CN110536589A - A kind of radiator structure in PCB design - Google Patents
A kind of radiator structure in PCB design Download PDFInfo
- Publication number
- CN110536589A CN110536589A CN201910788773.3A CN201910788773A CN110536589A CN 110536589 A CN110536589 A CN 110536589A CN 201910788773 A CN201910788773 A CN 201910788773A CN 110536589 A CN110536589 A CN 110536589A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- cooling fin
- radiator structure
- pcb
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides the radiator structure in a kind of PCB design, it is characterized in that, the radiator structure includes pcb board and several piece cooling fin, electrical connection is provided with chip on the upside of the pcb board, the pcb board is respectively fixed with cooling fin in two sides up and down, and radiator structure compatible with chip is provided on cooling fin.The structure of above-mentioned radiator structure is simple and heat-sinking capability is strong, because its simple structure makes it more durable, and its production cost is also lower, more helps promote.
Description
Technical field
The invention belongs to electronic fields, are related specifically to a kind of pcb board field.
Background technique
In product use process, cause to produce since the too high a large amount of heat of generation of chip power-consumption can not disperse rapidly for the moment
Product temperature is spent high and is unable to operate normally, and needs the considerations of carrying out heat dissipation design at this time, quickly reduces to guarantee using temperature
Product can continue to operate normally.
A kind of documents of Patent No. " CN201821371480.2 ": thermal conduction effect of QFN encapsulation chip welding
Good PCB pad, including PCB substrate and heat dissipation bonding pad and the hot weld disk being mounted in PCB substrate, chip and is mounted on core
The exposure pad of piece side, heat dissipation bonding pad and hot weld the disk two sides that be symmetrically distributed in PCB substrate opposite, exposure pad and hot weld disk
It mutually welds, the side of PCB substrate offers multiple equally distributed heat release holes, and it is logical that the side of heat dissipation bonding pad offers multiple first
Hole, multiple first through hole are corresponding with multiple heat release holes respectively, and the bottom of PCB substrate is equipped with copper earth plate, the top of copper earth plate
Four fixed mechanisms that portion is provided symmetrically, fixed mechanism include fixed column, and the first threaded hole is offered at the top of fixed column,
The second threaded hole corresponding with the first threaded hole is offered at the top of PCB substrate.It can be rapidly to the chip in PCB substrate
It radiates, to ensure that the normal work of chip.
Above-mentioned documents increase the heat-sinking capability of PCB substrate to a certain extent, but its heat-sinking capability is still aobvious
Deficiency, and because its structure is complicated, production cost times is so relatively high, is not easy to promote.
Summary of the invention
To solve the above-mentioned problems, strong the purpose of the present invention is to provide a heat-sinking capability and structure is simply a kind of
Radiator structure in PCB design.
It is another object of the present invention to provide a long service life and convenient for dissipating in a kind of PCB design of popularization
Heat structure.
To achieve the goals above, technical scheme is as follows.
The present invention provides the radiator structure in a kind of PCB design, which is characterized in that the radiator structure include pcb board and
Several piece cooling fin, pcb board upside electrical connection are provided with chip, and the pcb board is respectively fixed with cooling fin in two sides up and down.On
The structure for stating radiator structure is simple and heat-sinking capability is strong, because its simple structure makes it more durable, and it is produced into
This is also lower, more helps promote.
Further, the pcb board corresponds to setting grooved hole at chip, and it is empty that the chip and slot are formed with receiving heat dissipation
Chamber.The occupied area in pcb board surface is the 95% of chip bottom area to above-mentioned slot again, that is, chip just covers slot
Hole.
Further, the cooling fin includes radiating part and contact portion, and the radiating part is fixedly connected with contact portion, institute
The contact portion for stating the cooling fin on the upside of pcb board is attached to chip upper surface, and the contact portion setting of the cooling fin on the downside of the pcb board exists
It accommodates in heat dissipation cavity and is attached to chip lower surface.The contact area of above-mentioned contact portion and chip is chip bottom area
94%, contact portion is slightly smaller than groove, can smoothly install into, and can increase its contact area with chip as far as possible, increases
The heat-sinking capability of strong radiator structure.In heat dissipation, chip delivers heat to radiating part by contact portion, and radiating part dissipates heat
It sends out.
Further, it is generated between the pcb board and the radiating part of the cooling fin of upper and lower two sides and keeps away a cavity, it is described
Two sides radiating part is provided with corresponding through-hole up and down for pcb board and pcb board, the heat dissipation of two sides above and below the pcb board and pcb board
It is provided with the screw of adaptation in portion in corresponding through-hole, the tail end of the screw is provided with nut, on the pcb board and pcb board
It is fastened between the cooling fin of lower two sides by screw and nut.An above-mentioned cavity of keeping away helps pcb board to play on pcb board
Component keeps away the effect of position.
Further, the radiating part is provided with far from the through hole of that side surface of pcb board and keeps away a groove.It is above-mentioned to keep away position
Groove during installation, can sink in radiating part for screw and nut, not only be able to satisfy fixed effect, but also do not affect the appearance, and
It can also conflict outside with other structures generation because screw-nut is prominent when in use to avoid the structure.
Further, the cooling fin is provided with radiating fin.Above-mentioned radiating fin can further increase thermal diffusivity
Energy.
Further, the contact portion of the cooling fin on the upside of the pcb board is heat dissipation groove, and the heat dissipation groove and chip are suitable
Match, the contact portion of the cooling fin on the downside of the pcb board is heat dissipation convex block.
The beneficial effects of the present invention are compared with prior art, the structure of radiator structure of the present invention is simple and heat radiation energy
Power is strong, because its simple structure makes it more durable, and its production cost is also lower, more helps promote.
Detailed description of the invention
Fig. 1 is a kind of perspective view of the explosion of embodiment of the radiator structure in a kind of PCB design of the present invention.
Fig. 2 is a kind of schematic elevation view of embodiment of the radiator structure in a kind of PCB design of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
To achieve the above object, technical scheme is as follows.
The present invention provides the radiator structure in a kind of PCB design, which is characterized in that radiator structure includes pcb board 1 and several piece
Cooling fin 2, electrical connection is provided with chip 3 on the upside of pcb board 1, and about 1 two sides of pcb board are respectively fixed with cooling fin 2.
In the present embodiment, grooved hole (not shown) is set at the corresponding chip 3 of pcb board 1, chip 3 and slot are formed with appearance
Receive heat dissipation cavity (not shown).
In the present embodiment, cooling fin 2 includes radiating part 21 and contact portion 22, and radiating part 21 and contact portion 22, which are fixed, to be connected
It connects, the contact portion 22 of the cooling fin 2 of 1 upside of pcb board is attached to 3 upper surface of chip, the contact portion 22 of the cooling fin 2 of 1 downside of pcb board
Setting is accommodating in heat dissipation cavity and is being attached to chip lower surface.
In the present embodiment, it is generated between pcb board 1 and the radiating part 21 of the cooling fin 2 of upper and lower two sides and keeps away a cavity
4, pcb board 1 and about 1 two sides radiating part 21 of pcb board are provided with corresponding through-hole 5, about 1 two sides of pcb board 1 and pcb board
Radiating part 21 on the screw 6 of adaptation is provided in corresponding through-hole 5, the tail end of screw 6 is provided with nut 7, pcb board 1 and PCB
It is fastened between the cooling fin 2 of about 1 two sides of plate by screw 6 and nut 7.
In the present embodiment, it is provided at through-hole 5 of the radiating part 21 far from 1 that side surface of pcb board and keeps away a groove 8.
In the present embodiment, cooling fin 2 is provided with radiating fin 23.
In the present embodiment, the contact portion 21 of the cooling fin 2 of 1 upside of pcb board is heat dissipation groove (not shown), and radiate groove
It is adapted to chip 3, the contact portion 21 of the cooling fin 2 on the downside of pcb board is heat dissipation convex block.
In another embodiment, the contact portion 21 of cooling fin 2 and pcb board downside cooling fin 2 is on the upside of the pcb board
Radiate convex block.
Radiating part 21 and contact portion 22 are two kinds of embodiments of radiator structure in above-described embodiment, can also be that other can
Realize the structure of heat sinking function.
The beneficial effects of the present invention are compared with prior art, the structure of radiator structure of the present invention is simple and heat radiation energy
Power is strong, because its simple structure makes it more durable, and its production cost is also lower, more helps promote.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (8)
1. the radiator structure in a kind of PCB design, which is characterized in that the radiator structure includes pcb board and several piece cooling fin, institute
It states electrical connection on the upside of pcb board and is provided with chip, the pcb board is respectively fixed with cooling fin in two sides up and down, and is arranged on cooling fin
There is radiator structure compatible with chip.
2. the radiator structure in a kind of PCB design as described in claim 1, which is characterized in that the pcb board corresponds at chip
Grooved hole is set, and the chip and slot are formed with receiving heat dissipation cavity.
3. the radiator structure in a kind of PCB design as claimed in claim 2, which is characterized in that the cooling fin includes scattered
Hot portion and contact portion, the radiating part are fixedly connected with contact portion, and the contact portion of the cooling fin on the upside of the pcb board is attached to chip
The contact portion setting of upper surface, the cooling fin on the downside of the pcb board is accommodating in heat dissipation cavity and is being attached to chip lower surface.
4. the radiator structure in a kind of PCB design as claimed in claim 3, which is characterized in that the pcb board and upper and lower two sides
Cooling fin radiating part between combine after generate and keep away a cavity, two sides radiating part is all provided with up and down for the pcb board and pcb board
It is equipped with corresponding through-hole, is provided with the spiral shell of adaptation above and below the pcb board and pcb board on the radiating part of two sides in corresponding through-hole
Silk, the tail end of the screw are provided with nut, pass through screw and spiral shell above and below the pcb board and pcb board between the cooling fin of two sides
Mother fastens.
5. the radiator structure in a kind of PCB design as claimed in claim 4, which is characterized in that the radiating part is far from pcb board
The through hole of that side surface, which is provided with, keeps away a groove.
6. the radiator structure in a kind of PCB design as described in claim 1, which is characterized in that the cooling fin is provided with scattered
Hot fin.
7. the radiator structure in a kind of PCB design as claimed in claim 3, which is characterized in that the heat dissipation on the upside of the pcb board
The contact portion of piece is heat dissipation groove, the heat dissipation groove and chip adaptation, and the contact portion of the cooling fin on the downside of the pcb board is scattered
Hot convex block.
8. the radiator structure in a kind of PCB design as claimed in claim 3, which is characterized in that cooling fin on the upside of the pcb board
Contact portion with cooling fin on the downside of pcb board is heat dissipation convex block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910788773.3A CN110536589A (en) | 2019-08-26 | 2019-08-26 | A kind of radiator structure in PCB design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910788773.3A CN110536589A (en) | 2019-08-26 | 2019-08-26 | A kind of radiator structure in PCB design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110536589A true CN110536589A (en) | 2019-12-03 |
Family
ID=68662811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910788773.3A Pending CN110536589A (en) | 2019-08-26 | 2019-08-26 | A kind of radiator structure in PCB design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110536589A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913594A (en) * | 2019-12-17 | 2020-03-24 | 无锡市五十五度科技有限公司 | Method for connecting heat dissipation plate and welded printed board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201886404U (en) * | 2010-11-30 | 2011-06-29 | 英业达股份有限公司 | Heat dissipation module provided with external force compression protecting mechanism |
| CN201966352U (en) * | 2010-11-30 | 2011-09-07 | 富士康(昆山)电脑接插件有限公司 | Electric connector assembly |
| US20130077256A1 (en) * | 2010-06-09 | 2013-03-28 | Sharp Kabushiki Kaisha | Heat dissipation structure for electronic device |
| CN203656874U (en) * | 2013-12-26 | 2014-06-18 | 杭州柏年光电标饰有限公司 | Fast cooling structural module |
-
2019
- 2019-08-26 CN CN201910788773.3A patent/CN110536589A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130077256A1 (en) * | 2010-06-09 | 2013-03-28 | Sharp Kabushiki Kaisha | Heat dissipation structure for electronic device |
| CN201886404U (en) * | 2010-11-30 | 2011-06-29 | 英业达股份有限公司 | Heat dissipation module provided with external force compression protecting mechanism |
| CN201966352U (en) * | 2010-11-30 | 2011-09-07 | 富士康(昆山)电脑接插件有限公司 | Electric connector assembly |
| CN203656874U (en) * | 2013-12-26 | 2014-06-18 | 杭州柏年光电标饰有限公司 | Fast cooling structural module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913594A (en) * | 2019-12-17 | 2020-03-24 | 无锡市五十五度科技有限公司 | Method for connecting heat dissipation plate and welded printed board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4668292B2 (en) | LED lighting device and heat dissipation member of LED lighting device | |
| TW200531294A (en) | Light-emitting device with high heat dissipation efficiency | |
| KR101152297B1 (en) | Led lamp | |
| TWM378614U (en) | The ceramic radiator with conductive circuit | |
| CN109616452A (en) | A kind of radiating subassembly, corresponding radiator and corresponding circuit board | |
| CN208971845U (en) | A kind of PCB pad that the thermal conduction effect of QFN encapsulation chip welding is good | |
| TW201215302A (en) | Thermal module and electronic device incorporating the same | |
| CN110536589A (en) | A kind of radiator structure in PCB design | |
| JP4438526B2 (en) | Power component cooling system | |
| CN210053642U (en) | Heat radiation component of circuit board and electronic equipment | |
| CN209880587U (en) | Heat radiator | |
| JP2008276999A (en) | Heat radiator of led lamp | |
| CN208738303U (en) | A kind of improved LED encapsulation structure | |
| CN208237698U (en) | A kind of novel bridge type LED streetlamp | |
| KR102063615B1 (en) | Street light fixture with air-cooled heat sink | |
| CN209563078U (en) | The server cooling fin of interchangeable radiating fin | |
| JPH077109A (en) | Package mounting structure | |
| JP3152577U (en) | Heat dissipation structure for communication equipment case | |
| CN111132524A (en) | Radiator for electronic product | |
| CN210405765U (en) | Metal substrate with good heat conductivity | |
| JP2008171963A (en) | Semiconductor chip cooling structure | |
| TWI413889B (en) | Heat dissipation device | |
| CN218158692U (en) | DMD packaging and heat dissipation structure for optical machine, heat dissipation pressing plate and projection optical machine | |
| CN213459716U (en) | IC chip easy to radiate heat | |
| CN216744266U (en) | Heat radiation structure and circuit board used by LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191203 |
|
| RJ01 | Rejection of invention patent application after publication |