CN110381717B - 一种半导体贴片焊接自动排布设备 - Google Patents
一种半导体贴片焊接自动排布设备 Download PDFInfo
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- CN110381717B CN110381717B CN201910536282.XA CN201910536282A CN110381717B CN 110381717 B CN110381717 B CN 110381717B CN 201910536282 A CN201910536282 A CN 201910536282A CN 110381717 B CN110381717 B CN 110381717B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000003466 welding Methods 0.000 title claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 25
- 238000005192 partition Methods 0.000 claims description 8
- 230000002452 interceptive effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 2
- 230000001360 synchronised effect Effects 0.000 claims 2
- 230000005611 electricity Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910536282.XA CN110381717B (zh) | 2019-06-20 | 2019-06-20 | 一种半导体贴片焊接自动排布设备 |
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CN201910536282.XA CN110381717B (zh) | 2019-06-20 | 2019-06-20 | 一种半导体贴片焊接自动排布设备 |
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CN110381717A CN110381717A (zh) | 2019-10-25 |
CN110381717B true CN110381717B (zh) | 2020-04-28 |
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CN201910536282.XA Active CN110381717B (zh) | 2019-06-20 | 2019-06-20 | 一种半导体贴片焊接自动排布设备 |
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CN (1) | CN110381717B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111128801B (zh) * | 2019-12-01 | 2024-04-05 | 深圳市嘉旺达科技有限公司 | 一种半导体贴片自动放置*** |
CN111430280B (zh) * | 2020-05-07 | 2024-05-17 | 度亘天元激光科技(丹阳)有限公司 | 一种多功能半导体激光器芯片的自动贴片生产线 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11145688A (ja) * | 1990-01-23 | 1999-05-28 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP3425868B2 (ja) * | 1998-08-20 | 2003-07-14 | 太陽誘電株式会社 | 電子部品供給装置 |
CN102832159A (zh) * | 2012-09-14 | 2012-12-19 | 天津必利优科技发展有限公司 | 高速取放微小轻小物体的高速摆杆组件 |
CN204893243U (zh) * | 2015-08-10 | 2015-12-23 | 苏州市丰本精密自动化设备有限公司 | 自动点焊机 |
CN207289404U (zh) * | 2017-09-15 | 2018-05-01 | 丽清汽车科技(上海)有限公司 | 一种在pcb上组装灯芯的循环式组装设备 |
CN208938933U (zh) * | 2018-10-29 | 2019-06-04 | 拓思精工科技(苏州)有限公司 | 一种化合物半导体平面片贴片机 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4126762B2 (ja) * | 1998-07-30 | 2008-07-30 | 松下電器産業株式会社 | 電子部品の実装方法 |
CN106493909B (zh) * | 2016-09-30 | 2019-01-18 | 东莞市信瑞智能科技有限公司 | 一种全自动吸塑机及吸塑机取收料方法 |
CN108305845B (zh) * | 2018-01-29 | 2020-06-23 | 江苏长电科技股份有限公司 | 半导体自动装片机构及运行方法 |
-
2019
- 2019-06-20 CN CN201910536282.XA patent/CN110381717B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11145688A (ja) * | 1990-01-23 | 1999-05-28 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP3425868B2 (ja) * | 1998-08-20 | 2003-07-14 | 太陽誘電株式会社 | 電子部品供給装置 |
CN102832159A (zh) * | 2012-09-14 | 2012-12-19 | 天津必利优科技发展有限公司 | 高速取放微小轻小物体的高速摆杆组件 |
CN204893243U (zh) * | 2015-08-10 | 2015-12-23 | 苏州市丰本精密自动化设备有限公司 | 自动点焊机 |
CN207289404U (zh) * | 2017-09-15 | 2018-05-01 | 丽清汽车科技(上海)有限公司 | 一种在pcb上组装灯芯的循环式组装设备 |
CN208938933U (zh) * | 2018-10-29 | 2019-06-04 | 拓思精工科技(苏州)有限公司 | 一种化合物半导体平面片贴片机 |
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CN110381717A (zh) | 2019-10-25 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200407 Address after: 318020 No.30, juningfeng Road, Hengjie, Ningxi Town, Huangyan District, Taizhou City, Zhejiang Province Applicant after: Taizhou Huangyan rilong mould factory (general partnership) Address before: 350004 campus of Fujian Taijiang Medical College, No.1 Xueyuan Road, Shangjie Town, Minhou County, Fuzhou City, Fujian Province Applicant before: Teng Jimei |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An automatic arrangement device for semiconductor patch welding Effective date of registration: 20211229 Granted publication date: 20200428 Pledgee: Taizhou Huangyan sub branch of Zhejiang Tailong Commercial Bank Co.,Ltd. Pledgor: Taizhou Huangyan rilong mould factory (general partnership) Registration number: Y2021980017124 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200428 Pledgee: Taizhou Huangyan sub branch of Zhejiang Tailong Commercial Bank Co.,Ltd. Pledgor: Taizhou Huangyan rilong mould factory (general partnership) Registration number: Y2021980017124 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240324 Address after: Building 1, 3rd Floor, No.123 Chutian Road, Xixing Street, Binjiang District, Hangzhou City, Zhejiang Province, 310051 Patentee after: Hangzhou Huayu Zhixun Technology Co.,Ltd. Country or region after: China Address before: 318020 No. 30, juningfeng Road, Hengjie, Ningxi Town, Huangyan District, Taizhou City, Zhejiang Province Patentee before: Taizhou Huangyan rilong mould factory (general partnership) Country or region before: China |