CN110471109B - Device for simulating fault fracture - Google Patents
Device for simulating fault fracture Download PDFInfo
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Abstract
The invention discloses a device for simulating fracture of a slip fault, which comprises: the device comprises a loading device, a supporting device, a testing device, an auxiliary device and a fault model device; the method comprises the steps of measuring the fracture speed of a fault through an acoustic emission sensor in a testing device, changing the load of a jack, monitoring the fracture speed and the evolution process of the fault, measuring acceleration data generated by different parts of the fault through a bidirectional acceleration sensor in the testing device, converting the acceleration data into speed data through an analog circuit, and extracting pulse data from the speed data, so that the pulse characteristics and the distribution rules of seismic records under the conditions of different fault fracture speeds are obtained.
Description
Technical Field
The invention relates to the technical field of geological science, in particular to a device for simulating fracture of a slip fault.
Background
The fracture mechanism of the seismic fault has great influence on the generation of the impulse seismic motion and the intensity parameters of the impulse seismic motion. With the development of science and technology, more and more pulse earthquake motion is recorded, and the research on the damage influence of the pulse earthquake motion on an engineering structure is deeper and deeper. In the Northridge earthquake of 1994, the Kobe earthquake of 1995, and the earthquake of 1999, a great deal of research has shown that near-field impulse-type earthquake motion has a greater destructive power on an engineering structure than far-field earthquake motion under the same earthquake moment magnitude and field conditions. Generally, impulsive seismic motion is generated due to the front field directionality effect and the kick effect in seismic fault fracture. The velocity pulses caused by the front field directionality effect are bidirectional pulses, and such pulses generally occur on a component perpendicular to the fault strike; the velocity pulse caused by the kick effect is a unidirectional pulse that is related to the time and magnitude of the permanent displacement of the burst and occurs predominantly in a component parallel to the fault strike. Many scholars perform comparative analysis by extracting energy of impulse type earthquake motion, and the results show that: the energy of seismic motion caused by the sliding shock effect and the directional effect is mainly concentrated in a low-frequency pulse time-holding section, and the sliding shock seismic motion has more remarkable pulse characteristics and more serious damage to a long-period structure. At present, although a great deal of seismic data has been recorded, due to uncertainty of seismic motion and restriction of observation techniques, impulse-type seismic records obtained from actual earthquakes are still insufficient, and the characteristics of near-fault impulse-type seismic motion cannot be accurately obtained in a statistical sense. The invention can obtain the corresponding impulse earthquake motion time-course curve by simulating the walk-slip fault, and further can research the relevant aspects of the impulse earthquake motion time-course curve, thereby providing great reference for structural earthquake response analysis and design.
Disclosure of Invention
Aiming at the defects in the prior art, the device for simulating the break of the strike-slip fault solves the problems that due to the uncertainty of seismic motion and the restriction of an observation technology, pulse type seismic records obtained from an actual earthquake are insufficient, and the characteristic of near fault pulse type seismic motion cannot be accurately obtained in a statistical sense.
In order to achieve the purpose of the invention, the invention adopts the technical scheme that: an apparatus for simulating a slip fault fracture comprising: the device comprises a loading device, a supporting device, a testing device, an auxiliary device and a fault model device;
the auxiliary device includes: a first auxiliary device and a second auxiliary device; the loading device comprises: a main load jack and a supplementary load jack; the fault model apparatus includes: the reaction wall comprises a first reaction wall, a second reaction wall, a third reaction wall, a reaction steel frame and a simulated stratum;
the simulated stratum has a 6-body structure;
the first reaction wall, the main load jack, the first auxiliary device and the first side surface of the simulated formation are sequentially and fixedly connected;
the second reaction wall, the supplementary load jack, the second auxiliary device and the second side surface of the simulated formation are sequentially and fixedly connected;
the third reaction wall is fixedly connected with the third side surface of the simulated formation;
the counter-force steel frame is fixedly connected with the simulated stratum;
the supporting device is fixedly connected with the simulated stratum;
the testing device is fixedly connected with the simulated stratum (12);
further: the supporting device comprises: the supporting frame, the upper bottom plate and the lower bottom plate; the support frame is arranged between the upper base plate and the lower base plate and is fixedly connected with the upper base plate and the lower base plate respectively.
Further: the first auxiliary device includes: the first steel plate pad and the first rubber pad; the second auxiliary device includes: a second steel plate pad and a second rubber pad;
the first reaction wall, the main load jack, the first steel plate pad, the first rubber pad and the first side surface of the simulated formation are sequentially and fixedly connected; the base of the main load jack is fixedly connected with the first reaction wall, and the top end of the piston rod of the main load jack is fixedly connected with the first steel plate pad; the second reaction wall, the supplementary load jack, the second steel plate pad, the second rubber pad and the second side surface of the simulated formation are sequentially and fixedly connected; and the base of the supplementary load jack is fixedly connected with a second reaction wall, and the top end of the piston rod of the second reaction wall is fixedly connected with a second steel plate pad.
Further: the reaction steelframe includes: a first reaction steel frame, a second reaction steel frame and a third reaction steel frame;
first reaction steelframe, second reaction steelframe and third reaction steelframe all include: the simulation device comprises a vertical plate and a top plate, wherein one side surface of one end of the top plate is fixedly connected with the bottom surface of one end of the vertical plate to form an inverted L-shaped structural plate, the top plates of the first, second and third counter-force steel frames are fixedly connected with one bottom surface of a simulated stratum, the vertical plates of the first, second and third counter-force steel frames are fixedly connected with the fourth side surface of the simulated stratum, the upper surface of the simulated stratum is provided with a groove, the groove is positioned on the edge where the other ends of the top plates of the first, second and third counter-force steel frames are connected with the bottom surface of the simulated stratum and vertically extends to the first side surface and the third side surface of the simulated stratum, the other bottom surface of the simulated stratum is fixedly connected with the upper bottom plate, and the third counter-force wall is arranged at one end, close to the top plate, of the third side surface of.
The beneficial effects of the further scheme are as follows: a part of the simulated stratum is fixed through a counterforce steel frame, a main load jack and a supplementary load jack apply loads to the simulated stratum, a steel plate pad and a rubber pad are added to the jacks and the simulated stratum, the concentration effect is relieved, and the influence of boundary waveform reflection on results is reduced.
Further: the test device comprises: the circuit comprises an analog circuit, a main processor circuit and a power supply circuit;
the analog circuit includes: a 5V input end, a current source input end and a signal output end;
the main processor circuit includes: a 3.3V input and a signal input;
the power supply circuit includes: a current source output terminal, a 5V output terminal and a 3.3V output terminal;
the current source output end of the power supply circuit is connected with the current source input end of the analog circuit; the 5V output end of the power supply circuit is connected with the 5V input end of the analog circuit; the 3.3V output end of the power supply circuit is connected with the 3.3V input end of the main processor circuit; and the signal input end of the main processor circuit is connected with the signal output end of the analog circuit.
Further: the power supply circuit includes: the power supply system comprises a 4mA current source, a 20-30V analog power supply module, a 5V analog power supply module, a 3.3V digital power supply module, a lithium battery, a charging interface and a power supply control module;
the first input end of the power supply control module is connected with the charging interface; the second input end of the power supply control module is connected with the lithium battery; the first output end of the power supply control module is connected with the input end of the 3.3V digital power supply module, and the output end of the 3.3V digital power supply module is used as the 3.3V output end of the power supply circuit; the second output end of the power supply control module is connected with the input end of the 5V analog power supply module, and the output end of the 5V analog power supply module is used as the 5V output end of the power supply circuit; the third output end of the power supply control module is connected with the input end of the 20-30V analog power supply module, the output end of the 20-30V analog power supply module is connected with the input end of the 4mA current source, and the output end of the 4mA current source is used as the current source output end of the power supply circuit.
Further: the analog circuit includes: the device comprises a sensor array, a preamplifier, a filter, a first double-T type primary integrator, a second double-T type primary integrator, a switch module and a voltage adjusting module;
the power supply input end of the sensor array is used as the current source input end of the analog circuit; the signal output end of the sensor array is connected with the signal input end of the preamplifier; the power supply input end of the preamplifier is respectively connected with the power supply input ends of the filter, the first double-T type primary integrator, the second double-T type primary integrator, the switch module and the voltage adjusting module and serves as the 5V input end of the analog circuit; the signal output end of the preamplifier is connected with the signal input end of the filter, and the signal output end of the filter is respectively connected with the signal input end of the first double-T type primary integrator and the first signal input end of the switch module; the signal output end of the first double-T type primary integrator is connected with the signal input end of the second double-T type primary integrator and the second signal input end of the switch module respectively, the signal output end of the second double-T type primary integrator is connected with the third signal input end of the switch module, the signal output end of the switch module is connected with the signal input end of the voltage adjusting module, and the signal output end of the voltage adjusting module is used as the signal output end of the analog circuit.
Further: the sensor array includes: an acoustic emission sensor array and a bidirectional acceleration sensor array; the acoustic emission sensor array is fixedly arranged in a groove of the simulated stratum; the bidirectional acceleration sensor array is fixed on the simulated stratum and distributed on the surface of the simulated stratum on two sides of the groove.
Further: the main processor circuit includes: the device comprises a liquid crystal, an ARM processor, a FLASH memory, a key module, a USB interface and a clock module;
the power supply input ends of the liquid crystal, the ARM processor, the FLASH memory, the key module and the clock module are jointly used as the 3.3V input end of the main processor circuit;
the analog-to-digital conversion interface of the ARM processor is used as a signal input end of the main processor circuit;
the ARM processor is in communication connection with the liquid crystal, the FLASH memory, the key module, the USB interface and the clock module respectively.
The beneficial effects of the further scheme are as follows: the recess of the simulated stratum is a planned fault fracture direction, and acoustic emission sensors are distributed along the fault fracture direction and used for monitoring the fault fracture speed and the evolution process; and detecting and quantifying the fault fracture speed through the acoustic emission sensor, and determining the relationship between the load applied by the jack and the fault fracture speed.
In order to research the characteristics and the spatial distribution rule of the pulse earthquake motion generated by the fault, the characteristic changes of pulse records generated at different parts are compared by distributing the bidirectional acceleration sensor arrays on two sides of the simulated stratum concave trough.
The invention has the beneficial effects that: a device for simulating the fracture of a slip fault measures the fracture speed of the fault through an acoustic emission sensor, simultaneously can change the load of a jack, and monitors the fracture speed and the evolution process of the fault; the device solves the problems that due to the uncertainty of earthquake motion and the restriction of observation technology, pulse type earthquake records obtained from actual earthquakes are insufficient, and the characteristics of the near-fault pulse type earthquake motion cannot be accurately obtained in a statistical sense.
Drawings
FIG. 1 is a schematic diagram of a device for simulating a fault fracture;
FIG. 2 is a block diagram of a test apparatus for an apparatus for simulating a fault fracture;
FIG. 3 is a schematic diagram of a sensor array arrangement of an apparatus for simulating a fault fracture;
wherein: 1. a support frame; 2. an upper base plate; 3. a lower base plate; 4. a load-supplementing jack; 5. a first counterforce wall; 6. a second counterforce wall; 7. a third counterforce wall; 8. a first steel plate mat; 9. a first rubber pad; 10. a second steel plate pad; 11. a second rubber pad; 12. simulating a formation; 13. a groove; 14. a first reaction steel frame; 15. a second reaction steel frame; 16. a third reaction steel frame; 17. and a main load jack.
Detailed Description
The following description of the embodiments of the present invention is provided to facilitate the understanding of the present invention by those skilled in the art, but it should be understood that the present invention is not limited to the scope of the embodiments, and it will be apparent to those skilled in the art that various changes may be made without departing from the spirit and scope of the invention as defined and defined in the appended claims, and all matters produced by the invention using the inventive concept are protected.
As shown in fig. 1, an apparatus for simulating a slip fault fracture comprises: the device comprises a loading device, a supporting device, a testing device, an auxiliary device and a fault model device;
the auxiliary device includes: a first auxiliary device and a second auxiliary device; the loading device comprises: a main load jack 17 and a supplementary load jack 4; the fault model apparatus includes: the reaction wall comprises a first reaction wall 5, a second reaction wall 6, a third reaction wall 7, a reaction steel frame and a simulated stratum 12;
the simulated formation 12 is of a 6-face structure;
the first reaction wall 5, the main load jack 17, the first auxiliary device and the first side surface of the simulated formation 12 are fixedly connected in sequence;
the second reaction wall 6, the supplementary load jack 4, the second auxiliary device and the second side surface of the simulated formation 12 are fixedly connected in sequence;
the third reaction wall 7 is fixedly connected with the third side surface of the simulated formation 12;
the reaction steel frame is fixedly connected with the simulated stratum 12;
the supporting device is fixedly connected with the simulated stratum 12;
the testing device is fixedly connected with the simulated formation 12.
The supporting device comprises: the device comprises a support frame 1, an upper base plate 2 and a lower base plate 3; the support frame 1 is arranged between the upper base plate 2 and the lower base plate 3 and is fixedly connected with the upper base plate 2 and the lower base plate 3 respectively.
The first auxiliary device includes: a first steel plate pad 8 and a first rubber pad 9; the second auxiliary device includes: a second steel plate pad 10 and a second rubber pad 11;
the first reaction wall 5, the main load jack 17, the first steel plate pad 8, the first rubber pad 9 and the first side surface of the simulated formation 12 are fixedly connected in sequence; the base of the main load jack 17 is fixedly connected with the first reaction wall 5, and the top end of the piston rod of the main load jack 17 is fixedly connected with the first steel plate pad 8; the second reaction wall 6, the supplementary load jack 4, the second steel plate pad 10, the second rubber pad 11 and the second side surface of the simulated formation 12 are fixedly connected in sequence; the base of the supplementary load jack 4 is fixedly connected with a second reaction wall 6, and the top end of a piston rod of the second reaction wall 6 is fixedly connected with a second steel plate pad 10.
The reaction steelframe includes: a first reaction steel frame 14, a second reaction steel frame 15 and a third reaction steel frame 16;
first reaction steelframe 14, second reaction steelframe 15 and third reaction steelframe 16 all include: a vertical plate and a top plate, wherein one side surface of one end of the top plate is fixedly connected with the bottom surface of one end of the vertical plate to form an inverted L-shaped structural plate, the top plates of the first, second and third reaction steel frames 14, 15, 16 are fixedly connected to a bottom surface of the simulated formation 12, the vertical plates of the first reaction steel frame 14, the second reaction steel frame 15 and the third reaction steel frame 16 are fixedly connected with the fourth side surface of the simulated formation 12, the upper surface of the simulated formation 12 is provided with a groove 13, the groove 13 is positioned at the edge where the other ends of the top plates of the first reaction steel frame 14, the second reaction steel frame 15 and the third reaction steel frame 16 are connected with the bottom surface of the simulated formation 12, and vertically extend to the first side surface and the third side surface of the simulated formation 12, the other bottom surface of the simulated formation 12 is fixedly connected with the upper bottom plate 2, the third reaction wall 7 is disposed at one end of the third side surface of the simulated formation 12 close to the top plate.
A part of the simulated formation 12 is fixed through a counterforce steel frame, the main load jack 17 and the supplementary load jack 4 apply loads to the simulated formation 12, a steel plate pad and a rubber pad are added to the jacks and the simulated formation 12, the concentration effect is relieved, and the influence of boundary waveform reflection on the result is reduced.
When the reaction wall is used, the reaction wall is embedded into part of the ground, and the reaction steel frame is placed on the ground.
As shown in fig. 2, the test apparatus includes: the circuit comprises an analog circuit, a main processor circuit and a power supply circuit;
the analog circuit includes: a 5V input end, a current source input end and a signal output end;
the main processor circuit includes: a 3.3V input and a signal input;
the power supply circuit includes: a current source output terminal, a 5V output terminal and a 3.3V output terminal;
the current source output end of the power supply circuit is connected with the current source input end of the analog circuit; the 5V output end of the power supply circuit is connected with the 5V input end of the analog circuit; the 3.3V output end of the power supply circuit is connected with the 3.3V input end of the main processor circuit; and the signal input end of the main processor circuit is connected with the signal output end of the analog circuit.
The power supply circuit includes: the power supply system comprises a 4mA current source, a 20-30V analog power supply module, a 5V analog power supply module, a 3.3V digital power supply module, a lithium battery, a charging interface and a power supply control module;
the first input end of the power supply control module is connected with the charging interface; the second input end of the power supply control module is connected with the lithium battery; the first output end of the power supply control module is connected with the input end of the 3.3V digital power supply module, and the output end of the 3.3V digital power supply module is used as the 3.3V output end of the power supply circuit; the second output end of the power supply control module is connected with the input end of the 5V analog power supply module, and the output end of the 5V analog power supply module is used as the 5V output end of the power supply circuit; the third output end of the power supply control module is connected with the input end of the 20-30V analog power supply module, the output end of the 20-30V analog power supply module is connected with the input end of the 4mA current source, and the output end of the 4mA current source is used as the current source output end of the power supply circuit.
The analog circuit includes: the device comprises a sensor array, a preamplifier, a filter, a first double-T type primary integrator, a second double-T type primary integrator, a switch module and a voltage adjusting module;
the power supply input end of the sensor array is used as the current source input end of the analog circuit; the signal output end of the sensor array is connected with the signal input end of the preamplifier; the power supply input end of the preamplifier is respectively connected with the power supply input ends of the filter, the first double-T type primary integrator, the second double-T type primary integrator, the switch module and the voltage adjusting module and serves as the 5V input end of the analog circuit; the signal output end of the preamplifier is connected with the signal input end of the filter, and the signal output end of the filter is respectively connected with the signal input end of the first double-T type primary integrator and the first signal input end of the switch module; the signal output end of the first double-T type primary integrator is connected with the signal input end of the second double-T type primary integrator and the second signal input end of the switch module respectively, the signal output end of the second double-T type primary integrator is connected with the third signal input end of the switch module, the signal output end of the switch module is connected with the signal input end of the voltage adjusting module, and the signal output end of the voltage adjusting module is used as the signal output end of the analog circuit.
The sensor array includes: an acoustic emission sensor array and a bidirectional acceleration sensor array; the acoustic emission sensor array is fixedly arranged in a groove 13 of a simulated stratum 12; the bidirectional acceleration sensor array is fixed on the simulated stratum 12 and distributed on the surface of the simulated stratum 12 on two sides of the groove 13.
The main processor circuit includes: the device comprises a liquid crystal, an ARM processor, a FLASH memory, a key module, a USB interface and a clock module;
the power supply input ends of the liquid crystal, the ARM processor, the FLASH memory, the key module and the clock module are jointly used as the 3.3V input end of the main processor circuit;
the analog-to-digital conversion interface of the ARM processor is used as a signal input end of the main processor circuit;
the ARM processor is in communication connection with the liquid crystal, the FLASH memory, the key module, the USB interface and the clock module respectively.
In the present embodiment, as shown in fig. 3, where the broken line indicates the fracture position, S1 to S9 are acoustic emission sensors; W1-W32 are bidirectional acceleration sensors.
The groove 13 of the simulated formation 12 is a planned fault fracture direction, and acoustic emission sensors are distributed along the fault fracture direction and used for monitoring the fault fracture speed and the evolution process; and detecting and quantifying the fault fracture speed through the acoustic emission sensor, and determining the relationship between the load applied by the jack and the fault fracture speed.
In order to research the characteristics and the spatial distribution rule of the pulse earthquake motion generated by the fault, the characteristic changes of pulse records generated at different parts are compared by distributing the bidirectional acceleration sensor arrays on two sides of the groove 13 of the simulated stratum 12.
The walk-slip fault is mainly characterized in that the cross section is straight and smooth and nearly upright, and the shearing property is outstanding. The recess 13 indicates the set position of the fracture surface, in which the recess 12 is previously provided in order to make the model fracture-slip according to the set position. The counterforce steel frame is used for fixing one side of the model, and the other side of the model applies corresponding thrust to the model by using the main load jack 17 in front of the model, and the loading rate of the model is controlled so as to control the fracture evolution of the fault and enable the fault to slide. The fault breaking is a progressive failure process, the normal stress of the fault is adjusted by using a supplementary load jack 4, and the force application mode is that the load is linearly increased. Because the jack is applied to the model to concentrate force, the model is likely to be locally damaged due to the action of concentrated load in the test process, and therefore a steel plate pad and a rubber pad are added between the jack and the model to reduce the concentration effect and reduce the influence of boundary waveform reflection on the result.
The invention has the beneficial effects that: a device for simulating the fracture of a slip fault measures the fracture speed of the fault through an acoustic emission sensor, simultaneously can change the load of a jack, and monitors the fracture speed and the evolution process of the fault; the device solves the problems that due to the uncertainty of earthquake motion and the restriction of observation technology, pulse type earthquake records obtained from actual earthquakes are insufficient, and the characteristics of the near-fault pulse type earthquake motion cannot be accurately obtained in a statistical sense.
Claims (7)
1. An apparatus for simulating a slip fault fracture, comprising: the device comprises a loading device, a supporting device, a testing device, an auxiliary device and a fault model device;
the auxiliary device includes: a first auxiliary device and a second auxiliary device; the loading device comprises: a main load jack (17) and a supplementary load jack (4); the fault model apparatus includes: the reaction wall comprises a first reaction wall (5), a second reaction wall (6), a third reaction wall (7), a reaction steel frame and a simulated stratum (12);
the simulated formation (12) is of a 6-face structure;
the first reaction wall (5), the main load jack (17), the first auxiliary device and the first side surface of the simulated stratum (12) are fixedly connected in sequence;
the second reaction wall (6), the supplementary load jack (4), the second auxiliary device and the second side surface of the simulated formation (12) are sequentially and fixedly connected;
the third reaction wall (7) is fixedly connected with the third side surface of the simulated formation (12);
the reaction steel frame is fixedly connected with the simulated stratum (12);
the supporting device is fixedly connected with the simulated stratum (12);
the testing device is fixedly connected with the simulated stratum (12);
the support device includes: the device comprises a support frame (1), an upper base plate (2) and a lower base plate (3); the support frame (1) is arranged between the upper base plate (2) and the lower base plate (3) and is respectively fixedly connected with the upper base plate (2) and the lower base plate (3);
the first auxiliary device includes: a first steel plate pad (8) and a first rubber pad (9); the second auxiliary device includes: a second steel plate pad (10) and a second rubber pad (11);
the first reaction wall (5), the main load jack (17), the first steel plate pad (8), the first rubber pad (9) and the first side surface of the simulated formation (12) are sequentially and fixedly connected; the base of the main load jack (17) is fixedly connected with the first reaction wall (5), and the top end of the piston rod of the main load jack (17) is fixedly connected with the first steel plate pad (8); the second reaction wall (6), the supplementary load jack (4), the second steel plate pad (10), the second rubber pad (11) and the second side surface of the simulated formation (12) are sequentially and fixedly connected; the base of the supplementary load jack (4) is fixedly connected with a second reaction wall (6), and the top end of a piston rod of the second reaction wall (6) is fixedly connected with a second steel plate pad (10).
2. The apparatus of claim 1, wherein the counterforce steel frame comprises: a first reaction steel frame (14), a second reaction steel frame (15) and a third reaction steel frame (16);
first reaction steelframe (14), second reaction steelframe (15) and third reaction steelframe (16) all include: the simulation ground layer (12) is provided with a groove (13) on the upper surface, the groove (13) is positioned on the edge where the other end of the top plate of the first reaction steel frame (14), the second reaction steel frame (15) and the third reaction steel frame (16) is connected with the bottom surface of the simulation ground layer (12) and vertically extends to the first side surface and the third side surface of the simulation ground layer (12), and the other bottom surface of the simulation ground layer (12) is fixedly connected with the upper bottom plate (2), the third reaction wall (7) is arranged at one end, close to the top plate, of the third side surface of the simulated formation (12).
3. The apparatus for simulating a fault fracture of walk-behind according to claim 2, wherein the testing apparatus comprises: the circuit comprises an analog circuit, a main processor circuit and a power supply circuit;
the analog circuit includes: a 5V input end, a current source input end and a signal output end;
the main processor circuit includes: a 3.3V input and a signal input;
the power supply circuit includes: a current source output terminal, a 5V output terminal and a 3.3V output terminal;
the current source output end of the power supply circuit is connected with the current source input end of the analog circuit; the 5V output end of the power supply circuit is connected with the 5V input end of the analog circuit; the 3.3V output end of the power supply circuit is connected with the 3.3V input end of the main processor circuit; and the signal input end of the main processor circuit is connected with the signal output end of the analog circuit.
4. The apparatus of claim 3, wherein the power supply circuit comprises: the power supply system comprises a 4mA current source, a 20-30V analog power supply module, a 5V analog power supply module, a 3.3V digital power supply module, a lithium battery, a charging interface and a power supply control module;
the first input end of the power supply control module is connected with the charging interface; the second input end of the power supply control module is connected with the lithium battery; the first output end of the power supply control module is connected with the input end of the 3.3V digital power supply module, and the output end of the 3.3V digital power supply module is used as the 3.3V output end of the power supply circuit; the second output end of the power supply control module is connected with the input end of the 5V analog power supply module, and the output end of the 5V analog power supply module is used as the 5V output end of the power supply circuit; the third output end of the power supply control module is connected with the input end of the 20-30V analog power supply module, the output end of the 20-30V analog power supply module is connected with the input end of the 4mA current source, and the output end of the 4mA current source is used as the current source output end of the power supply circuit.
5. The apparatus of claim 3, wherein the analog circuitry comprises: the device comprises a sensor array, a preamplifier, a filter, a first double-T type primary integrator, a second double-T type primary integrator, a switch module and a voltage adjusting module;
the power supply input end of the sensor array is used as the current source input end of the analog circuit; the signal output end of the sensor array is connected with the signal input end of the preamplifier; the power supply input end of the preamplifier is respectively connected with the power supply input ends of the filter, the first double-T type primary integrator, the second double-T type primary integrator, the switch module and the voltage adjusting module and serves as the 5V input end of the analog circuit; the signal output end of the preamplifier is connected with the signal input end of the filter, and the signal output end of the filter is respectively connected with the signal input end of the first double-T type primary integrator and the first signal input end of the switch module; the signal output end of the first double-T type primary integrator is connected with the signal input end of the second double-T type primary integrator and the second signal input end of the switch module respectively, the signal output end of the second double-T type primary integrator is connected with the third signal input end of the switch module, the signal output end of the switch module is connected with the signal input end of the voltage adjusting module, and the signal output end of the voltage adjusting module is used as the signal output end of the analog circuit.
6. The apparatus of claim 5, wherein the sensor array comprises: an acoustic emission sensor array and a bidirectional acceleration sensor array; the acoustic emission sensor array is fixedly arranged in a groove (13) of the simulated formation (12); the bidirectional acceleration sensor array is fixed on the simulated stratum (12) and distributed on the surfaces of the simulated stratum (12) on the two sides of the groove (13).
7. The apparatus of claim 3 wherein the main processor circuit comprises: the device comprises a liquid crystal, an ARM processor, a FLASH memory, a key module, a USB interface and a clock module;
the power supply input ends of the liquid crystal, the ARM processor, the FLASH memory, the key module and the clock module are jointly used as the 3.3V input end of the main processor circuit;
the analog-to-digital conversion interface of the ARM processor is used as a signal input end of the main processor circuit;
the ARM processor is in communication connection with the liquid crystal, the FLASH memory, the key module, the USB interface and the clock module respectively.
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