CN110349879B - Manipulator transmission mechanism, transmission cavity and semiconductor processing equipment - Google Patents
Manipulator transmission mechanism, transmission cavity and semiconductor processing equipment Download PDFInfo
- Publication number
- CN110349879B CN110349879B CN201810288397.7A CN201810288397A CN110349879B CN 110349879 B CN110349879 B CN 110349879B CN 201810288397 A CN201810288397 A CN 201810288397A CN 110349879 B CN110349879 B CN 110349879B
- Authority
- CN
- China
- Prior art keywords
- lead screw
- transmission
- manipulator
- connecting piece
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
Abstract
The invention relates to a manipulator transmission mechanism, comprising: the device comprises a guide block, a first connecting piece, a second connecting piece and a transmission piece; the guide block is connected with a first connecting piece, and the first connecting piece is used for enabling the guide block to move along the first connecting piece under the driving of the driver; the guide block is provided with a first guide rail, and the manipulator is arranged in the first guide rail; the transmission part is connected with the first connecting part and the second connecting part, the second connecting part is connected with the manipulator and used for transmitting the motion of the first connecting part to the second connecting part, and the second connecting part drives the manipulator to move towards a target position or away from the target position along the first guide rail. The invention also provides a transmission cavity and semiconductor processing equipment. The film conveying device is simple in structure, and the transmission mechanical arm is in place at one time, so that the film conveying time is short and the film conveying efficiency is high.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment manufacturing, and particularly relates to a manipulator transmission mechanism, a transmission cavity and semiconductor processing equipment.
Background
In the wafer etching process in the fields of integrated circuits, semiconductor illumination, micro electro mechanical systems and the like, a plasma dry etching device is generally adopted to complete the etching process of a wafer. To improve the automation and safety of the equipment, the wafers are generally transported by an automated device.
Fig. 1 is a simplified schematic diagram of a typical single chamber semiconductor processing tool, and referring to fig. 1, the tool includes: the process chamber 1 and the transmission chamber 2 are connected through the gate valve 3, a mechanical arm 21 is arranged in the transmission chamber 2, before the process, the transmission chamber 2 is in an atmospheric state, a wafer is placed on a finger of the mechanical arm 21, then the transmission chamber 2 is vacuumized, then the gate valve 3 is opened, the mechanical arm 21 transmits the wafer to a bearing position in the process chamber 1, the mechanical arm 21 retracts into the transmission chamber 2, the gate valve 3 is closed, and therefore the wafer transmission is completed.
It should be noted that a robot driving mechanism is further provided in the transfer chamber 2 for driving the robot so that the robot can be transferred between the transfer chamber 2 and the process chamber 1. However, the structure of the current robot transmission mechanism is relatively complex, and the transfer process is complex, thereby resulting in a long time for transferring the wafer.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a manipulator transmission mechanism, a transmission cavity and semiconductor processing equipment.
In order to solve the above problems, the present invention provides a manipulator transmission mechanism, including: the device comprises a guide block, a first connecting piece, a second connecting piece and a transmission piece; the guide block is connected with the first connecting piece, and the first connecting piece is used for enabling the guide block to move along the first connecting piece under the driving of a driver;
the guide block is provided with a first guide rail, and the manipulator is arranged in the first guide rail;
the transmission part is connected with the first connecting part and the second connecting part, the second connecting part is connected with the manipulator and used for transmitting the motion of the first connecting part to the second connecting part, and the second connecting part drives the manipulator to move towards or away from a target position along the first guide rail.
Preferably, the first connecting piece is a first lead screw;
the second connecting piece is a second lead screw;
the guide block is sleeved on the first lead screw and used for enabling the first lead screw to rotate along a first direction and enabling the guide block to move towards a target position along the first lead screw under the driving of a driver, and the first lead screw rotates along a second direction and enables the guide block to move away from the target position along the first lead screw;
the second lead screw is fixed with one of the transmission part and the manipulator and is in threaded connection with the other one;
the transmission part is used for transmitting the rotary motion of the first lead screw along the first direction to the second lead screw, so that the manipulator connected with the second lead screw moves towards the target position along the first guide rail, and transmitting the rotary motion of the first lead screw along the second direction to the second lead screw, so that the manipulator connected with the second lead screw moves away from the target position along the first guide rail.
Preferably, the method further comprises the following steps: a guide rail plate;
a second guide rail is arranged on the guide rail plate;
the guide block is disposed on the second guide rail to move along the second guide rail.
Preferably, the transmission member comprises: the first gear and the second gear are meshed;
the first gear is connected with the first lead screw;
the second gear is connected with the second lead screw.
Preferably, the transmission further comprises: two parallel baffles arranged on the guide rail plate;
the first gear and the second gear are disposed between the two parallel baffles.
Preferably, the second lead screw is fixedly connected with the manipulator and is in threaded connection with the second gear;
through holes are formed in the two parallel baffles and are used as channels for the second lead screw to move relative to the second gear.
Preferably, the device further comprises a mounting plate;
the mounting plate is used for supporting and fixing one end of the first lead screw on the inner wall of the chamber;
the first lead screw penetrates through the first mounting plate and is connected with the driver, and the first lead screw rotates under the driving of the driver.
Preferably, the driver includes: a motor and a belt drive assembly;
the motor is connected with the first lead screw through a belt transmission assembly.
Preferably, the belt drive assembly is a rotary belt drive assembly.
The invention also provides a transmission cavity, which comprises a manipulator transmission mechanism and a manipulator, and the manipulator transmission mechanism is adopted.
The invention also provides semiconductor processing equipment which comprises a reaction cavity and a transmission cavity, wherein the transmission cavity is provided by the transmission cavity.
The manipulator transmission mechanism provided by the invention adopts the connection of a transmission part and a first connecting piece, a guide block is connected with the first connecting piece, and the first connecting piece enables the guide block to move along the first connecting piece under the driving of a driver; and the second connecting piece drives the manipulator to move towards the target position or away from the target position along a first guide rail arranged on the guide block. Therefore, the process of driving the mechanical arm by the mechanical arm driving mechanism is in place and simple at one time, so that the time for transmitting the wafer by the mechanical arm is short, and the wafer transmission efficiency is improved; in addition, the manipulator transmission mechanism is simple in structure and convenient to manufacture and install.
Drawings
FIG. 1 is a simplified schematic diagram of a typical single chamber semiconductor processing apparatus;
FIG. 2 is a schematic diagram of a transfer chamber with a robot actuator according to an embodiment of the present invention in an initial state;
fig. 3 is a schematic view illustrating a final state in which the robot of fig. 2 is transferred out of the transfer chamber.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the robot driving mechanism, the transfer chamber, and the semiconductor processing apparatus provided in the present invention will be described in detail below with reference to the accompanying drawings.
Example 1
FIG. 2 is a schematic diagram of a transfer chamber with a robot actuator according to an embodiment of the present invention in an initial state; fig. 3 is a schematic diagram illustrating a final state of the robot in fig. 2 being transferred out of the transfer chamber, and referring to fig. 2 and fig. 3 together, a robot transmission mechanism according to an embodiment of the present invention includes: the device comprises a first connecting piece, a guide block 11, a transmission piece 12, a second connecting piece and a driver 14. The guide block 11 is connected with a first connecting piece, and the first connecting piece is used for enabling the guide block 11 to move along the first connecting piece under the driving of a driver; a first guide rail 111 is arranged on the guide block 11, and the manipulator is arranged in the first guide rail 111; the transmission member 12 is connected to the first connection member and the second connection member, the second connection member is connected to the manipulator 21, and is configured to transmit the motion of the first connection member to the second connection member, and the second connection member drives the manipulator 21 to move toward the target position or away from the target position along the first guide rail 111.
In this embodiment, preferably, the first connecting member is a first lead screw 10; the second connecting piece is a second lead screw 13; the guide block 11 is disposed on the first lead screw 10, and is used for driving the first lead screw 10 to rotate along a first direction and move the guide block 11 along the first lead screw 10 toward a target position, and the first lead screw 10 rotates along a second direction and moves the guide block along the first lead screw 10 away from the target position. The second lead screw 13 is fixed with the manipulator 21 and is in threaded connection with the conveying piece 12; the transmission member 12 is configured to transmit a rotational motion of the first lead screw 10 in a first direction to the second lead screw 13, so that the manipulator connected to the second lead screw 13 moves toward the target position along the first guide rail 111, and transmit a rotational motion of the first lead screw 10 in a second direction to the second lead screw 13, so that the manipulator connected to the second lead screw moves away from the target position along the first guide rail 111.
It can be understood that the first and second connecting members adopt a screw structure, which is not only simple in structure, easy to install and low in cost, but also can be transferred out or back by the manipulator only by rotating in a single direction, and the transferring process is further simplified.
The manipulator transport mechanism provided by the embodiment of the invention further comprises: a rail plate 15; wherein, a second guide rail is arranged on the guide rail plate 15; the guide block 11 moves along the second guide rail, which both provides support for the weight of the guide block 11 and the robot 21 located thereon, and assists in the movement of the guide block 11.
Specifically, in the present embodiment, the transmission member 12 includes: a first gear 121 and a second gear 122; wherein, the first gear 121 is meshed with the second gear 122, and the first gear 121 is fixedly connected with the first lead screw 10; the second gear 122 is in threaded connection with the second lead screw 13, so that the rotation of the first lead screw 10 drives the first gear 121 to rotate at the same time; the rotation of the first gear 121 drives the second gear 122 to rotate, and the rotating second gear 122 and the second lead screw perform a thread transmission, so that the second lead screw 13 and the manipulator 21 move together relative to the first gear 121.
Preferably, the transmission member 12 further comprises: two parallel baffles 123 provided on the rail plate 15; the first gear 121 and the second gear 122 are disposed between the two parallel baffles 123, and both are limited in the same plane, which is beneficial to drive both.
In order to facilitate the movement of the second lead screw 13, through holes 1231 are provided on the two parallel baffles 123, the through holes 1231 are used for serving as a passage for the movement of the second lead screw 13 relative to the second gear 122, when the manipulator 21 is located at the initial position (as shown in fig. 2), the second lead screw 13 passes through the through hole on the left parallel baffle 123 to be rotatably connected with the second gear 122, and when the manipulator 21 is moved (as shown in fig. 3), the right end of the second lead screw 13 moves to the right to pass through the through hole 1231 on the left parallel baffle 123.
Also preferably, the robot transmission further comprises a mounting plate 16; the mounting plate 16 is used for supporting and fixing one end of the first lead screw 10 on the inner wall of the chamber; one end of the first lead screw 10 is connected to the driver 14 through the mounting plate 16 and is driven by the driver 14 to rotate.
In the present embodiment, the guide rail plate 15 is provided on the bottom wall of the transfer chamber 2, and the mounting plate 16 is fixed to the side wall of the guide rail plate 15.
Preferably, the driver 14 comprises: a motor 142 and a belt drive assembly 141; the motor 142 is connected to the first lead screw 10 via a belt drive 141, which saves space.
Further preferably, the belt transmission assembly 141 is, but not limited to: a rotary belt drive assembly.
The operation of the robot transport mechanism according to the embodiment of the present invention will be described in detail with reference to fig. 2 and 3. Specifically, referring to fig. 2, in the initial state of the robot transfer mechanism, in fig. 2, the robot 21 is located on the left side of the transfer chamber 2 and is located at a height level with a channel 22 formed on a side wall of the transfer chamber 2, so that the robot 21 can move left and right through the channel 22.
A manipulator conveying process: the motor 142 rotates forward to drive the first lead screw 10 to rotate, and because the first gear 121 and the right end of the first lead screw 10 are fixed, the first gear 121 rotates together with the first lead screw 10, and because the guide block 11 is in threaded transmission with the first lead screw 10, the guide block 11 is in right-facing transmission along the second guide rail 15 when the first lead screw 10 rotates; since the first gear 121 and the second gear 122 are engaged, the second gear 122 rotates with the first gear 121; since the second gear 122 and the second lead screw 13 are in threaded transmission, the manipulator 21 and the second lead screw 13 are fixed, and therefore, the second lead screw 13 and the manipulator 21 are transmitted to the right along the first guide rail 111 together; finally, as shown in fig. 3, the robot 21 passes through the passage 22, and in practical applications, the right side of the passage 22 should be a reaction chamber, so that the robot 21 can move between the transfer chamber 2 and the process chamber, and can transfer the wafer therebetween.
Since the process of retracting the robot back into the transfer chamber is the reverse of the process of ejecting, only the click 142 is required to be reversed, and will not be described in detail herein.
It is stated here that in practical applications, the transport distance of the entire robot transmission can be set by setting the transmission ratio of the transmission member 12 and the length of the first track in order to meet the transport requirements of different lengths.
In summary, the embodiment of the invention provides a novel manipulator transmission mechanism, which is not only simple in structure, but also capable of rapidly positioning the manipulator in place at one time, thereby reducing the wafer conveying time and improving the wafer conveying efficiency.
It should be noted that, although in the present embodiment, the second lead screw 13 is fixed to the robot 21 and rotatably connected to the second gear 122 in the transmission member 12, therefore, the first lead screw 13 and the robot 21 are conveyed out of the transfer chamber 2 together; however, in practical applications, the present invention is not limited thereto, and may be: the second lead screw 13 is connected with the robot 21 by screw threads and is fixedly connected with the second gear 122 in the transmission member 12, so that the second lead screw 13 rotates along with the second gear 122, and the rotating second gear 122 is in screw transmission with the robot 21, so that the robot 21 moves to the right along the first guide rail 111 relative to the second lead screw 13.
It should be noted that, although in the present embodiment, the transmission member 12 includes the first gear 121 and the second gear 122 which are engaged with each other and perform transmission; however, the present invention is not limited to this, and other transmission methods, for example, a belt transmission method, may be adopted in practical applications.
Example 2
The invention also provides a transfer chamber 2, as shown in fig. 2 and fig. 3, comprising a manipulator transmission mechanism and a manipulator 21, wherein the manipulator transmission mechanism adopts the manipulator transmission mechanism provided in the above embodiment 1, and specifically refer to the above embodiment 1.
According to the transmission cavity provided by the embodiment of the invention, the manipulator transmission mechanism provided by the embodiment 1 is adopted, so that the sheet transmission efficiency can be improved.
Example 3
The invention also provides semiconductor processing equipment which comprises a reaction cavity and a transmission cavity, wherein the transmission cavity adopts the transmission cavity provided by the embodiment 2.
According to the semiconductor processing equipment provided by the embodiment of the invention, the transmission cavity provided by the embodiment 2 is adopted, so that the process efficiency and the yield can be improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A manipulator transmission mechanism, comprising: the device comprises a guide block, a first connecting piece, a second connecting piece and a transmission piece; wherein
The guide block is connected with the first connecting piece, and the first connecting piece is used for enabling the guide block to move along the first connecting piece under the driving of a driver;
the guide block is provided with a first guide rail, and the manipulator is arranged in the first guide rail;
the transmission piece is connected with the first connecting piece and the second connecting piece, the second connecting piece is connected with the manipulator and used for transmitting the motion of the first connecting piece to the second connecting piece, and the second connecting piece drives the manipulator to move towards or away from a target position along the first guide rail;
the manipulator transmission mechanism further comprises: a guide rail plate;
a second guide rail is arranged on the guide rail plate;
the guide block is disposed on the second guide rail to move along the second guide rail.
2. The robot transmission of claim 1, wherein the first connection member is a first lead screw;
the second connecting piece is a second lead screw;
the guide block is sleeved on the first lead screw and used for enabling the first lead screw to rotate along a first direction and enabling the guide block to move towards a target position along the first lead screw under the driving of a driver, and the first lead screw rotates along a second direction and enables the guide block to move away from the target position along the first lead screw;
the second lead screw is fixed with one of the transmission part and the manipulator and is in threaded connection with the other one;
the transmission part is used for transmitting the rotary motion of the first lead screw along the first direction to the second lead screw, so that the manipulator connected with the second lead screw moves towards the target position along the first guide rail, and transmitting the rotary motion of the first lead screw along the second direction to the second lead screw, so that the manipulator connected with the second lead screw moves away from the target position along the first guide rail.
3. The robot transmission of claim 2, wherein the transmission comprises: the first gear and the second gear are meshed;
the first gear is connected with the first lead screw;
the second gear is connected with the second lead screw.
4. The robot drive mechanism of claim 3, wherein the drive member further comprises: two parallel baffles arranged on the guide rail plate;
the first gear and the second gear are disposed between the two parallel baffles.
5. The manipulator transmission mechanism according to claim 4, wherein the second lead screw is fixedly connected with the manipulator and is in threaded connection with the second gear;
through holes are formed in the two parallel baffles and are used as channels for the second lead screw to move relative to the second gear.
6. The robot transmission of claim 2, further comprising a mounting plate;
the mounting plate is used for supporting and fixing one end of the first lead screw on the inner wall of the chamber;
the first lead screw penetrates through the mounting plate and is connected with the driver, and the first lead screw is driven by the driver to rotate.
7. The robot transmission of claim 2, wherein the driver comprises: a motor and a belt drive assembly;
the motor is connected with the first lead screw through a belt transmission assembly.
8. The robot drive of claim 7, wherein the belt drive is a rotary belt drive.
9. A transfer chamber comprising a robot actuator and a robot, wherein the robot actuator as claimed in any one of claims 1 to 8 is used.
10. A semiconductor processing apparatus comprising a reaction chamber and a transfer chamber, wherein the transfer chamber is the transfer chamber of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810288397.7A CN110349879B (en) | 2018-04-03 | 2018-04-03 | Manipulator transmission mechanism, transmission cavity and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810288397.7A CN110349879B (en) | 2018-04-03 | 2018-04-03 | Manipulator transmission mechanism, transmission cavity and semiconductor processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110349879A CN110349879A (en) | 2019-10-18 |
| CN110349879B true CN110349879B (en) | 2021-12-17 |
Family
ID=68172562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810288397.7A Active CN110349879B (en) | 2018-04-03 | 2018-04-03 | Manipulator transmission mechanism, transmission cavity and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110349879B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114378787A (en) * | 2020-10-21 | 2022-04-22 | 江苏鲁汶仪器有限公司 | Mechanical arm device, use method thereof and substrate processing system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005044981A (en) * | 2003-07-28 | 2005-02-17 | Tokyo Electron Ltd | Carrying device |
| CN102368474A (en) * | 2011-09-20 | 2012-03-07 | 嘉兴科民电子设备技术有限公司 | Chip transporting system of plasma etcher for carrying out dry etching on inorganic material substrate |
| CN104176491A (en) * | 2013-05-23 | 2014-12-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Transmitting device and plasma machining equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11584000B2 (en) * | 2015-07-16 | 2023-02-21 | Persimmon Technologies Corporation | Robot arm with unequal link lengths and variable non-linear wrist orientation |
| CN106783703B (en) * | 2015-11-19 | 2019-10-11 | 北京北方华创微电子装备有限公司 | Manipulator and transmission chamber |
| CN107611069B (en) * | 2016-07-12 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Robot and semiconductor processing apparatus |
-
2018
- 2018-04-03 CN CN201810288397.7A patent/CN110349879B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005044981A (en) * | 2003-07-28 | 2005-02-17 | Tokyo Electron Ltd | Carrying device |
| CN102368474A (en) * | 2011-09-20 | 2012-03-07 | 嘉兴科民电子设备技术有限公司 | Chip transporting system of plasma etcher for carrying out dry etching on inorganic material substrate |
| CN104176491A (en) * | 2013-05-23 | 2014-12-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Transmitting device and plasma machining equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110349879A (en) | 2019-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI538088B (en) | Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing | |
| US8777547B2 (en) | Systems, apparatus and methods for transporting substrates | |
| TWI704038B (en) | Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing | |
| US20130149076A1 (en) | Fully-independent robot systems, apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing | |
| CN106024680A (en) | Port door positioning apparatus and associated methods | |
| WO2011065325A1 (en) | Conveyance arm and conveyance robot with same | |
| US20120063874A1 (en) | Low profile dual arm vacuum robot | |
| CN110349879B (en) | Manipulator transmission mechanism, transmission cavity and semiconductor processing equipment | |
| CN104176491A (en) | Transmitting device and plasma machining equipment | |
| KR200436002Y1 (en) | Dual arm robot | |
| US7984543B2 (en) | Methods for moving a substrate carrier | |
| CN111076580B (en) | Device and method for processing heat pipe in flow line production | |
| JP2004106105A (en) | Delivery robot | |
| CN215848230U (en) | Material taking clamp and manipulator | |
| CN113437012B (en) | Semiconductor process chamber and semiconductor process equipment | |
| KR20120137662A (en) | Traveling vacuum robot | |
| JP5620172B2 (en) | Substrate transport apparatus, electronic device manufacturing system, and electronic device manufacturing method | |
| US9421689B2 (en) | Manipulator apparatus | |
| CN113584453B (en) | Magnetic force driven vacuum coating conveying device and conveying method | |
| KR101640531B1 (en) | Substrate Transfer Apparatus and Chamber Thereof | |
| CN210499182U (en) | Duplex assembly turntable | |
| KR102636976B1 (en) | Rotate unit for OHT device | |
| CN116588680B (en) | Self-alignment structure and semiconductor track type transmission arm | |
| JP5770498B2 (en) | Rotation drive device and transfer device | |
| CN216902812U (en) | Double-swing-arm die bonder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |