CN211720827U - Active circuit printed board and phased array antenna - Google Patents
Active circuit printed board and phased array antenna Download PDFInfo
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- CN211720827U CN211720827U CN202020591021.6U CN202020591021U CN211720827U CN 211720827 U CN211720827 U CN 211720827U CN 202020591021 U CN202020591021 U CN 202020591021U CN 211720827 U CN211720827 U CN 211720827U
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Abstract
The utility model relates to the technical field of antennas, a active circuit printing board and phased array antenna is disclosed. The active circuit printed board comprises a first printed board and a second printed board; the first printed board is provided with a chip mounting area on the board surface facing the second printed board, and the chip mounting area is provided with a chip; the second printed board is provided with a first through groove which penetrates through the upper board surface and the lower board surface of the second printed board, and a projection area of the first through groove on the first printed board covers the chip mounting area; and the first printed board with the chip is connected with the second printed board with the first through groove in a laminated mode into a whole. The utility model discloses an active circuit printing board is made by pasting in advance the first printing board that is equipped with the chip and the second printing board range upon range of connection that has seted up logical groove in advance, adopts the design of logical groove to replace traditional blind groove, can enough reduce the processing complexity and the processing degree of difficulty, can ensure higher machining precision again, has reduced the wiring complexity and has pasted the chip operation degree of difficulty, has improved machining efficiency.
Description
Technical Field
The utility model relates to an antenna technology field especially relates to an active circuit printing board and phased array antenna and preparation technology thereof.
Background
Currently, most antennas, such as phased array antennas, require the use of an active circuit printed board and other printed boards laminated to form the entire laminated printed board.
The manufacturing process of the active circuit printed board comprises the following steps: firstly, pressing two printed boards with plane surfaces into a whole to obtain a pressed board; then, forming blind grooves with specified depth on the laminated plate; and finally, sticking a chip in the blind groove.
The manufacturing process and the manufactured product have the following defects:
the design of the blind groove not only leads to the complex layout and routing of the active plate in the design process, but also leads to the complex manufacturing process and the higher difficulty of the blind groove. In order to manufacture a blind slot with a specified depth, an initial blind slot is usually manufactured firstly, and the depth of the initial blind slot is smaller than the specified depth, so that a conductive adhesive film with a certain thickness is left at the bottom of the initial blind slot; and then the conductive adhesive film at the bottom of the groove is removed by some special means, so that the operation is complex, and part of the conductive adhesive film is always remained in the process, so that the manufacturing precision of the blind groove is limited.
In addition, the operation of attaching the chip in the blind slot is difficult, and the operation efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an active circuit printing board and phased array antenna and preparation technology thereof, the problem of the processing degree of difficulty that the solution prior art exists is big, the processing cost is high and efficient is solved.
To achieve the purpose, the embodiment of the present invention adopts the following technical solutions:
an active circuit printed board includes a first printed board and a second printed board;
a chip mounting area is preset on the surface of the first printed board facing the second printed board, and a chip is arranged in the chip mounting area;
the second printed board is provided with a first through groove penetrating through the upper board surface and the lower board surface of the second printed board, and the projection area of the first through groove on the first printed board covers the chip mounting area;
the first printed board with the chip attached thereon and the second printed board with the first through groove are connected into a whole in a stacked mode.
Optionally, the first printed board and the second printed board are connected by a reflow soldering method.
Optionally, the chip includes a radio frequency receiving chip, a radio frequency transmitting chip, or a radio frequency transceiving chip.
A phased array antenna comprises an antenna printed board, a vertical interconnection printed board and an active circuit printed board which are sequentially connected in a laminated mode through a conductive connecting layer; the active circuit printed board is as described in any of the above.
Optionally, a second through groove is formed in the vertical interconnection printed board, and the first through groove and the second through groove form a closed cavity for accommodating the chip.
Optionally, the conductive connection layer is a conductive adhesive film or solder.
Optionally, the surface of the active circuit printed board far away from the vertical interconnection printed board is further provided with a heat dissipation structure.
Optionally, the heat dissipation structure is a metal plate.
A process for manufacturing a phased array antenna, as described above, comprising:
respectively manufacturing the first printed board and the second printed board, wherein the chip is arranged in a chip mounting area of the first printed board, and the second printed board is provided with the first through groove;
laminating and connecting the first printed board and the second printed board to manufacture the active circuit printed board;
and the antenna printed board, the vertical interconnection printed board and the active circuit printed board are sequentially connected into a whole in a laminating way through a conductive connecting layer.
Optionally, the manufacturing process further includes: and a heat dissipation structure is arranged on the surface of the active circuit printed board far away from the vertical interconnection printed board.
The utility model discloses active circuit printing board is by pasting in advance the first printing board that is equipped with the chip and set up in advance the second printing board range upon range of connection of logical groove and make, and it has following beneficial effect:
1) the traditional blind groove design is replaced by the through groove design, so that the processing complexity and the processing difficulty can be greatly reduced, higher processing precision can be ensured, and only the second printed board with the corresponding thickness is required to be selected according to the required groove depth;
2) compared with the wiring on the plate surface with the groove, the embodiment can perform wiring on the planar plate surface of the first printed board, and wiring complexity is greatly reduced.
3) In the course of working, what adopt is pasting the chip on being planar face, compare with the mode of pasting the chip in the recess, greatly reduced the degree of difficulty of pasting the chip operation, improved machining efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of an active circuit printed board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a phased array antenna according to another embodiment of the present invention;
fig. 3 is a flowchart illustrating a manufacturing process of a phased array antenna according to another embodiment of the present invention.
In the figure:
the antenna comprises an active circuit printed board 10, a chip 20, an antenna printed board 30, a vertical interconnection printed board 40, a fuzz button 50, a conductive connection layer 60, a heat dissipation structure 70, a first printed board 11 and a second printed board 12.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of an active circuit printed board 10 according to an embodiment of the present invention. As shown in fig. 1, an active circuit printed board 10 according to an embodiment of the present invention includes: first printed board 11 and second printed board 12 are provided in a stacked arrangement.
The first printed board 11 is provided with a chip mounting area in advance on a board surface thereof facing the second printed board 12, and the chip 20 is mounted in the chip mounting area. The connection of the chip 20 and the active circuit board 10 is various, and for example, the chip 20 is soldered to the active circuit board 10.
The second printed board 12 is provided with a first through groove penetrating the upper and lower board surfaces thereof, and the projection area of the first through groove on the first printed board 11 covers the chip mounting area to avoid the chip 20.
The second printed board 12 provided with the first through groove and the first printed board 11 attached with the chip 20 are laminated and connected into a whole.
The connection manner of the first printed board 11 and the second printed board 12 is not particularly limited, and for example, a reflow soldering manner may be used. Reflow soldering refers to soldering by using different heating methods such as a reflow oven, an infrared heating lamp, or a heat gun, after connecting the first printed board 11 to the second printed board 12 with solder paste (a mixture of solder and flux), and melting the solder by controlled heating to achieve permanent bonding.
It should be noted that, in the conventional manner, the manufacturing process of the active circuit printed board 10 is as follows: the two printed boards are firstly pressed into a whole to obtain a pressed board, then a blind groove is arranged on the pressed board, and finally the chip 20 is stuck in the blind groove. In the process, the manufacturing process of the blind groove is relatively complex, and the manufacturing precision is relatively low, because: in order to reach the blind groove with the designated depth, an initial blind groove is usually manufactured, and the depth of the initial blind groove is smaller than the designated depth, so that a conductive adhesive film with a certain thickness is reserved at the bottom of the initial blind groove; and removing the conductive adhesive film at the bottom of the groove by some conventional means, wherein the operation is complex, and part of the conductive adhesive film is often remained in the process, so that the manufacturing precision of the blind groove is limited.
In the present embodiment, the active circuit printed board 10 is formed by laminating and connecting a first printed board 11 on which a chip 20 is previously mounted and a second printed board 12 on which a first through-groove is previously formed.
On one hand, the surface of the designated chip mounting area of the first printed board 11 is a plane, and compared with a mode of attaching the chip 20 in the groove, the operation of attaching the chip 20 on the plane is obviously simpler and faster; meanwhile, compared with wiring on a plate surface formed with a groove, wiring on a plate surface which is a plane is simpler.
On the other hand, the manufacturing step of the blind groove with the designated depth is omitted in the embodiment, only the through groove is required to be formed in the designated area of the second printed board 12, the processing complexity and the processing difficulty can be greatly reduced, the higher processing precision can be ensured, and only the second printed board 12 with the corresponding thickness needs to be selected according to the depth of the required groove.
Fig. 2 is a schematic structural diagram of a phased array antenna according to another embodiment of the present invention. As shown in fig. 2, the phased array antenna of the present embodiment includes: the antenna printed board 30, the vertical interconnection printed board 40, and the active circuit printed board 10 are sequentially connected in a stacked manner.
The structure of the active circuit printed board 10 is shown in fig. 1, and includes a first printed board 11 and a second printed board 12 which are arranged in a stacked manner.
A chip mounting area is preset on a surface of the first printed board 11 facing the first printed board 11, a chip 20 is attached to the chip mounting area, and the chip 20 is one of a radio frequency receiving chip, a radio frequency transmitting chip, and a radio frequency transceiving chip.
The second printed board 12 is provided with a first through groove penetrating the upper and lower board surfaces thereof, and the projection area of the first through groove on the first printed board 11 covers the chip mounting area to avoid the chip 20.
The second printed board 12 provided with the first through groove and the first printed board 11 attached with the chip 20 are laminated and connected into a whole. The connection method of the two is not particularly limited, and for example, a reflow soldering method may be used.
On the vertical interconnection printed board 40, a second through groove penetrating the upper and lower board surfaces thereof is formed in a position corresponding to the chip mounting area, and when the antenna printed board 30, the vertical interconnection printed board 40 and the active circuit printed board 10 are connected into a whole, the first through groove and the second through groove form a closed cavity capable of accommodating the chip 20, thereby providing a normal working environment for the chip 20. Meanwhile, the vertical interconnection printed board 40 is provided with the fuzz button 50, and the antenna printed board 30 and the radio frequency path of the active circuit printed board 10 can be effectively connected together by using the fuzz button 50.
Specifically, antenna printing board 30, perpendicular interconnection printing board 40 and active circuit printing board 10 connect through electrically conductive articulamentum 60 between the three, and this electrically conductive articulamentum 60's implementation has a plurality ofly, and is exemplary, and electrically conductive articulamentum 60 is conductive adhesive film, soldering tin or conductive adhesive etc. the embodiment of the utility model provides a do not do specifically to this and restrict.
In order to realize heat dissipation of the components such as the active circuit printed board 10 and the chip 20, as shown in fig. 2, optionally, the phased array antenna of the present embodiment further includes a heat dissipation structure 70, where the heat dissipation structure 70 is mounted on a board surface of the active circuit printed board 10 away from the vertical interconnection printed board 40.
The connection manner of the heat dissipation structure 70 and the active circuit printed board 10 is various, and is not particularly limited. The heat dissipation structure 70 may be a metal plate, and the metal plate is in contact with the active circuit printed board 10, so that good supporting and heat dissipation effects can be achieved. In operation, heat generated from the chip 20 is transferred to the active circuit printed board 10, and since the active circuit printed board 10 is in contact with the metal plate, the heat of the chip 20 is transferred to the metal plate through the active circuit printed board 10, thereby achieving heat dissipation. Of course, the heat dissipation structure 70 may also adopt other structures, and the present invention is not limited thereto.
As shown in fig. 3, another embodiment of the present invention further provides a manufacturing process of a phased array antenna, which specifically includes the steps of:
For example, the first printed board 11 and the second printed board 12 may be connected by reflow soldering.
Wherein, the vertical interconnection printed board 40 is provided with a second through groove, and the second through groove and the first through groove of the active circuit printed board 10 form a closed cavity for accommodating the chip 20, so as to provide a good working environment for the chip 20.
Illustratively, the conductive connection layer 60 may be a conductive adhesive film, a solder paste, or other materials having both conductive and connecting functions.
Illustratively, the heat dissipation structure 70 is a metal plate, which serves both as a support and a heat sink. The heat dissipation structure 70 may be disposed by adhering or welding, or other methods.
In summary, in the present embodiment, different conventional manufacturing processes of the active circuit printed board 10 are adopted, the first printed board 11 provided with the chip 20 and the second printed board 12 provided with the through groove are manufactured first, and then are welded and connected, so that compared with the conventional method of pressing, opening the blind groove, and finally attaching the chip 20, the complexity, difficulty and cost of the manufacturing process are greatly reduced, the manufacturing accuracy is improved, and the product quality is effectively ensured.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (8)
1. An active circuit printed board is characterized by comprising a first printed board and a second printed board;
a chip mounting area is preset on the surface of the first printed board facing the second printed board, and a chip is arranged in the chip mounting area;
the second printed board is provided with a first through groove penetrating through the upper board surface and the lower board surface of the second printed board, and the projection area of the first through groove on the first printed board covers the chip mounting area;
the first printed board with the chip attached thereon and the second printed board with the first through groove are connected into a whole in a stacked mode.
2. The active circuit printed board according to claim 1, wherein the first printed board and the second printed board are connected by reflow soldering.
3. The active circuit printed board according to claim 1, wherein the chip includes a radio frequency receiving chip, a radio frequency transmitting chip, or a radio frequency transceiving chip.
4. A phased array antenna is characterized by comprising an antenna printed board, a vertical interconnection printed board and an active circuit printed board which are sequentially connected in a laminating way through a conductive connecting layer; the active circuit printed board is as claimed in any one of claims 1 to 3.
5. The phased array antenna as claimed in claim 4, wherein said vertical interconnection printed board has a second through-slot formed therein, said first through-slot and said second through-slot forming an enclosed cavity for accommodating said chip.
6. The phased array antenna of claim 4, wherein the conductive connection layer is a conductive adhesive film or solder.
7. The phased array antenna according to claim 4, wherein a heat dissipation structure is further provided on a surface of the active circuit printed board away from the vertical interconnection printed board.
8. The phased array antenna of claim 7, wherein the heat dissipating structure is a metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020591021.6U CN211720827U (en) | 2020-04-20 | 2020-04-20 | Active circuit printed board and phased array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020591021.6U CN211720827U (en) | 2020-04-20 | 2020-04-20 | Active circuit printed board and phased array antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211720827U true CN211720827U (en) | 2020-10-20 |
Family
ID=72835624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020591021.6U Active CN211720827U (en) | 2020-04-20 | 2020-04-20 | Active circuit printed board and phased array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211720827U (en) |
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2020
- 2020-04-20 CN CN202020591021.6U patent/CN211720827U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An active circuit printed board and phased array antenna Effective date of registration: 20230717 Granted publication date: 20201020 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: CHENGDU KESAI TECHNOLOGY Co.,Ltd. Registration number: Y2023980048775 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |