CN110421968A - The printing equipment and electrode preparation system of solar battery electrode slurry - Google Patents
The printing equipment and electrode preparation system of solar battery electrode slurry Download PDFInfo
- Publication number
- CN110421968A CN110421968A CN201910736394.XA CN201910736394A CN110421968A CN 110421968 A CN110421968 A CN 110421968A CN 201910736394 A CN201910736394 A CN 201910736394A CN 110421968 A CN110421968 A CN 110421968A
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- Prior art keywords
- etching
- rifle
- spray gun
- solar battery
- ink spray
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- 239000011267 electrode slurry Substances 0.000 title claims abstract description 63
- 238000007639 printing Methods 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 126
- 239000007921 spray Substances 0.000 claims abstract description 76
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 72
- 239000010703 silicon Substances 0.000 claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000003860 storage Methods 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims description 19
- 238000005245 sintering Methods 0.000 claims description 16
- 238000000608 laser ablation Methods 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 description 10
- 230000033001 locomotion Effects 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241000931526 Acer campestre Species 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention relates to a kind of printing equipment of solar battery electrode slurry and electrode preparation systems, wherein the printing equipment of solar battery electrode slurry includes main body rack, etching mechanism and inkjet mechanism.The etching rifle that mechanism includes the etching mechanism body being installed on main body rack and connect with etching mechanism body is etched, the one end for etching rifle has etching rifle mouth, and etching rifle is used for etching silicon wafer to form the line of rabbet joint in silicon chip surface；Inkjet mechanism includes the material storing box for storage electrode slurry and the ink spray gun that is connected to material storing box, material storing box is installed on main body rack, one end of ink spray gun has ink spray gun mouth, ink spray gun is used to print the electrode slurry in material storing box into the line of rabbet joint after rifle etched on silicon wafer etching, the etching rifle mouth of the tight-lipped adjacent etching rifle of the ink spray gun of ink spray gun, and ink spray gun mouth is flushed with etching rifle mouth, above-mentioned printing equipment can precisely and quickly squeeze into electrode slurry in the line of rabbet joint of etching fluting.
Description
Technical field
The present invention relates to electrode of solar battery manufacture fields, more particularly to a kind of beating for solar battery electrode slurry
Printing equipment is set and electrode preparation system.
Background technique
Solar battery is the device for directly luminous energy being converted to by photoelectric effect or photochemical effect electric energy, because of it
Mainly using the sunlight of clean and environmental protection as the energy, so solar battery is with a wide range of applications.
Electrode of solar battery is made as an important ring during manufacture of solar cells.Wherein, solar battery
Electrode fabrication generallys use laser ablation fluting, ink jet printed electrode slurry, dries sintering processes again.But laser ablation shape
At the line of rabbet joint it is usually relatively thin, in subsequent i alphakjet printing, need secondary positioning, and it is difficult to ensure that ink jet printing electrode slurry essence
Standard is squeezed into the line of rabbet joint of laser ablation fluting, it will usually need to print near the line of rabbet joint big to prevent slurry from not entering in the line of rabbet joint
The electrode slurry of amount, excessive electrode slurry not only will cause wastage of material, or even will cause the performance decline of solar battery.
Summary of the invention
Based on this, a kind of electrode of solar battery that electrode slurry can be precisely squeezed into the line of rabbet joint that etching is slotted is provided
The printing equipment of slurry.
A kind of printing equipment of solar battery electrode slurry, the printing equipment packet of the solar battery electrode slurry
It includes:
Main body rack；
Etch mechanism, the etching mechanism include the etching mechanism body being installed on the main body rack and with it is described
The etching rifle of mechanism body connection is etched, one end of the etching rifle has etching rifle mouth, and the etching rifle is used for etching silicon wafer
To form the line of rabbet joint in silicon chip surface；And
Inkjet mechanism, the inkjet mechanism include being connected to for the material storing box of storage electrode slurry and with the material storing box
Inside be hollow structure ink spray gun, the material storing box is installed on the main body rack, and one end of the ink spray gun has
Ink spray gun mouth, the ink spray gun are used for the slot printed the electrode slurry in the material storing box to after rifle etched on silicon wafer etching
In line, the etching rifle mouth of the ink spray gun of the ink spray gun tight-lipped neighbour etching rifle, and the ink spray gun mouth and the etching rifle
Mouth flushes.
The structure of the printing equipment of above-mentioned solar battery electrode slurry is simple, and etching mechanism and inkjet mechanism are combined into one
Body realizes the purpose of printing speed cell size after etching.In addition, the quarter of the ink spray gun mouth of the ink spray gun and the etching rifle
Erosion rifle mouth is closely adjacent to each other, and the ink spray gun mouth is flushed with the etching rifle mouth, can guarantee ink spray gun along etching rifle in this way
Etching trace is carried out with track movement, i.e. the inkjet printing track of ink spray gun is consistent with the etching etching trace of rifle, by electrode slurry
Material is accurately squeezed into the line of rabbet joint of etching fluting, realizes the purpose precisely printed.
The distance between the ink spray gun mouth and the etching rifle mouth are 1mm-10mm in one of the embodiments,.
The aperture of the ink spray gun mouth is 1 μm -2000 μm in one of the embodiments, the aperture of the etching rifle mouth
It is 50 μm -1000 μm.
The etching mechanism is laser ablation mechanism in one of the embodiments,.
The printing equipment of the solar battery electrode slurry further includes being installed on the master in one of the embodiments,
Gun body mounting rack on body support frame, the gun body mounting rack have ink spray gun installation end and etching rifle installation end, the ink-jet
Holster is set in the ink spray gun installation end, and the etching holster is set in the etching rifle installation end, the ink spray gun installation
End and the etching rifle installation end are symmetrical set along the axial direction of the gun body mounting rack.
The gun body mounting rack is to be flexibly connected with the main body rack in one of the embodiments,.
The inkjet mechanism further includes pressurized part in one of the embodiments, the pressurized part and the storing
Case connection, the pressurized part, which provides pressure for the electrode slurry into the material storing box, makes electrode slurry be pressed into the ink-jet
In rifle.
The present invention also provides a kind of electrode of solar battery preparation systems comprising:
Machine table, the machine table is for carrying silicon wafer；
The printing equipment of the described in any item solar battery electrode slurries of the present invention；The solar battery electrode slurry
The etching mechanism of printing equipment be located in the machine table；And
Sintering furnace, the sintering furnace are located at the side of the machine table, and the sintering furnace is for will be filled with electrode slurry
Silicon wafer be sintered to form gate electrode line on silicon wafer.
The electrode of solar battery preparation system further includes silicon wafer conveying mechanism in one of the embodiments, described
Silicon wafer conveying mechanism is located at the side of the machine table, and silicon wafer for being successively transmitted to the processing by the silicon wafer conveying mechanism
In platform, the sintering furnace.
The electrode of solar battery preparation system further includes silicon wafer positioning mechanism in one of the embodiments, described
Silicon wafer positioning mechanism is located at the top of the machine table, and the silicon wafer positioning mechanism is used to acquire the position in silicon wafer region to be etched
Information data.
Detailed description of the invention
Fig. 1 is the front view of the printing equipment of solar battery electrode slurry in one embodiment of the invention；
Fig. 2 is the front view of electrode of solar battery preparation system in one embodiment of the invention.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited by the specific embodiments disclosed below.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Refering to fig. 1, the present invention provides a kind of printing equipments of solar battery electrode slurry comprising: main body rack
100, mechanism 200 and inkjet mechanism are etched.
Wherein, the etching mechanism 200 includes etching mechanism body 201 and etching rifle 210.Specifically, mechanism sheet is etched
Body 201 is installed on the main body rack 100, has etching control unit in etching mechanism body 201, is mainly used for control and is carved
It loses rifle 210 to work, the running parameters such as etching wavelength, etch period is adjusted.Etch rifle 210 and the etching mechanism body 201
Connection, etching rifle 210 are mainly used for performing etching silicon chip surface fluting, form the line of rabbet joint in silicon chip surface.More specifically, etching
Rifle 210 forms the parallel line of rabbet joint in several roads to the etched open slot of silicon chip surface by etching rifle mouth 211.One end of the etching rifle 210
With etching rifle mouth 211, it will be understood that etching rifle mouth 211 is located at the lowermost end of the etching rifle 210.
The aperture of the etching rifle mouth of the etching rifle 210 is 50 μm -1000 μm in one of the embodiments,.Further
Ground, the etching rifle 210 are laser ablation rifle, the aperture phase interworking of the laser output wavelength and etching rifle mouth of laser ablation rifle
It closes, common to adjust suitable etching spot size, spot diameter is up to 20 μm -200 μm.
Wherein, the inkjet mechanism includes material storing box 313 and ink spray gun 310.Specifically, material storing box 313 is installed on described
On main body rack 100, material storing box 313 is mainly used for storage electrode slurry.Ink spray gun 310 is connected to the material storing box 313, ink-jet
The inside of rifle 310 is hollow structure, for receiving for the electrode slurry in material storing box 313.The ink spray gun 310 be mainly used for by
Electrode slurry in the material storing box 313 is printed by ink spray gun mouth 311 to the line of rabbet joint of the silicon wafer after etched rifle 210 etching
In, realize covering of the electrode slurry to the etching line of rabbet joint.One end of ink spray gun 310 has ink spray gun mouth 311, it will be understood that ink-jet
Rifle mouth 311 is located at the lowermost end of the ink spray gun 310.
Wherein, the ink spray gun mouth 311 of the ink spray gun 310 close to the etching rifle 210 etching rifle mouth 211, and it is described
The ink spray gun mouth 311 of ink spray gun 310 with it is described etching rifle 210 etching rifle mouth 211 flush, that is to say, that ink spray gun mouth 311 with
Etching the line between rifle mouth 211 is a horizontal line, can guarantee that ink spray gun 310 can be along the etching of etching rifle 210 in this way
Track is carried out with track movement, i.e. the motion track of ink spray gun 310 is consistent with the etching etching trace of rifle 210, is printed in this way
Electrode slurry can be aligned with the line of rabbet joint of laser slotting accurate, realize the purpose precisely printed.
The distance between the ink spray gun mouth and the etching rifle mouth are 1mm-10mm in one of the embodiments, are protected
Holding the benefit of this distance, there are two aspects, one is can generate some etchings in fluting etching process in silicon chip surface and consider to be worth doing, such as
The distance between ink spray gun mouth described in fruit and the etching rifle mouth are in 1mm hereinafter, these etching bits can pollute near ink spray gun mouth
The electrode slurry to ink-jet；Secondly if the distance between the ink spray gun mouth and the etching rifle mouth are in 1mm hereinafter, laser
The temperature for etching rifle is higher, will lead to the organic matter volatilization in the electrode slurry to ink-jet near the ink spray gun mouth, thus
Reduce the performance for the gate electrode line being subsequently formed.
The aperture of the ink spray gun mouth is 1 μm -2000 μm in one of the embodiments,.It is more sharp in this pore diameter range
It is flowed out in electrode slurry from ink spray gun mouth smoothness, neither will cause electrode slurry blocking ink spray gun mouth, it will not be excessive because of flow
Cause the waste of electrode slurry.
The print speed of the electrode slurry of inkjet mechanism is 0.1g/s-4g/s, inkjet mechanism in one of the embodiments,
Whitewashing delay be 0s-10s.
The inkjet mechanism further includes the pressurized part being connected to the material storing box 313 in one of the embodiments,
315,315 main function of pressurized part is that the electrode slurry offer pressure into the material storing box 313 makes electrode slurry pressure
Enter in the ink spray gun 310.Further, the increase component 315 is connected to material storing box 313 by bearing pipe 317, that is, is increased
Splenium part 315 applies pressure into material storing box 313 by bearing pipe 317.Specifically, the pressure change range of pressurized part is
50bar-150bar。
The pressurized part is pressure pump in one of the embodiments,.
The printing equipment of the solar battery electrode slurry further includes being installed on the master in one of the embodiments,
Gun body mounting rack 110 on body support frame 100, the gun body mounting rack 110 have the ink-jet being symmetrical set along its axial direction
Rifle installation end and etching rifle installation end, symmetrically arranged benefit are can to guarantee to be in always in ink spray gun mouth and etching rifle mouth
In same horizontal line, and then keep the motion track of ink spray gun synchronous with the etching motion track holding of rifle.
Further, the shape of the ink spray gun installation end and the etching rifle installation end is circular ring shape, circular ring shape
Design is sheathed in etching rifle installation end convenient for the etching rifle 210, and the design of circular ring shape is sheathed on convenient for the ink spray gun 310
In ink spray gun installation end.
The gun body mounting rack 110 is to be flexibly connected with the main body rack in one of the embodiments,.It is flexibly connected
Benefit be easy for adjust etching rifle 210, ink spray gun 310 and silicon wafer height and angle, convenient for etching and inkjet printing electrode
Slurry.
The structure of the printing equipment of above-mentioned solar battery electrode slurry is simple, and etching mechanism and inkjet mechanism are combined into one
Body realizes the purpose of printing speed cell size after etching.In addition, the quarter of the ink spray gun mouth of the ink spray gun and the etching rifle
Erosion rifle mouth is closely adjacent to each other, and the ink spray gun mouth is flushed with the etching rifle mouth, can guarantee ink spray gun along etching rifle in this way
Etching trace is carried out with track movement, i.e. the inkjet printing track of ink spray gun is consistent with the etching etching trace of rifle, by electrode slurry
Material is accurately squeezed into the line of rabbet joint of etching fluting, realizes the purpose precisely printed.
In conjunction with Fig. 1 and referring to Fig.2, the present invention also provides a kind of electrode of solar battery preparation systems comprising: this hair
Printing equipment, machine table 400 and the sintering furnace 600 of bright described in any item solar battery electrode slurries.
Wherein, the machine table 400 is located at the lower section of the etching mechanism 200 of the solar battery electrode slurry.Specifically
For, the machine table 400 is located at the lower section of the etching rifle 210, and the machine table 400 is used as silicon wafer microscope carrier, mainly uses
In carrying silicon wafer.Further, the fan blade type machine table that machine table 400 is made of four sub- machine tables, between each sub- machine table
It is connected by two connecting rods being mutually connected vertically, the junction of two connecting rods is equipped with rotary shaft, and rotary shaft drives connection
The rotation of bar is so that four sub- machine tables move in a circle.When the silicon wafer in the sub- machine table of one of target is processed,
Other sub- machine tables can stock up, and when the silicon wafer in target machine table completes ink-jet, rotary shaft is by circular-rotation, by it
He stock up machine table rotate to etching mechanism under and inkjet mechanism below, perform etching, inkjet printing, and complete the silicon wafer of ink-jet
It send by conveyer belt into sintering furnace, is sintered, the design of this machine table substantially increases the work effect of silicon wafer processing
Rate.
Wherein, the sintering furnace 600 is located at the side of the machine table 400, and the sintering furnace 600 is mainly used for fill
There is the silicon wafer of electrode slurry to be sintered, forms gate electrode line on silicon chip surface.
The electrode of solar battery preparation system further includes silicon wafer conveying mechanism 500, institute in one of the embodiments,
The side that silicon wafer conveying mechanism 500 is located at the machine table 400 is stated, the silicon wafer conveying mechanism 500 is mainly used for transmitting silicon wafer.
Specifically, silicon wafer is first sent on the table top of the machine table 400 by the silicon wafer conveying mechanism 500, then carries out laser incising
Erosion and inkjet printing, then the silicon wafer after the completion of inkjet printing is sent in sintering furnace and is sintered, gate electrode line is formed on silicon wafer.
It is appreciated that without limitation to the structure of the silicon wafer conveying mechanism 500 in the present invention, as long as can be used for transmission silicon wafer
Transport mechanism, such as conveyer belt, transfer roller etc..
The electrode of solar battery preparation system further includes silicon wafer positioning mechanism in one of the embodiments, specifically
Ground, the silicon wafer positioning mechanism are located at the top of the machine table 400, and the silicon wafer positioning mechanism main function is acquisition silicon wafer
The location information data in region to be etched.Further, the silicon wafer positioning mechanism is CCD light source positioning system, convenient for certain
It is appreciated that the positioning system of position of silicon wafer information can also can be acquired using other.
The electrode of solar battery preparation system further includes and the silicon wafer positioning mechanism in one of the embodiments,
The control mechanism of electrical connection.The control mechanism is connect with the gun body mounting rack 110, and the control mechanism can receive silicon wafer
The location information data in region to be etched, and the position in the region to be etched according to silicon wafer control the gun body mounting rack 110 and move
It is dynamic, and then align etching rifle 210 and the etching area of silicon wafer precisely.Further, the control mechanism is coaxial XYZ
Controller can be such that the region to be etched for etching rifle 210 and silicon wafer realizes more accurate by the adjusting of coaxial XYZ controller
Contraposition.
Above-mentioned electrode of solar battery preparation system structure is simple, integrates etching fluting, inkjet printing and baking, In
Under the premise of realizing precisely printing, additionally it is possible to improve electrode of solar battery preparation efficiency.
In order to which objects and advantages of the present invention are more clearly understood, below in conjunction with the preparation process of electrode of solar battery
The use of electrode of solar battery preparation system of the invention is further elaborated.It should be appreciated that described herein
Specific examples are only used to explain the present invention, is not intended to limit the present invention.
Embodiment 1
A kind of preparation step of electrode of solar battery is as follows:
The P-type wafer containing each functional layer is taken to be placed on conveyer belt, then communicated band is sent on workbench, later CCD
Light source positioning system acquires the area to be etched of silicon wafer, after coaxial XYZ controller gets the zone position data to be etched of silicon wafer, adjusts
Controlling the gun body mounting rack movement makes the region to be etched of laser ablation rifle and P-type wafer realize contraposition.
Laser ablation rifle being moved later, the line of rabbet joint being performed etching to the region to be etched of P-type wafer, the parameter of laser ablation is set
Are as follows: the spot diameter size of optical maser wavelength 532nm, laser die sinking are adjusted to 20 μm.With the movement of laser ablation rifle, ink spray gun spray
The ink aluminium paste that synchronizing moving printing viscosity is 10Pa.s at the line of rabbet joint, the print speed of aluminium paste is 1g/s, the aluminium in ink spray gun
The pressure of slurry is 50bar, and whitewash switch time delay 5s.
After the completion of inkjet printing, conveyer belt will be filled out the chip transmission for having electrode slurry again and is sintered into sintering furnace, in silicon
Piece surface forms gate electrode line, and the preparation of electrode of solar battery is completed in discharging.
Embodiment 2
A kind of preparation step of electrode of solar battery is as follows:
The P-type wafer containing each functional layer is taken to be placed on conveyer belt, then communicated band is sent on workbench, later CCD
Light source positioning system acquires the area to be etched of silicon wafer, after coaxial XYZ controller gets the zone position data to be etched of silicon wafer, adjusts
Controlling the gun body mounting rack movement makes the region to be etched of laser ablation rifle and P-type wafer realize contraposition.
Laser ablation rifle being moved later, the line of rabbet joint being performed etching to the region to be etched of P-type wafer, the parameter of laser ablation is set
Are as follows: the spot diameter size of optical maser wavelength 532nm, laser die sinking are adjusted to 200 μm.With the movement of laser ablation rifle, ink spray gun
The ink-jet aluminium paste that synchronizing moving printing viscosity is 40Pa.s at the line of rabbet joint, the print speed of aluminium paste are 4g/s, in ink spray gun
The pressure of aluminium paste is 150bar, and whitewash switch time delay 10s.
After the completion of inkjet printing, conveyer belt will be filled out the chip transmission for having electrode slurry again and is sintered into sintering furnace, in silicon
Piece surface forms gate electrode line, and the preparation of electrode of solar battery is completed in discharging.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of printing equipment of solar battery electrode slurry characterized by comprising
Main body rack；
Etch mechanism, the etching mechanism include the etching mechanism body being installed on the main body rack and with the etching
Mechanism body connection etching rifle, it is described etching rifle one end have etching rifle mouth, the etching rifle be used for etching silicon wafer with
Silicon chip surface forms the line of rabbet joint；And
Inkjet mechanism, the inkjet mechanism include in being connected to for the material storing box of storage electrode slurry and with the material storing box
Portion is the ink spray gun of hollow structure, and the material storing box is installed on the main body rack, and one end of the ink spray gun has ink-jet
Rifle mouth, the ink spray gun are used for the line of rabbet joint printed the electrode slurry in the material storing box to after rifle etched on silicon wafer etching
In, the etching rifle mouth of the ink spray gun of the ink spray gun tight-lipped neighbour etching rifle, and the ink spray gun mouth and the etching rifle mouth
It flushes.
2. the printing equipment of solar battery electrode slurry according to claim 1, which is characterized in that the ink spray gun mouth
The distance between described etching rifle mouth is 1mm-10mm.
3. the printing equipment of solar battery electrode slurry according to claim 1, which is characterized in that the ink spray gun mouth
Aperture be 1 μm -2000 μm, it is described etching rifle mouth aperture be 50 μm -1000 μm.
4. the printing equipment of solar battery electrode slurry according to claim 1-3, which is characterized in that described
Etching mechanism is laser ablation mechanism.
5. the printing equipment of solar battery electrode slurry according to claim 1-3, which is characterized in that described
The printing equipment of solar battery electrode slurry further includes the gun body mounting rack being installed on the main body rack, the gun body peace
It shelves with ink spray gun installation end and etching rifle installation end, the ink spray gun is sheathed in the ink spray gun installation end, described
It etches holster to be set in the etching rifle installation end, the ink spray gun installation end and the etching rifle installation end are pacified along the gun body
The axial direction shelved is symmetrical set.
6. the printing equipment of solar battery electrode slurry according to claim 5, which is characterized in that the gun body installation
Frame is to be flexibly connected with the main body rack.
7. the printing equipment of solar battery electrode slurry according to claim 1-3, which is characterized in that described
Inkjet mechanism further includes pressurized part, and the pressurized part is connected to the material storing box, and the pressurized part is used for the storage
Electrode slurry in hopper, which provides pressure, is pressed into electrode slurry in the ink spray gun.
8. a kind of electrode of solar battery preparation system characterized by comprising
Machine table, the machine table is for carrying silicon wafer；
The printing equipment of the described in any item solar battery electrode slurries of claim 1-7；The electrode of solar battery slurry
The etching mechanism of the printing equipment of material is located in the machine table；And
Sintering furnace, the sintering furnace are located at the side of the machine table, and the sintering furnace is used to will be filled with the silicon of electrode slurry
Piece is sintered to form gate electrode line on silicon wafer.
9. electrode of solar battery preparation system according to claim 8, which is characterized in that the electrode of solar battery
Preparation system further includes silicon wafer conveying mechanism, and the silicon wafer conveying mechanism is located at the side of the machine table, the silicon wafer transmission
Silicon wafer for being successively transmitted to the machine table, in the sintering furnace by mechanism.
10. electrode of solar battery preparation system according to claim 8 or claim 9, which is characterized in that the solar battery
Electrode preparation system further includes silicon wafer positioning mechanism, and the silicon wafer positioning mechanism is located at the top of the machine table, the silicon wafer
Positioning mechanism is used to acquire the location information data in silicon wafer region to be etched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910736394.XA CN110421968B (en) | 2019-08-09 | 2019-08-09 | Printing device for solar cell electrode paste and electrode preparation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910736394.XA CN110421968B (en) | 2019-08-09 | 2019-08-09 | Printing device for solar cell electrode paste and electrode preparation system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110421968A true CN110421968A (en) | 2019-11-08 |
| CN110421968B CN110421968B (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910736394.XA Active CN110421968B (en) | 2019-08-09 | 2019-08-09 | Printing device for solar cell electrode paste and electrode preparation system |
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| CN (1) | CN110421968B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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