CN104741820A - Lead-free brazing filler metal - Google Patents
Lead-free brazing filler metal Download PDFInfo
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- CN104741820A CN104741820A CN201510130966.1A CN201510130966A CN104741820A CN 104741820 A CN104741820 A CN 104741820A CN 201510130966 A CN201510130966 A CN 201510130966A CN 104741820 A CN104741820 A CN 104741820A
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- CN
- China
- Prior art keywords
- solder
- filler metal
- brazing filler
- lead
- free brazing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
The invention belongs to the technical field of brazing filler metal and relates to lead-free brazing filler metal. The lead-free brazing filler metal is composed of, by mass, 0.5% to 4.0% of Cu, 0.04% to 0.2% of Ni, 0.005% to 1.0% of Ge, 0.05% to 2.0% of Bi and the balance Sn. Compared with the prior art, 0.005% to 1.0% of Ge and 0.05% to 2.0% of Bi are added to the brazing filler metal, structure distribution of the brazing filler metal can be even, and the melting point and the melting range of brazing filler metal alloy are reduced; due to the fact that germanium is high in oxyphile skin effect and can be concentrated on the surface of the melting brazing filler metal, the brazing filler metal is prevented from being further oxidized. Thus, oxidization resistance of the brazing filler metal can be remarkably improved by adding tiny germanium and the brazing filler metal is prevented from becoming yellow. In addition, the moisture and the tensile strength of the brazing filler metal can be remarkably improved by adding tiny germanium.
Description
Technical field
The invention belongs to solder technology field, relate to a kind of lead-free brazing.
Background technology
In brazing filler metal alloy, lead is generally for diluting tin to improve liquidity and the important meals of wetability.Traditional solder mainly adopts the alloy system based on Sn63-Pb37 eutectic composition, and this alloy eutectic temperature is 183 DEG C, has good mechanical property and processing performance, uses with a long history, have accumulated a large amount of production and practical experience.But lead is a kind of poisonous heavy metal, when waste electronic electrical equipment landfill disposal, lead in solder meets acid rain or underground water, can be transformed into can be water-soluble lead (II) ion, thus enter the water supply chain of people, cause lead poisoning.
Therefore, people begin one's study lead-free solder gradually, at present, have achieved some achievements, have obtained some lead-free brazings.
Such as, but regrettably, the physical property of current lead-free brazing is also not ideal, and: wetability is poor, oxidation resistance is more weak, and fusing point is high, and solder easily turns to be yellow, the Tissue distribution of alloy is uneven etc.
In view of this, necessaryly provide a kind of lead-free brazing, the Tissue distribution of its alloy is even, and has the anti-oxidation effect suppressing jaundice, and wetability is good simultaneously, and fusing point is low.
Summary of the invention
The object of the invention is to: for the deficiencies in the prior art, and provide a kind of lead-free brazing, the Tissue distribution of its alloy is even, and has the anti-oxidation effect suppressing jaundice, and wetability is good simultaneously, and fusing point is low.
In order to achieve the above object, the present invention adopts following technical scheme:
Lead-free brazing, by mass percentage, described lead-free brazing consists of the following composition:
0.3％～1.0％Cu；
0.01％～0.11％Ni；
0.005％～0.10％Ge；
0.05％～2.0％Bi；
Surplus is Sn.
One as lead-free brazing of the present invention is improved, and by mass percentage, described lead-free brazing consists of the following composition:
0.4％～0.8％Cu；
0.03％～0.09％Ni；
0.02％～0.09％Ge；
0.10％～1.5％Bi；
Surplus is Sn.
One as lead-free brazing of the present invention is improved, and by mass percentage, described lead-free brazing consists of the following composition:
0.7％Cu；
0.05％Ni；
0.025％Ge；
1.2％Bi；
Surplus is Sn.
One as lead-free brazing of the present invention is improved, and by mass percentage, described lead-free brazing consists of the following composition:
0.5％Cu；
0.07％Ni；
0.02％Ge；
0.5％Bi；
Surplus is Sn.
Relative to prior art, the present invention by adding 0.005% ~ 0.10%Ge (germanium) and 0.05% ~ 2.0%Bi (bismuth) in solder, the Tissue distribution of solder can be made even, fusing point and the melting range of brazing filler metal alloy are reduced (fusing point can be reduced to about 217 DEG C from about 227 DEG C), and there is very strong oxyphie kelvin effect due to germanium, can at the solder surface aggregation of melting, hinder the further oxidation of solder, therefore, trace germanium add the non-oxidizability that can significantly improve solder, suppress it to turn to be yellow; In addition, the wetability of solder and the hot strength of solder can also significantly be improved adding of trace germanium.
Accompanying drawing explanation
Fig. 1 is the micrograph of lead-free brazing of the present invention, wherein, the micrograph of the solder that Fig. 1-A provides for comparative example 1, the micrograph of the solder that Fig. 1-B provides for embodiment 3, the micrograph of the solder that Fig. 1-C provides for embodiment 4, the micrograph of the solder that Fig. 1-D provides for embodiment 6.
Fig. 2 is the microphotograph of the electron probe of lead-free brazing of the present invention, wherein, the microphotograph of the electron probe of the solder that Fig. 2-A provides for comparative example 1, the microphotograph of the electron probe of the solder that Fig. 2-B provides for embodiment 3, the microphotograph of the electron probe of the solder that Fig. 2-C provides for embodiment 4, the microphotograph of the electron probe of the solder that Fig. 2-D provides for embodiment 6.
Fig. 3 is the embodiment of the present invention 3, embodiment 4, the solid liquid phase temperature of the solder of embodiment 6 and comparative example 1 and melting range test result.
Fig. 4 is the embodiment of the present invention 3, embodiment 4, the molten copper the performance test results of the solder of embodiment 6 and comparative example 1.
Fig. 5 is the embodiment of the present invention 3, embodiment 4, the wettability test result of the lead-free brazing that embodiment 6 and comparative example 1 provide.
Fig. 6 is the embodiment of the present invention 3, embodiment 4, the mechanical experimental results of the lead-free brazing that embodiment 6 and comparative example 1 provide.
Detailed description of the invention
Embodiment 1
By mass percentage, the lead-free brazing that the present embodiment provides consists of the following composition:
0.7％Cu；
0.05％Ni；
0.025％Ge；
1.2％Bi；
Surplus is Sn.
Embodiment 2
By mass percentage, the lead-free brazing that the present embodiment provides consists of the following composition:
0.5％Cu；
0.07％Ni；
0.02％Ge；
0.5％Bi；
Surplus is Sn.
Embodiment 3
By mass percentage, the lead-free brazing that the present embodiment provides consists of the following composition:
0.7％Cu；
0.05％Ni；
0.01％Ge；
1.5％Bi；
Surplus is Sn.
Embodiment 4
By mass percentage, the lead-free brazing that the present embodiment provides consists of the following composition:
0.7％Cu；
0.05％Ni；
0.05％Ge；
1.5％Bi；
Surplus is Sn.
Embodiment 5
By mass percentage, the lead-free brazing that the present embodiment provides consists of the following composition:
0.3％Cu；
0.06％Ni；
0.04％Ge；
0.3％Bi；
Surplus is Sn.
Embodiment 6
By mass percentage, the lead-free brazing that the present embodiment provides consists of the following composition:
0.7％Cu；
0.05％Ni；
0.1％Ge；
1.5％Bi；
Surplus is Sn.
Comparative example 1
By mass percentage, the lead-free brazing that this comparative example provides consists of the following composition:
0.7％Cu；
0.05％Ni；
1.5％Bi；
Surplus is Sn.
Comparative example 2
By mass percentage, the lead-free brazing that this comparative example provides consists of the following composition:
0.7％Cu；
0.05％Ni；
Surplus is Sn.
Carry out microscopic examination to the solder that embodiment 3, embodiment 4, embodiment 6 and comparative example 1 provide, acquired results is shown in Fig. 1.
Wherein, the micrograph of the solder that Fig. 1-A provides for comparative example 1, wherein white base is β-Sn phase, and the grey form and aspect of disperse are Sn-Cu eutectic structure and a small amount of intermetallic compound Cu
6sn
5phase.
The micrograph of the solder that Fig. 1-B provides for embodiment 3, as can be seen from Fig. 1-B: when the interpolation mass fraction of Ge is 0.01%, the microscopic structure of solder obviously obtains refinement, distribution of each phase is comparatively even, and the form of primary phase also improves simultaneously.
The micrograph of the solder that Fig. 1-C provides for embodiment 4, as can be seen from Fig. 1-C: when the content of Ge is increased to 0.05%, the further refinement of microscopic structure, distribution of each phase is even, and netted eutectic structure also significantly increases.
The micrograph of the solder that Fig. 1-D provides for embodiment 6, as can be seen from Fig. 1-D: when the mass fraction of Ge is 0.10%, occur eutectic structure netted in a large number in solder microscopic structure, the intermetallic compound even dispersion after refinement is distributed in grain boundaries.This is mainly because intermetallic compound can absorb the germanium of trace, thus the speed that change crystal grows along different directions, Cu
6sn
5mutually and the growing up of rich Sn phase, make grain refinement and Dispersed precipitate in β-Sn phase grain boundaries.
In sum, the addition of Ge can not be too large, can not be too little, the alloy structure that ability shape becomes distribution Zhuo even.
The microphotograph of the electron probe of the brazing filler metal alloy that embodiment 3, embodiment 4, embodiment 6 and comparative example 1 provide is as shown in A, B, C and D figure of Fig. 2.As seen from Figure 2: the interpolation of micro-Ge significantly can change the microscopic structure of brazing filler metal alloy, when the content of Ge is 0.01%, respectively i.e. remarkable refinement mutually, intermetallic compound crystallite dimension is about 10 μm, and EDX analyzes and shows that this intermetallic compound is Cu
6sn
5phase.Along with the increase of Ge content, Cu
6sn
5further refinement be uniformly distributed in netted eutectic structure grain boundaries mutually.When the content of Ge is 0.10%, crystallite dimension is about 2 μm, when the content of Ge is greater than 0.10%, likely can generate the Compound Phase of thick sheet in brazing filler metal alloy, the viscosity of liquid solder is increased and finally affects the combination property of brazing filler metal alloy.
In order to study the impact of Ge content of the present invention on the pre-arcing characterisitics of solder, to embodiment 3, embodiment 4, the solder of embodiment 6 and comparative example 1 carries out solid liquid phase temperature and melting range test, and acquired results is shown in Fig. 3.
As seen from Figure 3: when the content of Ge is not more than 0.10%, the interpolation of Ge affects less on solder solid liquid phase temperature and melting range, and the eutectic peak of low melting point does not appear in solder within the scope of this interpolation, is therefore conducive to the solder joint forming high reliability.When the content of Ge is 0.10%, the solid liquid phase temperature of solder and melting range are respectively 218.6 DEG C, 212.2 DEG C and 3.6 DEG C, and compared to 218.3 DEG C of the solder that comparative example 1 provides, 220.8 DEG C and 2.5 DEG C increase all to some extent.This mainly because the fusing point (937.4 DEG C) of Ge is far away higher than the fusing point of SnCuNiBi brazing filler metal alloy, makes brazing filler metal alloy fusing point and melting range all increase.And in addition, carry out solid liquid phase temperature and melting range test to the solder of comparative example 2, the fusing point comparing the solder that comparative example 1 and comparative example 2 provide finds: Bi adds the fusing point that can reduce solder, and reduction amplitude is about 10 DEG C.
To embodiment 3, embodiment 4, the solder of embodiment 6 and comparative example 1 carries out molten copper performance test, and acquired results is shown in Fig. 4.
We know, the Cu on the copper coating of pcb board and component down-lead can be dissolved in molten tin bath.According to calculating, every cylinder capacity is that the tin stove of 250kg often produces 150m
2circuit board, the Cu in molten tin bath can increase about 0.10%.The rising of copper content makes the liquidus temperature of solder improve; When w (Cu) is elevated to 1.00% from 0.70%, the fusing point of solder rises to 236 DEG C from 227 DEG C, and this will affect the mobility of solder, and then cause the defects such as bridging.As seen from Figure 4: be within the scope of the interpolation of 0 ~ 0.10% at w (Ge), along with the increase of Ge content, molten copper amount is fallen after rising.This mainly because Ge is surface active element, can accelerate the diffusion velocity of solder interfacial reaction when w (Ge) <0.01%, and then accelerates the dissolution velocity of copper.When Ge content increases further, certain inhibitory action is played in the dissolving of germanium to copper.This may be because along with the further increase of Ge content, and it produces the dissolution velocity of copper at molten solder surface aggregation and certain slows down effect.In addition, copper is mainly with Cu
6sn
5the form of intermetallic compound is dissolved, and the interpolation of micro-Ge can suppress it to grow, and along with Ge content, to increase molten copper speed on a declining curve.
In addition, the present inventor is also to embodiment 3, embodiment 4, the oxidation proof properties of the lead-free brazing that embodiment 6 and comparative example 1 provide has carried out testing (probe temperature is 260 DEG C), according to the physical principle of film color and luster, when burning film thickness and incident light wave grow up to certain multiple, due to the interference of incident light and reverberation, oxide-film can present specific color and luster, and this color and luster can change regularly along with the change of oxide thickness.Therefore the thickness of oxide-film and the qualitative degree comparing oxidation can intuitively be estimated according to the change of liquid solder oxide-film color.Result shows: liquid solder surface energy keep for a long time light minute surface, trace germanium add the non-oxidizability that can significantly improve solder.According to thermodynamic principles, under equal temperature, the negative value of the standard free energy of formation of oxide is larger, and this metal is more easily oxidized.According to calculating, 260 DEG C time, in the solder that embodiment provides, the oxide standard free energy of formation of Ge can generate GeO prior to other element oxide than all low therefore Ge of other element oxides
2.Meanwhile, Ge element has very strong oxyphie kelvin effect, at the surface aggregation of the solder of melting, can hinder the further oxidation of solder.
The present inventor is also to embodiment 3, and embodiment 4, the wettability of the lead-free brazing that embodiment 6 and comparative example 1 provide is studied, and acquired results is shown in Fig. 5.As seen from Figure 5: within the scope of the interpolation of germanium (mass fraction is 0.01% ~ 0.10%), along with the increase of Ge content, the wetting power of solder increases gradually, and wetting time reduces gradually.What this showed trace germanium adds the wetability significantly improving SnCuNiBi solder.This is mainly because Ge is surface reactive material, as compared to Cu with Ni, all little than Cu and Ni of the Hm/Vm of Ge, its tendency to Surface Segregation in liquid alloy is large, Ge reduces the surface tension of solder alloy in the segregation on surface, be conducive to accelerating wetting speed, and then be conducive to the wettability improving solder.In addition, as previously mentioned, the microscopic structure of the solder of different Ge content is different, and when Ge content is increased to 0.10% from 0, the netted eutectic structure increased considerably in solder, is also conducive to improving solder wetting performance.
The present inventor is also to embodiment 3, and embodiment 4, the mechanical property of the lead-free brazing that embodiment 6 and comparative example 1 provide is studied, and acquired results is shown in Fig. 6.As seen from Figure 6: the interpolation of trace germanium significantly can strengthen the hot strength of solder, and the hot strength of solder increases gradually along with the increase of Ge content.This mainly adds the structure refinement of solder and the netted eutectic structure increased considerably and Dispersed precipitate in the Cu of grain boundaries because the hot strength of solder is subject to germanium
6sn
5the impact of particle strengthening effect.
In a word: the microscopic structure of the remarkable refinement solder of interpolation energy of (1) trace germanium, suppress the growth of intermetallic compound, improve the Tissue distribution of alloy.When the content of germanium is 0.10%, in solder microscopic structure, there is a large amount of equally distributed netted eutectic structure.
(2) interpolation of trace germanium is less to brazing filler metal melts properties influence, but significantly can strengthen the non-oxidizability of solder.And when the content of germanium is 0.10%, the dissolution velocity of solder to copper can also be slowed down.
(3) add the refinement of brazing filler metal alloy tissue and the Cu of the netted eutectic structure increased considerably and Dispersed precipitate based on germanium
6sn
5the invigoration effect of particle, the interpolation of germanium significantly can strengthen wetability and the hot strength of solder.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also carry out suitable change and amendment to above-mentioned embodiment.Therefore, the present invention is not limited to detailed description of the invention disclosed and described above, also should fall in the protection domain of claim of the present invention modifications and changes more of the present invention.In addition, although employ some specific terms in this description, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (4)
1. lead-free brazing, is characterized in that, by mass percentage, described lead-free brazing consists of the following composition:
0.3％～1.0％Cu；
0.01％～0.11％Ni；
0.005％～0.10％Ge；
0.05％～2.0％Bi；
Surplus is Sn.
2. lead-free brazing according to claim 1, is characterized in that, by mass percentage, described lead-free brazing consists of the following composition:
0.4％～0.8％Cu；
0.03％～0.09％Ni；
0.02％～0.09％Ge；
0.10％～1.5％Bi；
Surplus is Sn.
3. lead-free brazing according to claim 2, is characterized in that, by mass percentage, described lead-free brazing consists of the following composition:
0.7％Cu；
0.05％Ni；
0.025％Ge；
1.2％Bi；
Surplus is Sn.
4. lead-free brazing according to claim 2, is characterized in that, by mass percentage, described lead-free brazing consists of the following composition:
0.5％Cu；
0.07％Ni；
0.02％Ge；
0.5％Bi；
Surplus is Sn.
Priority Applications (1)
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|---|---|---|---|
| CN201510130966.1A CN104741820A (en) | 2015-03-24 | 2015-03-24 | Lead-free brazing filler metal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510130966.1A CN104741820A (en) | 2015-03-24 | 2015-03-24 | Lead-free brazing filler metal |
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| Publication Number | Publication Date |
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| CN104741820A true CN104741820A (en) | 2015-07-01 |
Family
ID=53582382
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| CN201510130966.1A Pending CN104741820A (en) | 2015-03-24 | 2015-03-24 | Lead-free brazing filler metal |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105479031A (en) * | 2016-01-29 | 2016-04-13 | 谢拂晓 | Lead-free brazing filler metal |
| CN106425154A (en) * | 2016-11-29 | 2017-02-22 | 东莞市广信知识产权服务有限公司 | Unleaded brazing filler metal |
| CN110315238A (en) * | 2019-07-31 | 2019-10-11 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of carbon nanotube enhancing lead-free brazing, preparation method and its application |
| CN114055010A (en) * | 2021-11-05 | 2022-02-18 | 安徽工业大学 | Copper-based alloy brazing filler metal containing trace Ge, preparation method and brazing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101011782A (en) * | 2007-01-24 | 2007-08-08 | 太仓市南仓金属材料有限公司 | Leadless soft tin solder |
| CN102029479A (en) * | 2010-12-29 | 2011-04-27 | 广州有色金属研究院 | Low-silver lead-free solder alloy and preparation method and device thereof |
| CN102066043A (en) * | 2008-04-23 | 2011-05-18 | 千住金属工业株式会社 | Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| EP2277657B1 (en) * | 2008-04-23 | 2012-07-11 | Senju Metal Industry Co., Ltd | Lead-free solder |
| CN103801852A (en) * | 2012-11-12 | 2014-05-21 | 恒硕科技股份有限公司 | High-strength silver-free and lead-free soldering tin |
-
2015
- 2015-03-24 CN CN201510130966.1A patent/CN104741820A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101011782A (en) * | 2007-01-24 | 2007-08-08 | 太仓市南仓金属材料有限公司 | Leadless soft tin solder |
| CN102066043A (en) * | 2008-04-23 | 2011-05-18 | 千住金属工业株式会社 | Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| EP2277657B1 (en) * | 2008-04-23 | 2012-07-11 | Senju Metal Industry Co., Ltd | Lead-free solder |
| CN102029479A (en) * | 2010-12-29 | 2011-04-27 | 广州有色金属研究院 | Low-silver lead-free solder alloy and preparation method and device thereof |
| CN103801852A (en) * | 2012-11-12 | 2014-05-21 | 恒硕科技股份有限公司 | High-strength silver-free and lead-free soldering tin |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105479031A (en) * | 2016-01-29 | 2016-04-13 | 谢拂晓 | Lead-free brazing filler metal |
| CN106425154A (en) * | 2016-11-29 | 2017-02-22 | 东莞市广信知识产权服务有限公司 | Unleaded brazing filler metal |
| CN110315238A (en) * | 2019-07-31 | 2019-10-11 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of carbon nanotube enhancing lead-free brazing, preparation method and its application |
| CN114055010A (en) * | 2021-11-05 | 2022-02-18 | 安徽工业大学 | Copper-based alloy brazing filler metal containing trace Ge, preparation method and brazing method thereof |
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