CN110421968B - Printing device for solar cell electrode paste and electrode preparation system - Google Patents
Printing device for solar cell electrode paste and electrode preparation system Download PDFInfo
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- CN110421968B CN110421968B CN201910736394.XA CN201910736394A CN110421968B CN 110421968 B CN110421968 B CN 110421968B CN 201910736394 A CN201910736394 A CN 201910736394A CN 110421968 B CN110421968 B CN 110421968B
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- 238000007639 printing Methods 0.000 title claims abstract description 42
- 239000002003 electrode paste Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 116
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 78
- 239000010703 silicon Substances 0.000 claims abstract description 78
- 238000003860 storage Methods 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 74
- 238000012545 processing Methods 0.000 claims description 30
- 239000011267 electrode slurry Substances 0.000 claims description 28
- 238000005245 sintering Methods 0.000 claims description 18
- 238000010329 laser etching Methods 0.000 claims description 17
- 238000012546 transfer Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims 8
- 238000010009 beating Methods 0.000 abstract 1
- 238000007641 inkjet printing Methods 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a printing device of solar cell electrode paste and an electrode preparation system, wherein the printing device of the solar cell electrode paste comprises a main body support, an etching mechanism and an ink jet mechanism. The etching mechanism comprises an etching mechanism body arranged on the main body bracket and an etching gun connected with the etching mechanism body, wherein one end of the etching gun is provided with an etching gun nozzle, and the etching gun is used for etching the silicon wafer to form a groove line on the surface of the silicon wafer; the ink jet mechanism is including the storage case that is used for storing the electrode thick liquids and the ink jet gun who communicates with the storage case, the storage case is installed on main part support, the one end of ink jet gun has the inkjet rifle mouth, the ink jet gun is arranged in printing the electrode thick liquids in the storage case to the silicon chip in the trough line after the sculpture rifle sculpture, the sculpture rifle mouth of the sculpture rifle of the inkjet rifle mouth next-door neighbour, and the inkjet rifle mouth flushes with the sculpture rifle mouth, above-mentioned printing device can be with the accurate and quick grooved trough line of beating into of sculpture of electrode thick liquids.
Description
Technical Field
The invention relates to the field of solar cell electrode processing, in particular to a printing device of solar cell electrode paste and an electrode preparation system.
Background
The solar cell is a device for directly converting light energy into electric energy through a photoelectric effect or a photochemical effect, and has wide application prospect because clean and environment-friendly sunlight is mainly used as an energy source.
The manufacture of solar cell electrodes is an important part of the solar cell production process. The solar cell electrode is usually manufactured by laser etching and grooving, ink-jet printing of electrode slurry and drying and sintering treatment. However, the groove line formed by laser etching is usually thin, secondary positioning is required during subsequent inkjet printing, it is difficult to ensure that the electrode slurry of inkjet printing is accurately injected into the groove line of the laser etching groove, a large amount of electrode slurry needs to be printed near the groove line to prevent the slurry from not entering the groove line, and excessive electrode slurry not only causes raw material waste, but also causes performance degradation of the solar cell.
Disclosure of Invention
Therefore, the printing device of the electrode paste of the solar cell, which can accurately drive the electrode paste into the groove line of the etched groove, is provided.
A printing device of solar cell electrode paste, the printing device of solar cell electrode paste comprises:
a main body support;
the etching mechanism comprises an etching mechanism body arranged on the main body support and an etching gun connected with the etching mechanism body, wherein one end of the etching gun is provided with an etching gun nozzle, and the etching gun is used for etching the silicon wafer to form a groove line on the surface of the silicon wafer; and
the ink jet mechanism, the ink jet mechanism including be used for the storage case of storage electrode thick liquids and with the inside of storage case intercommunication is hollow structure's ink-jet gun, the storage case install in on the main part support, the one end of ink-jet gun has the ink-jet gun mouth, the ink-jet gun be used for with electrode thick liquids in the storage case are printed on the silicon chip in the trough line after the sculpture rifle sculpture, the ink-jet gun mouth next-door neighbour of ink-jet gun the sculpture rifle mouth, just the ink-jet gun mouth with the sculpture rifle mouth flushes.
The printing device for the solar cell electrode paste is simple in structure, integrates the etching mechanism and the ink-jet mechanism into a whole, and achieves the purpose of printing the solar cell paste quickly after etching. In addition, the ink-jet gun nozzle of the ink-jet gun is adjacent to the etching gun nozzle of the etching gun, and the ink-jet gun nozzle is flush with the etching gun nozzle, so that the ink-jet gun can move along the same track of the etching gun, namely the ink-jet printing track of the ink-jet gun is consistent with the etching track of the etching gun, and the electrode slurry is accurately injected into the groove line of the etching groove, so that the purpose of accurate printing is realized.
In one embodiment, the distance between the ink-jet gun nozzle and the etching gun nozzle is 1mm-10 mm.
In one embodiment, the pore diameter of the ink-jet gun nozzle is 1-2000 μm, and the pore diameter of the etching gun nozzle is 50-1000 μm.
In one embodiment, the etching mechanism is a laser etching mechanism.
In one embodiment, the printing device for the solar cell electrode paste further comprises a gun body mounting frame installed on the main body support, the gun body mounting frame is provided with an ink jet gun mounting end and an etching gun mounting end, the ink jet gun sleeve is arranged in the ink jet gun mounting end, the etching gun sleeve is arranged in the etching gun mounting end, and the ink jet gun mounting end and the etching gun mounting end are symmetrically arranged along the axial direction of the gun body mounting frame.
In one embodiment, the gun body mounting bracket is movably connected with the main body bracket.
In one embodiment, the ink jet mechanism further comprises a pressurizing component, the pressurizing component is communicated with the storage box, and the pressurizing component is used for providing pressure for the electrode slurry in the storage box to press the electrode slurry into the ink jet gun.
The invention also provides a solar cell electrode preparation system, which comprises:
the processing table is used for bearing a silicon wafer;
the printing device of the solar cell electrode paste provided by the invention; the etching mechanism of the printing device of the solar cell electrode paste is positioned on the processing table; and
and the sintering furnace is positioned at one side of the processing table and is used for sintering the silicon wafer filled with the electrode slurry to form the electrode grid line on the silicon wafer.
In one embodiment, the solar cell electrode preparation system further comprises a silicon wafer conveying mechanism, the silicon wafer conveying mechanism is located on one side of the processing table, and the silicon wafer conveying mechanism is used for conveying the silicon wafers to the processing table and the sintering furnace in sequence.
In one embodiment, the solar cell electrode preparation system further comprises a silicon wafer positioning mechanism, the silicon wafer positioning mechanism is located above the processing table, and the silicon wafer positioning mechanism is used for collecting position information data of a region to be etched of the silicon wafer.
Drawings
Fig. 1 is a front view of a printing apparatus for electrode paste of a solar cell according to an embodiment of the present invention;
fig. 2 is a front view of a solar cell electrode preparation system in an embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the present invention provides a printing apparatus for electrode paste of a solar cell, including: a body support 100, an etching mechanism 200, and an ink-jet mechanism.
The etching mechanism 200 comprises an etching mechanism body 201 and an etching gun 210. Specifically, the etching mechanism body 201 is installed on the main body support 100, and an etching control unit is provided in the etching mechanism body 201, and is mainly used for controlling the operation of the etching gun 210, and adjusting the working parameters such as the etching wavelength and the etching time. The etching gun 210 is connected with the etching mechanism body 201, and the etching gun 210 is mainly used for etching and grooving the surface of a silicon wafer and forming a groove line on the surface of the silicon wafer. More specifically, the etching gun 210 etches and slots the silicon wafer surface through the etching gun nozzle 211 to form several parallel slot lines. One end of the etching gun 210 has an etching gun nozzle 211, and it is understood that the etching gun nozzle 211 is located at the lowermost end of the etching gun 210.
In one embodiment, the aperture of the etching gun nozzle of the etching gun 210 is 50 μm-1000 μm. Further, the etching gun 210 is a laser etching gun, the laser output wavelength of the laser etching gun is matched with the aperture of the etching gun nozzle, and the suitable etching light spot size is adjusted together, and the light spot diameter can reach 20 μm-200 μm.
Wherein the ink jet mechanism includes a storage bin 313 and an ink jet gun 310. Specifically, the storage tank 313 is mounted on the main body support 100, and the storage tank 313 is mainly used for storing the electrode slurry. The ink-jet gun 310 is communicated with the storage tank 313, and the interior of the ink-jet gun 310 is of a hollow structure and is used for receiving the electrode slurry in the storage tank 313. The ink-jet gun 310 is mainly used for printing the electrode slurry in the storage box 313 to the groove lines of the silicon wafer etched by the etching gun 210 through the ink-jet gun nozzle 311, so that the etching groove lines are covered by the electrode slurry. One end of the gun 310 has a gun nozzle 311, and it is understood that the gun nozzle 311 is located at the lowermost end of the gun 310.
The ink jet gun nozzle 311 of the ink jet gun 310 is close to the etching gun nozzle 211 of the etching gun 210, and the ink jet gun nozzle 311 of the ink jet gun 310 is flush with the etching gun nozzle 211 of the etching gun 210, that is, a connecting line between the ink jet gun nozzle 311 and the etching gun nozzle 211 is a horizontal line, so that the ink jet gun 310 can move along the etching track of the etching gun 210 along the same track, that is, the moving track of the ink jet gun 310 is consistent with the etching track of the etching gun 210, and thus, the printed electrode slurry can be aligned accurately with the grooved slot line of the laser, and the purpose of accurate printing is achieved.
In one embodiment, the distance between the ink-jet nozzle and the etching nozzle is 1mm-10mm, and the advantage of keeping the distance has two aspects, one is that some etching scraps can be generated on the surface of a silicon wafer during the grooving etching process, and if the distance between the ink-jet nozzle and the etching nozzle is below 1mm, the etching scraps can pollute electrode slurry to be jetted near the ink-jet nozzle; secondly, if the distance between the ink-jet gun nozzle and the etching gun nozzle is less than 1mm, the temperature of the laser etching gun is higher, organic matters in the electrode slurry to be ink-jetted near the ink-jet gun nozzle can be volatilized, and the performance of the electrode grid line formed subsequently is reduced.
In one embodiment, the aperture of the nozzle is 1 μm to 2000 μm. In the aperture range, the electrode slurry can smoothly flow out of the ink-jet gun nozzle, the ink-jet gun nozzle cannot be blocked by the electrode slurry, and the waste of the electrode slurry caused by overlarge flow can be avoided.
In one embodiment, the printing speed of the electrode paste of the ink-jet mechanism is 0.1g/s-4g/s, and the paste spraying time delay of the ink-jet mechanism is 0s-10 s.
In one embodiment, the ink jet mechanism further comprises a pressurizing unit 315 in communication with the reservoir 313, wherein the pressurizing unit 315 is mainly used for providing pressure to the electrode slurry in the reservoir 313 to press the electrode slurry into the ink jet gun 310. Further, the increasing member 315 is communicated with the accumulator tank 313 through a pressure-containing pipe 317, that is, the pressurizing member 315 applies pressure to the accumulator tank 313 through the pressure-containing pipe 317. In particular, the pressure of the pressurizing means varies in the range of 50bar to 150 bar.
In one embodiment, the pressurizing member is a pressure pump.
In one embodiment, the printing apparatus for solar cell electrode paste further includes a gun body mounting bracket 110 mounted on the main body support 100, the gun body mounting bracket 110 has an inkjet gun mounting end and an etching gun mounting end which are symmetrically arranged along an axial direction of the gun body mounting bracket 110, and the symmetric arrangement has the advantage that the nozzle of the inkjet gun and the nozzle of the etching gun are always on the same horizontal line, so that a moving track of the inkjet gun and a moving track of the etching gun are kept synchronous.
Further, the shapes of the ink jet gun mounting end and the etching gun mounting end are both circular rings, the etching gun 210 is conveniently sleeved in the etching gun mounting end due to the circular ring design, and the ink jet gun 310 is conveniently sleeved in the ink jet gun mounting end due to the circular ring design.
In one embodiment, the gun body mount 110 is movably connected to the main body support. The movable connection has the advantages of being convenient to adjust the height and the angle of the etching gun 210 and the ink-jet gun 310 and the silicon wafer, and being convenient to etch and ink-jet print electrode slurry.
The printing device for the solar cell electrode paste is simple in structure, integrates the etching mechanism and the ink-jet mechanism into a whole, and achieves the purpose of printing the solar cell paste quickly after etching. In addition, the ink-jet gun nozzle of the ink-jet gun is adjacent to the etching gun nozzle of the etching gun, and the ink-jet gun nozzle is flush with the etching gun nozzle, so that the ink-jet gun can move along the same track of the etching gun, namely the ink-jet printing track of the ink-jet gun is consistent with the etching track of the etching gun, and the electrode slurry is accurately injected into the groove line of the etching groove, so that the purpose of accurate printing is realized.
With reference to fig. 2 in conjunction with fig. 1, the present invention also provides a solar cell electrode preparation system, comprising: the invention provides a printing device of solar cell electrode paste, a processing table 400 and a sintering furnace 600.
Wherein the processing table 400 is positioned below the etching mechanism 200 for the solar cell electrode paste. Specifically, the processing table 400 is located below the etching gun 210, and the processing table 400 is used as a silicon wafer carrying table and is mainly used for carrying a silicon wafer. Further, the processing table 400 is a fan-blade type processing table composed of four sub-processing tables, each sub-processing table is connected with each other through two connecting rods which are vertically connected with each other, a rotating shaft is arranged at the joint of the two connecting rods, and the rotating shaft drives the connecting rods to rotate so that the four sub-processing tables do circular motion. When the silicon wafer on one target sub-processing table is processed, other sub-processing tables can prepare materials, when the silicon wafer on the target processing table finishes ink jetting, the rotating shaft rotates through the circumference, the other material preparation processing tables rotate to the positions below the etching mechanism and the ink jetting mechanism to carry out etching and ink jetting printing, and the silicon wafer which finishes ink jetting is conveyed to the sintering furnace through the conveying belt to be sintered.
The sintering furnace 600 is located at one side of the processing table 400, and the sintering furnace 600 is mainly used for sintering the silicon wafer filled with the electrode slurry to form an electrode grid line on the surface of the silicon wafer.
In one embodiment, the solar cell electrode preparation system further comprises a silicon wafer conveying mechanism 500, the silicon wafer conveying mechanism 500 is located at one side of the processing table 400, and the silicon wafer conveying mechanism 500 is mainly used for conveying silicon wafers. Specifically, the silicon wafer conveying mechanism 500 conveys the silicon wafer to the top of the processing table 400, then performs laser etching and inkjet printing, and conveys the silicon wafer after inkjet printing to a sintering furnace for sintering, so as to form an electrode grid line on the silicon wafer. It is to be understood that the structure of the silicon wafer transfer mechanism 500 of the present invention is not limited, and any transfer mechanism may be used as long as it can transfer the silicon wafer, such as a transfer belt, a transfer roller, etc.
In one embodiment, the solar cell electrode preparation system further includes a silicon wafer positioning mechanism, specifically, the silicon wafer positioning mechanism is located above the processing table 400, and the silicon wafer positioning mechanism is mainly used for collecting position information data of a region to be etched of a silicon wafer. Furthermore, the silicon wafer positioning mechanism is a CCD light source positioning system, which is convenient to understand, and other positioning systems capable of collecting the position information of the silicon wafer can be adopted.
In one embodiment, the solar cell electrode preparation system further comprises a control mechanism electrically connected with the silicon wafer positioning mechanism. The control mechanism is connected with the gun body mounting frame 110, can receive position information data of a region to be etched of a silicon wafer, and controls the gun body mounting frame 110 to move according to the position of the region to be etched of the silicon wafer, so that the etching gun 210 and the etching region of the silicon wafer are accurately aligned. Further, the control mechanism is a coaxial XYZ controller, and the etching gun 210 and the region to be etched of the silicon wafer can be aligned more accurately by adjusting the coaxial XYZ controller.
The solar cell electrode preparation system is simple in structure, integrates etching grooving, ink-jet printing and baking, and can improve the solar cell electrode preparation efficiency on the premise of realizing accurate printing.
In order to make the objects and advantages of the present invention more apparent, the use of the solar cell electrode preparation system of the present invention is further described in detail below in conjunction with the solar cell electrode preparation process. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
The preparation steps of the solar cell electrode are as follows:
the method comprises the steps that a P-type silicon wafer containing each functional layer is placed on a conveying belt and then conveyed to a workbench through the conveying belt, then a CCD light source positioning system collects a region to be etched of the silicon wafer, and after a coaxial XYZ controller obtains position data of the region to be etched of the silicon wafer, movement of a gun body mounting frame is regulated and controlled to enable a laser etching gun to be aligned with the region to be etched of the P-type silicon wafer.
And then moving the laser etching gun to etch the groove line on the region to be etched of the P-type silicon wafer, wherein the parameters of the laser etching are as follows: the laser wavelength is 532nm, and the diameter of a laser opening spot is adjusted to 20 mu m. Along with the movement of the laser etching gun, the ink jet of the ink jet gun synchronously moves and prints the aluminum paste with the viscosity of 10Pa.s at the groove line, the printing speed of the aluminum paste is 1g/s, the pressure of the aluminum paste in the ink jet gun is 50bar, and the time delay of a paste jet switch is 5 s.
And after the ink-jet printing is finished, the conveyor belt conveys the silicon wafer filled with the electrode slurry to a sintering furnace for sintering, an electrode grid line is formed on the surface of the silicon wafer, and the solar cell electrode is prepared after discharging.
Example 2
The preparation steps of the solar cell electrode are as follows:
the method comprises the steps that a P-type silicon wafer containing each functional layer is placed on a conveying belt and then conveyed to a workbench through the conveying belt, then a CCD light source positioning system collects a region to be etched of the silicon wafer, and after a coaxial XYZ controller obtains position data of the region to be etched of the silicon wafer, movement of a gun body mounting frame is regulated and controlled to enable a laser etching gun to be aligned with the region to be etched of the P-type silicon wafer.
And then moving the laser etching gun to etch the groove line on the region to be etched of the P-type silicon wafer, wherein the parameters of the laser etching are as follows: the laser wavelength is 532nm, and the diameter of a laser opening spot is adjusted to 200 mu m. Along with the movement of the laser etching gun, the ink jet of the ink jet gun synchronously moves and prints the aluminum paste with the viscosity of 40Pa.s at the groove line, the printing speed of the aluminum paste is 4g/s, the pressure of the aluminum paste in the ink jet gun is 150bar, and the time delay of a paste jet switch is 10 s.
And after the ink-jet printing is finished, the conveyor belt conveys the silicon wafer filled with the electrode slurry to a sintering furnace for sintering, an electrode grid line is formed on the surface of the silicon wafer, and the solar cell electrode is prepared after discharging.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A printing device for electrode paste of a solar cell, comprising:
a main body support;
the etching mechanism comprises an etching mechanism body arranged on the main body support and an etching gun connected with the etching mechanism body, wherein one end of the etching gun is provided with an etching gun nozzle, and the etching gun is used for etching the silicon wafer to form a groove line on the surface of the silicon wafer; and
the ink jet mechanism comprises a storage box for storing electrode slurry and an ink jet gun which is communicated with the storage box and is internally of a hollow structure, the storage box is arranged on the main body support, one end of the ink jet gun is provided with an ink jet gun nozzle, the ink jet gun is used for printing the electrode slurry in the storage box to a groove line etched on a silicon wafer by an etching gun, the ink jet gun nozzle of the ink jet gun is close to the etching gun nozzle of the etching gun, and the ink jet gun nozzle is flush with the etching gun nozzle;
solar cell electrode thick liquids's printing device still including install in rifle body mounting bracket on the main part support, rifle body mounting bracket has inkjet rifle installation end and sculpture rifle installation end, inkjet rifle installation end with sculpture rifle installation end is followed the axial direction of rifle body mounting bracket is the symmetry and sets up, inkjet rifle installation end with the shape of sculpture rifle installation end is ring shape, inkjet gun cover is located in the inkjet rifle installation end, the sculpture gun cover is located in the sculpture rifle installation end.
2. The printing apparatus for electrode paste of solar cell according to claim 1, wherein the distance between the ink-jet gun nozzle and the etching gun nozzle is 1mm-10 mm.
3. The printing apparatus for electrode paste of solar cell according to claim 1, wherein the aperture of the ink-jet gun nozzle is 1 μm to 2000 μm, and the aperture of the etching gun nozzle is 50 μm to 1000 μm.
4. The apparatus for printing electrode paste for solar cell according to any one of claims 1 to 3, wherein the etching mechanism is a laser etching mechanism.
5. The printing device for the electrode paste of the solar cell according to claim 1, wherein the printing speed of the electrode paste of the ink-jet mechanism is 0.1g/s to 4g/s, and the paste-jet delay of the ink-jet mechanism is 0s to 10 s.
6. The apparatus for printing electrode paste of solar cell according to claim 1, wherein the gun body mounting frame is movably connected to the main body support.
7. The device for printing the electrode paste of the solar cell according to any one of claims 1 to 3, wherein the ink jet mechanism further comprises a pressurizing member, the pressurizing member is communicated with the storage box, and the pressurizing member is used for providing pressure for the electrode paste in the storage box to press the electrode paste into the ink jet gun.
8. A solar cell electrode preparation system, comprising:
the processing table is used for bearing a silicon wafer;
a printing apparatus of the solar cell electrode paste of any one of claims 1 to 7; the etching mechanism of the printing device of the solar cell electrode paste is positioned on the processing table; and
and the sintering furnace is positioned at one side of the processing table and is used for sintering the silicon wafer filled with the electrode slurry to form the electrode grid line on the silicon wafer.
9. The solar cell electrode preparation system of claim 8, further comprising a silicon wafer transfer mechanism located at one side of the processing table, the silicon wafer transfer mechanism being configured to transfer silicon wafers sequentially to the processing table and the sintering furnace.
10. The solar cell electrode preparation system according to claim 8 or 9, further comprising a silicon wafer positioning mechanism, wherein the silicon wafer positioning mechanism is located above the processing table, and the silicon wafer positioning mechanism is configured to collect position information data of a region to be etched of a silicon wafer.
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| CN201910736394.XA CN110421968B (en) | 2019-08-09 | 2019-08-09 | Printing device for solar cell electrode paste and electrode preparation system |
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| CN201910736394.XA CN110421968B (en) | 2019-08-09 | 2019-08-09 | Printing device for solar cell electrode paste and electrode preparation system |
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| CN110421968A CN110421968A (en) | 2019-11-08 |
| CN110421968B true CN110421968B (en) | 2020-12-08 |
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