CN110430661B - Flexible circuit board capable of being used in flexible touch sensing field and manufacturing method thereof - Google Patents
Flexible circuit board capable of being used in flexible touch sensing field and manufacturing method thereof Download PDFInfo
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- CN110430661B CN110430661B CN201910683190.4A CN201910683190A CN110430661B CN 110430661 B CN110430661 B CN 110430661B CN 201910683190 A CN201910683190 A CN 201910683190A CN 110430661 B CN110430661 B CN 110430661B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides an FPC flexible circuit board and a manufacturing method thereof, comprising a flexible substrate, a signal sensing area and a signal output connecting part, wherein the signal sensing area and the signal output connecting part are arranged on the flexible substrate; the signal induction area comprises an induction area body, a signal input end and a signal output end; the signal output connecting part comprises a signal output connecting port and a conductive connecting wire, one end of the conductive connecting wire is connected with the signal output connecting port, and the other end of the conductive connecting wire is respectively contacted with a signal input end and a signal output end of the signal sensing area to form a conductive connecting point of Ag and Cu. The FPC flexible circuit board obtained by the invention has the advantages that the signal output connecting part can be connected with an external circuit with high reliability and can be used repeatedly, the signal induction area is resistant to bending, no trace is left after bending, and the signal acquisition is not influenced.
Description
Technical Field
The invention belongs to the technical field of FPC (flexible printed circuit) flexible circuits, and particularly relates to a flexible circuit board capable of being used in the field of flexible touch sensing and a manufacturing process thereof.
Background
The flexible circuit board (also called FPC flexible board) mainly comprises a flexible base material, a signal sensing area and a signal output connecting part. The flexible circuit board is usually realized by adopting a chemical etching process, the signal output connecting part is made of Cu, is resistant to plugging and unplugging, has high reliability in connection with an external sensor signal identification circuit, and can be repeatedly used; however, because the Cu-based layer of the FPC flexible printed circuit is 12um thin pure copper, the Cu-based layer cannot recover the flatness after bending, and a crease is easily left, which affects the accuracy of signal acquisition.
The film keyboard flexible circuit board is a flexible circuit board made of a PET film as a base material, has good flexibility, light weight, stable transmission performance, impact resistance and low price, and is commonly used at key positions of products. The film keyboard flexible circuit board is usually realized by adopting a process of printing Ag, the signal output connecting part is made of Ag + carbon and is not resistant to plugging and unplugging, the reliability of the connection between the signal output connecting part and an external circuit electrode is poor, and the film keyboard flexible circuit board cannot be repeatedly used for 3-5 times at most; however, the signal induction area of the flexible circuit board is formed by printing Ag coating, the Ag coating is formed by mixing conductive silver powder and resin, the flexible circuit board has good flexibility and bending resistance, no trace exists after bending, and signal acquisition is not affected.
At present, the FPC flexible board is mainly used for connecting parts of electronic products, such as a mobile phone cable, a liquid crystal module, and the like, and mainly aims at only connecting and transmitting signals. The film keyboard flexible circuit board is widely used for intelligent electronic instruments, medical instrument computer control, industrial numerical control equipment, household electrical appliance products and the like, and is mainly used for connection and induction touch control functions. However, in the field of flexible touch sensing applications, due to the high requirements for flexibility and connection output reliability, the requirements cannot be met by using an FPC (flexible printed circuit) or a film keyboard flexible circuit board.
Disclosure of Invention
The invention provides an FPC (flexible printed circuit) and a manufacturing method thereof, which solve the problems by adopting a process of printing Ag on the FPC, can realize high reliability of connection between a signal output connecting part and an external circuit, can be repeatedly used, has a bending-resistant signal induction area and no trace after bending, and does not influence signal acquisition.
The technical scheme of the invention is as follows:
the first scheme is as follows: a flexible circuit board comprises a flexible substrate, a signal sensing area and a signal output connecting part, wherein the signal sensing area and the signal output connecting part are arranged on the flexible substrate; the signal induction area comprises an induction area body, a signal input end and a signal output end; the induction area body is formed on the surface of the flexible base material in a printing mode, and the printing slurry comprises conductive silver powder and resin; the signal output connecting part is made of Cu and is formed on the surface of the flexible base material through a chemical etching process; the signal output connecting part comprises a signal output connecting port and a conductive connecting wire, one end of the conductive connecting wire is connected with the signal output connecting port, and the other end of the conductive connecting wire is respectively contacted with a signal input end and a signal output end of the signal induction area to form a conductive connecting point of Ag and Cu.
As a preferable scheme, the Ag paste used at the conductive connection point is an epoxy thermosetting conductive paste containing metallic silver fine particles, a binder, a solvent and an auxiliary agent; wherein the content of the metal silver particles is 80-90%; the adhesive is an epoxy resin adhesive, and the content of the adhesive is 10 percent; the solvent comprises at least one of butyl acetic anhydride acetate, diethylene glycol butyl ether acetate and diethylene glycol ethyl ether acetate; the auxiliary agent is isophorone.
Preferably, the solvent comprises butyl acetic anhydride with a content of 2%, diethylene glycol butyl ether acetate with a content of 1.5%, and diethylene glycol ethyl ether acetate with a content of 1.5%.
Preferably, the conductive connection point of Ag and Cu is formed by the following steps: before printing Ag on the reserved signal induction area, carrying out chemical surface treatment on the part of the conductive connecting wire connecting the signal input end and the signal output end so as to realize the subsequent reliable connection of Cu and Ag; the chemical surface treatment mode is as follows:
dip-coating 3-mercaptopropyltriethoxysilane and 3-aminopropyltriethoxysilane ethanol solution on a part to be treated; and (4) dip-coating for a period of time, taking out, cleaning with absolute ethyl alcohol, and drying.
As a preferable scheme, the 3-mercaptopropyltriethoxysilane is 1.5 wt%, the 3-aminopropyltriethoxysilane is 2 wt%, and the ethanol is 96.5 wt%.
As a preferred scheme, the signal sensing area and the signal output connection port are both arranged on the front surface of the flexible substrate; the other end of the conductive connecting line penetrates from the front surface to the back surface of the flexible base material, penetrates through the signal sensing area from the back surface to the front surface, and is respectively contacted with the signal input end and the signal output end of the signal sensing area to form a conductive connecting point of Ag and Cu.
As a preferred scheme, the signal sensing area and the signal output connection port are respectively arranged on the front side and the back side of the flexible substrate; and the other end of the conductive connecting line penetrates through the flexible substrate from the surface where the signal output connecting port is located, and then is respectively contacted with the signal input end and the signal output end of the signal sensing area on the other surface to form a conductive connecting point of Ag and Cu.
Scheme II: a method for manufacturing a flexible circuit board comprises the following steps:
manufacturing a signal output connecting part on a flexible base material by adopting a chemical etching process, wherein the material of the signal output connecting part is Cu;
etching away the Cu of the reserved signal sensing area, and only leaving the Cu at the signal input end and the signal output end as a subsequent conductive connection point of Ag and Cu;
printing Ag slurry in a signal induction area reserved for a signal in a printing mode, and forming a conductive connection point of Ag and Cu at a part where Cu is reserved; the Ag paste comprises conductive silver powder and resin;
the Ag paste is epoxy thermosetting conductive paste containing metal silver particles, an adhesive, a solvent and an auxiliary agent; wherein the content of the metal silver particles is 80-90%; the adhesive is an epoxy resin adhesive, and the content of the adhesive is 10 percent; the solvent comprises at least one of butyl acetic anhydride acetate, diethylene glycol butyl ether acetate and diethylene glycol ethyl ether acetate; the auxiliary agent is isophorone.
Preferably, the solvent comprises butyl acetic anhydride with a content of 2%, diethylene glycol butyl ether acetate with a content of 1.5%, and diethylene glycol ethyl ether acetate with a content of 1.5%.
The third scheme is as follows: a method for manufacturing a flexible circuit board comprises the following steps:
manufacturing a signal output connecting part on a flexible base material by adopting a chemical etching process, wherein the material of the signal output connecting part is Cu;
etching away the Cu of the reserved signal sensing area, and only leaving the Cu at the signal input end and the signal output end as a subsequent conductive connection point of Ag and Cu;
printing Ag slurry in a signal induction area reserved for a signal in a printing mode, and forming a conductive connection point of Ag and Cu at a part where Cu is reserved; the Ag paste comprises conductive silver powder and resin;
the Ag and Cu connection point is formed by the following method:
before printing Ag on the reserved signal induction area, carrying out chemical surface treatment on the part of the conductive connecting wire connecting the signal input end and the signal output end so as to realize the subsequent reliable connection of Cu and Ag; the chemical surface treatment mode is as follows:
dip-coating 3-mercaptopropyltriethoxysilane and 3-aminopropyltriethoxysilane ethanol solution on a part to be treated; and (4) dip-coating for a period of time, taking out, cleaning with absolute ethyl alcohol, and drying.
Preferably, the 3-mercaptopropyltriethoxysilane is 1.5 wt%, the 3-aminopropyltriethoxysilane is 2 wt%, and the ethanol is 96.5 wt%; the dip coating time was 30 min.
Has the advantages that:
the invention simultaneously solves the problems that the FPC is provided with creases and cannot be recovered after being bent and the connecting part of the film keyboard flexible circuit board is unreliable, integrates the advantages and the disadvantages of the FPC and the film keyboard flexible circuit board, and can carry out flexible bending and ensure the reliable and effective output of signals.
Drawings
FIG. 1 is a schematic external view of an FPC flexible wiring board;
FIG. 2 is a sectional view of an FPC flexible wiring board;
FIG. 3 is a flow chart of a process for manufacturing an FPC flexible circuit board;
the attached drawings are marked as follows: the flexible substrate 1, the signal induction area 2, the induction area body 21, the signal input end 22, the signal output end 23, the signal output connecting part 3, the signal output connecting port 31, the conductive connecting line 32, the back cover film 4 and the anti-oxidation gold-plating layer 5.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Referring to fig. 1 and 2, the embodiment discloses a flexible printed circuit board on FPC, which mainly includes a flexible substrate 1, a signal sensing area 2 and a signal output connection portion 3.
The flexible substrate 1, i.e., the PI base film, has characteristics such as high temperature resistance, flexibility, and connection insertion/removal reliability.
The signal induction area 2 is located on the front surface of the flexible substrate and mainly comprises an induction area body 21, a signal input end 22 and a signal output end 23, and the induction area body 21 is connected with the signal output connecting part 3 through the signal input end 22 and the signal output end 23.
The material of induction zone body 2 is mainly Ag, forms in the positive signal induction reservation region of flexible substrate 1 through the printing mode, and Ag coating mainly is formed by electrically conductive silver powder and resin mixture, possesses fine pliability, is resistant to buckle and can resume after buckling, does not leave the vestige, can use repeatedly.
The signal output connection portion 3 is made of Cu by a chemical etching process, and includes a signal output connection port 31 located on the front surface of the flexible substrate 1 and a conductive connection line 32 (also called conductive copper) penetrating the flexible substrate. One end of the conductive connecting line 32 is connected to the signal output connection port 31, and the other end is inserted from the front to the back of the flexible substrate 1, and then inserted from the back to the front of the signal sensing region 2, and is connected to the signal input end 22 and the signal output end 23 of the signal sensing region 2, so as to form a connection point of Ag and Cu. In other cases, the lead connecting wire can be directly connected with the signal input end and the signal output end of the signal sensing area on the front surface without penetrating through the flexible substrate; or, the signal output connection port and the signal sensing area are not on the same surface of the flexible substrate, and in short, the electrical connection can be realized through the conductive connection line.
The signal induction area of the FPC flexible board is realized by adopting a printing Ag process, can be bent, can be restored without traces, and does not influence signal acquisition; the signal output connecting part is made of Cu, is resistant to pulling and inserting, can be used repeatedly, and is good in connection reliability.
The FPC flexible board is realized by adopting a process of printing Ag on Cu, and mainly comprises the following steps:
firstly, a chemical etching process is adopted to manufacture an FPC flexible board, wherein the signal output connecting part is made of etched Cu, and the FPC flexible board has good connectivity and good plugging reliability of a signal output end connecting circuit; then completely etching away the Cu of the reserved signal sensing area, and only leaving the Cu at the positions of the signal input end and the signal output end as the connection point of the subsequent Ag and the Cu; and finally, printing Ag in the signal induction reserved area in a printing mode, and realizing reliable connection of the Ag and the Cu at the conductive connection point where the Cu is reserved.
It should be noted that, in the above process, the problem of reliability of the connection between the Cu conductive connection line etched by the FPC and the Ag conductive paste printed at the signal input end and the signal output end in the signal sensing area is a great technical difficulty at present, and in order to solve the problem, the present invention provides two solutions, including:
1) directly printing epoxy thermosetting silver paste in the signal induction reserved area;
2) and (3) carrying out chemical surface treatment on the part of the conductive connecting line exposed out of the signal sensing area, and then directly printing conventional conductive silver paste.
With reference to fig. 2 and 3, an embodiment of the present invention further discloses a method for manufacturing an FPC flexible board, which specifically includes:
s1, performing optical positioning drilling on the PI flexible base material plated with copper on the double sides, and then performing chemical copper plating and black hole (namely black hole direct electroplating) to ensure conductivity of the two sides;
s2, carrying out film pressing exposure treatment on the PI flexible base material with two conductive surfaces, and fully exposing the part needing FPC connection to obtain a semi-finished product capable of being developed and chemically treated;
s3, developing and chemically etching the exposed PI flexible substrate, and finally removing the film layer to obtain an electrode circuit pattern with two conductive surfaces;
s4, performing high-temperature pressing on the back surface of the FPC flexible board by the processed drilling and punching covering film to form a covering layer on the back surface of the FPC flexible board;
s5, punching and positioning the product;
s6, conducting conductivity detection is conducted after trepanning positioning;
s7, carrying out anti-oxidation gold plating treatment on the signal output connection port on the front surface of the qualified semi-finished product after passing the detection;
so far, basically, the manufacture of the signal output connection part of the FPC is completed, and the above process is also a conventional technology in the art, and the following is our key process:
and preparing an induction zone body in a signal induction reserved zone in a printing mode, and realizing the reliable connection of Ag and Cu at a signal input end and a signal output end. The key process specifically comprises the following two implementation schemes:
the first scheme is as follows: and special Ag slurry is directly printed in the signal induction reserved area, so that the reliable connection of Ag and Cu is realized.
The special Ag paste is epoxy thermosetting conductive paste, which is a viscous paste of a mechanical mixture consisting of high-purity metal silver particles, an adhesive, a solvent and an auxiliary agent. Wherein, the content of the high-purity metal silver particles is 80-90%, the epoxy resin type adhesive is 10%, 2% of BCA (butyl acetic anhydride) solvent, 1.5% of diethylene glycol butyl ether acetate solvent, 1.5% of diethylene glycol ethyl ether acetate solvent, a small amount of auxiliary agent isophorone and the like are added. The slurry is mixed and stirred at high speed for 1 hour.
Scheme II: when Ag is printed in a signal induction reserved area of the FPC flexible board, chemical surface treatment is carried out on the part, exposed out of the signal induction area, of the conductive connecting wire in advance, so that reliable connection between Cu and the Ag printing area is achieved, and the induction signal of the bending-resistant Ag printing area is input to the signal output connecting part. Here, since the oxidation resistance treatment is performed in advance, the etched copper is not affected when the chemical surface treatment is performed.
Wherein, the chemical surface treatment mode is as follows: dip-coating the semi-finished product to be treated with an ethanol solution of 3-mercaptopropyltriethoxysilane and 3-aminopropyltriethoxysilane, wherein 1.5 wt% of 3-mercaptopropyltriethoxysilane, 2 wt% of 3-aminopropyltriethoxysilane and 85-95 wt% of ethanol are soaked for 30min and then taken out, and then the semi-finished product is cleaned with absolute ethanol and dried.
Finally, it should be noted that while the above describes exemplifying embodiments of the invention with reference to the accompanying drawings, the invention is not limited to the embodiments and applications described above, which are intended to be illustrative and instructive only, and not limiting. Those skilled in the art, having the benefit of this disclosure, may effect numerous modifications thereto without departing from the scope of the invention as defined by the appended claims.
Claims (12)
1. A flexible circuit board used in the flexible touch sensing field is characterized by comprising a flexible substrate, a signal sensing area and a signal output connecting part, wherein the signal sensing area and the signal output connecting part are arranged on the flexible substrate; the signal induction area comprises an induction area body, a signal input end and a signal output end; the signal induction area body is formed on the surface of the flexible base material in a printing mode, and the printing slurry comprises conductive silver powder and resin; the signal output connecting part is formed on the surface of the flexible base material through a chemical etching process and is made of Cu; the signal output connecting part comprises a signal output connecting port and a conductive connecting wire, one end of the conductive connecting wire is connected with the signal output connecting port, and the other end of the conductive connecting wire is respectively contacted with a signal input end and a signal output end of the signal induction area to form a conductive connecting point of Ag and Cu.
2. The flexible wiring board of claim 1, wherein the Ag paste used at the conductive connection point of Ag and Cu is an epoxy thermosetting conductive paste containing metallic silver fine particles, a binder, a solvent and an auxiliary agent; wherein the content of the metal silver particles is 80-90%; the adhesive is an epoxy resin adhesive, and the content of the adhesive is 10 percent; the solvent comprises at least one of butyl acetic anhydride acetate, diethylene glycol butyl ether acetate and diethylene glycol ethyl ether acetate; the auxiliary agent is isophorone.
3. The flexible wiring board of claim 2, wherein the solvent comprises 2% butyl anhydro acetate, 1.5% diethylene glycol butyl ether acetate, and 1.5% diethylene glycol ethyl ether acetate.
4. The flexible wiring board of claim 1, wherein said conductive connection points of Ag and Cu are formed by: before printing Ag on the reserved signal induction area, carrying out chemical surface treatment on the part of the conductive connecting wire connecting the signal input end and the signal output end so as to realize the subsequent reliable connection of Cu and Ag; the chemical surface treatment mode is as follows:
dip-coating 3-mercaptopropyltriethoxysilane and 3-aminopropyltriethoxysilane ethanol solution on a part to be treated; and (4) dip-coating for a period of time, taking out, cleaning with absolute ethyl alcohol, and drying.
5. The flexible wiring board of claim 4, wherein the 3-mercaptopropyltriethoxysilane is 1.5% wt, the 3-aminopropyltriethoxysilane is 2% wt, and the ethanol is 96.5% wt.
6. The flexible circuit board of any one of claims 1 to 5, wherein the signal sensing area and the signal output connection port are both disposed on the front surface of the flexible substrate; the other end of the conductive connecting line penetrates from the front surface to the back surface of the flexible base material, penetrates through the signal sensing area from the back surface to the front surface, and is respectively contacted with the signal input end and the signal output end of the signal sensing area to form a conductive connecting point of Ag and Cu.
7. The flexible wiring board according to any one of claims 1 to 5, wherein the signal sensing area and the signal output connection port are disposed on both the front and back sides of the flexible substrate, respectively; and the other end of the conductive connecting line penetrates through the flexible substrate from the surface where the signal output connecting port is located, and then is respectively contacted with the signal input end and the signal output end of the signal sensing area on the other surface to form a conductive connecting point of Ag and Cu.
8. A method for manufacturing a flexible circuit board is characterized by comprising the following steps:
manufacturing a signal output connecting part on a flexible base material by adopting a chemical etching process, wherein the material of the signal output connecting part is Cu;
etching away the Cu of the reserved signal sensing area, and only leaving the Cu at the signal input end and the signal output end as a subsequent conductive connection point of Ag and Cu;
printing Ag slurry in a signal induction area reserved for a signal in a printing mode, and forming a conductive connection point of Ag and Cu at a part where Cu is reserved; the Ag paste comprises conductive silver powder and resin;
the Ag paste used at the conductive connection point of Ag and Cu is epoxy thermosetting conductive paste containing metal silver particles, a binder, a solvent and an auxiliary agent; wherein the content of the metal silver particles is 80-90%; the adhesive is an epoxy resin adhesive, and the content of the adhesive is 10 percent; the solvent comprises at least one of butyl acetic anhydride acetate, diethylene glycol butyl ether acetate and diethylene glycol ethyl ether acetate; the auxiliary agent is isophorone.
9. The method of manufacturing a flexible printed circuit board according to claim 8, wherein the solvent comprises 2% butyl acetic anhydride, 1.5% diethylene glycol butyl ether acetate, and 1.5% diethylene glycol ethyl ether acetate.
10. A method for manufacturing a flexible circuit board is characterized by comprising the following steps:
manufacturing a signal output connecting part on a flexible base material by adopting a chemical etching process, wherein the material of the signal output connecting part is Cu;
etching away the Cu of the reserved signal sensing area, and only leaving the Cu at the signal input end and the signal output end as a subsequent conductive connection point of Ag and Cu;
printing Ag slurry in a signal induction area reserved for a signal in a printing mode, and forming a conductive connection point of Ag and Cu at a part where Cu is reserved; the Ag paste comprises conductive silver powder and resin;
the Ag and Cu connection point is formed by the following method:
before printing Ag on the reserved signal induction area, carrying out chemical surface treatment on the part of the conductive connecting wire connecting the signal input end and the signal output end so as to realize the subsequent reliable connection of Cu and Ag; the chemical surface treatment mode is as follows:
dip-coating 3-mercaptopropyltriethoxysilane and 3-aminopropyltriethoxysilane ethanol solution on a part to be treated; and (4) dip-coating for a period of time, taking out, cleaning with absolute ethyl alcohol, and drying.
11. The method of manufacturing a flexible wiring board according to claim 10, wherein the 3-mercaptopropyltriethoxysilane is 1.5% wt, the 3-aminopropyltriethoxysilane is 2% wt, and the ethanol is 96.5% wt.
12. The method of manufacturing a flexible wiring board according to claim 10, wherein the dip coating time is 30 min.
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| CN201910683190.4A CN110430661B (en) | 2019-07-26 | 2019-07-26 | Flexible circuit board capable of being used in flexible touch sensing field and manufacturing method thereof |
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| CN110430661B true CN110430661B (en) | 2020-10-30 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201846329U (en) * | 2010-09-10 | 2011-05-25 | 江苏惠通集团有限责任公司 | Electrically conductive ink approach induction press key |
| CN105358070A (en) * | 2013-02-08 | 2016-02-24 | 阿库图森医疗有限公司 | Expandable catheter assembly with flexible printed circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1249064A (en) * | 1987-07-06 | 1989-01-17 | Reginald B.P. Bennett | Process for application of overlay conductors to surface of printed circuit board assemblies |
| CN2730078Y (en) * | 2004-07-22 | 2005-09-28 | 嘉联益科技股份有限公司 | Compound multi-layer flexible circuit board structure |
| CN105101700B (en) * | 2015-06-12 | 2020-02-21 | 惠州Tcl移动通信有限公司 | Mobile terminal and flexible circuit board |
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2019
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201846329U (en) * | 2010-09-10 | 2011-05-25 | 江苏惠通集团有限责任公司 | Electrically conductive ink approach induction press key |
| CN105358070A (en) * | 2013-02-08 | 2016-02-24 | 阿库图森医疗有限公司 | Expandable catheter assembly with flexible printed circuit board |
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