CN110499492A - A kind of evaporation coating device and its evaporation coating method - Google Patents
A kind of evaporation coating device and its evaporation coating method Download PDFInfo
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- CN110499492A CN110499492A CN201910886093.5A CN201910886093A CN110499492A CN 110499492 A CN110499492 A CN 110499492A CN 201910886093 A CN201910886093 A CN 201910886093A CN 110499492 A CN110499492 A CN 110499492A
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- heating part
- reflecting plate
- crucible
- evaporation coating
- coating device
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of evaporation coating device and its evaporation coating method.The evaporation coating method includes the crucible for accommodating luminous organic material for luminous organic material, including evaporation source, evaporation source to be deposited, and is set to the nozzle of crucible top and is set to the heating part of crucible bottom, and nozzle is used to make the luminous organic material output after gasification；Heating part is used for heating crucible bottom, so that luminous organic material gasifies, it further include heat regulation mechanism, heat regulation mechanism is set to the side away from crucible of heating part, for automatically adjusting itself aperture opening ratio, to adjust its reflectivity to heating part heat.The evaporation coating device can realize the automatic adjustment to heating part heat reflectivity by the automatic adjustment to itself aperture opening ratio of heat regulation mechanism, so that it is guaranteed that homogeneous heating of the heating part to crucible bottom, and then ensure that the uniformity of vapor deposition film thickness.
Description
Technical field
The invention belongs to field of display technology, and in particular to a kind of evaporation coating device and its evaporation coating method.
Background technique
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) is due to self-luminous, wide view
The advantages that angle, high contrast, low power consumption, high reaction speed, receive more and more attention in field of display technology, study with
Investment, is broadly recognized as in the industry new next-generation display technology.But as high-end display screen, to realize OLED display screen
Scale of mass production there are still certain difficulty at present, mostly use vacuum evaporation luminous organic material at present.
Vacuum evaporation technology refers under vacuum conditions, heats luminous organic material by linear evaporation source and is vaporized,
Luminous organic material is sprayed by nozzle, and the material of gasification is contacted with glass substrate, and the deposition that is cooled condensation film forming passes through the method
Realize the scale of mass production of small size, high quality OLED display screen.But during vacuum evaporation, luminous organic material
Evaporation rate is easy to be influenced by several factors, and then influences whether the film thickness uniformity of OLED material.Luminous organic material
Film thickness uniformity it is most important to the performance of OLED device, film thickness uniformity is poor, and the colour cast problem of OLED device will compare
More serious, for example a certain column Cell colour cast problem of small angle pastiness, glass substrate is serious, influences yield, and then influence production capacity.In
In production, the standard of film thickness uniformity (Film thickness uniformity) is often formulated, once beyond established
Existing standard would have to stop production, not so can bring large-scale defective products.
If the stability of linear evaporation source influences whether the film thickness uniformity of machine luminescent material, for different linear vapor depositions
For source, structure design is similar, is made of heating system (Heater) and cooling system (cooling water), passes through it
The arrangement of Heater and cooling water guarantees homogeneous heating, thus guarantee film thickness uniformity, evaporation source reasonable in design,
Stability is often preferable, and film thickness adjusting is easier to, but even if structure designs reasonable evaporation source again, only leans on Heater and cooling
The arrangement de-regulation film thickness uniformity of water all unavoidably has certain limitation.In production for being adjusted beyond evaporation source heating
The poor situation of range, film thickness uniformity is controlled, often stops line and begins to speak to ascertain the reason and then solve the problems, such as, influence the company of production
Continuous property, time-consuming consumption money are laborious.
Heating process when how preferably evaporation source to be deposited carries out real-time monitoring, good during being deposited to ensure
Film thickness uniformity, be reduced or avoided stop line begin to speak processing have become current urgent problem to be solved.
Summary of the invention
The present invention is directed to the problems of the prior art, provides a kind of evaporation coating device and its evaporation coating method.The evaporation coating device energy
It is enough that the automatic adjustment to heating part heat reflectivity is realized by the automatic adjustment to itself aperture opening ratio of heat regulation mechanism, from
And ensure heating part to the homogeneous heating of crucible bottom, and then ensure that vapor deposition film thickness uniformity.
The present invention provides a kind of evaporation coating device, and for luminous organic material, including evaporation source to be deposited, the evaporation source includes
The crucible for accommodating luminous organic material is set to the nozzle of the crucible top and is set to the heating part of the crucible bottom,
The nozzle is used to make the luminous organic material output after gasification；The heating part is for heating the crucible bottom, so as to have
The gasification of machine luminescent material, further includes heat regulation mechanism, and it is described that the heat regulation mechanism is set to deviating from for the heating part
The side of crucible, for automatically adjusting itself aperture opening ratio, to adjust its reflectivity to the heating part heat.
Preferably, the heat regulation mechanism includes that adjustment portion, driving portion and monitoring control unit, the driving portion connect institute
State adjustment portion and the monitoring control unit；
The adjustment portion corresponds to the nozzle setting, forms reflection, the adjustment portion for the heat to the heating part
It is adjustable to the reflective surface area of heat；
The reflective surface area that the driving portion is used to that the adjustment portion to be driven to adjust it to heat；
Thickness of the monitoring control unit for real-time monitoring vapor deposition film layer, and according to the thickness real-time control of vapor deposition film layer
Driving of the driving portion to the adjustment portion.
Preferably, the adjustment portion includes muti-piece reflecting plate and the multiple groups support rod for being separately connected the Bu Tong reflecting plate；
The outer rim of reflecting plate described in muti-piece the crucible orthographic projection on the whole be overlapped；
Through-hole is not opened up on one of reflecting plate, offers through-hole on remaining described reflecting plate, described in difference
The percent opening of through-hole is different on reflecting plate；
The reflecting plate of through-hole is not opened up with respect to reflecting plate described in remaining far from the heating part；
The support rod is electrically connected the driving portion, and the driving portion can drive the support rod to move；
The reflecting plate of through-hole is not opened up and the reflection Board position near the heating part is fixed, described in remaining
Reflecting plate can be moved in the drive lower edge of the support rod close to or far from the direction of the heating part.
Preferably, along the direction far from the heating part, the percent opening of the reflecting plate is gradually reduced.
Preferably, the reflecting plate is five pieces.
Preferably, the percent opening of four pieces of reflecting plates is respectively 90%, 75%, 50%, 25%.
Preferably, connecting support rod described in one group of reflecting plate described in same has four, equidistantly distributed and to described
The outer rim of reflecting plate forms support；
The support rod of reflecting plate corresponding position described in muti-piece can be mutually nested one under the driving of the driving portion
It rises or stretches out opposite to each other.
Preferably, the nozzle includes multiple, and the adjustment portion includes multiple, one a pair of the adjustment portion and the nozzle
It should be arranged.
Preferably, the driving portion uses cylinder.
The present invention also provides a kind of evaporation coating methods of above-mentioned evaporation coating device, comprising: heating part heating crucible bottom, so as to hold
The luminous organic material gasification being contained in the crucible；The nozzle of luminous organic material steam after gasification from the crucible top
Output is deposited on to which on plated substrate, during the crucible is heated in the heating part, heat regulation mechanism automatically adjusts itself
Aperture opening ratio, to adjust its reflectivity to the heating part heat.
Beneficial effects of the present invention: evaporation coating device provided by the present invention can be passed through by the way that heat regulation mechanism is arranged
The automatic adjustment to heating part heat reflectivity is realized in automatic adjustment to itself aperture opening ratio of heat regulation mechanism, so that it is guaranteed that
Heating part ensure that the uniformity of vapor deposition film thickness to the homogeneous heating of crucible bottom, during efficiently solving vapor deposition
The problem of vapor deposition membrane thickness unevenness caused by luminous organic material heating temperature unevenness occurred, while can be avoided
Stop line when membrane thickness unevenness is deposited to begin to speak to handle, it is time saving and energy saving, it is ensured that the continuity of vapor deposition is conducive to improve production capacity.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of evaporation coating device in the embodiment of the present invention；
Fig. 2 is the schematic diagram of the reflecting plate of the different percent openings of evaporation coating device in Fig. 1；
Fig. 3 is that the reflecting plate of different openings rate adjusts the schematic diagram of reflection heat；
Fig. 4 is the schematic diagram that the support rod of different reflecting plates is nested together；
Fig. 5 is the adjustment process schematic diagram that adjustment portion adjusts its aperture opening ratio；
Fig. 6 is the adjustment state schematic diagram that adjustment portion adjusts its aperture opening ratio；
Fig. 7 is the schematic diagram that evaporation coating device adjusts certain thicknesses of layers by adjusting other thicknesses of layers in Fig. 1；
Fig. 8 is that evaporation coating device carries out the schematic diagram that film thickness fixed point is adjusted in Fig. 1.
Wherein appended drawing reference are as follows:
1, evaporation source；2, crucible；3, nozzle；4, heat regulation mechanism；41, adjustment portion；411, reflecting plate；412, it supports
Bar；100, through-hole；42, driving portion；43, control unit is monitored.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, with reference to the accompanying drawing and specific embodiment party
Formula is described in further detail a kind of evaporation coating device of the present invention and its evaporation coating method.
The embodiment of the present invention provides a kind of evaporation coating device, for luminous organic material to be deposited, as shown in Figure 1, including vapor deposition
Source 1, evaporation source 1 include the crucible 2 for accommodating luminous organic material, are set to the nozzle 3 at 2 top of crucible and are set to 2 bottom of crucible
The heating part (not shown) in portion, nozzle 3 are used to make the luminous organic material output after gasification；Heating part is used for heating crucible
2 bottoms, so that luminous organic material gasifies, it further include heat regulation mechanism 4, heat regulation mechanism 4 is set to the back of heating part
Side from crucible 2, for automatically adjusting itself aperture opening ratio, to adjust its reflectivity to heating part heat.
The evaporation coating device can be by itself aperture opening ratio of heat regulation mechanism 4 by the way that heat regulation mechanism 4 is arranged
Automatic adjustment realizes the automatic adjustment to heating part heat reflectivity, so that it is guaranteed that heating part is equal to the heating of 2 bottom of crucible
It is even, so ensure that vapor deposition film thickness uniformity, efficiently solve vapor deposition during occur due to luminous organic material by
The problem of vapor deposition membrane thickness unevenness caused by hot temperature unevenness, while can be avoided and stop line when membrane thickness unevenness is deposited and begin to speak
Processing, it is time saving and energy saving, it is ensured that the continuity of vapor deposition is conducive to improve production capacity.
Wherein, heat regulation mechanism 4 includes adjustment portion 41, driving portion 42 and monitoring control unit 43, and the connection of driving portion 42 is adjusted
Section portion 41 and monitoring control unit 43；The setting of 41 corresponding nozzle 3 of adjustment portion forms reflection, adjustment portion for the heat to heating part
The reflective surface area of 41 pairs of heats is adjustable；Driving portion 42 is for driving adjustment portion 41 to adjust its reflective surface area to heat；Monitoring control
Thickness of the portion 43 processed for real-time monitoring vapor deposition film layer, and according to the thickness real-time control driving portion 42 of vapor deposition film layer to adjustment portion
41 driving.It is equal to the heating of 2 bottom of crucible to can be realized heating part by the adjusting to heat reflective surface area for adjustment portion 41
It is even, thus ensure that vapor deposition film thickness uniformity, efficiently solve vapor deposition during occur due to luminous organic material by
The problem of vapor deposition membrane thickness unevenness caused by hot temperature unevenness.
In the present embodiment, as shown in Figures 2 and 3, adjustment portion 41 includes muti-piece reflecting plate 411 and is separately connected different reflections
The multiple groups support rod 412 of plate 411；The outer rim of muti-piece reflecting plate 411 crucible 2 orthographic projection on the whole be overlapped；It is one of
Through-hole 100 is not opened up on reflecting plate 411, through-hole 100, through-hole on different reflecting plates 411 are offered on remaining reflecting plate 411
100 percent opening is different；Remaining opposite reflecting plate 411 of reflecting plate 411 of through-hole 100 is not opened up far from heating part；Support rod 412
It is electrically connected driving portion 42, driving portion 42 can drive support rod 412 to move；The reflecting plate 411 of through-hole 100 is not opened up and near adding
411 position of reflecting plate in hot portion is fixed, remaining reflecting plate 411 can support rod 412 drive lower edge close to or far from heating part
Direction it is mobile.
Preferably, along the direction far from heating part, the percent opening of reflecting plate 411 is gradually reduced.
Preferably, reflecting plate 411 is five pieces.The percent opening of four pieces of reflecting plates 411 is respectively 90%, 75%, 50%,
25%.
The main function of reflecting plate 411 is the heat for keeping 2 bottom luminous organic material of crucible heated, passes through reflecting plate
It is different that the adjusting of 411 percent openings is adjustable the heated heat in 2 bottom of crucible, to play the role of adjusting vapor deposition film thickness uniformity.Instead
The percent opening for penetrating plate 411 is different, and the heat for receiving storage is different, so that the heat of reflection is different, 2 bottom organic light emission material of crucible
Heated also just different, the luminous organic material evaporation rate difference for then causing nozzle 3 to spray of material, and then can control adjusting
The uniformity of film thickness is deposited.The percent opening of reflecting plate 411 is bigger, and the heat for receiving storage is more, and the heat of reflection is also just smaller,
By the variation of the percent opening of reflecting plate 411, the online real-time adjusting of vapor deposition film thickness uniformity is realized, it is suitable to expand its adjusting
With range, long-time, extensive, high-quality, high yield continuous production ensure that.
It should be noted that reflecting plate 411 or six pieces or more, what the percent opening of each reflecting plate 411 can also divide
Thinner, the percent opening of such as each reflecting plate 411 differs 5%-10% each other, and subtleer adjusting can be so carried out to film thickness.
Which is not described herein again.
Further, in this embodiment one group of support rod 412 of connection same reflecting plate 411 has four, equidistant point
Cloth simultaneously forms support to the outer rim of reflecting plate 411；The support rod 412 of 411 corresponding position of muti-piece reflecting plate can be in driving portion 42
It is nested together (as shown in Figure 4) under driving or stretches out opposite to each other.That is during the support rod 412 of reflecting plate 411 is
412 internal diameter of support rod of empty cylinder, different reflecting plates 411 is different, this keeps the support rod 412 of different reflecting plates 411 mutually embedding
Set stacks, and 412 internal diameter of outermost layer support rod is maximum, and ecto-entad internal diameter is successively reduced, and the identical support rod 412 of one group of internal diameter is solid
Determine one piece of reflecting plate 411, driving portion 42 can drive every group of support rod 412 to be freely lifted.The support rod 412 of above structure is set
It sets, be able to achieve each piece of reflecting plate 411 is freely lifted movement.
The specific adjustment process of adjustment portion 41 with above structure are as follows: as shown in Figure 5 and Figure 6, adjustment portion 41 it is initial
State is that the maximum reflecting plate 411 of percent opening is located at top layer, and the reflecting plate 411 of non-aperture is located at lowest level, top layer and most
This two pieces of 411 positions of reflecting plate of lower layer immobilize, other three pieces of reflecting plates 411 are located at top layer and this two pieces undermost
Between reflecting plate 411, and original state is that three pieces of intermediate reflecting plates 411 are stacked and placed on lowest level reflecting plate 411；Adjustment portion 41
When reflective surface area is adjusted, the rising of the reflecting plate 411 of its corresponding support can be driven by the rising of one group of support rod 412,
Until it is in contact with the reflecting plate 411 of top layer and is bonded, while other centrally located reflecting plates 411 can continue to lead to
It crosses and its support rod 412 is supported to rise, until contacting fitting with the reflecting plate 411 on upper layer, further realize adjustment portion percent opening
Reduction；To realize the variation of 41 aperture opening ratio of adjustment portion, and then realize the adjusting of 41 reflective surface area of adjustment portion.Otherwise adjustment portion
The increase recovery of 41 aperture opening ratios can be realized by the decline of support rod 412.By the movement of support rod 412, realize not
With the free switching combination of the reflecting plate 411 of percent opening, to realize the automatic adjustment of 41 reflective surface area of adjustment portion, Jin Ershi
The flexible modulation of vapor deposition film thickness uniformity is showed.In addition, by the adjusting to above structure adjustment portion 41, it can also be further real
The uniformity of film thickness is now specifically deposited.
In the present embodiment, nozzle 3 is including multiple, and including multiple, adjustment portion 41 is set adjustment portion 41 with the one-to-one correspondence of nozzle 3
It sets.If nozzle 3 is seven, adjustment portion 41 is seven.It is adjusted so set, fixed point may be implemented.The tune of film thickness uniformity at present
Section mode is heating part adjusting, and heating part distribution is mostly monoblock type, two-part or three-stage, is distributed as especially with three-stage
Good, film thickness stability and uniformity adjusting are also optimal.Different, the Lai Shixian by the heating heat for adjusting three sections of bottom heating part
The difference of luminous organic material heating temperature, and then realize the adjusting of vapor deposition film thickness uniformity.But due to the hot spoke of heating part
Penetrate that range is larger, a heating part can influence the evaporation rate of the ejection material of multiple nozzles 3, can not often cope with glass
The problem that substrate only has somewhere film thickness partially thick or partially thin, especially point midway film thickness are abnormal, and then will cause glass substrate
Colour cast occurs for a certain column, influences yield, and nozzle 3 adjusts film thickness uniformity, each adjusting using seven adjustment portions 41 below
The reflecting plate 411 in portion 41 can carry out the free switching of percent opening, it can be achieved that fixed point is adjusted, and solves existing evaporation source and adjusts heat
The larger problem of radiation scope, and then can solve the problems, such as a certain column colour cast of glass substrate occurred in production, yield is improved,
It ensure that the duration of production.
In the present embodiment, driving portion 42 uses cylinder.Every group of support rod 412 can be under the pneumatic action of cylinder freely
Lifting.
As shown in fig. 7, when preparing to form organic light emitting display product using above-mentioned evaporation coating device, in the material of certain film layer
Film thickness uniformity is poor, in the nonadjustable situation of film thickness, can be compensated by adjusting the thickness of other film layers (such as shared layer),
So that the total film thickness uniformity of organic light emitting display product is reached preferably even more preferably standard, and then produces the organic of high-quality
Luminescence display product.By using above-mentioned evaporation coating device, it can also realize that film thickness fixed point is adjusted, solve the vapor deposition certain point films of film layer
Thick partially thick or partially thin problem realizes thicknesses of layers homogenization, as shown in Figure 8.
Above structure based on evaporation coating device, the present embodiment also provide a kind of evaporation coating method of evaporation coating device, comprising: add
Hot portion's heating crucible bottom, so that the luminous organic material gasification being contained in crucible；Luminous organic material steam after gasification
It exports, is deposited on to which on plated substrate, in heating part during heating crucible, heat regulation mechanism is automatic from the nozzle of crucible top
The aperture opening ratio of itself is adjusted, to adjust its reflectivity to heating part heat.
By using above-mentioned evaporation coating method, the automatic adjustment treated and thicknesses of layers is deposited on plated substrate can be realized, meanwhile,
The fixed point for being also able to achieve evaporation film thickness is adjusted, to ensure that the uniformity of vapor deposition film thickness, and then improves vapor deposition yield, and protect
The duration of production is demonstrate,proved.
Beneficial effects of the present invention: evaporation coating device provided by the present invention can be passed through by the way that heat regulation mechanism is arranged
The automatic adjustment to heating part heat reflectivity is realized in automatic adjustment to itself aperture opening ratio of heat regulation mechanism, so that it is guaranteed that
Heating part ensure that the uniformity of vapor deposition film thickness to the homogeneous heating of crucible bottom, during efficiently solving vapor deposition
The problem of vapor deposition membrane thickness unevenness caused by luminous organic material heating temperature unevenness occurred, while can be avoided
Stop line when membrane thickness unevenness is deposited to begin to speak to handle, it is time saving and energy saving, it is ensured that the continuity of vapor deposition is conducive to improve production capacity.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of evaporation coating device, for luminous organic material, including evaporation source to be deposited, the evaporation source includes accommodating organic light emission
The crucible of material is set to the nozzle of the crucible top and is set to the heating part of the crucible bottom, and the nozzle is used for
Luminous organic material output after making gasification；The heating part is for heating the crucible bottom, so that luminous organic material gas
Change, which is characterized in that further include heat regulation mechanism, the heat regulation mechanism be set to the heating part away from the earthenware
The side of crucible, for automatically adjusting itself aperture opening ratio, to adjust its reflectivity to the heating part heat.
2. evaporation coating device according to claim 1, which is characterized in that the heat regulation mechanism includes adjustment portion, driving
Portion and monitoring control unit, the driving portion connect the adjustment portion and the monitoring control unit；
The adjustment portion corresponds to the nozzle setting, forms reflection for the heat to the heating part, the adjustment portion is to heat
The reflective surface area of amount is adjustable；
The reflective surface area that the driving portion is used to that the adjustment portion to be driven to adjust it to heat；
Thickness of the monitoring control unit for real-time monitoring vapor deposition film layer, and according to the thickness real-time control of vapor deposition film layer
Driving of the driving portion to the adjustment portion.
3. evaporation coating device according to claim 2, which is characterized in that the adjustment portion includes muti-piece reflecting plate and connects respectively
Connect the multiple groups support rod of the different reflecting plates；The outer rim of reflecting plate described in muti-piece the crucible orthographic projection weight on the whole
It closes；
Through-hole is not opened up on one of reflecting plate, and through-hole, the different reflections are offered on remaining described reflecting plate
The percent opening of through-hole is different on plate；
The reflecting plate of through-hole is not opened up with respect to reflecting plate described in remaining far from the heating part；
The support rod is electrically connected the driving portion, and the driving portion can drive the support rod to move；
The reflecting plate of through-hole is not opened up and the reflection Board position near the heating part is fixed, remaining described reflection
Plate can be moved in the drive lower edge of the support rod close to or far from the direction of the heating part.
4. evaporation coating device according to claim 3, which is characterized in that along the direction far from the heating part, the reflection
The percent opening of plate is gradually reduced.
5. evaporation coating device according to claim 3 or 4, which is characterized in that the reflecting plate is five pieces.
6. evaporation coating device according to claim 5, which is characterized in that the percent opening of four pieces of reflecting plates is respectively
90%, 75%, 50%, 25%.
7. evaporation coating device according to claim 3, which is characterized in that propped up described in one group of reflecting plate described in connection same
Strut has four, and equidistantly distributed simultaneously forms support to the outer rim of the reflecting plate；
The support rod of reflecting plate corresponding position described in muti-piece can be nested together under the driving of the driving portion or
Person stretches out opposite to each other.
8. evaporation coating device according to claim 2, which is characterized in that the nozzle include it is multiple, the adjustment portion includes
Multiple, the adjustment portion is arranged in a one-to-one correspondence with the nozzle.
9. evaporation coating device according to claim 2, which is characterized in that the driving portion uses cylinder.
10. a kind of evaporation coating method of evaporation coating device as described in any one of claims 1-9, comprising: heating part heating crucible
Bottom, so that the luminous organic material gasification being contained in the crucible；Luminous organic material steam after gasification is from the earthenware
Nozzle output at the top of crucible, is deposited on on plated substrate, which is characterized in that during the crucible is heated in the heating part,
Heat regulation mechanism automatically adjusts the aperture opening ratio of itself, to adjust its reflectivity to the heating part heat.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088892A (en) * | 2021-03-31 | 2021-07-09 | 京东方科技集团股份有限公司 | Vapor deposition source and vapor deposition device |
| CN113774331A (en) * | 2021-09-14 | 2021-12-10 | 合肥维信诺科技有限公司 | Reflecting member and vapor deposition device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317257A (en) * | 1989-06-14 | 1991-01-25 | Mitsubishi Electric Corp | Material vapor generator |
| CN1782120A (en) * | 2004-11-26 | 2006-06-07 | 三星Sdi株式会社 | Evaporation source and steam plating device with evaporation source |
| CN1990902A (en) * | 2005-12-28 | 2007-07-04 | 三星Sdi株式会社 | Evaporation source and method for thin film evaporation using the same |
| JP2008115416A (en) * | 2006-11-02 | 2008-05-22 | Canon Inc | Vacuum vapor-deposition source and vacuum vapor-deposition apparatus |
| CN103774095A (en) * | 2012-10-22 | 2014-05-07 | 三星显示有限公司 | Linear deposition source and vacuum deposition apparatus including the same |
| CN105296952A (en) * | 2015-11-03 | 2016-02-03 | 深圳职业技术学院 | Substrate temperature control system and method |
| CN106987810A (en) * | 2017-05-24 | 2017-07-28 | 昆山国显光电有限公司 | Crucible thermal field control device and deposition system is deposited |
| CN107805783A (en) * | 2017-11-30 | 2018-03-16 | 京东方科技集团股份有限公司 | Evaporation source, evaporated device and evaporation control method |
| WO2018199184A1 (en) * | 2017-04-26 | 2018-11-01 | 株式会社アルバック | Evaporation source and film deposition device |
-
2019
- 2019-09-19 CN CN201910886093.5A patent/CN110499492A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317257A (en) * | 1989-06-14 | 1991-01-25 | Mitsubishi Electric Corp | Material vapor generator |
| CN1782120A (en) * | 2004-11-26 | 2006-06-07 | 三星Sdi株式会社 | Evaporation source and steam plating device with evaporation source |
| CN1990902A (en) * | 2005-12-28 | 2007-07-04 | 三星Sdi株式会社 | Evaporation source and method for thin film evaporation using the same |
| JP2008115416A (en) * | 2006-11-02 | 2008-05-22 | Canon Inc | Vacuum vapor-deposition source and vacuum vapor-deposition apparatus |
| CN103774095A (en) * | 2012-10-22 | 2014-05-07 | 三星显示有限公司 | Linear deposition source and vacuum deposition apparatus including the same |
| CN105296952A (en) * | 2015-11-03 | 2016-02-03 | 深圳职业技术学院 | Substrate temperature control system and method |
| WO2018199184A1 (en) * | 2017-04-26 | 2018-11-01 | 株式会社アルバック | Evaporation source and film deposition device |
| CN106987810A (en) * | 2017-05-24 | 2017-07-28 | 昆山国显光电有限公司 | Crucible thermal field control device and deposition system is deposited |
| CN107805783A (en) * | 2017-11-30 | 2018-03-16 | 京东方科技集团股份有限公司 | Evaporation source, evaporated device and evaporation control method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088892A (en) * | 2021-03-31 | 2021-07-09 | 京东方科技集团股份有限公司 | Vapor deposition source and vapor deposition device |
| CN113088892B (en) * | 2021-03-31 | 2023-02-28 | 京东方科技集团股份有限公司 | Vapor deposition source and vapor deposition device |
| CN113774331A (en) * | 2021-09-14 | 2021-12-10 | 合肥维信诺科技有限公司 | Reflecting member and vapor deposition device |
| CN113774331B (en) * | 2021-09-14 | 2023-11-28 | 合肥维信诺科技有限公司 | Reflecting member and vapor deposition device |
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