CN110370374A - A kind of method of circuit board substrate capillary processing - Google Patents
A kind of method of circuit board substrate capillary processing Download PDFInfo
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- CN110370374A CN110370374A CN201910679860.5A CN201910679860A CN110370374A CN 110370374 A CN110370374 A CN 110370374A CN 201910679860 A CN201910679860 A CN 201910679860A CN 110370374 A CN110370374 A CN 110370374A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention provides a kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed control of auger spindle is 150-168krpm, the rate of feed is 1.5-3.0m/min, the rate for returning knife is 15-18cm/s, and offset 0.4-0.6, hole is limited to 1500-2300hits.The present invention can effectively solve that the hole wall occurred in circuit board substrate micropore boring procedure is excessively coarse, is easy to break blade, the problems such as processing efficiency is too low, effectively improve production efficiency, save the production time, productivity and product quality are improved, realizes the sustainable development of economic benefit and social benefit.
Description
Technical field
The invention belongs to wiring board capillary processing technical fields, and in particular to a kind of side of circuit board substrate capillary processing
Method.
Background technique
With the fast development of national economy and digital information technique, people start to mention printed circuit board end product
Increasingly higher demands out, and the layout density of printed circuit board is being stepped up, so just needing to reduce boring aperture, is
The layout density of printed circuit board is increased, this is undoubtedly a kind of development trend of state-of-the-art technology.But with regard to the printing of current generation
The facture of micropore for circuit board current situation, most commonly seen method just there are two types of: one is machine drilling, it is another then
It is laser drill, and merely for technical capability level, as long as aperture is more than 0.15m m's, machine drilling can be used,
And the aperture less than 0.1mm can use laser drill.Can laser drill technique because its price it is extremely high, and production costs
With also high, this can larger production to a certain extent production cost.Thus, it is most of that machine drilling can all be selected to be added
Work.
In boring procedure, either the accuracy of drilling machine, plate, speed of mainshaft degree or feed speed, running speed,
A variety of elements such as the type and thickness of running speed and cover board can all directly influence the quality of bore process, but also can band
To adversely affect.This is because the condition of drilling can constantly change, and unnecessary trouble can be also brought to above-mentioned factor,
If only simply by rule of thumb if optimize the parameter of bore process, that is that success will follow.Along with above-mentioned a variety of elements
Between be all interactional, if a kind of speed changes, other speed then can immediately change.In the prior art
Circuit board substrate capillary processing is easy to appear that hole wall is excessively coarse, to be easy to break blade, processing efficiency excessively low various asks
Topic, continues to improve.
Summary of the invention
In view of this, the present invention provides a kind of method of circuit board substrate capillary processing, the present invention can effectively solve line
The hole wall occurred in the plate substrate micropore boring procedure of road is excessively coarse, is easy to break blade, the problems such as processing efficiency is too low, effectively
Production efficiency is improved, the production time is saved, improves productivity and product quality, realizes the sustainable of economic benefit and social benefit
Development.
The technical solution of the present invention is as follows:
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.2mm, the drilling parameter: the revolving speed control of auger spindle is 168krpm,
The rate of feed is 1.5-2.5m/min, and the rate for returning knife is 15cm/s, and offset 0.5, hole is limited to 1500-2300hits.
Further, when the aperture of drilling is 0.25mm, the drilling parameter: the revolving speed control of auger spindle is 162-
168krpm, the rate of feed are 2.0-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-
2300hits。
Further, when the aperture of drilling is 0.3mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
Further, when the aperture of drilling is 0.35mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
Further, when the aperture of drilling is 0.4mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
Further, when the aperture of drilling is 0.45mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
It is worth noting that, during digital control hole drilling, the either accuracy of drilling machine, plate, speed of mainshaft degree, still
A variety of elements such as feed speed, running speed, the type of running speed and cover board and thickness can all directly influence drillman
The quality of skill, but also adverse effect can be brought.This is because drilling condition can constantly change, and can also to it is above-mentioned because
Element brings unnecessary trouble, so, if only simply
The parameter for just optimizing bore process by rule of thumb, that is that success will follow.Along with being all between above-mentioned a variety of elements
Interactional, if a kind of speed changes, other speed then can immediately change.Thus, the present invention passes through big
The creative test of amount, obtains a set of reasonable and effective use experimental design, it is mainly with Probability Theory and Math Statistics work
For theory practice basis, and science is tested, and occurs that hole wall is excessively coarse, is easy to break knife in the boring procedure that achieves a solution
The parametric technique of the problems such as piece, too low processing efficiency.
It further, further include that subsection hole-drilling is carried out to z axis.
Because of process requirement, routine will do it lamination when drilling.When drilling through orifice plate from top to bottom lamination be followed successively by aluminium flake,
PCB plate, cardboard.Printed wiring board shifts and influences machining accuracy when drilling processing in order to prevent, and drilling factory generallys use pin
Above-mentioned laminated plate is fixed the mode of nail, and the laminated plate with pin is using folder PIN device or is fixed on two on bakelite plate
Kind mode is fixed on PCB numerical controlled machinery drilling machine.
Z is bored downwards since the H of trip-out position, and drilling stroke includes that aluminium flake thickness, PCB plate thickness and a part of cardboard are thick
The summation of degree and surplus.H is drilling operator's calculating and setting, and for balance by operator's sets itself, Normal practice is to estimate
The thickness and lamination number, aluminium flake thickness for calculating PCB plate, estimate that certain surplus is set further according to experience.Due to PCB plate thickness
Degree has deviation, in estimated thickness, is set to H value in order to safely relatively high.As printed wiring board is to light and short variation
Trend, hole is smaller and smaller also more and more intensive, therefore x, y are short to mobile distance when PCB numerical controlled machinery drilling machine drills,
Z needs to drill aluminium flake and multilayer laminated PCB plate to vertical movement distance and part cardboard, stroke are relatively long.So right
In PCB numerical controlled machinery drilling machine, z more influences the penetration rate of complete machine to feed, withdrawing speed.The drilling process of standard is x, y
Axis linkage is adjusted and is bored under good rear z axis, and x, y are to when movement, and since pitch of holes is close, usual x, y are to motor without reaching most
It brakes and stops when big speed, x, y could be only embodied in long distance movement to the fireballing superiority of motor movement.Closely
Distance drilling z upgrades determinant to drilling efficiency to movement velocity.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.The speed that partial journey is bored under z axis is improved by the method, the lower target position bored of high speed is defeated by client
Enter, can adjust.
The present invention can effectively solve that the hole wall occurred in circuit board substrate micropore boring procedure is excessively coarse, is easy to break
The problems such as blade, too low processing efficiency, effectively improves production efficiency, saves the production time, improves productivity and product quality, real
The sustainable development of existing economic benefit and social benefit.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with specific embodiment, to this
Invention is described in further detail.It should be understood that the specific embodiments described herein are only to explain this hair
It is bright, and the scope of protection of the present invention is not limited.
Embodiment 1
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.2mm, the drilling parameter: the revolving speed control of auger spindle is 168krpm,
The rate of feed is 1.5-2.5m/min, and the rate for returning knife is 15cm/s, and offset 0.5, hole is limited to 1500-2300hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 2
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.25mm, the drilling parameter: the revolving speed control of auger spindle is 162-
168krpm, the rate of feed are 2.0-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-
2300hits。
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 3
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.3mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 4
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.35mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 5
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.4mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 6
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.45mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.5-3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 7
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.2mm, the drilling parameter: the revolving speed control of auger spindle is 168krpm,
The rate of feed is 2.0m/min, and the rate for returning knife is 15cm/s, and offset 0.5, hole is limited to 2000hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 8
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.25mm, the drilling parameter: the revolving speed control of auger spindle is 165krpm,
The rate of feed is 2.5m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2000hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 9
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.3mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.8m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2000hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 10
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.35mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.7m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2100hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 11
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.4mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.8m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1900hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 12
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.45mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.7m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2000hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 13
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.2mm, the drilling parameter: the revolving speed control of auger spindle is 168krpm,
The rate of feed is 1.5m/min, and the rate for returning knife is 15cm/s, and offset 0.5, hole is limited to 1500hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 14
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.25mm, the drilling parameter: the revolving speed control of auger spindle is 162krpm,
The rate of feed is 2.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 15
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.3mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.5m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 16
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.35mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.5m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 17
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.4mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.5m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 18
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.45mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.5m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 1500hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 19
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.2mm, the drilling parameter: the revolving speed control of auger spindle is 168krpm,
The rate of feed is 2.3m/min, and the rate for returning knife is 15cm/s, and offset 0.5, hole is limited to 2200hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 20
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.25mm, the drilling parameter: the revolving speed control of auger spindle is 168krpm,
The rate of feed is 2.6m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2300hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 21
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.3mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.8m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2300hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 22
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.35mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm,
The rate of feed is 2.8m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 500-2300hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 23
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.4mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 3.0m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2100hits.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
Embodiment 24
A kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed of auger spindle, which controls, is
150-168krpm, the rate of feed are 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6, hole
It is limited to 1500-2300hits.
Further, the drilling parameter is suitable for the micropore that hole diameter is 0.2-0.45mm.
Further, when the aperture of drilling is 0.45mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm,
The rate of feed is 2.7m/min, and the rate for returning knife is 18cm/s, and offset 0.45, hole is limited to 2200hits.
It further, further include that subsection hole-drilling is carried out to z axis.
Further, it is x, y mobile to target hole simultaneously to crossbeam platform that the z-axis, which carries out subsection hole-drilling movement decomposition,；
After reaching target hole, z axis high speed is lower to be bored；Z axis reach close to aluminium flake height when, be changed to bore under feed speed；Z after the completion of drilling
It is lifted in axis high speed.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (10)
1. a kind of method of circuit board substrate capillary processing, which is characterized in that including controlling drilling parameter: the revolving speed control of auger spindle
For 150-168krpm, the rate of feed is 1.5-3.0m/min, and the rate for returning knife is 15-18cm/s, offset 0.4-0.6,
Hole is limited to 1500-2300hits.
2. the method for circuit board substrate capillary processing according to claim 1, which is characterized in that the drilling parameter is applicable in
In the micropore that hole diameter is 0.2-0.45mm.
3. the method for circuit board substrate capillary processing according to claim 2, which is characterized in that when the aperture of drilling is
When 0.2mm, the drilling parameter: the revolving speed control of auger spindle is 168krpm, and the rate of feed is 1.5-2.5m/min, returns knife
Rate is 15cm/s, and offset 0.5, hole is limited to 1500-2300hits.
4. the method for circuit board substrate capillary processing according to claim 2, which is characterized in that when the aperture of drilling is
When 0.25mm, the drilling parameter: the revolving speed control of auger spindle is 162-168krpm, and the rate of feed is 2.0-3.0m/min, is returned
The rate of knife is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
5. the method for circuit board substrate capillary processing according to claim 2, which is characterized in that when the aperture of drilling is
When 0.3mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm, and the rate of feed is 2.5-3.0m/min, returns knife
Rate is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
6. the method for circuit board substrate capillary processing according to claim 2, which is characterized in that when the aperture of drilling is
When 0.35mm, the drilling parameter: the revolving speed control of auger spindle is 155krpm, and the rate of feed is 2.5-3.0m/min, returns knife
Rate is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
7. the method for circuit board substrate capillary processing according to claim 2, which is characterized in that when the aperture of drilling is
When 0.4mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm, and the rate of feed is 2.5-3.0m/min, returns knife
Rate is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
8. the method for circuit board substrate capillary processing according to claim 2, which is characterized in that when the aperture of drilling is
When 0.45mm, the drilling parameter: the revolving speed control of auger spindle is 150krpm, and the rate of feed is 2.5-3.0m/min, returns knife
Rate is 18cm/s, and offset 0.45, hole is limited to 1500-2300hits.
9. the method for circuit board substrate capillary processing according to claim 1, which is characterized in that further include being carried out to z axis
Subsection hole-drilling.
10. the method for circuit board substrate capillary processing according to claim 9, which is characterized in that the z-axis is segmented
It is mobile to target hole simultaneously to crossbeam platform that boring action is decomposed into x, y；After reaching target hole, z axis high speed is lower to be bored；Z axis arrives
When up to height close to aluminium flake, it is changed to bore under feed speed；It is lifted in z axis high speed after the completion of drilling.
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| CN201910679860.5A CN110370374A (en) | 2019-07-26 | 2019-07-26 | A kind of method of circuit board substrate capillary processing |
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| CN201910679860.5A CN110370374A (en) | 2019-07-26 | 2019-07-26 | A kind of method of circuit board substrate capillary processing |
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| CN111716444A (en) * | 2020-06-24 | 2020-09-29 | 江西景旺精密电路有限公司 | PCB drilling method |
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