CN110429168A - 具有磷光体膜的封装发光二极管以及相关的***和方法 - Google Patents
具有磷光体膜的封装发光二极管以及相关的***和方法 Download PDFInfo
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Abstract
本申请涉及具有磷光体膜的封装发光二极管以及相关的***和方法。本发明公开具有磷光体膜的封装发光二极管LED以及相关的***和方法。本发明的特定实施例的***包括具有支撑部件接合位点的支撑部件、由所述支撑部件携载且具有LED接合位点的LED,和在所述支撑部件接合位点与所述LED接合位点之间电连接的线接合。所述***可进一步包括由所述LED和所述支撑部件携载的磷光体膜,所述磷光体膜经定位以从所述LED接收第一波长的光并发射与所述第一波长不同的第二波长的光。所述磷光体膜可经定位成在所述LED接合位点处与所述线接合直接接触。
Description
本申请是申请日为2011年6月21日,申请号为201180030696.7,发明名称为“具有磷光体膜的封装发光二极管以及相关的***和方法”的申请的分案申请。
技术领域
概括来说,本发明涉及具有磷光体膜的封装发光二极管(LED)以及相关的***和方法。
背景技术
由于LED有效产生高强度、高质量的光,因此出于许多目的对所述装置的需求不断增加。例如,移动电话、个人数字助理、数字照相机、MP3播放器和其它便携式装置使用LED或其它固态发光装置产生白光用于背景照明。LED还可用于除电子装置以外的应用中,例如用于天花板面板、桌灯、冰箱灯、台灯、路灯、自动前照灯和需要或期望发光的其它情况中。
与生产LED有关的一个挑战是控制生产成本以使LED的定价与其它更常规的发光源相比具有竞争力。由于LED的成本大部分归因于制备LED的方法,因此制造商已尝试降低处理成本。处理成本的一个方面涉及磷光体在封装LED***中的使用。具体来说,典型的LED发射蓝光,而许多应用需要或至少受益于较柔和的有色光或白光。因此,制造商用吸收一部分所发射蓝光并重新发射黄光形式的光的磷光体涂布所述LED,从而产生白色或至少大约白色的复合光发射。
用于在LED的发射光途径中提供磷光体区域的现有方法可显著增加LED的成本。一种所述方法包括将LED置于支撑衬底的腔或凹槽中,且随后用磷光体填充所述腔。另一方法包括将LED置于平坦衬底上且随后在LED周围构建坝状物并用磷光体填充内部区域。又一方法包括将磷光体层直接沉积于LED晶粒上且随后去除磷光体的部分以暴露下伏接合垫,由此与晶粒电连接。尽管上述方法已获得产生适宜光发射特性的LED,但其都会增加LED的成本。因此,工业中仍需要改良的低成本处理技术。
发明内容
本申请涉及一种发光二极管LED***,其包含:
支撑部件,其具有支撑部件接合位点;
LED,其由所述支撑部件携载且具有LED接合位点;
线接合,其在所述支撑部件接合位点与所述LED位点之间电连接;和
磷光体膜,其由所述LED和所述支撑部件携载,所述磷光体膜经定位以从所述LED接收第一波长的光并发射与所述第一波长不同的第二波长的光,所述磷光体膜经定位成在所述LED接合位点处与所述线接合直接接触。
本申请还涉及一种制造LED***的方法,其包含:
将LED安装到支撑部件;
用线接合将所述LED电连接到所述支撑部件;
使预形成的磷光体膜在所述LED与所述支撑部件之间的所述线接合的至少一部分上贴合所述线接合;和
将所述磷光体膜附接到所述LED和所述支撑部件。
附图说明
图1是根据本发明实施例配置的LED***中组件的局部示意性剖视侧面图。
图2是图1中所示各组件的局部示意性剖视侧面图,其结合形成本发明实施例的封装。
图3A是绘示根据本发明实施例形成磷光体膜的方法的流程图。
图3B是绘示根据本发明的另一实施例形成多层磷光体膜的方法的流程图。
图4是根据本发明实施例具有多层磷光体膜的封装的局部示意性分解剖视侧面图。
图5是根据本发明的其它实施例形成LED封装的多种方法的局部示意性图解。
具体实施方式
本发明的方面概括来说涉及具有磷光体膜的封装发光二极管(LED)以及相关的***和方法。下文参照特定LED阐述本发明的若干实施例的具体细节以便透彻了解这些实施例。在其它实施例中,本发明的方面可与具有其它配置的LED结合使用。出于清晰起见,以下说明中并未阐释用以阐述众所周知且通常与LED有关、但可不必要地淡化本发明的一些显著方面的结构或方法的若干细节。此外,尽管以下揭示内容阐释本发明不同方面的若干实施例,但若干其它实施例可具有与此部分中所述的那些不同的配置、不同的组件和/或不同的方法或步骤。因此,本发明可具有其它实施例,所述实施例具有额外要素和/或无下文参照图1到5阐述的若干要素。
图1是LED***100的局部示意性剖视侧面图,所述***包括经组合以形成本发明实施例的封装101的组件。这些组件可包括携载LED 130的支撑部件140和任选地由载体120支撑的磷光体膜110。磷光体膜110具有贴合性,且在利用线接合104将LED 130后连接到支撑部件140之后附接到LED 130和支撑部件140。下文阐述此布置和相关方法的更多细节。
在图1中所示的特定实施例中,支撑部件140是由陶瓷或其它适宜的衬底材料形成,且具有第一(例如,面朝上)表面143a和第二(例如,面朝下)表面143b。每一支撑部件140进一步包括为LED 130和/或从其提供电连通的第一和第二支撑部件接合位点141a、141b(例如接合垫)。因此,支撑部件接合位点141a、141b中的每一者通过相应通孔142或另一导电结构连接到相应封装接合位点102a、102b。第一和第二封装接合位点102a、102b可从封装101的外侧接近,以有利于在封装101与外部装置(图1中未显示)之间进行物理和电连接。
支撑部件140在(例如)第一支撑部件表面143a处携载LED 130。LED 130可包括第一LED接合位点131a和第二LED接合位点131b。第二LED接合位点131b可面朝第二支撑部件接合位点141b且与其直接电连接。在另一实施例中,第二LED接合位点131b可背离第二支撑部件接合位点141b,且可利用线接合连接到第二支撑部件接合位点141b。在任一实施例中,第一LED接合位点131a可利用线接合104电连接到第一支撑部件接合位点141a。在图1中所示的实施例的特定方面中,封装101还可包括静电放电(ESD)晶粒103,其为LED 130提供保护,而且利用线接合104电连接到第一支撑部件接合位点141a,并以适宜背侧表面对表面连接电连接到第二支撑部件接合位点141b。在其它实施例中,可省略ESD晶粒103。
在图1中所示的实施例中,LED 130具有面朝上的有效表面132,透过其发射光(例如蓝光)。磷光体膜110定位在有效表面132上以改变经导向远离封装101的光的特性。因此,磷光体膜110可包括具有磷光体成份112分布的基质材料111。磷光体成份112从LED 130接收光并发射不同波长的光,例如以产生白色而非蓝色的复合发射光。
在特定实施例中,磷光体膜110是由自支撑性、保持形状但易弯的或可贴合的材料形成。举例来说,磷光体膜110的基质材料111可包括部分固化(例如,b阶段)的环氧树脂材料,其在呈膜形式时具有足够的强度以供处理,但其在加热时可贴合LED和相关特征。在加工期间,如箭头C所示,使磷光体膜110与LED 130和支撑部件140接触,并加热以形成下文参照图2阐述的组装单元。基质材料111可因加热而软化,从而使磷光体膜110贴合LED 130和连接LED 130与支撑部件140的线接合104。在特定实施例中,基质材料111在高温下具有足够顺从性以在线接合104周围贴合、流动或以其它方式变形,而不会移置、扭曲、干扰或以其它方式改变线接合104的位置和/或形状。因此,可在添加磷光体膜110之前将LED 130用线接合到支撑部件140,磷光体膜110不会干扰线接合104的完整性。
基质材料111还被选择为对由LED 130和膜110发射的辐射至少部分(且在特定实施例中,完全)透明。举例来说,在LED发射蓝光且磷光体成份112发射黄光的情况下,基质材料111被选择为对两种波长大体上透明。在某些实施例中,膜110可包括多个磷光体成份112,选择不同磷光体成份以发射相应不同波长的光。在其它实施例中,封装101可包括多个膜层110,其各自具有磷光体成份112以发射相应不同波长的光。在这些实施例中的任一者中,基质材料111可被选择为对一或多种(例如,所有)发射波长至少部分(且在特定实施例中,完全)透明。
在特定实施例中,磷光体膜110作为独立式单元强到足以耐受常规微电子装置处理技术。在其它实施例中,磷光体膜110可附接到载体120,其可为刚性或半刚性的,以便在制造过程期间为磷光体膜提供额外支撑。因此,磷光体膜110可包括面朝LED 130和支撑部件140的第一表面113a和与第一表面113a相反面对且附接到载体120的第二表面113b。载体120通常比磷光体膜110更硬和/或刚性更强以提供额外支撑。在特定实施例中,载体120可包括大体上平坦、大体上刚性且大体上透明的材料,其为磷光体膜110提供支撑,而不会影响远离LED 130的光的透光率。例如,载体120可包括对辐射(例如,光,且在特定实施例中,可见光)透明的平坦玻璃层。在其它实施例中,载体120可包括影响由LED 130发射的光的特征。例如,载体120可包括重定向从LED 130发射的光的透镜部分121。在另一实施例中,载体120可包括除磷光体膜110中存在的那些磷光体成份以外的其它磷光体成份112。如果载体120包括磷光体成份,那么磷光体成份在载体120中的浓度通常小于磷光体成份112在磷光体膜110中的浓度。载体120可固定附接到膜110,且可形成封装101的永久部分。在其它实施例中,在膜110附接到LED 130和支撑部件140之后,载体可从膜110释放。
图2绘示磷光体膜110与LED 130和衬底140接触之后的封装101。在制造过程期间,对封装101的元件施加热105,从而使得磷光体膜110软化并贴合线接合104、LED 130、ESD晶粒103(如果存在)和/或可从衬底140的第一表面143a凸起或从其凹陷的其它特征。因此,磷光体膜110可在第一LED接合位点131a、第一支撑部件接合位点141a和/或两个接合位点131a、141a之间的线接合104的位置处完全包围、囊封和/或以其它方式容纳线接合104。随后可以图2中所示的形状和位置完全固化整个封装101以硬化磷光体膜110,其中磷光体膜110粘附到LED 130和衬底140。
图3A是绘示根据本发明实施例形成磷光体膜110的方法300a的示意性方块图。在本实施例的一个方面中,将基质材料111(例如,软化、液体或以其它方式可流动或可延展的环氧树脂或其它材料)与磷光体成份112合并形成混合物114。磷光体成份112可均匀分布于基质材料111中。其后,可根据多种适宜技术中的任一者使混合物114成形或以其它方式进行处理以产生磷光体膜110。所述技术可包括旋涂方法、橡皮辊方法或产生具有均匀厚度的磷光体膜110的另一方法。随后可在将磷光体膜110施加到LED之前对其进行部分固化,如上文参照图1和2所述。
图3B绘示根据多个其它实施例形成磷光体膜310的另一方法300b。在这些实施例中,磷光体成份不需均匀分布于基质材料中。例如,所述方法可包括使用上述形成膜的方法中的任一者从基质材料111形成基质膜层115a。因此,基质材料111可具有上述粘着和易弯特性。随后可使用磷光体沉积方法(显示于方块116中)将磷光体成份直接安置在基质膜层115a上。在替代实施例中,磷光体成份自身也可使用上述技术中的任一者形成单独的磷光体膜层115b。在本实施例中,随后可将磷光体膜层115b附接到基质膜层115a。在上述实施例的任一者中,结果是产生具有磷光体成份的不均匀分布的多层磷光体膜310。
图4是具有(例如)使用上述技术中的任一者参照图3B形成的多层磷光体膜310的封装401的局部示意性立面分解图。多层磷光体膜310可包括由基质材料形成的第一层115a和由磷光体成份112形成的第二层115b。如上文所论述,磷光体成份112和/或磷光体成份112的套组可经选择以发射一个或一个以上波长的辐射。磷光体成份112集中在与LED 130直接毗邻的区域中。如上文参照图1所论述,多层磷光体膜310可为自支撑或非自支撑的,且在任一实施例中,可包括载体420以提供额外支撑。在图4中所示的实施例中,载体420不包括透镜部分。在其它实施例中,载体420可包括(例如)与上文参照图1阐述的透镜部分121类似的透镜部分。
图5是根据本发明的若干实施例对LED施加磷光体膜的不同技术的局部示意性图解。在特定实施例中,磷光体膜510可直接在载体晶片520上形成,且可经定尺寸以覆盖多种LED。在本实施例的一个方面中,可一起切割载体晶片520和膜510以形成膜元件516。随后使用常规拾取并放置(pick-and-place)方法将个别膜元件516个别地放置于相应衬底140(其中的一者显示于图5中)上。在另一实施例中,晶片载体520和膜510可在附接到相应LED之后进行切割。例如,晶片载体520和相关膜510可直接附接到LED晶片133,其具有在LED晶片133自身中已用线接合到预图案化或以其它方式形成的电线的LED。在膜510和载体晶片520已附接到LED晶片133之后,可切割或单切整个组合件以产生(例如)配置与图2中所示类似的个别封装。
在另一实施例中,可对经单切LED施加不同磷光体膜(例如,具有不同浓度、分布和/或类型的磷光体成份的磷光体膜),以引起由LED产生的输出(例如,发射光的颜色)的差别。例如,个别LED由于相关制造过程的变化而通常具有稍微不同的发射光特性,且因此“分频率仓(binned)”以使具有类似光特性的LED组合在一起。不同频率仓的LED可接收具有不同磷光体特性的磷光体膜以差异地调节所得封装的光输出。使用这种技术可封装不同频率仓的LED以便产生相同或几乎相同的光输出,和/或可封装频率仓内的LED以贴合频率仓内的其它LED。这种技术的优点在于,其可减少或消除用于归类LED的频率仓的数量和/或改良频率仓内的LED的均匀性。
上文参照图1到5阐述的至少一些实施例的一个特征在于其可包括预形成的含磷光体的膜,其是在LED已用线接合到适宜支撑结构之后置于相应LED上(在晶片水平或个别晶粒水平上)。由于磷光体成份由膜携载,因此其不需要以液态或其它形式直接沉积在LED上。因此,支撑部件不需要包括腔、凹槽、坝状物或其它围阻特征来容纳和/或限制磷光体成份。另外,预期在至少一些实施例中,磷光体成份一旦被施加到LED其分布会比利用常规技术获得的分布均匀。
上述工艺的实施例的另一个优点在于,由于膜具有顺从性,因此其可贴合下伏线接合的形状,而无需进一步加工。具体来说,膜的贴合性质可消除在膜中切割沟槽或凹槽来容纳线接合的需要。因此,所述工艺所需的步骤可比一些常规技术中所用的步骤少。所述工艺的实施例还可消除如下需要:在将磷光体成份安置在LED上之前铺置单独层来覆盖线接合,这是其它常规技术中所用的工艺。这一特征使得膜110中的磷光体直接毗邻LED 130、例如直接毗邻有效表面132定位。此外,可在将膜与LED啮合之前向膜中添加磷光体成份。这一特征使得膜可与LED晶粒完全独立、例如与制造和加工晶粒平行地制造。这一布置可减少封装晶粒所需的流程时间且可允许晶粒和膜独立形成或贮存,由此降低在总制造工艺中形成瓶颈的可能性。上述特征单独或组合起来可减少与封装晶粒有关的时间和花费,且因此可降低所得晶粒封装的成本。
依据前文所述,应了解,本文已出于图解说明的目的阐述本发明的具体实施例,但可在不背离本发明的情况下作出各种修改。举例来说,基质材料可包括其它组成(例如,除环氧树脂以外),其也为磷光体成份提供支撑且具有粘着特性以有利于接合到LED和/或支撑部件。所述材料可包括(但不限于)固态、部分固化的热固性粘着材料,其中一个实例是b阶段环氧树脂。LED可具有与图中所示不同的形状、尺寸和/或其它特性。在特定实施例的背景下阐述的本发明的某些方面在其它实施例中可组合或去除。举例来说,图1中所示的载体120在一些实施例中可去除,且在其它实施例中可与图4中所示的磷光体膜组合。此外,尽管已在某些实施例的背景下阐述与某些实施例相关的优点,但其它实施例也可呈现所述优点。并不是所有实施例都需要一定呈现所述优点才能处于本发明范畴内。因此,本发明和相关技术可涵盖本文中未明确显示或阐述的其它实施例。
Claims (18)
1.一种制造LED***的方法,所述方法包括:
将LED安装到支撑部件;
用线接合将所述LED电连接到所述支撑部件;
提供自支撑的磷光体膜,所述磷光体膜具有不均匀分布的磷光体成份;
使所述磷光体膜贴合所述线接合,使得所述磷光体膜接触所述LED和所述支撑部件之间的至少一部分线接合;和
将所述磷光体膜附接到所述LED和所述支撑部件。
2.根据权利要求1所述的方法,其中贴合包括在所述磷光体膜至少部分固化时加热所述磷光体膜和用所述磷光体膜包围所述线接合的部分,且其中附接所述磷光体膜包括进一步固化所述磷光体膜。
3.根据权利要求1所述的方法,其中所述LED是形成LED晶片的至少一部分的多个LED晶粒中的一个,且其中将所述磷光体膜附接到所述LED包括将所述磷光体膜附接到所述晶片的多个LED晶粒,随后从所述晶片切割所述LED晶粒。
4.根据权利要求1所述的方法,其中所述磷光体膜包括:包含基质材料的第一层和包含磷光体成分的第二层,其中所述第二层经安置成在所述磷光体膜贴合所述线接合时与所述第一层表面对表面接触。
5.根据权利要求1所述的方法,其中贴合包括在所述LED已从LED晶片单切之后使所述磷光体膜贴合。
6.根据权利要求1所述的方法,其中贴合包括在所述LED从LED晶片单切之前使所述磷光体膜贴合。
7.根据权利要求1所述的方法,其中所述磷光体膜附接到载体,所述载体的硬度比所述磷光体膜的硬度更大且其组成与所述磷光体膜的组成不同。
8.根据权利要求7所述的方法,其中所述载体包括经定位以重定向由所述LED发射的光的透镜部分。
9.根据权利要求1所述的方法,其进一步包含通过以下步骤来形成所述磷光体膜:
混合磷光体成份与基质材料;和
至少部分地固化所述基质材料。
10.根据权利要求1所述的方法,其中所述LED是具有第一输出特性的第一LED,所述支撑部件是第一支撑部件,所述线接合是第一线接合且所述磷光体膜是具有第一磷光体特性的第一磷光体膜,且其中所述方法进一步包含:
将第二LED安装到第二支撑部件,所述第二LED具有与所述第一输出特性不同的第二输出特性;
用第二线接合将所述第二LED电子连接到所述第二支撑部件;
使第二保持形状且自支撑的磷光体膜在所述第二LED与所述第二支撑部件之间的所述第二线接合的至少一部分上贴合所述第二线接合,所述第二磷光体膜具有与所述第一磷光体特性不同的第二磷光体特性,以至少部分抵消所述第一输出特性与所述第二输出特性之间的差异;和
将所述第二磷光体膜附接到所述第二LED和所述第二支撑部件。
11.根据权利要求10所述的方法,其中所述第一输出特性是第一颜色特性且其中所述第二输出特性是与所述第一颜色特性不同的第二颜色特性。
12.根据权利要求11所述的方法,其中所述第一颜色特性是第一波长且所述第二颜色特性是与所述第一波长不同的第二波长。
13.根据权利要求1所述的方法,其中所述磷光体膜第一侧面和与所述第一侧面相对的第二侧面,且其中将所述磷光体膜附接到所述支撑部件包括使所述磷光体膜的所述第一侧面附接到所述支撑部件,所述方法还包括:在将所述磷光体膜附接到支撑衬底之前将载体附接到所述磷光体膜的所述第二侧面。
14.根据权利要求1所述的方法,其中所述LED经由所述线接合直接地电连接到所述支撑部件。
15.一种用于制造半导体装置的方法,所述方法包括:
提供支撑部件和安置在所述支撑部件上的LED;
提供自支撑磷光体膜,所述磷光体膜具有不均匀分布的磷光体成份;
经由线接合将所述LED电耦合到所述支撑部件;和
将所述磷光体膜安置在所述LED、所述支撑部件和所述线接合的至少一部分上,其中经安置的磷光体膜与所述线接合接触。
16.根据权利要求15所述的方法,其中所述磷光体膜包含磷光体成分。
17.根据权利要求15所述的方法,其中提供所述支撑部件和LED包括:提供所述支撑部件、LED和安置在所述支撑部件上的多个其他LED,其中所述磷光体膜在所述支撑部件表面上连续地延伸。
18.根据权利要求15所述的方法,其中安置包括:使所述磷光体膜贴合在所述线接合上,且其中所述磷光体膜包括:包含基质材料的第一层和包含磷光体成分的第二层,其中所述第二层经安置成在所述磷光体膜贴合所述线接合时与所述第一层表面对表面接触。
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CN2011800306967A CN102947958A (zh) | 2010-06-21 | 2011-06-21 | 具有磷光体膜的封装发光二极管以及相关的***和方法 |
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US11901494B2 (en) | 2024-02-13 |
TW201205891A (en) | 2012-02-01 |
US20210359173A1 (en) | 2021-11-18 |
WO2011163170A3 (en) | 2012-04-19 |
KR20130036754A (ko) | 2013-04-12 |
CN102947958A (zh) | 2013-02-27 |
SG10201911967SA (en) | 2020-02-27 |
TWI458134B (zh) | 2014-10-21 |
WO2011163170A2 (en) | 2011-12-29 |
KR101627021B1 (ko) | 2016-06-02 |
CN110429168B (zh) | 2022-11-04 |
SG10201507806XA (en) | 2015-10-29 |
US20170194537A1 (en) | 2017-07-06 |
SG186164A1 (en) | 2013-01-30 |
US20240186465A1 (en) | 2024-06-06 |
US11081625B2 (en) | 2021-08-03 |
US20110309393A1 (en) | 2011-12-22 |
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