CN110462785B

CN110462785B - Substrate processing apparatus and display method thereof

Info

Publication number: CN110462785B
Application number: CN201780088759.1A
Authority: CN
Inventors: 守田修; 山冈雄治
Original assignee: Kokusai Electric Corp
Current assignee: Kokusai Electric Corp
Priority date: 2017-03-31
Filing date: 2017-03-31
Publication date: 2023-08-11
Anticipated expiration: 2037-03-31
Also published as: CN110462785A; JPWO2018179353A1; SG11201908759VA; JP6802903B2; WO2018179353A1

Abstract

The present invention aims to provide a structure capable of displaying execution schedule of tasks in time series. The structure comprises: a display unit having an operation screen including a two-dimensional space in which one axis is set as a reserved status of various tasks executed by the device including a task currently being executed by the device and the other axis is set as a predetermined monitoring period; and a display control unit that acquires various pieces of information including a start time and an end scheduled time of a task being executed by the device or a start scheduled time and an end scheduled time of a task reserved by the device, calculates execution scheduled time of the task based on the acquired start time and end scheduled time of the task currently being executed and/or the acquired start scheduled time and end scheduled time of the reserved task, and causes the display unit to graphically display an image indicating the execution scheduled time of the task currently being executed and the reserved task.

Description

Substrate processing apparatus and display method thereof

Technical Field

The present invention relates to a substrate processing apparatus for processing a substrate and a display method thereof, and for example, to an apparatus for grasping a production state of a semiconductor manufacturing apparatus for performing a film formation process on a substrate and a display method thereof.

Background

In the field of semiconductor manufacturing, a substrate container (for example, a FOUP) containing a wafer to be processed (hereinafter, also referred to as a substrate) is placed in an apparatus, and a film forming process or the like is performed on the wafer under specified conditions. For example, a command for processing such as film formation processing (hereinafter, also referred to as a processing task) is issued by a customer host computer or an operator of an operation unit. The processing status of the wafer is displayed on a screen of the operation unit together with a screen image of the semiconductor manufacturing apparatus, and for example, the production status is displayed for each processing chamber. When the film formation process is completed, the film formation process is stored in the storage unit as production information. The accumulation is registered in the order of completion of the processing, and displayed in a list.

For example, in patent document 1, the processing state of the substrate is displayed on the operation screen for each processing chamber together with an image obtained by observing the semiconductor manufacturing apparatus from above. Further, in patent document 2, the progress status of a currently executing processing task and the like, or the content of a processing recipe executed by the processing task and production history information are displayed on an operation screen.

However, the reservation of when each reserved processing task starts to be executed and when it ends is not known. Thus, it is difficult for the operator to predict the time when the device is in the specific state, and time waste occurs in arrangement of the device, and delay in setting the device is involved.

Prior art literature

Patent literature

Patent document 1: japanese patent No. 2000-077288

Patent document 2: japanese patent laid-open publication No. 2011-077435

Disclosure of Invention

Problems to be solved by the invention

The present invention aims to provide a structure capable of displaying execution schedule of tasks in time series.

According to one aspect of the present invention, there is provided a structure including: a display unit having an operation screen including a two-dimensional space in which one axis is set as a reserved status of various tasks executed by the device including a task currently being executed by the device and the other axis is set as a predetermined monitoring period; and a display control unit that acquires various pieces of information including a start time and an end scheduled time of a task being executed by the device or a start scheduled time and an end scheduled time of a task reserved by the device, calculates execution scheduled time of the task based on the acquired start time and end scheduled time of the task currently being executed and/or the acquired start scheduled time and end scheduled time of the task reserved, and causes the display unit to graphically display an image indicating the execution scheduled time of the task currently being executed and the task reserved.

Effects of the invention

According to the above configuration, by graphically displaying tasks to be executed, it is possible to grasp an execution plan of an unprocessed task.

Drawings

Fig. 1 is an example of a cross-sectional view showing a substrate processing apparatus suitably used in an embodiment of the present invention.

Fig. 2 is an example of a vertical cross-sectional view of a substrate processing apparatus suitably used in one embodiment of the present invention.

Fig. 3 is an example of a vertical sectional view of a processing furnace suitably used in the substrate processing apparatus according to the embodiment of the present invention.

Fig. 4 is a diagram for explaining a functional structure of a controller suitably used in an embodiment of the present invention.

Fig. 5 shows a process flow suitably used for the graphic display of an embodiment of the present invention.

Fig. 6 shows an embodiment of a display by the process flow of fig. 5.

Fig. 7 is used to illustrate a different manner from the diagram illustrating the embodiment of fig. 6.

Fig. 8 is a diagram when a restoration condition wait is generated in the currently executing recipe shown by the processing flow of fig. 5.

Fig. 9 shows an embodiment showing details of the resume condition wait icon shown in fig. 8.

Fig. 10 shows a process flow suitably used for the graphic display of an embodiment of the present invention.

Fig. 11 shows an embodiment of a process flow shown by fig. 10.

Fig. 12 is a diagram illustrating the differences in formulation categories according to an embodiment of the present invention.

Detailed Description

(outline of substrate processing apparatus) an embodiment of the present invention will be described with reference to fig. 1 and 2. In an embodiment to which the present invention is applied, as an example, a substrate processing apparatus is configured as a substrate processing apparatus for performing processing in a semiconductor device (IC) manufacturing method. In the following description, a description will be given of a case where a vertical apparatus (hereinafter, simply referred to as a processing apparatus) for performing oxidation, diffusion processing, CVD processing, or the like on a substrate is applied as a substrate processing apparatus.

As shown in fig. 1 and 2, the substrate processing apparatus 10 includes two adjacent processing modules, which are processing furnaces 202 described later. The processing module is a vertical processing module for performing batch processing on tens of wafers 200 as substrates.

Conveying chambers 6A and 6B as preparation chambers are disposed below the processing furnace 202. A transfer chamber 8 is disposed adjacent to the transfer chambers 6A, 6B on the front sides of the transfer chambers 6A, 6B, and the transfer chamber 8 has a conveyor 125 for transferring the wafer 200 as a substrate. In the present embodiment, a configuration in which a processing furnace 202 described later is provided above each of the transfer chambers 6A and 6B will be described.

A receiving chamber 9 (cassette conveying space) for receiving a cassette (FOUP) 110 is provided on the front side of the transfer chamber 8, wherein the cassette 110 serves as a receiving container for receiving a plurality of wafers 200. A load port 22 as an I/O port is provided on the entire surface of the storage chamber 9, and the transfer cassette 110 is carried in and out of the processing apparatus 2 via the load port 22.

Gate valves 90A and 90B as isolation portions are provided on boundary walls (abutting surfaces) between the transfer chambers 6A and 6B and the transfer chamber 8. Pressure detectors are provided in the transfer chamber 8 and the transfer chambers 6A and 6B, respectively, and the pressure in the transfer chamber 8 is set to be lower than the pressure in the transfer chambers 6A and 6B. Oxygen concentration detectors are provided in the transfer chamber 8 and the transfer chambers 6A and 6B, respectively, to maintain the oxygen concentration in the transfer chamber 8A and the transfer chambers 6A and 6B lower than the oxygen concentration in the atmosphere. Preferably, the concentration is maintained at 30ppm or less.

A cleaning unit (not shown) for supplying clean air into the transfer chamber 8 is provided in the ceiling portion of the transfer chamber 8, and for example, an inert gas is circulated in the transfer chamber 8 as clean air. By circulating the inert gas in the transfer chamber 8, the interior of the transfer chamber 8 can be kept in a clean atmosphere.

With this configuration, particles and the like in the transfer chambers 6A and 6B in the transfer chamber 8 are prevented from being mixed into the processing furnace 202, which is not shown, and natural oxide films are prevented from being formed on the wafer 200 in the transfer chamber 8 and the transfer chambers 6A and 6B.

A plurality of, for example, 3 cassette openers 21 for opening and closing the covers of the cassettes 110 are disposed behind the storage chamber 9 and on the boundary wall between the storage chamber 9 and the transfer chamber 8. The cassette opener 21 opens the lid of the cassette 110, and thereby carries in and out the wafers 200 in the cassette 110 to the inside and outside of the transfer chamber 8.

As shown in fig. 2, the substrate processing apparatus 10 in which a plurality of wafers 200 made of silicon or the like are stored and the transfer cassette 110 is used has a housing 111 used as a main body of the substrate processing apparatus.

A front maintenance opening (not shown) which is an opening provided for enabling maintenance is formed in front of the front surface wall of the housing 111, and front maintenance windows for opening and closing the front maintenance opening are respectively attached. The front wall is provided with a cassette loading/unloading port so as to communicate the inside and outside of the housing 111. The transfer box loading/unloading port may be opened and closed by a front shutter (not shown).

The cassette loading/unloading port is provided with a load port 22 used as a loading/unloading section, and the load port 22 is configured to position the cassette 110 for alignment. The in-process transport device carries the cassette 110 into the load port 22 and carries it out of the load port 22.

A storage rack (cassette rack) 105 is provided in a matrix in the vertical and horizontal directions around the periphery of the cassette loading/unloading port on the front rear side of the frame 111. The cassette rack 105 is provided with a placement portion 140 as a receiving portion for placing the cassettes. The storage unit is composed of the storage unit 140 and a horizontal movement mechanism (storage rack horizontal movement mechanism) for horizontally moving the storage unit 140 between a standby position of the storage transfer cassette 110 and a delivery position of the delivery transfer cassette 110. The plurality of independent placement portions 140 aligned in the same horizontal line form one stage of the cassette rack 105, and the cassette rack is provided in multiple stages in the vertical direction. Each placement unit 140 can be horizontally moved independently without synchronizing with the placement units 140 adjacent to each other vertically or laterally and with any other placement unit 140. The cassette transport device 130 is configured to transport the cassette 110 among the load port 22, the cassette rack 105, and the cassette opener 121.

A transfer cassette rack (storage rack) 105 is provided in the frame 111 in a matrix in the vertical and horizontal directions on the front side of the sub-frame 119. Like the cassette racks 105 on the front rear side of the frame 111, the placement units 140 of the cassette racks 105 serving as storage units for placing cassettes can be horizontally moved, and can be independently horizontally moved without synchronizing with the vertically or laterally adjacent placement units 140. The cassette holder 105 is configured to hold the cassettes 110 in a state where one cassette 110 is placed in each of the plurality of placement portions 140.

A pair of wafer carry-in/out ports 120 arranged vertically in two stages are provided in the front wall 119a of the sub-frame 119, the wafer carry-in/out ports 120 are used for carrying in and out wafers 200 in the sub-frame 119, and a pair of cassette openers 21 are provided in the upper and lower stage wafer carry-in/out ports 120, respectively. In the present embodiment, the transfer box opener 21 is provided in two stages up and down, but two may be provided in the horizontal direction. The transfer box opener 21 has: a placement table 122 on which the transfer cassette 110 is placed, and a cover attachment/detachment mechanism 123 for attaching and detaching a cover of the transfer cassette 110 used as a sealing member. The cassette opener 21 opens and closes the wafer inlet and outlet of the cassette 110 by attaching and detaching the cover of the cassette 110 placed on the placing stage 122 by the cover attaching and detaching mechanism 123.

The sub-frame 119 forms the transfer chamber 8 that is fluidly isolated from the space in which the cassette transport device 130 and the cassette rack 105 are disposed. A wafer transfer mechanism 125 is provided in a front region of the transfer chamber 8, and the wafer transfer mechanism 125 is constituted by a wafer transfer device 125a and a wafer transfer device lifter 125b, the wafer transfer device 125a being capable of rotating or translating the wafer 200 in a horizontal direction, and the wafer transfer device lifter 125b being for lifting and lowering the wafer transfer device 125 a. These are configured to load (load) and unload (unload) the wafer 200 to and from the boat (substrate holder) 217 by the continuous operation of the wafer transfer device lifter 125b and the wafer transfer device 125a with tweezers (substrate holder) 125c of the wafer transfer device 125a as a placement portion of the wafer 200.

A transfer chamber 6 serving as a standby section for receiving and waiting the boat 217 via the gate valve 90 is formed in the rear region of the transfer chamber 8. A processing furnace 202, which constitutes a processing chamber inside, is provided above the transfer chamber 6. The lower end of the treatment furnace 202 is opened and closed by a furnace mouth damper 147.

The boat 217 is lifted by a boat lift 115 (not shown) and introduced into the processing furnace. A sealing cap 219 as a cover is horizontally mounted to an arm (not shown) as a connector connected to the lift table of the boat lift 115, and the cover 219 vertically supports the boat 217, which can close the lower end of the processing furnace 202. The wafer boat 217 has a plurality of holding members for holding the wafers 200 horizontally in a state where the wafers 200 are aligned in the vertical direction.

Next, the operation of the substrate processing apparatus 10 will be described. As one of the steps of manufacturing a semiconductor device (apparatus), an example of substrate processing using the substrate processing apparatus 10 will be described. In the present embodiment, when the execution processing start time of the reserved processing task is reached, the controller 121 controls the operations of the respective units constituting the substrate processing apparatus 10 to start the substrate processing. Here, the processing task constitutes three steps of preprocessing, main processing, and post processing. First, the conveyance process of the wafer 200 is performed by the controller 121 as a pretreatment. In the present embodiment, the wafer 200 is transferred to the boat 217 as a pretreatment. Hereinafter, pretreatment will be mainly described.

When the cassette 110 is supplied to the load port 22, the cassette 110 on the load port 22 is carried into the frame 111 from the cassette carry-in/carry-out port by the cassette carry-in device. The loaded cassette 110 is automatically transferred to the designated placement unit 140 of the cassette rack 105 by the cassette transfer device 130, and is transferred from the cassette rack 105 to one of the cassette openers 21 for transfer to the placement table 122 or directly to the cassette opener 21 for transfer to the placement table 122 after temporary storage.

The opening side end surface of the transfer cassette 110 placed on the placement table 122 is pressed against the opening edge portion of the wafer carry-in/out port 120 of the front wall 119a of the sub-frame 119, and the cover of the transfer cassette 110 is removed by the cover loading/unloading mechanism 123, so that the wafer inlet/outlet is opened. When the cassette 110 is opened by the cassette opener 21, the wafer 200 is picked up from the cassette 110 through the wafer inlet and outlet by the tweezers 125c of the wafer transfer device 125a, and carried into the transfer chamber 6 located behind the transfer chamber 8 via the gate valve 90 to be loaded into the boat 217. In this case, the wafer may be mounted after being adjusted by a notch alignment apparatus, not shown. The wafer transfer device 125a, which transfers the wafer 200 to the boat 217, returns to the transfer cassette 110, and loads the next wafer 200 into the boat 217.

In the loading operation of loading wafers into the wafer boat 217 by the wafer transfer mechanism 125 of one (upper or lower) cassette opener 21, the cassette transport device 130 transports the other cassette 110 from the cassette rack 105 to the other (lower or upper) cassette opener 21, and the cassette opener 21 simultaneously opens the cassettes 110.

When the wafer 200 of the number specified in advance is loaded into the boat 217, the pretreatment is completed, and the main treatment (here, the treatment recipe) is executed. The process recipe executed by the main process of the process task is a recipe for processing a substrate, and is controlled by the controller 121. When the process recipe is started, the lower end portion of the process furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Then, the sealing cap 219 of the wafer boat 217 holding the wafer group is lifted by the boat elevator 115, and is carried (loaded) into the processing furnace 202.

After loading, the wafer 200 is subjected to an arbitrary process by the process furnace 202. After the processing, the wafer 200 and the cassette 110 are carried out (unloaded) to the outside of the frame in the order approximately reverse to the above. Here, the process recipe (main process) ends.

As shown in fig. 3, the processing furnace 202 has a heater 207 as a heating unit (heating means). The heater 207 is cylindrical and is vertically mounted by being supported by a heater base (not shown) serving as a holding plate. The heater 207 also functions as an activation mechanism (excitation portion) that activates (excites) the process gas by heat.

Inside the heater 207, a reaction tube 203 is disposed which constitutes a reaction vessel (process vessel) concentrically with the heater 207. The reaction tube 203 is made of a heat-resistant material such as quartz (SiO 2) or silicon carbide (SiC). The reaction tube 203 is formed in a ceiling shape with an opened lower end and a flat wall closing an upper end. The reaction tube 203 includes: a cylindrical portion 209 formed in a cylindrical shape, a nozzle arrangement chamber 222 divided between the cylindrical portion 209 and the reaction tube 203, a gas supply slit 235 as a gas supply port formed in the cylindrical portion 209, a first gas exhaust port 236 formed in the cylindrical portion 209, and a second gas exhaust port 237 formed in the cylindrical portion 209 and below the first gas exhaust port 236. The tubular portion 209 is formed in a ceiling shape with a lower end portion opened and an upper end portion closed by a flat wall body. Further, the cylindrical portion 209 is disposed immediately adjacent to the wafer 200 to surround the wafer 200. A process chamber 201 is formed inside a cylindrical portion 209 of the reaction tube 203. The processing chamber 201 is configured to be capable of processing a wafer 200 as a substrate. Further, the process chamber 201 can house a boat 217 as a substrate holder capable of holding the wafers 200 in a state in which the wafers 200 are aligned in a horizontal posture and in a vertical direction in multiple stages.

The lower ends of the reaction tubes 203 are supported by a cylindrical manifold 226. The manifold 226 is made of a metal such as nickel alloy or stainless steel, or a heat-resistant material such as quartz or SiC. A flange is formed at an upper end of the manifold 226, and a lower end of the reaction tube 203 is disposed and supported on the flange. An airtight member 220 such as an O-ring is provided between the flange and the lower end portion of the reaction tube 203, so that the inside of the reaction tube 203 is airtight.

A seal cap 219 is hermetically attached to an opening at the lower end of the manifold 226 via an airtight member 220 such as an O-ring, and the opening side of the lower end of the reaction tube 203, that is, the opening of the manifold 226 is hermetically closed. The seal cap 219 is formed of a metal such as nickel alloy or stainless steel, and is formed into a disk shape. The seal cap 219 may be formed to cover the outside thereof with a heat-resistant material such as quartz (SiO 2) or silicon carbide (SiC).

A boat support table 218 for supporting the boat 217 is provided on the seal cover 219. The boat support table 218 is a support body as follows: for example, the substrate boat is made of a heat-resistant material such as quartz or SiC, and functions as a heat insulating portion to support the substrate boat. The boat 217 stands on the boat support table 218. The boat 217 is made of a heat-resistant material such as quartz or SiC. The boat 217 has a bottom plate fixed to a boat support table, not shown, and a top plate disposed above the bottom plate, and has a structure in which a plurality of struts are arranged between the bottom plate and the top plate. A plurality of wafers 200 are held in the wafer boat 217. The wafers 200 are placed in a state of being aligned with each other in the center while being kept in a horizontal posture with a predetermined distance therebetween, and are supported by the support columns of the boat 217 while being stacked in multiple stages in the tube axis direction of the reaction tube 203.

A boat rotation mechanism 267 for rotating the boat is provided on the opposite side of the seal cap 219 from the process chamber 201. The rotation shaft 265 of the boat rotation mechanism 267 penetrates the seal cover and is connected to the boat support table 218, and the boat 217 is rotated via the boat support table 218 by the boat rotation mechanism 267, thereby rotating the wafer 200.

The seal cap 219 is vertically lifted by a boat lift 115 as a lift mechanism provided outside the reaction tube 203, and thereby the boat 217 can be carried in and out of the process chamber 201.

The manifold 226 is provided with nozzle support portions 350a to 350d for supporting the nozzles 340a to 340d so as to penetrate the manifold 226, and the nozzles 340a to 340d serve as gas nozzles for supplying the process gas into the process chamber 201. Here, 4 nozzle support portions 350a to 350d are provided. The nozzle support portions 350a to 350d are made of a material such as nickel alloy or stainless steel. Gas supply pipes 310a to 310c for supplying gas into the process chamber 201 are connected to one ends of the nozzle support portions 350a to 350c on the side of the reaction tube 203, respectively. A gas supply pipe 310d for supplying gas to the gap S formed between the reaction tube 203 and the cylindrical portion 209 is connected to one end of the nozzle support portion 350d on the side of the reaction tube 203. Further, nozzles 340a to 340d are connected to the other ends of the nozzle support portions 350a to 350d, respectively. The nozzles 340a to 340d are made of a heat-resistant material such as quartz or SiC.

A first process gas supply source 360a for supplying a first process gas, a Mass Flow Controller (MFC) 320a as a flow controller (flow control unit), and a valve 330a as an on-off valve are provided in this order from the upstream side of the gas supply pipe 310 a. A second process gas supply source 360b, an MFC320b, and a valve 330b for supplying a second process gas are provided in this order from the upstream side of the gas supply pipe 310 b. A third process gas supply source 360c, an MFC320c, and a valve 330c for supplying a third process gas are provided in this order from the upstream side of the gas supply pipe 310 c. An inert gas supply source 360d, an MFC320d, and a valve 330d for supplying an inert gas are provided in this order from the upstream side of the gas supply pipe 310 d. Gas supply pipes 310e and 310f for supplying inert gas are connected to the downstream sides of the valves 330a and 330b of the gas supply pipes 310a and 310b, respectively. MFCs 320e and 320f and valves 330e and 330f are provided in the gas supply pipes 310e and 310f in this order from the upstream side.

The first process gas supply system is mainly composed of a gas supply pipe 310a, an MFC320a, and a valve 330a. The first process gas supply source 360a, the nozzle support 350a, and the nozzle 340a may be considered to be included in the first process gas supply system. The second process gas supply system is mainly composed of a gas supply pipe 310b, an MFC320b, and a valve 330b. The second process gas supply source 360b, the nozzle support 350b, and the nozzle 340b may be considered to be included in the second process gas supply system. The third process gas supply system is mainly composed of a gas supply pipe 310c, an MFC320c, and a valve 330c. The third process gas supply source 360c, the nozzle support 350c, and the nozzle 340c may be included in the third process gas supply system. The inert gas supply system is mainly composed of a gas supply pipe 310d, an MFC320d, and a valve 330d. The inert gas supply source 360d, the nozzle support 350d, and the nozzle 340d may be considered to be included in an inert gas supply system.

An exhaust port 230 is formed in the reaction tube 203. The exhaust port 230 is formed below the second gas exhaust port 237 and is connected to the exhaust pipe 231. The exhaust pipe 231 is configured to: a vacuum pump 246 serving as a vacuum evacuation device is connected via a pressure sensor 245 serving as a pressure detector for detecting the pressure in the processing chamber 201 and an APC (AutoPressure Controller automatic pressure controller) valve 224 serving as a pressure adjustment unit, and vacuum evacuation can be performed so that the pressure in the processing chamber 201 becomes a predetermined pressure. The exhaust pipe 231 on the downstream side of the vacuum pump 246 is connected to an exhaust gas treatment device (not shown) or the like. The APC valve 244 is an on-off valve as follows: the valve is opened and closed to enable vacuum evacuation and vacuum evacuation in the processing chamber 201 to be stopped, and the valve opening is adjusted to adjust conductance to adjust pressure in the processing chamber 201. An exhaust system functioning as an exhaust unit is mainly composed of an exhaust pipe 231, an APC valve 244, and a pressure sensor 245. In addition, a vacuum pump 246 may be included in the exhaust system.

A temperature sensor (not shown) as a temperature detector is provided in the reaction tube 203, and the supply power to the heater 207 is adjusted based on the temperature information detected by the temperature sensor, so that the temperature in the process chamber 201 becomes a desired temperature distribution.

In the processing furnace 202 described above, the wafer boat 217 is supported by the boat support table 218 and is inserted into the processing chamber 201 in a state in which a plurality of wafers 200 are batch-processed in a plurality of stages with respect to the wafer boat 217, and the heater 207 heats the wafers 200 inserted into the processing chamber 201 to a predetermined temperature.

As shown in fig. 4, the controller 121 as a control unit (control means) is configured as a computer having a CPU (Central Processing Unit central processing unit) 121a, a RAM (Random Access Memory random access memory) 121b, a storage device 121c as a storage unit, and an I/O port 121d as execution units for executing various programs. The RAM121b, the storage device 121c, and the I/O port 121d, which are configured to temporarily hold a memory area (work area) of a program, data, or the like read by the CPU121a, can exchange data with the CPU121a via the internal bus 121 e. The controller 121 is connected to an input/output device 122 as a display unit configured as, for example, a touch panel.

The storage device 121c is constituted by, for example, a flash memory, an HDD (Hard Disk Drive), or the like. The memory device 121c stores a control program for controlling the operation of the substrate processing apparatus, a process recipe in which steps, conditions, and the like of the substrate processing are described, and the like, so as to be readable. The processing recipe is a processing recipe in which the controller 121 performs steps of a substrate processing process described later so that a predetermined result can be obtained, and the maintenance recipe is a recipe in which the controller 121 performs steps, for example, a recipe capable of maintaining a component, in a state where the wafer 200 is not placed in the apparatus, and functions as a program. In addition, a maintenance recipe is also executed as a main process in some cases. In addition, the storage device 121c stores device data generated by executing tasks to operate the respective components constituting the device. The time data is added to the device data by a time stamp function of the controller 121 as a timer.

Here, the device data is data collected when a task is performed as described above. For example, the data (for example, a set value and an actual measurement value) related to the substrate processing such as the processing temperature, the processing pressure, and the flow rate of the processing gas when the substrate processing apparatus 10 processes the wafer 200, the data related to the quality of the manufactured product substrate (for example, the film thickness of the film, the cumulative value of the film thickness, and the like), and the data related to the components (for example, a reaction tube, a heater, a valve, and an MFC) of the substrate processing apparatus 1 (for example, a set value and an actual measurement value) generated when the substrate processing apparatus processes the wafer 200.

In addition, measured values at specific intervals collected during recipe execution, for example, measured value data from the start to the end of a recipe, and statistic data of each step in a recipe are sometimes referred to as process data, and the process data is also included in the device data. The statistic data includes a maximum value, a minimum value, an average value, and the like. Event data indicating a device event in which a recipe starts or ends, and event data indicating a device event in which a process recipe is not executed (for example, in the case where a substrate is not put into idle operation of the device) are also included in the device data. In addition, data indicating the occurrence of an alarm (abnormality) and an event of an alarm (warning) (occurrence and recovery) is also included in the device data.

The storage device 121c stores a graph display program, a screen transition program, and the like according to the present embodiment. The CPU121a is configured to execute these programs in response to input of an operation instruction or the like from the input/output device 122. In the present embodiment, the CPU121a functions as a display control unit. The storage device 121c stores various screen files including the screen file for displaying the graph in the present embodiment, such as a schedule screen and a production information screen.

In addition, when a term called a program is used in this specification, there are cases where only a single processing recipe (maintenance recipe) is included, only a single control program is included, or both of them are included.

The I/O port 121d is connected to the MFCs 320 a-320 f, the valves 330 a-330 f, the pressure sensor 245, the APC valve 244, the vacuum pump 246, the heater 207, the temperature sensor, the boat rotation mechanism 267, the boat elevator 115, and the like.

The CPU121a is configured to read out a control program or the like from the storage device 121c to execute the control program or the like, and to read out a process recipe (maintenance recipe) from the storage device 121c in accordance with an input of an operation instruction or the like from the input/output device 122. The CPU121a is configured to control the flow rate adjustment operation of the respective gases, the opening and closing operation of the valves 330a to 330f, the opening and closing operation of the APC valve 244, the pressure adjustment operation of the APC valve 244 by the pressure sensor 245, the start and stop of the vacuum pump 246, the temperature adjustment operation of the heater 207 by the temperature sensor, the rotation and rotation speed adjustment operation of the boat 217 by the boat rotation mechanism 267, the lifting operation of the boat 217 by the boat elevator 115, and the like, in accordance with the content of the processing recipe read out through the I/O port 121 d.

Next, a substrate processing step corresponding to a main process of a processing task will be described with reference to fig. 3. In the present embodiment, the controller 121 performs a substrate processing process by executing a processing recipe. The processing recipe is a recipe for processing a substrate, which is executed in the main process, and is controlled by the controller 121. The controller 121 controls operations of the respective units constituting the substrate processing apparatus 10 to perform predetermined processing on the wafer 200.

(substrate processing step) the boat 217 on which the wafers 200 of a predetermined number are placed is inserted into the reaction tube 203, and the reaction tube 203 is hermetically sealed by the seal cap 219. The wafer 200 is heated in the reaction tube 203 which is hermetically sealed, and a process gas is supplied into the reaction tube 203 to perform a predetermined process on the wafer 200.

As a predetermined process, for example, NH3 gas as a first process gas, HCDS gas as a second process gas, and N2 gas as a third process gas are alternately supplied, thereby forming a SiN film on the wafer 200.

First, HCDS gas is supplied from the gas supply pipe 310b of the second process gas supply system into the process chamber 201 through the gas supply hole 234b of the nozzle 340b and the gas supply slit 235. Specifically, by opening the valves 330b and 330f, the HCDS gas starts to be supplied into the process chamber 201 from the gas supply pipe 310b together with the carrier gas. At this time, the opening of the APC valve 244 is adjusted to maintain the pressure in the processing chamber 201 at a predetermined pressure. When the predetermined time has elapsed, the valve 330b is closed, and the supply of HCDS gas is stopped.

The HCDS gas supplied into the process chamber 201 is supplied to the wafer 200, flows in parallel to the wafer 200, flows from the upper part to the lower part through the gap S via the first gas exhaust port 236, and is exhausted from the exhaust pipe 231 via the second gas exhaust port 237 and the exhaust port 230.

In addition, when the inert gas such as N2 is flowed by opening the valve 330e of the inert gas supply pipe connected to the gas supply pipe 310a and the valves 330c and 330d of the gas supply pipes 310c and 310d while the HCDS gas is supplied into the process chamber 201, the HCDS gas can be prevented from flowing back into the gas supply pipes 310a, 310c and 310 d.

After the valve 330b is closed, the supply of the HCDS gas into the process chamber 201 is stopped, and the process chamber 201 is exhausted to remove the HCDS gas, the reaction products, and the like remaining in the process chamber 201. At this time, when the inert gas such as N2 is supplied from the gas supply pipes 310a, 310b, 310c, and 310d into the process chamber 201 and the gap S, respectively, and cleaning is performed, the effect of exhausting the residual gas from the process chamber 201 and the gap S can be further improved.

Next, NH3 gas is supplied from the gas supply pipe 310a of the first process gas supply system into the process chamber 201 through the gas supply hole 234a of the nozzle 340a and the gas supply slit 235. Specifically, by opening the valves 330a and 330e, NH3 gas starts to be supplied into the process chamber 201 from the gas supply pipe 310a together with the carrier gas. At this time, the opening of the APC valve 244 is adjusted to maintain the pressure in the processing chamber 201 at a predetermined pressure. When the predetermined time elapses, the valve 330a is closed, and the supply of NH3 gas is stopped.

The NH3 gas supplied into the process chamber 201 is supplied to the wafer 200, flows in parallel to the wafer 200, flows from the upper part to the lower part through the first gas exhaust port 236, and is exhausted from the exhaust pipe 231 through the second gas exhaust port 237 and the exhaust port 230.

In addition, when the inert gas such as N2 is flowed by opening the valve 330f and the valves 330c and 330d of the inert gas supply pipe connected to the gas supply pipe 310b while NH3 gas is supplied into the process chamber 201, NH3 gas can be prevented from flowing back into the gas supply pipes 310b, 310c and 310 d.

After the valve 330a is closed, the supply of NH3 gas into the process chamber 201 is stopped, and the process chamber 201 is exhausted, so that NH3 gas, reaction products, and the like remaining in the process chamber 201 are removed. At this time, when the inert gas such as N2 is supplied from the gas supply pipes 310a, 310b, 310c, and 310d into the process chamber 201 and the gap S, respectively, and cleaning is performed, the effect of exhausting the residual gas from the process chamber 201 and the gap S can be further improved.

When the processing of the wafer 200 is completed, the wafer boat 217 is carried out of the reaction tube 203 by a procedure reverse to the above-described operation.

In the above-described embodiments, the case where the first process gas and the second process gas are alternately supplied has been described, and the present invention can be applied to a case where the first process gas and the second process gas are simultaneously supplied.

(example 1) fig. 5 is a process flow showing a graph display program for displaying a schedule of tasks according to the present embodiment.

When the controller 121 is started, the graph display program is started, and the controller 121 first obtains the current time. Then, the storage unit 121c performs a search to confirm whether or not a predetermined task to be executed by the apparatus exists. If no task exists, the standby state is ended or maintained. In any case, when an update button described later is pressed, the program is restarted, and the current time is acquired.

When a task is retrieved, the controller 121 obtains information of the task. Not only task information (name, recipe name, start scheduled time, end scheduled time, etc.) but also at least recipe information (name, category, processing chamber, processing data, etc.) on which the task is executed is acquired.

Next, it is determined whether a task is reserved or is currently being executed. Specifically, the acquired current time is compared with a scheduled start time of the task, and a determination is made based on whether or not the current time has elapsed the scheduled start time and based on whether or not there is device data indicating the start of the task (time data indicating the start time of execution of the task).

When a task is reserved, a preprocessing scheduled time is calculated based on task information according to preprocessing starting time and preprocessing ending time of preprocessing, main processing scheduled time is calculated according to main processing starting time and main processing ending time of main processing, post-processing scheduled time is calculated according to post-processing starting time and post-processing ending time of post-processing, and the calculated preprocessing scheduled time, main processing scheduled time and post-processing scheduled time are added to calculate execution scheduled time of the task. In order to enable the respective recognition, for example, the color display pretreatment predetermined time, the main treatment predetermined time, and the post-treatment predetermined time may be distinguished. Further, for example, when all tasks are reserved, a predetermined time for preprocessing of a task to be executed at the beginning is calculated so as to be from the current time to the preprocessing end time.

While the task is currently being executed, the controller 121 confirms which of the preprocessing, the main processing, and the post-processing is being executed. Specifically, the controller 121 determines, for example, which of the start scheduled time and the end scheduled time of the preprocessing, the start scheduled time and the end scheduled time of the main processing, and the start scheduled time and the end scheduled time of the post-processing corresponds to the current time, based on the acquired device data, based on whether or not there is time data indicating the start of the preprocessing, the start of the main processing, and the start of the post-processing. For example, if there is time data at which the preprocessing starts, it is determined that preprocessing is in progress.

When it is determined that the preprocessing is in progress, the controller 121 then compares the current time with a predetermined time for ending the preprocessing, calculates a preprocessing execution time from the start time of the task to the current time when the current time passes the predetermined time for ending the preprocessing, and calculates a preprocessing execution time from the start time of the task to the predetermined time for ending the preprocessing when the current time is before the predetermined time for ending the preprocessing.

Then, the controller 121 adds the preprocessing execution time to the main processing predetermined time and the post-processing predetermined time to calculate an execution predetermined time for the task. In addition, in the case where the task currently being executed is in the main processing and in the case where the task is in the post-processing, the calculation is performed similarly. Therefore, when the current time is in the main process, the main process execution time calculated by comparing the current time with the end scheduled time is added to the pre-process execution time and the post-process scheduled time, and the main process execution time is calculated as the task execution scheduled time.

Next, it is determined whether the task is generating a recovery condition wait. For example, when confirming whether or not the recovery condition waiting is generated in the preprocessing, the controller 121 determines that the recovery condition waiting is generated when the state of the alarm requiring the recovery operation is generated based on the acquired device data, and acquires the information of the recovery determination waiting.

When the calculation (graph calculation processing) of the execution scheduled time of one task ends, the controller 121 similarly performs the graph calculation processing for the next task, and acquires the task execution scheduled time as graph processing result information for all the retrieved task calculation tasks. Here, as the graph processing result information, the execution time or the execution scheduled time of the preprocessing, the main processing, and the post-processing of each task is also acquired.

Then, the controller 121 generates a schedule screen file (for example, shown in fig. 6) based on the acquired various device data such as the current time, task information, recipe information, graph processing result information, recovery condition waiting information, and the like, and displays the respective graphs of the tasks. The controller 121 is configured to display a line symbol corresponding to the current time on the schedule screen.

As described above, according to the graph display program of the present embodiment, when the processing start time and the processing end time are held in the task information, first, the scheduled execution time of the first task is calculated from the processing start time and the processing end time of the first task or the task currently being executed. The scheduled execution time of the reserved task is calculated by reflecting the scheduled end time of the head task to the task scheduled to be executed next and repeating the operation according to the number of the searched tasks.

Further, when the recovery condition waiting information is acquired for the task currently being executed, the controller 121 displays an icon indicating that the recovery condition waiting is generated in a predetermined space of the schedule screen as shown in fig. 8. Further, for example, when a cause button described later displayed in a predetermined area of the schedule screen is pressed, the controller 121 displays details of the cause for which the recovery condition waiting is performed on the display section.

Fig. 6 shows an embodiment of a schedule screen displayed in the operation screen of the input-output device 122 by executing a graph display program by the controller 121. The schedule screen 500 shown in fig. 6 includes a two-dimensional space in which the vertical axis is a project number cell 501 indicating the reservation order of various tasks executed by the device including the task currently being executed by the device, and the horizontal axis is task information including a task name cell 502, a PM cell 503, a recipe name, and an end scheduled time cell 504, and a date and time 505 indicating a scheduled monitoring period. Here, PM is abbreviated as PM of the processing module (Processing Module).

Further, in the two-dimensional space of the schedule screen 500, a line 506 indicating the current time, a task 507 currently being executed, which is displayed by an icon indicating the execution time of the task or the execution scheduled time, a reserved task 508, which is displayed by an icon indicating the start scheduled time to the end scheduled time, are displayed, and the task 507 currently being executed and the reserved task 508 are graphically displayed. In addition, the recipe name (process recipe 1) is displayed in the recipe name or end predetermined time cell 504.

The preprocessing step 508a, the main processing step 508b, and the post-processing step 508c of the reserved task 508 are displayed in the two-dimensional space of the schedule screen 500, and are displayed in colors predetermined in the respective steps. Although not explicitly shown, the preprocessing step, the main processing step, and the post-processing step are displayed independently, and are displayed in predetermined colors, similarly to the task 507 currently being executed.

Fig. 7 shows when the recipe name or the end predetermined time cell 504 is pressed to switch to the end predetermined time in the schedule screen shown in fig. 6.

Fig. 8 is a display example of an icon 510 on the schedule screen indicating that a recovery condition wait has been generated. It is known that the recipe 507 currently being executed is displayed with the current time 506 as a boundary. Some faults are generated in the preprocessing (or main processing), and the state of the recovery processing of the next main processing (or post processing) waiting for the faults continues. When the restoration process is performed, the icon 510 is not displayed. When the cause button shown in fig. 9 is pressed at the time of displaying the icon 510, a detailed cause of displaying the icon 510 is displayed.

Fig. 9 is a cause detailed screen 600 displayed on the display unit 122 when the cause button 511 on the schedule screen is pressed. The cause detailed screen 600 is a screen when the condition a in the restoration condition waiting cause is pressed (selected). Condition a includes four conditions of "EFEM", "maintenance", "PM1", "PM 2". "EFEM", "PM1", "PM2" are maintenance state release waiting of the EFEM as the storage chamber 9, the process module 1 as the process furnace 202, and the process module 2 as the process furnace 202, and "maintenance" is in the schedule of temporary stop due to maintenance. Further, when the restoration condition waiting is generated, the cause button 511 may be displayed in a different color on the schedule screen.

The cause of the "EFEM" (maintenance state release wait) and the method of coping with the cause are described below the cause detail screen 600. When the search cell is pressed, a screen for selecting four conditions of "EFEM", "maintenance", "PM1", "PM2" is displayed, and thus, it is possible to change the screen by selecting other conditions than "EFEM". Although not explicitly shown in fig. 8, cells that generate conditions for waiting for the recovery condition are displayed in different colors. When the OK button at the lower part is pressed, the display of the cause detail screen 600 is released, and the screen returns to the schedule screen 500.

Further, when the update button 509 displayed in the schedule screen 500 is pressed, the update of the chart display is performed. That is, the graph display program shown in fig. 5 is restarted, and the current time is newly acquired. Then, the processing flow shown in fig. 5 is executed from the present time to update the schedule screen shown in fig. 6.

Specifically, when the controller 121 detects that the update button 509 is pressed, it executes the processing flow shown in fig. 5, updates the new current time, task information, and recipe information, and accordingly, calculates the scheduled ending time of the currently executing task and the scheduled starting time and scheduled ending time of the reserved task again, and calculates the execution time and execution scheduled time of the currently executing task and the scheduled execution time of the reserved task based on the calculated scheduled starting time and scheduled ending time, and updates and displays the schedule screen shown in fig. 6.

As shown in fig. 12, an icon is displayed in the item number cell 501 so that the difference between the production task (processing task) and the maintenance task (cleaning task in fig. 12) is clearly displayed. Further, for example, an icon for identifying whether the recipe for which the task is performed is a process recipe (a recipe for processing a substrate) or a maintenance recipe (a recipe for cleaning a maintenance structural member such as a recipe) is displayed in the item number cell 501.

(embodiment 2) fig. 10 is a process flow of the graph display program of the present embodiment showing the executed task, and fig. 11 shows an embodiment of a production information screen displayed on the operation screen of the input-output device 122 by executing the graph display program.

When a button for switching to the production information screen is pressed, a graph display program of the executed task is started. First, the controller 121 obtains the current time. Then, the storage unit 121c searches for a task (executed task) that the device has executed. Ending if there are no executed tasks. When an update button, not shown, is pressed, the program is restarted, and the current time is acquired.

When an executed task is retrieved, the controller 121 obtains information of the executed task. Not only task information (name, recipe name, start scheduled time, end scheduled time, etc.) but also at least recipe information (name, category, process chamber, process data, production information, etc.) on which the task is executed is acquired. Further, device data including production information collected and stored in the storage unit 121c when the task is executed is acquired.

The controller 121 calculates a preprocessing execution time from the preprocessing start time and the preprocessing end time of the task information, calculates a main processing execution time from the main processing start time and the main processing end time, calculates a post-processing execution time from the post-processing start time and the post-processing end time, and adds the calculated execution times to calculate an execution time of the executed task. Then, the execution time is calculated for all the executed tasks. The execution time, the preprocessing execution time, the main processing execution time, and the post-processing execution time of all the executed tasks are acquired as graph processing result information.

Next, the controller 121 generates a production information screen file (shown in fig. 11) from various device data including the acquired current time, task information, recipe information, execution time of the executed task, and other graphic processing result information, and graphically displays the executed task, respectively.

The production information screen 700 shown in fig. 11 includes a two-dimensional space in which the vertical axis is a project number cell 701 indicating the order of various tasks executed by the apparatus, and the horizontal axis is task information including a task name cell 702, a PM cell 703, and a recipe name cell 704, and a date and time 705 indicating a predetermined monitoring period. Here, as in fig. 5, PM is abbreviated as PM of the processing module (Processing Module).

Further, the executed task 706 displayed by the icon indicating the execution time of the task is graphically displayed in the two-dimensional space of the production information screen 700, and the executed task 706 has a preprocessing step 706a, a main processing step 706b, and a post-processing step 706c, and is displayed by the colors predetermined in the respective steps.

When the acquired device data includes abnormal data indicating that an abnormality has occurred, the controller 121 displays an abnormality icon 707 in the item number cell 701 of the executed task in which the abnormal data has occurred. In addition, when a failure occurs in a task in execution on the schedule screen shown in fig. 6, an abnormality icon may be set in the item number cell 501 as well.

As shown in fig. 12, an icon may be displayed in the item number cell 701 so that a difference between a production task (processing task) and a maintenance task (cleaning task in fig. 12) is clearly displayed.

According to the present embodiment, one or more of the following effects (1) to (7) are obtained.

(1) According to the present embodiment, by performing the graphic display, the progress status of the task selected from the group consisting of reservation, pretreatment, main treatment, and post-treatment can be easily recognized, and the processing order of all the reserved tasks can be recognized. (2) According to the present embodiment, since the start timing and the end scheduled timing of all reserved tasks can be recognized by performing the graphic display, the execution plan of the task can be formulated, and as a result, the setup job can be performed more efficiently. (3) According to the present embodiment, since the cause information of the task waiting for the recovery condition is stored in the task unit, the task for which the recovery condition waiting is generated can be grasped and the cause thereof can be recognized. (4) According to the present embodiment, by performing the graphic display, it is possible to recognize not only the actual results of task execution such as the frequency of use and the use interval of each processing module, but also the relationship with the actual results of other processing modules. (5) According to the present embodiment, by performing the graphic display, the relationship between the task in which the failure has occurred and the tasks executed before and after can be grasped, and therefore, the failure can be easily removed. (6) According to the present embodiment, the production task and the maintenance task can be recognized at a glance, and it can be determined whether or not the regular maintenance task is normally executed. (7) According to the present embodiment, the processing start time and the processing end time are held in the task information, and when the start time of the first task is determined, the execution scheduled time of the task can be calculated from the processing start time and the processing end time, so that the scheduled end time of the task can be calculated. The scheduled execution time of the reserved task can be calculated by reflecting the scheduled end time of the task to the task scheduled to be executed next and repeating the operation.

The control unit 121 according to the embodiment of the present invention is not limited to the case of being configured as a dedicated computer, and may be configured as a general-purpose computer. For example, the controller 121 of the present embodiment can be configured by preparing an external storage device 123 (for example, a semiconductor memory such as a USB memory) storing the program, and installing the program to a general-purpose computer or the like using the external storage device 123. The means for supplying the program to the computer is not limited to the case of supplying the program via the external storage device 123. For example, a communication unit such as the internet or a dedicated line may be used to supply the program without the external storage device 123. The storage device 121c and the external storage device 123 are configured as a computer-readable recording medium. Hereinafter, they are simply referred to as a recording medium. When the term recording medium is used in the present specification, there are cases where only the storage device 121c alone is included, only the external storage device 123 alone is included, or both of them are included.

The substrate processing apparatus 1 according to the embodiment of the present invention is used not only for a semiconductor manufacturing apparatus for manufacturing a semiconductor but also for an apparatus for processing a glass substrate such as an LCD (Liquid Crystal Display liquid crystal display) apparatus. Alternatively, the present invention can be applied to various substrate processing apparatuses such as an exposure apparatus, a photolithography apparatus, a coating apparatus, and a processing apparatus using plasma.

Industrial application

The present invention can display progress status of various formulations executed by a task on a screen, and can be applied to a substrate processing apparatus that performs progress management of a task on a screen.

Symbol description

10 … substrate processing apparatus

200 … wafer.

Claims

1. A substrate processing apparatus, comprising:

a display unit having an operation screen including a two-dimensional space in which one axis is set as a reserved status of various tasks executed by the device including a task currently being executed by the device and the other axis is set as a predetermined monitoring period; and

a display control unit configured to acquire various pieces of information including a start time and an end scheduled time of a task being executed by the device or a start scheduled time and an end scheduled time of a task reserved by the device, calculate execution scheduled time of the task based on the acquired start time and end scheduled time of the task currently being executed and/or the acquired start scheduled time and end scheduled time of the task reserved, and cause the display unit to graphically display an image indicating the execution scheduled time of the task currently being executed and the task reserved,

The display control unit is configured to cause the display unit to display an icon indicating that the recovery condition is waiting when the acquired various information includes information indicating that the recovery condition is waiting.

2. The substrate processing apparatus according to claim 1, wherein,

the display control unit is configured to acquire a current time, and the display control unit is configured to cause the display unit to display a line indicating the current time.

3. The substrate processing apparatus according to claim 1, wherein,

the display control unit is configured to display a cause of the recovery condition waiting when a press of a cause button provided in the display unit is detected.

4. The substrate processing apparatus according to claim 1, wherein,

the display control unit is configured to recalculate a scheduled start time and a scheduled end time of the task currently being executed and the task scheduled when the update button provided on the display unit is pressed, and to cause the display unit to display the task currently being executed and the task scheduled based on the calculated scheduled start time and scheduled end time.

5. The substrate processing apparatus according to claim 1, wherein,

the display control unit is configured to update the current time and display the updated time on the display unit when the update button provided on the display unit is pressed.

6. The substrate processing apparatus according to claim 1, wherein,

the display control unit is configured to display an icon for identifying whether the recipe in which the task has been performed is a recipe for processing a substrate or a recipe for maintaining a structural member in a project number cell provided in the display unit.

7. A substrate processing apparatus, comprising:

a display unit having an operation screen including a two-dimensional space in which one axis is set to a sequence of executing tasks and the other axis is set to a predetermined monitoring period;

a storage unit that stores various pieces of information including a start time and an end time of a task including a preprocessing step, a main processing step, and a post-processing step that have been executed by the device; and

a display control unit configured to calculate execution times of the preprocessing step, the main processing step, and the post-processing step, which are acquired from the storage unit, and to display the task in a recognizable manner for each step, and to graphically display the display unit as an image indicating the execution time of the task that has been executed,

8. The substrate processing apparatus according to claim 7, wherein,

the display control unit is configured to display the item number cell provided in the display unit in a color-separated manner based on the presence or absence of data indicating an abnormality occurring during execution of the task.

9. The substrate processing apparatus according to claim 7, wherein,

10. A display method of a substrate processing apparatus having an operation screen including a two-dimensional space in which one axis is set as a reserved status of various tasks executed by the apparatus including a task currently being executed by the apparatus and the other axis is set as a predetermined monitoring period,

the display method comprises the following steps:

Acquiring various information including a start time and an end scheduled time of a task being executed by the device or a start scheduled time and an end scheduled time of a task reserved by the device;

calculating the scheduled execution time of the task according to the acquired scheduled starting time and scheduled ending time of the task currently being executed and/or the scheduled starting time and scheduled ending time of the task;

a graph displayed as an image representing the task currently being executed and the execution scheduled time of the reserved task; and

when the acquired various information includes information indicating that the recovery condition is waiting, the operation screen is displayed with an icon indicating that the recovery condition is waiting.

11. A display method of a substrate processing apparatus having an operation screen including a two-dimensional space in which one axis is set to a sequence of executing tasks and the other axis is set to a predetermined monitoring period,

the display method comprises the following steps:

storing various information including a start time and an end time of a task including a preprocessing step, a main processing step, and a post processing step that have been executed by the apparatus;

Calculating the execution time of each stored preprocessing step, main processing step and post processing step;

displaying the task identifiably for each step while a graph is displayed as an image representing the execution time of the task that has been executed; and

when the various information includes information indicating a waiting for a recovery condition, an icon indicating the waiting for the recovery condition is displayed on the operation screen.