CN110401005B - Packaged antenna, preparation method thereof and mobile communication terminal - Google Patents
Packaged antenna, preparation method thereof and mobile communication terminal Download PDFInfo
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- CN110401005B CN110401005B CN201810374945.8A CN201810374945A CN110401005B CN 110401005 B CN110401005 B CN 110401005B CN 201810374945 A CN201810374945 A CN 201810374945A CN 110401005 B CN110401005 B CN 110401005B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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Abstract
The embodiment of the invention discloses a packaged antenna, a preparation method thereof and a mobile communication terminal. The packaged antenna comprises a first substrate and a second substrate, wherein the first substrate is abutted with the second substrate and is connected with the second substrate through a bonding material; the cavity wall of the cavity of the first substrate is provided with a glue overflow hole, and the glue overflow hole penetrates through the first substrate; a solder mask structure is arranged at the joint of the welding surface of the second substrate and the cavity surface; the bonding material is arranged on the welding surface, connected with the second plate surface of the first substrate and extends into the glue overflow hole. The excessive adhesive material is absorbed by the glue overflowing holes, so that the influence of the adhesive material on the butt joint and the distance between the first substrate and the second substrate is avoided; the solder resist structure prevents the adhesive material from flowing to the cavity to ensure the reliability of the antenna. The overflow glue hole is combined with the solder mask structure, so that the process problems that the redundant bonding material pollutes the antenna area and the thickness of the bonding material is difficult to control are effectively solved, and the bonding material forms a rivet structure, so that the first substrate and the second substrate are firmly and reliably connected.
Description
Technical Field
The invention relates to the field of antenna structures, in particular to a packaged antenna, a preparation method thereof and a mobile communication terminal.
Background
With the advent of high-speed communication times such as 5G and VR, millimeter wave communication gradually becomes mainstream, and the design and application requirements of millimeter wave antennas are more and more vigorous. Since the length of the transmission path in the millimeter wave band has a great influence on the signal amplitude loss, the traditional architecture mode of the IC + PCB + Antenna has been unable to meet the high performance requirement, and the architecture of the IC + packaged Antenna becomes the mainstream, which is the AiP (Antenna in Package) technology. High antenna gain is not usually obtained, and an antenna array is generally adopted. Because the antenna feeder path is extremely short in the AiP architecture, the EIRP (Equivalent Isotropic Radiated Power) value of the wireless system can be maximized, which is beneficial to wider coverage. In addition, the wavelength of the millimeter wave frequency band is extremely short, the sensitivity of the electrical property to the processing error is very high, if the manufacturing precision is not good, the impedance mismatch can be caused to cause signal reflection, and the traditional PCB processing technology can not meet the requirement of millimeter wave processing precision, so that the packaging processing technology with higher processing precision can exert higher value.
AiP the antenna array technology will gradually become the mainstream antenna technology of 5G and millimeter wave high-speed communication systems, and has wide application space and market space prospect. In the existing AIP technology, a dual-substrate package structure for implementing a 10G-40 GHz band millimeter wave antenna and an antenna array in a package body mainly includes an upper substrate and a lower substrate, the height of the distance between the upper substrate and the lower substrate is different with the difference of antenna frequency, the lower the antenna frequency is, the larger the distance between two antenna radiation pieces is, and therefore how to control the height between the upper substrate and the lower substrate is a technical key point. In the prior art, an upper substrate and a lower substrate are welded by using solder balls or other viscous materials, the solder balls or other viscous materials are positioned between the upper substrate and the lower substrate after welding, and the solder balls are adopted for bonding, so that thermal instability exists, and the distance between the upper substrate and the lower substrate is unstable; in addition, the viscous material easily enters the cavity to form glue overflow pollution, so that gas and the bonding material exist in the cavity at the same time, the influence of the dielectric constant of the bonding material on the inside of the cavity is changed, the performance of the antenna is further influenced, the thickness of the adhesive layer is difficult to control, and the process cost is high.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a packaged antenna, a method for manufacturing the same, and a mobile communication terminal, which can ensure the reliability of the antenna and avoid the problem of glue overflow pollution of a bonding material.
In a first aspect, an embodiment of the present invention provides a packaged antenna, including a first substrate and a second substrate, where the first substrate and the second substrate are stacked and abutted against each other and connected by an adhesive material;
the first substrate is provided with a first plate surface and a second plate surface which are arranged in an opposite way, the second plate surface is arranged towards the second substrate, the first substrate is provided with a cavity, the opening of the cavity is positioned on the second plate surface and faces towards the second substrate, the cavity wall of the cavity is provided with a glue overflow hole, and the glue overflow hole penetrates through the first plate surface and the second plate surface;
the second substrate is provided with a third plate surface facing the first substrate, the third plate surface comprises a cavity surface and a welding surface, the cavity surface is opposite to the cavity, the welding surface is opposite to the cavity wall of the cavity, and a welding resistance structure is arranged at the joint of the welding surface and the cavity surface;
the bonding material is arranged on the welding surface, is opposite to the glue overflow hole, is connected with the second plate surface and extends into the glue overflow hole.
In a first possible implementation manner of the first aspect, a bonding pad is disposed on the welding surface at a position corresponding to the glue overflow hole, and the bonding material is disposed on the bonding pad; the bonding pad is arranged on the welding surface, so that the connection strength of the bonding material and the second substrate can be enhanced;
the solder resist structure and the bonding pad are arranged at intervals, so that a gap exists between the solder resist structure and the bonding pad, the flowing range of the bonding material is enlarged, the connecting area of the bonding material and the bonding pad is increased, the connecting strength is improved, and meanwhile, the influence of the bonding material on the distance between the first substrate and the second substrate is reduced;
or the solder mask structure covers the edge of the solder pad; so as to prevent the adhesive material from flowing out of the solder resist structure and prevent the redundant adhesive material from flowing into the flash hole.
In a second possible implementation manner of the first aspect, the bonding material is directly connected with the welding surface; the first substrate and the second substrate can be directly fixedly connected by using the bonding material, so that the processing technology is simplified, and the processing cost is reduced.
In a third possible implementation manner of the first aspect, the solder mask structure is annular, the solder mask structure is arranged opposite to the glue overflow hole, and an inner diameter of the solder mask structure is larger than an inner diameter of the glue overflow hole; the flow range of the solder mask structure can be reduced by utilizing the annular solder mask structure, so that the bonding material is surrounded in a certain range by the solder mask structure, and the pollution of the bonding material to the cavity is effectively avoided;
or the solder mask structure is in a strip shape arranged along the cavity wall of the cavity, the bonding material can move along the extension direction of the cavity wall, and the glue overflow range of the bonding material can be increased, so that the influence on the distance between the first substrate and the second substrate is reduced.
In a fourth possible implementation manner of the first aspect, the bonding material and the solder mask structure are arranged at an interval, so that the usage amount of the bonding material can be reduced, and the influence on the antenna performance caused by the excessive bonding material when the bonding material passes over the solder mask structure is avoided.
In a fifth possible implementation manner of the first aspect, the solder resist structure is made of a solder resist material; the use of solder resist material may further prevent the ingress of adhesive material into the cavity.
With reference to any one of the foregoing possible implementation manners, in a sixth possible implementation manner of the first aspect, the glue overflow hole is a stepped hole, the glue overflow hole includes a first section of hole and a second section of hole, an inner diameter of the first section of hole is smaller than an inner diameter of the second section of hole, the first section of hole is close to the second substrate relative to the second section of hole, and the bonding material is filled in the first section of hole and extends into the second section of hole; utilize bonding material can be rivet structure at both ends, further improve joint strength, and through the great second section hole of diameter, can hold more bonding material.
In a seventh possible implementation manner of the first aspect, the second board surface abuts against the solder resist structure; so that the first substrate and the second substrate are mutually abutted and the height distance between the first substrate and the second substrate is kept fixed.
In an eighth possible implementation manner of the first aspect,
the second substrate is provided with a fourth plate surface, and the fourth plate surface is opposite to the third plate surface;
the packaged antenna further comprises a chip, and the chip is connected to the fourth board surface. Through the matching of the antenna pattern and the chip, the packaged antenna can reach a preset frequency band.
In a second aspect, the present invention provides a mobile communication terminal having the aforementioned packaged antenna.
In a third aspect, the present invention provides a method for manufacturing a packaged antenna, where the method is used to manufacture the packaged antenna, and the method includes:
providing a first substrate, wherein the first substrate is provided with a first plate surface and a second plate surface which are arranged in an opposite manner, a cavity is arranged on the first substrate, an opening of the cavity is positioned on the second plate surface, a glue overflow hole is arranged on the cavity wall of the cavity, and the glue overflow hole penetrates through the first plate surface and the second plate surface;
providing a second substrate, wherein the second substrate is provided with a third plate surface, the third plate surface comprises a cavity surface and a welding surface, and a solder mask structure is arranged at the joint of the welding surface and the cavity surface;
arranging an adhesive material on the welding surface;
and facing the opening of the cavity to the second substrate, aligning the glue overflow hole of the first substrate with the bonding material, then pasting the first substrate on the second substrate to enable the first substrate and the second substrate to be abutted, and connecting the bonding material with the second plate surface and extending into the glue overflow hole.
In a first possible implementation manner of the third aspect, in the step of providing a first substrate, the method further includes the following sub-steps:
providing a copper-clad plate, wherein the copper-clad plate is provided with a first surface and a second surface which are oppositely arranged;
providing an antenna pattern on the first surface;
silk-screen printing a resin layer on the second surface, baking to form a cavity wall, and enclosing the cavity wall to form a cavity;
and drilling glue overflow holes at the positions of the cavity walls, wherein the glue overflow holes penetrate through the copper-clad plate and the resin layer. Through the silk screen printing resin layer, can solve first base plate production efficiency low, problem with high costs.
In a second possible implementation manner of the third aspect, the steps of printing the resin layer on the second surface and baking are repeated for multiple times to reach a preset thickness so as to reach the application frequency and performance of the antenna.
In a third possible implementation manner of the third aspect, in the step of disposing an adhesive material on the concave welding surface, the adhesive material is disposed on the welding surface through dispensing, and a diameter of the adhesive material is larger than a diameter of the glue overflow hole; so that the bonding material can be bonded with the second plate surface, and the connection strength of the first substrate and the second substrate is improved.
In a fourth possible implementation manner of the third aspect, in the step of disposing an adhesive material on the concave soldering surface, a gap is disposed between the adhesive material and the solder resist structure; in order to avoid that the adhesive material is too much so that the adhesive material crosses the solder resist structure during the mounting process to cause contamination.
By implementing the embodiment of the invention, the first substrate and the second substrate are arranged in a butting way, so that the distance between the first substrate and the second substrate can be ensured to be a fixed value, and the reliability of the antenna is ensured; the first substrate and the second substrate can be fixedly connected together by connecting the bonding material with the second plate surface and the welding surface, and the excessive bonding material can be absorbed by the glue overflow hole, so that the direct butt joint between the first substrate and the second substrate caused by the bonding material is avoided; the solder mask structure can prevent the bonding material from flowing to the cavity area, so that the bonding material is prevented from entering the cavity, the dielectric constant in the cavity is not influenced by the bonding material, and the bonding material is prevented from being attached to the second radiating sheet, so that the reliability of the antenna is effectively ensured; the overflow glue hole is combined with the solder mask structure, so that the process problems that the redundant bonding material pollutes the antenna area and the thickness of the bonding material is difficult to control are effectively solved, the bonding material is connected with the second board surface and enters the overflow glue hole, the bonding material can form a rivet structure, and the effect of better welding the first substrate and the second substrate is achieved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present invention, the drawings required to be used in the embodiments or the background art of the present invention will be described below.
Fig. 1 is a schematic structural diagram of a packaged antenna provided in the preferred embodiment of the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1;
FIG. 3 is an enlarged view of the structure at B in FIG. 1;
FIG. 4 is an enlarged view of the structure at C in FIG. 1;
FIG. 5 is a schematic structural diagram of another embodiment of an adhesive overflow hole of a packaged antenna according to the present invention;
fig. 6 to 9 are schematic process diagrams of a first substrate for a packaged antenna according to a first method for manufacturing the first substrate;
fig. 10 to 13 are schematic process diagrams of a second method for manufacturing a first substrate of a packaged antenna according to the present invention;
fig. 14 to 18 are schematic process diagrams of a third method for manufacturing a first substrate of a packaged antenna according to the present invention;
fig. 19 is a schematic structural view of a second substrate of the packaged antenna of the present invention;
fig. 20 is a schematic view of the structure after an adhesive material is provided on the second substrate;
FIG. 21 is a schematic view of the first and second substrates bonded together in accordance with the present invention;
fig. 22 is a schematic structural view after chips are provided on the second substrate in fig. 21;
fig. 23 is a schematic structural view of the second substrate of fig. 22 after the BGA balls are mounted thereon.
Detailed Description
The embodiments of the present invention will be described below with reference to the drawings.
Referring to fig. 1, fig. 1 is a diagram of a packaged antenna according to an embodiment of the present invention, which includes a first substrate 100 and a second substrate 200, where the first substrate 100 and the second substrate 200 are stacked and connected to each other by an adhesive 300, and the first substrate 100 and the second substrate 200 are connected to each other by the adhesive 300, so that a distance between the two substrates can be ensured to be a fixed value, and even after multiple times of high temperature thermal changes, the antenna can still maintain good stability and ensure reliability.
The first substrate 100 has a first plate surface 100a and a second plate surface 100b opposite to each other. The first board surface 100a is disposed away from the second substrate 200, and the first board surface 100a may be disposed with an antenna pattern including the first radiation sheet 109. The second board surface 100b is disposed toward the second board 200, the first board 100 is provided with a cavity 10, the cavity 10 is a groove structure disposed at the second board surface 100b, an opening of the cavity 10 is located at the second board surface 100b and faces the second board 200, a cavity wall 101 of the cavity 10 is provided with a glue overflow hole 102, and the glue overflow hole 102 penetrates through the first board surface 100a and the second board surface 100 b. The second substrate 200 has a third plate surface 200a facing the first substrate 100, the third plate surface 200a includes a cavity surface 210a and a bonding surface 220a, the cavity surface 210a is provided with a second radiation sheet 209, the cavity surface 210a is disposed opposite to the cavity 10, and the cavity 10 is located between the first radiation sheet 109 and the second radiation sheet 209. The cavity 10 may be filled with air having a low dielectric constant, and signal radiation may be achieved by interaction of the first radiation plate 109 and the second radiation plate 209 with the cavity 10. In this embodiment, one first radiation piece 109 and one second radiation piece 209 are correspondingly disposed at the position of the cavity 10, but in other embodiments, the number of the first radiation piece 109 and the second radiation piece 209 corresponding to the position of the cavity 10 may be specifically determined according to needs.
The welding surface 220a is arranged opposite to the cavity wall 101 of the cavity 10, the welding-resistant structure 201 is arranged at the joint of the welding surface 220a and the cavity surface 210a, and the welding-resistant structure 201 protrudes out of the third plate surface. The adhesive material 300 is disposed on the welding surface 220a, the adhesive material 300 is disposed opposite to the glue overflow hole 102, and the adhesive material 300 is connected to the second plate surface 100b and extends into the glue overflow hole 102.
The bonding material 300 is connected to the second board surface 100b and the soldering surface 220a, so that the first board 100 and the second board 200 can be fixedly connected together, the excess bonding material 300 can be absorbed by the glue overflow holes 102, and the direct butt joint between the first board 100 and the second board 200 caused by the bonding material 300 is avoided.
The solder resist structure 201 can prevent the adhesive material 300 from flowing to the area of the cavity 10, prevent the adhesive material 300 from entering the cavity 10, prevent the dielectric constant in the cavity 10 from being affected by the adhesive material 300, and prevent the adhesive material 300 from adhering to the second radiation patch 209, thereby effectively ensuring the reliability of the antenna.
The glue overflow hole 102 is combined with the solder resist structure 201, so that the process problems that the redundant bonding material 300 pollutes the antenna area and the thickness of the bonding material 300 is difficult to control are effectively solved, the bonding material 300 is connected with the second board surface 100b and enters the glue overflow hole 102, the bonding material 300 can form a rivet structure, and the effect of better welding the first substrate 100 and the second substrate 200 is achieved.
In this embodiment, the number of the cavities 10 on the first substrate 100 is multiple, the cavities 10 are arranged at intervals, two adjacent cavities 10 are separated by the cavity wall 101, the cavities 10 may be arranged in a matrix, and as shown in the cross-sectional view of fig. 1, four cavities 10 are shown. Here, the number of the cavities 10 is not limited to that shown in fig. 1, and the number of the cavities 10 may be determined according to the antenna performance.
At least three cavity walls 101 are formed among the four cavities 10, and glue overflow holes 102 are formed in all the three cavity walls 101. More specifically, there are differences in the structures of the corresponding positions of the second substrate 200 corresponding to the three glue overflow holes 102, which form three different embodiments. In addition, in other embodiments, the structures of the corresponding positions of the second substrate 200 corresponding to the three glue overflow holes 102 may be the same, so as to facilitate the processing and manufacturing and reduce the production cost.
As shown in fig. 2, at a position of the first glue overflow hole 102, that is, a position a, a bonding pad 202 is disposed on the bonding surface 220a corresponding to the glue overflow hole 102, the adhesive material 300 is disposed on the bonding pad 202, and the solder resist structure 201 is disposed at a distance from the bonding pad 202. By providing the bonding pad 202 on the bonding surface 220a, the bonding strength between the adhesive material 300 and the second substrate 200 can be enhanced. The solder resist structure 201 and the pad 202 are arranged at intervals, so that a gap 203 exists between the solder resist structure 201 and the pad 202, the flowing range of the adhesive material 300 is increased, the connecting area of the adhesive material 300 and the pad is increased, the connecting strength is improved, and meanwhile, the influence of the adhesive material 300 on the distance between the first substrate 100 and the second substrate 200 is reduced.
As shown in fig. 3, at the position B of the second glue overflow hole 102, a pad 202 is disposed on the bonding surface 220a corresponding to the glue overflow hole 102, the adhesive material 300 is disposed on the pad 202, and the solder resist structure 201 covers the edge of the pad 202 to prevent the adhesive material 300 from flowing out of the solder resist structure 201 and prevent the excess adhesive material 300 from flowing into the glue overflow hole 102.
As shown in fig. 4, at the position C of the third glue overflow hole 102, the adhesive material 300 is directly connected to the soldering surface 220a, and the adhesive material 300 can be used to directly realize the fixed connection between the first substrate 100 and the second substrate 200, thereby simplifying the processing process and reducing the processing cost.
In the above embodiment at the positions of the three solder resist structures 201, the solder resist structure 201 may be in a ring shape, the solder resist structure 201 is disposed opposite to the glue overflow hole 102, and the inner diameter of the solder resist structure 201 is greater than the inner diameter of the glue overflow hole 102; the bonding material 300 can be conveniently connected with the second board surface 100b, and the flow range of the solder mask structure 201 can be reduced by using the annular solder mask structure 201, so that the bonding material 300 is surrounded by the solder mask structure 201 within a certain range, and the cavity 10 is effectively prevented from being polluted by the bonding material 300. Here, in other embodiments, the solder resist structure 201 may also be a strip shape disposed along the cavity wall 101 of the cavity 10, and the adhesive material 300 may move along the extending direction of the cavity wall 10, so as to increase the glue overflow range of the adhesive material, thereby reducing the influence on the distance between the first substrate and the second substrate; the solder resist structure 201 may prevent the adhesive material 300 from flowing into the cavity 10.
In this embodiment, the solder resist structure 201 is made of a solder resist material, which may be solder resist ink or a solder resist used for a circuit board, such as green oil, and may be formed by directly coating the solder resist material on the third board surface 200 a; alternatively, the solder resist structure 201 is a protrusion provided on the third board surface 200a, and a solder resist material is coated on the surface of the protrusion. The entry of the adhesive material 300 into the cavity 10 can be further prevented by the solder resist material.
The bonding material 300 and the solder mask structure 201 are arranged at intervals, so that the using amount of the bonding material 300 can be reduced, and the influence on the antenna performance caused by the fact that the bonding material 300 crosses the solder mask structure 201 due to the fact that the bonding material 300 is too much is avoided.
In the present embodiment, as shown in fig. 2 to fig. 4, the second board surface 100b abuts against the solder resist structure 201, so that the first substrate 100 and the second substrate 200 abut against each other, and the height distance between the two is kept constant. Here, in other embodiments, a protrusion may be provided on the second plate surface 100b to abut against the third plate surface 200a of the second substrate 200, or a protrusion may be provided on the third plate surface 200a to abut against the second surface of the first substrate 100, so that the first substrate 100 and the second substrate 200 can be ensured to abut against each other; or the solder mask structure is also arranged at the edge of the cavity on the second board surface, and the solder mask structure on the second board surface is abutted to the solder mask structure on the third board surface, so that the first substrate and the second substrate are abutted to each other, and the solder mask structure on the second board surface can further prevent the bonding material from flowing into the cavity.
The second substrate 200 has a fourth plate surface 200b, which is opposite to the third plate surface 200 a; the packaged antenna further includes a chip 400, and the chip 400 is connected to the fourth board 200 b. Through the cooperation of the first radiating plate 109, the cavity 10, the second radiating plate 209 and the chip 400, the packaged antenna can reach a preset frequency band and exert performance.
In the above embodiment, the glue overflow hole 102 is a through hole, and in other embodiments, as shown in fig. 5, the glue overflow hole 102 may also be a stepped hole, the glue overflow hole 102 includes a first section hole 102a and a second section hole 102b, an inner diameter of the first section hole 102a is smaller than an inner diameter of the second section hole 102b, the first section hole 102a is close to the second substrate 200 relative to the second section hole 102b, the adhesive material 300 is filled in the first section hole 102a and extends into the second section hole 102b, both ends of the adhesive material 300 may be rivet structures, so as to further improve the connection strength, and more adhesive material 300 may be accommodated by the second section hole 102b with a larger diameter. Here, a chamfer may also be provided at an edge of the flash hole 102 facing the second substrate 200 to facilitate the entry of the bonding material 300 into the flash hole 102.
The invention provides a mobile communication terminal which is provided with the packaging antenna.
The invention also provides a preparation method of the packaged antenna, which comprises the following steps:
In the first specific implementation manner of this step 10, as shown in fig. 6 to 9, the following sub-steps are further included.
Step 111, as shown in fig. 6, a copper-clad plate 11 is provided, where the copper-clad plate 11 has a first surface 11a and a second surface 11b that are arranged oppositely.
Step 112, as shown in fig. 6, an antenna pattern is arranged on the first surface 11a of the copper-clad plate 11, and a first radiation sheet 109 is formed. In this step, an antenna pattern may be provided on the first surface 11a of the copper-clad plate 11 by using existing equipment and conditions of a substrate factory or a printed wiring board factory.
Step 113, as shown in fig. 7, a resin layer 12 is silk-screened on the second surface 11b of the copper-clad plate 11, and baked to form a cavity wall 101, and the cavity wall 101 is enclosed to form the cavity 10. The positions of the cavity wall 101 and the cavity 10 can be determined according to the position of the first radiation piece 109. In this step, the resin layer may be formed by screen printing through a screen printing machine or a screen printing process. As shown in fig. 8, a single printing may not reach the preset thickness, and this step may be repeatedly performed, printing and baking for a plurality of times, until the preset thickness is reached. The predetermined thickness may be determined based on the antenna application frequency and performance.
And step 114, drilling glue overflow holes 102 at the positions of the cavity walls 101, wherein the glue overflow holes 102 penetrate through the copper-clad plate 11 and the resin layer 12.
Through above steps, can process and form first base plate 100, through the silk screen printing resin layer, can solve first base plate 100 low in production efficiency, problem with high costs.
In the second specific implementation manner of the present step 10, as shown in fig. 10 to 13, the following sub-steps may be further included.
Step 121, as shown in fig. 10, a copper-clad plate 11 is provided, where the copper-clad plate 11 has a first surface 11a and a second surface 11b that are arranged oppositely.
Step 122, as shown in fig. 10, an antenna pattern is provided on the first surface 11 a. In this step, an antenna pattern may be provided on the first surface 11a of the copper-clad plate 11 by using existing equipment and conditions of a substrate factory or a printed wiring board factory, and the first radiation sheet 109 is formed.
Step 123, as shown in fig. 11, preparing a photosensitive dielectric material, and attaching the photosensitive dielectric material to the second surface 11b of the copper-clad plate 11 by using a vacuum film attachment machine to form a photosensitive dielectric material layer 13, wherein the thickness of the photosensitive dielectric material layer 13 depends on the application frequency and performance of the antenna.
In step 124, as shown in fig. 12, the photosensitive dielectric material layer 13 in the area corresponding to the first radiation patch 109 of the antenna pattern is removed by using an exposure and development device, so as to form the cavity 10 and the cavity wall 101 thereof.
Step 125, as shown in fig. 13, an overflow hole 102 is drilled at the position of the cavity wall 101, and the overflow hole 102 penetrates through the photosensitive dielectric material layer 13 and the copper-clad plate 11.
In the third specific implementation manner of the present step 10, as shown in fig. 14 to 18, the following sub-steps may be further included.
Step 131, as shown in fig. 14, providing copper clad laminates with two thicknesses, namely a first copper clad laminate CCL1, a second copper clad laminate CCL2, and a low fluidity paste prepreg PPG, wherein the thicknesses of the first copper clad laminate CCL, the second copper clad laminate CCL2, and the low fluidity paste prepreg PPG depend on the performance of the antenna to be manufactured.
And 132, performing the following conventional flow processing on the first copper-clad plate CCL1 and the second copper-clad plate CCL2 made of the three materials and the low-fluidity bonding prepreg PPG.
As shown in fig. 15, an antenna pattern is formed on a first surface CCL1a of a first copper clad laminate CCL 1.
As shown in fig. 16, the second copper-clad CCL2 is hollowed out and removed corresponding to the antenna area of the first copper-clad CCL1 by mechanical drilling and edge milling equipment, so as to form the cavity 10 and the cavity wall 101 thereof.
Step 133, as shown in fig. 17, the first copper clad CCL1 and the second copper clad CCL2 are bonded together by lamination using a prepreg PPG, and the second copper clad CCL2 is bonded to the second surface CCL1b of the first copper clad CCL 1.
In step 134, as shown in fig. 18, an overflow hole 102 is drilled at the cavity wall 101, and the overflow hole 102 penetrates through the first copper-clad CCL1, the prepreg PPG, and the second copper-clad CCL 2.
In the above embodiments, the antenna pattern may be prepared and formed first to form the first radiation sheet, and then the cavity and the cavity wall thereof may be prepared and formed according to the position of the first radiation sheet; of course, in other embodiments, the cavity and the cavity wall thereof may be prepared and formed first, and then the first radiation piece may be prepared and formed according to the position of the cavity.
Step 20, as shown in fig. 19, providing a second substrate 200, where the second substrate 200 has a third board surface 200a, the third board surface 200a includes a cavity surface 210a and a soldering surface 220a, the cavity surface 210a is provided with a second radiation sheet, a solder resist structure 201 is provided at a connection position of the soldering surface 220a and the cavity surface 210a, and the solder resist structure 201 protrudes from the third board surface 200 a. The positions of the cavity surface 210a and the soldering surface 220a may be determined and designed by combining the position of the antenna pattern, the positions of the cavity and the cavity wall thereof, and the positions of the glue overflow hole and the solder resist structure may be determined according to the positions to be soldered.
The main body of the second substrate 200 may be manufactured by a conventional process, in this embodiment, the second substrate 200 has a multilayer structure, specifically, may be a six-layer structure substrate, and may be actually adjusted according to the wiring and performance requirements, the number of layers is not limited to the six-layer structure, and the number of layers may be reduced or increased. After the main body of the second substrate 200 is prepared, a solder mask structure is disposed on the third surface of the second substrate 200 according to the position of the glue overflow hole. The solder resist structure may be formed by coating a solder resist material.
The above steps 10 and 20 may not be in sequence.
In step 30, as shown in fig. 20, an adhesive 300 is applied to the bonding surface 220 a. The adhesive material 300 may be applied to the soldering surface 220a by dispensing. Here, in other embodiments, the glue may be applied by a steel mesh printing process, and the adhesive material may be: copper paste, tin paste, silver paste, low-fluidity adhesive resin glue, and the like.
Preferably, the diameter of the adhesive 300 is larger than that of the glue overflow hole 102, so that the adhesive 300 can be adhered to the second plate surface 100b, thereby improving the connection strength between the first substrate and the second substrate.
In this step, a gap may be provided between the adhesive material 300 and the solder resist structure 201 to avoid contamination caused by the adhesive material 300 crossing the solder resist structure 201 during the mounting process due to the excessive adhesive material 300.
Step 40, as shown in fig. 21, the opening of the cavity 10 faces the second substrate 200, the glue overflow hole 102 of the first substrate 100 is aligned with the adhesive material 300, the first substrate 100 is attached to the second substrate 200 and is abutted against the second substrate 200, and the adhesive material 300 is connected to the second substrate and extends into the glue overflow hole 102. Here, the first substrate 100 may be aligned to the second substrate 200 using a sheet-loading apparatus.
Step 50, as shown in fig. 22, the chip 400 is attached to the fourth surface 200b of the second substrate 200 by a conventional flip chip process.
In step 60, as shown in fig. 23, BGA (Ball Grid Array) balls 500 are implanted on the fourth surface 200b of the second substrate 200 by a conventional process to facilitate connection of the whole packaged antenna to a circuit board or the like.
According to the packaged antenna and the preparation method thereof provided by the invention, the first substrate 100 and the second substrate 200 are bonded by using the viscous material, the bonding welding points are designed at the glue overflow holes 102 of the cavity wall 101, and the bonding material 300 is extruded into the glue overflow holes 102 by using the pressure when the first substrate 100 is in pressure joint with the second substrate 200, so that a rivet-like structure is formed, and a good bonding effect between the first substrate 100 and the second substrate 200 is achieved. And packaging and mounting the chip and the BGA ball according to a conventional process. The cavity 10 between the first substrate 100 and the second substrate 200 is highly stable, and can maintain good stability even after a plurality of high-temperature thermal cycles. The excessive adhesive material 300 is effectively absorbed by the glue overflow hole 102 of the first substrate 100, and the process problems that the antenna area is polluted by glue overflow and the thickness of the viscous substance is difficult to control are effectively solved. Meanwhile, the flash glue and the glue on the second plate surface 100b form a rivet structure, which plays a good role in welding the first substrate 100 and the second substrate 200.
The above embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.
Claims (15)
1. A packaged antenna is characterized by comprising a first substrate and a second substrate, wherein the first substrate and the second substrate are stacked and are abutted and connected through an adhesive material;
the first substrate is provided with a first plate surface and a second plate surface which are arranged in a back-to-back mode, an antenna pattern is arranged on the first substrate, and the antenna pattern comprises a first radiation sheet; the second plate surface is arranged towards the second substrate, the first substrate is provided with a cavity, the cavity is of a groove structure arranged at the second plate surface, an opening of the cavity is positioned on the second plate surface and faces the second substrate, the cavity wall of the cavity is provided with a glue overflow hole, and the glue overflow hole penetrates through the first plate surface and the second plate surface;
the second substrate is provided with a third plate surface facing the first substrate, the third plate surface comprises a cavity surface and a welding surface, and a second radiation sheet is arranged on the cavity surface; the cavity surface is opposite to the cavity, and the cavity is positioned between the first radiation piece and the second radiation piece; the welding surface is opposite to the cavity wall of the cavity, a welding resistance structure is arranged at the joint of the welding surface and the cavity wall, and the welding resistance structure protrudes out of the third plate surface;
the bonding material is arranged on the welding surface, is opposite to the glue overflow hole, is connected with the second plate surface and extends into the glue overflow hole.
2. The packaged antenna according to claim 1, wherein a bonding pad is disposed on the soldering surface at a position corresponding to the glue overflow hole, and the adhesive material is disposed on the bonding pad;
the solder mask structure and the bonding pad are arranged at intervals, or the solder mask structure covers the edge of the bonding pad.
3. The packaged antenna of claim 1, wherein the bonding material is directly connected to the bonding surface.
4. The packaged antenna of claim 1, wherein the solder mask structure is annular, the solder mask structure is disposed opposite to the glue overflow hole, and an inner diameter of the solder mask structure is larger than an inner diameter of the glue overflow hole; alternatively, the first and second electrodes may be,
the solder mask structure is in a strip shape arranged along the cavity wall of the cavity.
5. The packaged antenna of claim 1, wherein the adhesive material is spaced from the solder resist structure.
6. The packaged antenna of any of claims 1-5, wherein the solder resist structure is made of a solder resist material.
7. The packaged antenna of claim 1, wherein the glue overflow hole is a stepped hole, the glue overflow hole comprises a first section of hole and a second section of hole, an inner diameter of the first section of hole is smaller than an inner diameter of the second section of hole, the first section of hole is close to the second substrate relative to the second section of hole, and the adhesive material is filled in the first section of hole and extends into the second section of hole.
8. The packaged antenna of claim 1, wherein the second board surface abuts the solder resist structure.
9. The packaged antenna according to any one of claims 1, wherein the second substrate has a fourth plate surface, and the fourth plate surface is disposed opposite to the third plate surface;
the packaged antenna further comprises a chip, and the chip is connected to the fourth board surface.
10. A mobile communication terminal, characterized in that it has a packaged antenna according to any of claims 1-8.
11. A method for manufacturing a packaged antenna, the method being used for manufacturing the packaged antenna according to any one of claims 1 to 9, the method comprising:
providing a first substrate, wherein the first substrate is provided with a first plate surface and a second plate surface which are arranged in a back-to-back mode, an antenna pattern is arranged on the first substrate, and the antenna pattern comprises a first radiation sheet; the first substrate is provided with a cavity, the cavity is of a groove structure arranged at the second plate surface and corresponds to the first radiation sheet in position, an opening of the cavity is located at the second plate surface, the cavity wall of the cavity is provided with a glue overflow hole, and the glue overflow hole penetrates through the first plate surface and the second plate surface;
providing a second substrate, wherein the second substrate is provided with a third plate surface, the third plate surface comprises a cavity surface and a welding surface, and a second radiation sheet is arranged on the cavity surface; a solder mask structure is arranged at the joint of the welding surface and the cavity surface; the solder resist structure protrudes out of the third board surface;
arranging an adhesive material on the welding surface;
and facing the opening of the cavity to the second substrate, aligning the glue overflow hole of the first substrate with the bonding material, then pasting the first substrate on the second substrate to enable the first substrate and the second substrate to be abutted, and connecting the bonding material with the second plate surface and extending into the glue overflow hole.
12. The method for manufacturing a packaged antenna according to claim 11, wherein the step of providing a first substrate further comprises the following sub-steps:
providing a copper-clad plate, wherein the copper-clad plate is provided with a first surface and a second surface which are oppositely arranged;
providing an antenna pattern on the first surface;
silk-screen printing a resin layer on the second surface and baking to form a cavity wall, wherein the cavity wall is closed to form a cavity;
and drilling glue overflow holes at the positions of the cavity walls, wherein the glue overflow holes penetrate through the copper-clad plate and the resin layer.
13. The method of claim 12, wherein the steps of printing a resin layer on the second surface and baking are repeatedly performed a plurality of times to achieve a predetermined thickness.
14. The method for manufacturing a packaged antenna according to claim 11, wherein in the step of disposing an adhesive material on the soldering surface, the adhesive material is disposed on the soldering surface by dispensing, and a diameter of the adhesive material is larger than a diameter of the glue overflow hole.
15. The method for manufacturing a packaged antenna according to claim 11, wherein in the step of disposing an adhesive material on the soldering face, a gap is disposed between the adhesive material and the solder resist structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810374945.8A CN110401005B (en) | 2018-04-24 | 2018-04-24 | Packaged antenna, preparation method thereof and mobile communication terminal |
| PCT/CN2019/080187 WO2019205883A1 (en) | 2018-04-24 | 2019-03-28 | Encapsulation antenna and preparation method therefor, and mobile communication terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810374945.8A CN110401005B (en) | 2018-04-24 | 2018-04-24 | Packaged antenna, preparation method thereof and mobile communication terminal |
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| CN110401005A CN110401005A (en) | 2019-11-01 |
| CN110401005B true CN110401005B (en) | 2021-01-29 |
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| CN (1) | CN110401005B (en) |
| WO (1) | WO2019205883A1 (en) |
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| CN110401005A (en) | 2019-11-01 |
| WO2019205883A1 (en) | 2019-10-31 |
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