 1999-07-26 | 2001-02-09 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
| CN202651079U (en) * | 2012-06-01 | 2013-01-02 | 先进光电器材（深圳）有限公司 | Double-swing arm type direct-drive die bonder |
| CN103400784A (en) * | 2013-08-08 | 2013-11-20 | 王敕 | Multipurpose encapsulating equipment |
| TWM534430U (en) * | 2016-08-25 | 2016-12-21 | Wei Lie Machinery Co Ltd | Electronic component transferring device |
| CN208570657U (en) * | 2018-07-02 | 2019-03-01 | 中山市新益昌自动化设备有限公司 | A kind of automatic brilliant ring mechanism of LED bonder |
| CN109461667A (en) * | 2018-12-06 | 2019-03-12 | 深圳市佳思特光电设备有限公司 | Semiconductor chip packaging bonding apparatus and implementation method |
| CN110194290A (en) * | 2019-06-05 | 2019-09-03 | 深圳市诺泰自动化设备有限公司 | A kind of rotary type tower chip braider |
| CN210443526U (en) * | 2019-10-22 | 2020-05-01 | 苏州艾科瑞思智能装备股份有限公司 | Chip packaging equipment |
-
2019
- 2019-10-22 CN CN201911006682.6A patent/CN110610869A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035864A (en) * | 1999-07-26 | 2001-02-09 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
| CN202651079U (en) * | 2012-06-01 | 2013-01-02 | 先进光电器材（深圳）有限公司 | Double-swing arm type direct-drive die bonder |
| CN103400784A (en) * | 2013-08-08 | 2013-11-20 | 王敕 | Multipurpose encapsulating equipment |
| TWM534430U (en) * | 2016-08-25 | 2016-12-21 | Wei Lie Machinery Co Ltd | Electronic component transferring device |
| CN208570657U (en) * | 2018-07-02 | 2019-03-01 | 中山市新益昌自动化设备有限公司 | A kind of automatic brilliant ring mechanism of LED bonder |
| CN109461667A (en) * | 2018-12-06 | 2019-03-12 | 深圳市佳思特光电设备有限公司 | Semiconductor chip packaging bonding apparatus and implementation method |
| CN110194290A (en) * | 2019-06-05 | 2019-09-03 | 深圳市诺泰自动化设备有限公司 | A kind of rotary type tower chip braider |
| CN210443526U (en) * | 2019-10-22 | 2020-05-01 | 苏州艾科瑞思智能装备股份有限公司 | Chip packaging equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111415895A (en) * | 2020-02-19 | 2020-07-14 | 苏州艾科瑞思智能装备股份有限公司 | Get piece and chip bonding device and chip bonding machine |
| CN111415895B (en) * | 2020-02-19 | 2023-08-04 | 苏州艾科瑞思智能装备股份有限公司 | Get piece and dress piece device and dress piece machine |
| WO2022198717A1 (en) * | 2021-03-26 | 2022-09-29 | 桂林芯飞光电子科技有限公司 | Multifunctional suction nozzle and operating method |
| CN113163702A (en) * | 2021-04-16 | 2021-07-23 | 浙江鸿广科技有限公司 | Chip mounter |
| CN113163702B (en) * | 2021-04-16 | 2023-04-07 | 浙江鸿广科技有限公司 | Chip mounter |
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