CN110364515A - 发光模块的制造方法及发光模块 - Google Patents

发光模块的制造方法及发光模块 Download PDF

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Publication number: CN110364515A
Authority: CN; China
Prior art keywords: light; guide plate; section; emitting; recess portion
Prior art date: 2018-03-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201910232439.XA

Other languages

English (en)

Chinese (zh)

Inventor

桥本启

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Japan Chemical Co

Nichia Corp

Original Assignee

Japan Chemical Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-03-26

Filing date

2019-03-26

Publication date

2019-10-22

2019-03-26 Application filed by Japan Chemical Co filed Critical Japan Chemical Co

2019-10-22 Publication of CN110364515A publication Critical patent/CN110364515A/zh

Status Pending legal-status Critical Current

Links

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Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H—ELECTRICITY
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Computer Hardware Design (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Planar Illumination Modules (AREA)
Securing Globes, Refractors, Reflectors Or The Like (AREA)

CN201910232439.XA 2018-03-26 2019-03-26 发光模块的制造方法及发光模块 Pending CN110364515A (zh)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2018-059064		2018-03-26
JP2018059064		2018-03-26
JP2019056065A JP6879325B2 (ja)	2018-03-26	2019-03-25	発光モジュールの製造方法及び発光モジュール
JP2019-056065		2019-03-25

Publications (1)

Publication Number	Publication Date
CN110364515A true CN110364515A (zh)	2019-10-22

Family

ID=68169625

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201910232439.XA Pending CN110364515A (zh)	2018-03-26	2019-03-26	发光模块的制造方法及发光模块

Country Status (4)

Country	Link
JP (1)	JP6879325B2 (ja)
KR (1)	KR102512369B1 (ja)
CN (1)	CN110364515A (ja)
TW (1)	TWI750466B (ja)

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JP2021100090A (ja) *	2019-12-20	2021-07-01	日亜化学工業株式会社	発光モジュールの製造方法
CN114114749A (zh) *	2020-08-31	2022-03-01	日亚化学工业株式会社	发光模块的制造方法

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JP6864875B2 (ja)	2019-08-30	2021-04-28	日亜化学工業株式会社	発光モジュール及びその製造方法
US20220333615A1 (en)	2019-09-26	2022-10-20	Ebara Corporation	Vertical multi-stage pump
JP6828794B1 (ja)	2019-11-29	2021-02-10	日亜化学工業株式会社	面発光光源
JP7140987B2 (ja) *	2019-12-25	2022-09-22	日亜化学工業株式会社	発光モジュール及び発光モジュールの製造方法
US11581460B2 (en)	2019-12-25	2023-02-14	Nichia Corporation	Light emitting module and method for manufacturing light emitting module
JP7002714B2 (ja) *	2020-01-31	2022-02-04	日亜化学工業株式会社	発光モジュール、面状光源、及び発光モジュールの製造方法
WO2021153561A1 (ja)	2020-01-31	2021-08-05	日亜化学工業株式会社	面状光源
JP6924958B1 (ja) *	2020-01-31	2021-08-25	日亜化学工業株式会社	面状光源
TWI786715B (zh) *	2020-07-21	2022-12-11	日商日亞化學工業股份有限公司	發光模組及面狀光源
JP7144694B2 (ja)	2020-07-31	2022-09-30	日亜化学工業株式会社	発光モジュール、面状光源、液晶表示装置
JP7239839B2 (ja) *	2020-08-31	2023-03-15	日亜化学工業株式会社	発光モジュール
JP7270133B2 (ja) *	2020-08-31	2023-05-10	日亜化学工業株式会社	発光モジュールの製造方法
JP7277865B2 (ja) *	2020-10-29	2023-05-19	日亜化学工業株式会社	面状光源及びその製造方法

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2019
- 2019-03-25 JP JP2019056065A patent/JP6879325B2/ja active Active
- 2019-03-26 KR KR1020190034704A patent/KR102512369B1/ko active IP Right Grant
- 2019-03-26 CN CN201910232439.XA patent/CN110364515A/zh active Pending
- 2019-03-26 TW TW108110432A patent/TWI750466B/zh active

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JP2021100090A (ja) *	2019-12-20	2021-07-01	日亜化学工業株式会社	発光モジュールの製造方法
JP7111993B2 (ja)	2019-12-20	2022-08-03	日亜化学工業株式会社	発光モジュールの製造方法
CN114114749A (zh) *	2020-08-31	2022-03-01	日亚化学工业株式会社	发光模块的制造方法
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Also Published As

Publication number	Publication date
JP6879325B2 (ja)	2021-06-02
JP2019175846A (ja)	2019-10-10
TW202005112A (zh)	2020-01-16
TWI750466B (zh)	2021-12-21
KR20190112675A (ko)	2019-10-07
KR102512369B1 (ko)	2023-03-20

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2019-10-22	PB01	Publication
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Publication	Publication Date	Title
CN110364515A (zh)	2019-10-22	发光模块的制造方法及发光模块
EP3547377B1 (en)	2021-06-30	Method of manufacturing light emitting module, and light emitting module
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