CN110416137B - 用于半导体工艺的基板传送机构及成膜*** - Google Patents

用于半导体工艺的基板传送机构及成膜*** Download PDF

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Publication number: CN110416137B
Authority: CN; China
Prior art keywords: substrate; rear arm; pick; arm; place
Prior art date: 2018-04-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN201910320003.6A

Other languages

English (en)

Chinese (zh)

Other versions

CN110416137A (zh

Inventor

薛士雍

杨志国

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hermes Epitek Corp

Original Assignee

Hermes Epitek Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-04-30

Filing date

2019-04-19

Publication date

2022-03-15

2019-04-19 Application filed by Hermes Epitek Corp filed Critical Hermes Epitek Corp

2019-11-05 Publication of CN110416137A publication Critical patent/CN110416137A/zh

2022-03-15 Application granted granted Critical

2022-03-15 Publication of CN110416137B publication Critical patent/CN110416137B/zh

Status Active legal-status Critical Current

2039-04-19 Anticipated expiration legal-status Critical

Links

239000000758 substrate Substances 0.000 title claims abstract description 158
230000007246 mechanism Effects 0.000 title claims abstract description 34
239000004065 semiconductor Substances 0.000 title claims abstract description 13
238000000034 method Methods 0.000 title claims abstract description 9
210000000245 forearm Anatomy 0.000 claims abstract description 9
238000012546 transfer Methods 0.000 claims description 24
238000006243 chemical reaction Methods 0.000 claims description 16
230000015572 biosynthetic process Effects 0.000 claims description 5
238000012545 processing Methods 0.000 claims description 5
230000007723 transport mechanism Effects 0.000 claims 4
239000010408 film Substances 0.000 description 16
239000007789 gas Substances 0.000 description 12
235000012431 wafers Nutrition 0.000 description 10
238000007740 vapor deposition Methods 0.000 description 9
239000010409 thin film Substances 0.000 description 4
238000005137 deposition process Methods 0.000 description 3
239000002245 particle Substances 0.000 description 3
239000012808 vapor phase Substances 0.000 description 3
239000012159 carrier gas Substances 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
239000002994 raw material Substances 0.000 description 2
238000000151 deposition Methods 0.000 description 1
238000013461 design Methods 0.000 description 1
239000003989 dielectric material Substances 0.000 description 1
230000005611 electricity Effects 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000005381 potential energy Methods 0.000 description 1
230000011218 segmentation Effects 0.000 description 1
230000003068 static effect Effects 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Robotics (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

CN201910320003.6A 2018-04-30 2019-04-19 用于半导体工艺的基板传送机构及成膜*** Active CN110416137B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
TW107114636		2018-04-30
TW107114636A TWI668790B (zh)	2018-04-30	2018-04-30	用於半導體製程之基板傳送機構及成膜裝置

Publications (2)

Publication Number	Publication Date
CN110416137A CN110416137A (zh)	2019-11-05
CN110416137B true CN110416137B (zh)	2022-03-15

Family

ID=68316544

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201910320003.6A Active CN110416137B (zh)	2018-04-30	2019-04-19	用于半导体工艺的基板传送机构及成膜***

Country Status (3)

Country	Link
JP (1)	JP2019195055A (ja)
CN (1)	CN110416137B (ja)
TW (1)	TWI668790B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI752416B (zh) *	2020-02-19	2022-01-11	總督科技股份有限公司	晶圓載盤之置載裝置及其置載方法

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CN102064126A (zh) *	2010-11-04	2011-05-18	友达光电股份有限公司	基板运输处理***及方法
CN102134709A (zh) *	2009-12-25	2011-07-27	东京毅力科创株式会社	成膜装置
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CN103805961A (zh) *	2012-11-14	2014-05-21	理想能源设备(上海)有限公司	金属有机化学气相沉积***及其传输承载腔与传输方法
US9202733B2 (en) *	2011-11-07	2015-12-01	Persimmon Technologies Corporation	Robot system with independent arms
US10103046B2 (en) *	2015-04-20	2018-10-16	Applied Materials, Inc.	Buffer chamber wafer heating mechanism and supporting robot

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US6132165A (en) *	1998-02-23	2000-10-17	Applied Materials, Inc.	Single drive, dual plane robot
TWI451519B (zh) *	2010-10-19	2014-09-01	Au Optronics Corp	基板運輸處理方法
WO2015013143A1 (en) *	2013-07-22	2015-01-29	Applied Materials, Inc.	An end effector for transferring a substrate

2018
- 2018-04-30 TW TW107114636A patent/TWI668790B/zh active
2019
- 2019-04-17 JP JP2019078398A patent/JP2019195055A/ja active Pending
- 2019-04-19 CN CN201910320003.6A patent/CN110416137B/zh active Active

Patent Citations (10)

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Publication number	Priority date	Publication date	Assignee	Title
TWI311794B (en) *	2004-08-17	2009-07-01	Mattson Tech Inc	Advanced low cost high throughput processing platform
JP2008141095A (ja) *	2006-12-05	2008-06-19	Tatsumo Kk	半導体製造用搬送装置
CN101872736A (zh) *	2006-12-27	2010-10-27	大日本网目版制造株式会社	基板承载架和基板处理装置
CN102349144A (zh) *	2009-03-13	2012-02-08	川崎重工业株式会社	具备末端执行器的机器人及其运行方法
CN102134709A (zh) *	2009-12-25	2011-07-27	东京毅力科创株式会社	成膜装置
CN102064126A (zh) *	2010-11-04	2011-05-18	友达光电股份有限公司	基板运输处理***及方法
CN103415649A (zh) *	2011-03-01	2013-11-27	应用材料公司	具有连续旋转的原子层沉积旋转料架及其使用方法
US9202733B2 (en) *	2011-11-07	2015-12-01	Persimmon Technologies Corporation	Robot system with independent arms
CN103805961A (zh) *	2012-11-14	2014-05-21	理想能源设备(上海)有限公司	金属有机化学气相沉积***及其传输承载腔与传输方法
US10103046B2 (en) *	2015-04-20	2018-10-16	Applied Materials, Inc.	Buffer chamber wafer heating mechanism and supporting robot

Also Published As

Publication number	Publication date
TWI668790B (zh)	2019-08-11
JP2019195055A (ja)	2019-11-07
CN110416137A (zh)	2019-11-05
TW201946197A (zh)	2019-12-01

Legal Events

Date	Code	Title
2019-11-05	PB01	Publication
2019-11-05	PB01	Publication
2019-11-29	SE01	Entry into force of request for substantive examination
2019-11-29	SE01	Entry into force of request for substantive examination
2022-03-15	GR01	Patent grant
2022-03-15	GR01	Patent grant

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US10679883B2 (en)	2020-06-09	Wafer plate and mask arrangement for substrate fabrication
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KR100927302B1 (ko)	2009-11-18	기판처리장치
TWI611998B (zh)	2018-01-21	製造基板所用的晶圓承載板與光罩配置
KR20070116745A (ko)	2007-12-11	유리 기판의 픽업 및 전달 장치 및 이를 이용하는 유리기판의 픽업 및 전달 방법
KR101883028B1 (ko)	2018-07-27	접합 시스템, 기판 처리 시스템 및 접합 방법
KR20080082905A (ko)	2008-09-12	기판처리장치
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CN113078089A (zh)	2021-07-06	晶圆转移装置、半导体工艺设备、晶圆转移控制方法
KR101760667B1 (ko)	2017-07-31	고생산성 박막증착이 가능한 원자층 증착 시스템
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JP2014017313A (ja)	2014-01-30	部品実装装置
KR20130043371A (ko)	2013-04-30	다이 본딩 장치
CN110416137B (zh)	2022-03-15	用于半导体工艺的基板传送机构及成膜***
WO2015075817A1 (ja)	2015-05-28	基板処理システム
KR20170042957A (ko)	2017-04-20	반도체 다이들을 이송하기 위한 다이 셔틀 및 이를 포함하는 다이 본딩 장치
CN113025985A (zh)	2021-06-25	旋转驱动装置、成膜装置以及电子器件的制造方法
JP2743274B2 (ja)	1998-04-22	基板処理装置および基板搬送装置
JP3898401B2 (ja)	2007-03-28	部品供給装置