CN110430666B - Preparation method of 3D printed circuit board - Google Patents
Preparation method of 3D printed circuit board Download PDFInfo
- Publication number
- CN110430666B CN110430666B CN201910615328.7A CN201910615328A CN110430666B CN 110430666 B CN110430666 B CN 110430666B CN 201910615328 A CN201910615328 A CN 201910615328A CN 110430666 B CN110430666 B CN 110430666B
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- Prior art keywords
- conductive
- circuit board
- circuit
- insulating liquid
- printed circuit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
Abstract
The invention discloses a preparation method of a 3D printed circuit board, which comprises the following steps: (1) preparing a conductive circuit: manufacturing a conductive circuit by using a 3D printing technology; (2) coating insulating liquid: immersing the conductive line in an insulating liquid; (3) curing and forming: the preparation method can print by using a single material, simplifies equipment and process, and can effectively avoid the defects of bending, infirm connection or scorching and the like caused by material performance difference such as thermal expansion coefficient and the like when the insulating layer and the conducting layer are printed layer by layer.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a preparation method of a 3D printed circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The Circuit Board can be called as a Printed Circuit Board or a Printed Circuit Board, and the english name (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC Circuit Board (FPC Circuit Board is also called as a Flexible Circuit Board) which is a Flexible Printed Circuit Board made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. Therefore, the rigid-flexible printed circuit board is a circuit board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like; 3D printing is typically achieved using digital technology material printers. The method is often used for manufacturing models in the fields of mold manufacturing, industrial design and the like, and is gradually used for directly manufacturing some products, and parts printed by the technology are already available. The technology has applications in jewelry, footwear, industrial design, construction, engineering and construction (AEC), automotive, aerospace, dental and medical industries, education, geographic information systems, civil engineering, firearms, and other fields.
The existing circuit board can also use a 3D printing technology in the manufacturing process, and at present, when the 3D printing technology is used for manufacturing the circuit board, a layer-by-layer printing method is usually adopted for printing a conducting layer or an insulating layer, but the method not only makes the printing equipment and the printing process thereof complex and improves the manufacturing difficulty, but also needs to print various materials with different properties, so that the insulating layer and the conducting layer of the circuit board can have the defects of bending, poor connection, scorching and the like caused by material performance differences such as thermal expansion coefficients and the like when the insulating layer and the conducting layer are printed layer by layer.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a preparation method of a 3D printed circuit board, which can be used for printing by using a single material, simplifies equipment and a process, and can effectively avoid the defects of bending, infirm connection, scorching and the like caused by the difference of material properties such as thermal expansion coefficients and the like when an insulating layer and a conductive layer are printed layer by layer.
The purpose of the invention is realized by the following technical scheme:
a preparation method of a 3D printed circuit board comprises the following steps:
(1) preparing a conductive circuit: manufacturing a conductive circuit by using a 3D printing technology;
(2) coating insulating liquid: immersing the conductive line in an insulating liquid;
(3) curing and forming: and carrying out curing molding to make the insulating liquid adhere to the surface of the conductive circuit.
Further, in the step (1), the 3D printing technology is one of a selective laser melting molding technology, a selective laser sintering molding technology, a laser cladding molding technology, an electron beam melting technology, and a fused deposition molding technology.
Further, in the step (1), the conductive circuit is made of one of a metal conductive material and a nonmetal composite conductive material, and the metal conductive material is one of conductive metal or multiple alloy conductive metals of copper, silver and gold; the non-metal composite conductive material is one of conductive ceramic, conductive resin and conductive rubber.
Further, in the step (2), the insulating liquid is one of epoxy resin, polyether ether ketone, polyimide and polyether sulfone.
Further, in the step (2), the conductive circuit is repeatedly leached in the insulating liquid during the process of coating the insulating liquid with the insulating liquid and coating the insulating liquid.
Further, in the step (2), the conducting circuit is in a high-frequency vibration state when being immersed in the insulating liquid.
Further, the frequency of the high-frequency vibration is not less than 20 KHz.
Further, in the step (3), after the curing molding is finished, the position of the circuit exposed in the conductive circuit is cut.
Further, in step (3), during the curing process of the conductive circuit, the conductive circuit is rotated.
Further, in the step (3), the curing manner is photocuring.
Has the advantages that: according to the preparation method, the conducting circuit can be printed by a single material in the manufacturing process by using a 3D printing technology, so that equipment and a process are simplified, and then the insulating layer is solidified on the surface of the conducting circuit by soaking the conducting circuit in insulating liquid, so that the defects of bending, poor connection, scorching and the like caused by material performance differences such as thermal expansion coefficients and the like when the insulating layer and the conducting layer are printed layer by layer can be effectively avoided.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
Fig. 1 is a process flow diagram of a method for manufacturing a 3D printed circuit board according to the present invention.
Fig. 2 is an operation flowchart of a method for manufacturing a 3D printed circuit board according to the present invention.
The figure includes: conductive line 1, insulating liquid 2.
Detailed Description
The invention is further described with reference to the following examples.
As shown in fig. 1-2, the present embodiment provides a method for manufacturing a 3D printed circuit board, including the following steps:
(1) preparing a conductive circuit 1: manufacturing a conductive circuit 1 by using a 3D printing technology;
(2) coating insulating liquid: immersing the conductive line 1 in an insulating liquid 2;
(3) curing and forming: and performing curing molding so that the insulating liquid 2 is attached to the surface of the conductive circuit 1.
In a preferred embodiment, in step (1), the 3D printing technique includes a selective laser melting and forming technique, a selective laser sintering and forming technique, a laser cladding and forming technique, an electron beam melting technique, and a fused deposition and forming technique.
In a preferred embodiment, in the step (1), the conductive circuit 1 is made of one of a metal conductive material and a non-metal composite conductive material, and the metal conductive material is one of conductive metal or multiple alloy conductive metals of copper, silver and gold; the non-metal composite conductive material is one of conductive ceramic, conductive resin and conductive rubber;
in a preferred embodiment, in the step (2), the insulating liquid 2 is one of epoxy resin, polyether ether ketone, polyimide and polyether sulfone.
In the preferred embodiment, in the step (2), the conductive circuit 1 is repeatedly leached in the insulating liquid 2 during the process of coating the insulating liquid and coating the insulating liquid, so that the curing quality and speed of the conductive circuit 1 can be improved.
In the preferred embodiment, in the step (2), the conductive circuit 1 is in a high-frequency vibration state when being immersed in the insulating liquid 2, and further, the frequency of the high-frequency vibration is not less than 20KHz, so that air bubbles in the resin can be eliminated.
In a preferred embodiment, in step (3), after the curing molding is finished, the position of the exposed circuit in the conductive circuit line 1 is cut, so that the exposed part is used for connecting an electronic component.
In a preferred embodiment, in step (3), during the curing process of the conductive circuit 1, the conductive circuit 1 is to be rotated, and further, the curing manner is photocuring, which can improve the uniformity of photocuring.
Example 1
The embodiment provides a preparation method of a 3D printed circuit board, which comprises the following steps:
(1) preparing a conductive circuit: manufacturing a conductive circuit by using a 3D printing technology; the specific process comprises the following steps: printing the copper circuit layer by using a selective laser melting molding technology;
(2) coating insulating liquid: immersing the conductive line in an insulating liquid; the specific process comprises the following steps: soaking the conductive circuit in insulating photosensitive liquid, repeatedly leaching the conductive circuit while vibrating at super-frequency and low amplitude, wherein the frequency of the high-frequency vibration is 21KHz, and the insulating liquid is epoxy resin;
(3) curing and forming: carrying out curing molding to enable the insulating liquid to be attached to the surface of the conducting circuit; the specific process comprises the following steps: and (3) carrying out photocuring on the soaked conductive circuit, ensuring that the conductive circuit rotates in the photocuring process, cutting the position of the exposed circuit in the conductive circuit, and connecting the exposed part with an electronic element to obtain the final 3D printed PCB.
Example 2
The embodiment provides a preparation method of a 3D printed circuit board, which comprises the following steps:
(1) preparing a conductive circuit: manufacturing a conductive circuit by using a 3D printing technology; the specific process comprises the following steps: printing silver lines layer by using a selective laser sintering molding technology;
(2) coating insulating liquid: immersing the conductive line in an insulating liquid; the specific process comprises the following steps: soaking the conducting circuit in insulating photosensitive liquid, repeatedly leaching the conducting circuit while vibrating at super-frequency and low amplitude, wherein the frequency of the high-frequency vibration is 22KHz, and the insulating liquid is polyether ether ketone;
(3) curing and forming: carrying out curing molding to enable the insulating liquid to be attached to the surface of the conducting circuit; the specific process comprises the following steps: and (3) carrying out photocuring on the soaked conductive circuit, ensuring that the conductive circuit rotates in the photocuring process, cutting the position of the exposed circuit in the conductive circuit, and connecting the exposed part with an electronic element to obtain the final 3D printed PCB.
Example 3
The embodiment provides a preparation method of a 3D printed circuit board, which comprises the following steps:
(1) preparing a conductive circuit: manufacturing a conductive circuit by using a 3D printing technology; the specific process comprises the following steps: printing gold lines layer by using a selective laser melting forming technology;
(2) coating insulating liquid: immersing the conductive line in an insulating liquid; the specific process comprises the following steps: soaking the conductive circuit in insulating photosensitive liquid, wherein the conductive circuit is repeatedly leached while vibrating at an ultra-frequency and low amplitude, the frequency of the high-frequency vibration is 20KHz, and the insulating liquid is polyimide;
(3) curing and forming: carrying out curing molding to enable the insulating liquid to be attached to the surface of the conducting circuit; the specific process comprises the following steps: and (3) carrying out photocuring on the soaked conductive circuit, ensuring that the conductive circuit rotates in the photocuring process, cutting the position of the exposed circuit in the conductive circuit, and connecting the exposed part with an electronic element to obtain the final 3D printed PCB.
The invention has the beneficial effects that: according to the preparation method, the conducting circuit can be printed by a single material in the manufacturing process by using a 3D printing technology, so that equipment and a process are simplified, and then the insulating layer is solidified on the surface of the conducting circuit by soaking the conducting circuit in insulating liquid, so that the defects of bending, poor connection, scorching and the like caused by material performance differences such as thermal expansion coefficients and the like when the insulating layer and the conducting layer are printed layer by layer can be effectively avoided.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. A preparation method of a 3D printed circuit board is characterized by comprising the following steps: the method comprises the following steps:
(1) preparing a conductive circuit: manufacturing a conductive circuit by using a 3D printing technology;
(2) coating insulating liquid: immersing the conductive line in an insulating liquid; repeatedly leaching the conducting circuit in the insulating liquid;
(3) curing and forming: and carrying out curing molding to enable the insulating liquid to be attached to the surface of the conductive circuit, wherein the conductive circuit is cured by light in the curing process, and the conductive circuit is required to rotate.
2. The method for preparing a 3D printed circuit board according to claim 1, wherein: in the step (1), the 3D printing technology is one of a selective laser melting molding technology, a selective laser sintering molding technology, a laser cladding molding technology, an electron beam melting technology, and a fused deposition molding technology.
3. The method for preparing a 3D printed circuit board according to claim 1, wherein: in the step (1), the conductive circuit is made of one of a metal conductive material and a nonmetal composite conductive material, and the metal conductive material is one of copper, silver and gold or a plurality of alloy conductive metals; the non-metal composite conductive material is one of conductive ceramic, conductive resin and conductive rubber.
4. The method for preparing a 3D printed circuit board according to claim 1, wherein: in the step (2), the insulating liquid is one of epoxy resin, polyether-ether-ketone, polyimide and polyether sulfone.
5. The method for preparing a 3D printed circuit board according to claim 1, wherein: in the step (2), the conducting circuit is in a high-frequency vibration state when being immersed in the insulating liquid, and the frequency of the high-frequency vibration is not less than 20 KHz.
6. The method for preparing a 3D printed circuit board according to claim 1, wherein: in the step (3), after the curing molding is finished, the position of the circuit exposed in the conductive circuit is cut.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910615328.7A CN110430666B (en) | 2019-07-09 | 2019-07-09 | Preparation method of 3D printed circuit board |
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| CN201910615328.7A CN110430666B (en) | 2019-07-09 | 2019-07-09 | Preparation method of 3D printed circuit board |
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| CN110430666B true CN110430666B (en) | 2020-12-11 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022006792A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | Preparation method for electroplated circuit board |
| WO2022006787A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | 3d printed circuit board manufacturing method |
| CN112074090B (en) * | 2020-09-08 | 2023-09-26 | 北京大华博科智能科技有限公司 | 3D printing preparation method of circuit board and prepared circuit board |
| CN112739029A (en) * | 2021-01-08 | 2021-04-30 | 深圳市溪猫网络科技有限公司 | Manufacturing method and control method for manufacturing 3D circuit board based on photocuring |
| CN113543503B (en) * | 2021-09-16 | 2021-12-10 | 新恒汇电子股份有限公司 | Preparation method of conductive ceramic coating carrier tape |
| CN114512781B (en) * | 2022-02-25 | 2023-03-10 | 南京理工大学 | Coaxial shielding cable based on 3D printing and manufacturing method thereof |
| CN114980579B (en) * | 2022-06-08 | 2024-02-06 | 芯体素(杭州)科技发展有限公司 | Curing method in preparation process of high-precision multilayer circuit board |
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| CN108751953A (en) * | 2018-06-11 | 2018-11-06 | 三峡大学 | A kind of ceramics and preparation method thereof with space three-dimensional conductive network structure |
| CN108774052A (en) * | 2018-06-11 | 2018-11-09 | 三峡大学 | A kind of graphite containing graphene/ceramics conducing composite material and preparation method thereof |
| CN109774132A (en) * | 2019-03-04 | 2019-05-21 | 东南大学 | A kind of manufacturing method of the circuit board based on photocuring 3D printing technique |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002026522A (en) * | 2000-07-07 | 2002-01-25 | Mitsubishi Electric Corp | Manufacturing method of multilayer printed-wiring board |
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2019
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5652561A (en) * | 1993-06-29 | 1997-07-29 | Yokogawa Electric Corporation | Laminating type molded coil |
| CN104672402A (en) * | 2013-11-28 | 2015-06-03 | 比亚迪股份有限公司 | Conducting photosensitive resin for 3D printing and preparation method thereof |
| CN107324835A (en) * | 2017-06-14 | 2017-11-07 | 三峡大学 | A kind of preparation method of the graphite skeleton of graphene-containing |
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