CN110572763A - small-size MEMS microphone with welded side wall - Google Patents
small-size MEMS microphone with welded side wall Download PDFInfo
- Publication number
- CN110572763A CN110572763A CN201911006027.0A CN201911006027A CN110572763A CN 110572763 A CN110572763 A CN 110572763A CN 201911006027 A CN201911006027 A CN 201911006027A CN 110572763 A CN110572763 A CN 110572763A
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- CN
- China
- Prior art keywords
- packaging substrate
- packaging
- chip
- substrate
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000004806 packaging method and process Methods 0.000 claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000003321 amplification Effects 0.000 abstract description 5
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
Abstract
the invention relates to the field of microphones, in particular to a small-size MEMS microphone with welded side walls, which comprises a packaging substrate and a shell, wherein the packaging substrate is a stepped PCB (printed Circuit Board), a Sensor chip and an audio amplification chip are fixed on the upper end surface of the packaging substrate, the Sensor chip and the audio amplification chip are connected with an external element through a bonding wire in a soldering manner, the soldering position of the bonding wire and the external element is arranged at the stepped position of the packaging substrate, the packaging substrate is mutually fixed with the shell through an adhesive, and the bonding position of the packaging substrate and the shell is also arranged at the stepped position of the packaging substrate. The size of the upper end face of the design substrate can be basically the same as the size of a chip core, the requirements of CSP packaging specifications can be basically met, and the design of minimum packaging is realized.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of microphones, in particular to a small-size MEMS microphone with welded side walls.
[ background of the invention ]
MEMS is a Micro-Electro mechanical System (Micro-Electro mechanical System), which refers to a sensor device with a size of several millimeters or less, and the internal structure of the sensor device is generally in the micrometer or nanometer level, and the sensor device is an independent intelligent System. Briefly, the MEMS is a silicon-based sensor formed by miniaturizing mechanical components of a conventional sensor, fixing a device on a silicon wafer (wafer) by a three-dimensional stacking technique, for example, a three-dimensional through-silicon via (TSV) technique, and finally cutting and assembling the device in a specially-customized packaging form according to different application occasions. The MEMS has the advantages of miniaturization and high integration degree which cannot be achieved by the common sensor;
MEMS microphones are widely used in the acoustic field due to their thin and light weight, but in many miniaturized acoustic devices, smaller MEMS microphones are required, and at this stage, MEMS microphones in a conventional package form do not have an effective way to reduce the size of the product. Traditional encapsulated microphone, packaging substrate and shell pass through the adhesive and bond together, and its bonding part is at packaging substrate's upper surface, and bonding area can waste partly face area, and the short circuit appears for preventing the lead bonding simultaneously, and routing position and bonding area will keep certain safe distance, consequently lead to the product inner structure not compact enough, so the whole size of encapsulation is on the large side.
the invention is provided for overcoming the defects of the prior art.
[ summary of the invention ]
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and to provide a side wall soldered small-sized MEMS microphone.
The invention can be realized by the following technical scheme:
The invention discloses a small-size MEMS microphone with welded side walls, which comprises a packaging substrate and a shell, wherein the packaging substrate is a stepped PCB, a Sensor chip and an audio amplification chip are fixed on the upper end surface of the packaging substrate, the Sensor chip and the audio amplification chip are connected with an external element through a bonding wire in a soldering manner, the soldering positions of the bonding wire and the external element are arranged at the stepped position of the packaging substrate, the packaging substrate is mutually fixed with the shell through an adhesive, and the bonding position of the packaging substrate and the shell is also arranged at the stepped position of the packaging substrate. The soldering positions of the packaging substrate and external elements are arranged at the step positions of the step-shaped PCB, the upper surface of the packaging substrate is free of any welding area, the bonding position of the packaging substrate and the shell is arranged at the step positions of the step-shaped PCB, and the bonding position does not occupy the upper end face position of the packaging substrate, so that the packaging area can be utilized to the maximum extent, and meanwhile, the short circuit risk is extremely low; the size of the upper end face of the design substrate can be basically the same as the size of a chip core, the requirements of CSP packaging specifications can be basically met, and the design of minimum packaging is realized.
preferably, the bonding wire is made of a copper material.
preferably, the adhesive is made of a silica gel material.
Compared with the prior art, the invention has the following advantages:
1. The soldering tin positions of the packaging substrate and the external element are arranged at the step positions of the step-shaped PCB, and the upper surface of the packaging substrate is not provided with any welding area, so that the packaging area can be utilized to the maximum extent, and meanwhile, the short circuit risk is extremely low.
2. The bonding position of the packaging substrate and the shell is arranged at the step position of the step-shaped PCB, the bonding position does not occupy the position of the upper end face of the packaging substrate, and the packaging area can be utilized to the maximum extent.
3. The device can have a smaller size when the same-size chip is packaged, or the same-size chip can be packaged by the device and the method.
[ description of the drawings ]
The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a prior art structure;
FIG. 3 is a schematic structural diagram of a substrate and a Sensor chip according to the present invention;
FIG. 4 is a schematic diagram of a package substrate in the prior art;
FIG. 5 is a schematic view of a package substrate according to the present invention;
In the figure: 1. a housing; 2. a Sensor chip; 3. a package substrate; 31. a step position; 4. An audio amplification chip; 5. a bonding wire;
[ detailed description ] embodiments
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings:
As shown in fig. 1 to 5, the invention discloses a small-sized MEMS microphone with welded side walls, which comprises a package substrate 3 and a housing 1, wherein the package substrate 3 is a stepped PCB, a Sensor chip 2 and an audio amplifier chip 4 are fixed on the upper end surface of the package substrate 3, the Sensor chip 2 and the audio amplifier chip 4 are connected with an external component through a bonding wire 5, the bonding wire 5 and the external component are soldered at a stepped position 31 of the package substrate 3, the package substrate 3 is fixed with the housing 1 through an adhesive, and the adhesive position between the package substrate 3 and the housing 1 is also set at the stepped position 31 of the package substrate 3. The soldering positions of the package substrate 3 and external elements are arranged at the step position 31 of the step-shaped PCB, the upper surface of the package substrate 3 is free of any welding area, the bonding position of the package substrate 3 and the shell 1 is arranged at the step position 31 of the step-shaped PCB, and the bonding position does not occupy the position of the upper end surface of the package substrate 3, so that the package area can be utilized to the maximum extent, and meanwhile, the short circuit risk is extremely low; the size of the upper end face of the design substrate can be basically the same as the size of a chip core, the requirements of CSP packaging specifications can be basically met, and the design of minimum packaging is realized.
Wherein, the bonding wire 5 is made of copper material.
wherein, the adhesive is made of silica gel material.
The above description is only a preferred embodiment of the present invention, and it should be noted that a person skilled in the art can make various changes, modifications, substitutions and alterations to the embodiments without departing from the technical principles of the present invention, and such changes, modifications, substitutions and alterations should also be regarded as the protection scope of the present invention.
Claims (3)
1. A small-size MEMS microphone with welded side walls comprises a packaging substrate and a shell, and is characterized in that: packaging substrate is the notch cuttype PCB board, packaging substrate up end is fixed with Sensor chip and audio frequency and enlargies the chip, Sensor chip passes through the bonding wire with the audio frequency enlargies the chip and is connected with external component soldering tin, the bonding wire sets up the ladder position at aforementioned packaging substrate with external component soldering tin position, packaging substrate passes through adhesive and shell reciprocal anchorage, packaging substrate also sets up the ladder position at aforementioned packaging substrate with the bonding position of shell.
2. The small-sized MEMS microphone with welded side wall according to claim 1, wherein: the bonding wire is made of copper material.
3. The small-sized MEMS microphone with welded side wall according to claim 1, wherein: the adhesive is made of a silica gel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911006027.0A CN110572763A (en) | 2019-10-22 | 2019-10-22 | small-size MEMS microphone with welded side wall |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911006027.0A CN110572763A (en) | 2019-10-22 | 2019-10-22 | small-size MEMS microphone with welded side wall |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110572763A true CN110572763A (en) | 2019-12-13 |
Family
ID=68785816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911006027.0A Pending CN110572763A (en) | 2019-10-22 | 2019-10-22 | small-size MEMS microphone with welded side wall |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110572763A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115425379A (en) * | 2022-09-21 | 2022-12-02 | 河北美泰电子科技有限公司 | MEMS circulator, packaging method thereof and microwave component |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090129622A1 (en) * | 2007-11-21 | 2009-05-21 | Industrial Technology Research Institute | Mems microphone module and manufacturing process thereof |
| KR20110054529A (en) * | 2009-11-18 | 2011-05-25 | 주식회사 비에스이 | Mems microphone package and packaging method |
| CN103347239A (en) * | 2013-06-08 | 2013-10-09 | 歌尔声学股份有限公司 | MEMS microphone and assembling method thereof |
| US20140353779A1 (en) * | 2013-05-28 | 2014-12-04 | Zilltek Technology Corp. | Mems microphone and electronic equipment having the mems microphone |
| CN204131728U (en) * | 2014-09-29 | 2015-01-28 | 山东共达电声股份有限公司 | A kind of advance sound MEMS microphone |
| CN204681598U (en) * | 2015-06-29 | 2015-09-30 | 歌尔声学股份有限公司 | A kind of encapsulating structure of MEMS microphone |
| WO2018218509A1 (en) * | 2017-05-31 | 2018-12-06 | Goertek.Inc | A mems microphone and a manufacturing method thereof |
| CN209201346U (en) * | 2018-10-29 | 2019-08-02 | 歌尔科技有限公司 | MEMS microphone |
| CN209283508U (en) * | 2019-01-17 | 2019-08-20 | 朝阳聚声泰（信丰）科技有限公司 | Without pressure welding small size MEMS microphone |
| CN210491198U (en) * | 2019-10-22 | 2020-05-08 | 朝阳聚声泰（信丰）科技有限公司 | Small-size MEMS microphone with welded side wall |
-
2019
- 2019-10-22 CN CN201911006027.0A patent/CN110572763A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090129622A1 (en) * | 2007-11-21 | 2009-05-21 | Industrial Technology Research Institute | Mems microphone module and manufacturing process thereof |
| KR20110054529A (en) * | 2009-11-18 | 2011-05-25 | 주식회사 비에스이 | Mems microphone package and packaging method |
| US20140353779A1 (en) * | 2013-05-28 | 2014-12-04 | Zilltek Technology Corp. | Mems microphone and electronic equipment having the mems microphone |
| CN103347239A (en) * | 2013-06-08 | 2013-10-09 | 歌尔声学股份有限公司 | MEMS microphone and assembling method thereof |
| CN204131728U (en) * | 2014-09-29 | 2015-01-28 | 山东共达电声股份有限公司 | A kind of advance sound MEMS microphone |
| CN204681598U (en) * | 2015-06-29 | 2015-09-30 | 歌尔声学股份有限公司 | A kind of encapsulating structure of MEMS microphone |
| WO2018218509A1 (en) * | 2017-05-31 | 2018-12-06 | Goertek.Inc | A mems microphone and a manufacturing method thereof |
| CN209201346U (en) * | 2018-10-29 | 2019-08-02 | 歌尔科技有限公司 | MEMS microphone |
| CN209283508U (en) * | 2019-01-17 | 2019-08-20 | 朝阳聚声泰（信丰）科技有限公司 | Without pressure welding small size MEMS microphone |
| CN210491198U (en) * | 2019-10-22 | 2020-05-08 | 朝阳聚声泰（信丰）科技有限公司 | Small-size MEMS microphone with welded side wall |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115425379A (en) * | 2022-09-21 | 2022-12-02 | 河北美泰电子科技有限公司 | MEMS circulator, packaging method thereof and microwave component |
| CN115425379B (en) * | 2022-09-21 | 2024-02-06 | 河北美泰电子科技有限公司 | MEMS circulator, packaging method thereof and microwave component |
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