CN110303161A - 一种梯度硅铝-碳化硅铝电子封装复合材料及其制备方法 - Google Patents
一种梯度硅铝-碳化硅铝电子封装复合材料及其制备方法 Download PDFInfo
- Publication number
- CN110303161A CN110303161A CN201910704060.4A CN201910704060A CN110303161A CN 110303161 A CN110303161 A CN 110303161A CN 201910704060 A CN201910704060 A CN 201910704060A CN 110303161 A CN110303161 A CN 110303161A
- Authority
- CN
- China
- Prior art keywords
- sial
- silicon
- silicon carbide
- powder
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 172
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 141
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 117
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 110
- 239000004411 aluminium Substances 0.000 title claims abstract description 72
- 239000002131 composite material Substances 0.000 title claims abstract description 42
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 83
- 238000003763 carbonization Methods 0.000 claims abstract description 66
- 239000010703 silicon Substances 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000000843 powder Substances 0.000 claims description 192
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000001125 extrusion Methods 0.000 claims description 18
- 238000010792 warming Methods 0.000 claims description 18
- 238000004321 preservation Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- 238000007731 hot pressing Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 210000005239 tubule Anatomy 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 107
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 83
- 239000011863 silicon-based powder Substances 0.000 description 34
- 239000000203 mixture Substances 0.000 description 33
- 239000010935 stainless steel Substances 0.000 description 30
- 229910001220 stainless steel Inorganic materials 0.000 description 30
- 238000000498 ball milling Methods 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 17
- 238000003754 machining Methods 0.000 description 15
- 238000003801 milling Methods 0.000 description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 229910003978 SiClx Inorganic materials 0.000 description 6
- 238000002156 mixing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001192 hot extrusion Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B22F1/0003—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Powder Metallurgy (AREA)
- Carbon And Carbon Compounds (AREA)
- Ceramic Products (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910704060.4A CN110303161B (zh) | 2019-07-31 | 2019-07-31 | 一种梯度硅铝-碳化硅铝电子封装复合材料及其制备方法 |
Applications Claiming Priority (1)
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CN201910704060.4A CN110303161B (zh) | 2019-07-31 | 2019-07-31 | 一种梯度硅铝-碳化硅铝电子封装复合材料及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN110303161A true CN110303161A (zh) | 2019-10-08 |
CN110303161B CN110303161B (zh) | 2021-04-06 |
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CN201910704060.4A Active CN110303161B (zh) | 2019-07-31 | 2019-07-31 | 一种梯度硅铝-碳化硅铝电子封装复合材料及其制备方法 |
Country Status (1)
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110729251A (zh) * | 2019-11-12 | 2020-01-24 | 泰州铸鼎新材料制造有限公司 | 基于梯度硅铝合金的内置流道电子封装模块及其成形方法 |
CN113692198A (zh) * | 2021-08-26 | 2021-11-23 | 哈尔滨铸鼎工大新材料科技有限公司 | 一种硅铝合金内置冷却结构及其成型方法 |
CN114134373A (zh) * | 2021-11-16 | 2022-03-04 | 哈尔滨铸鼎工大新材料科技有限公司 | 一种具有高抗拉强度的硅铝合金封装材料及其制备方法 |
CN115974573A (zh) * | 2022-12-15 | 2023-04-18 | 中国科学院上海硅酸盐研究所 | 一种碳化硅连接件及激光辅助硅铝合金连接碳化硅陶瓷及其复合材料的方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002047504A (ja) * | 2000-07-31 | 2002-02-15 | Yanmar Diesel Engine Co Ltd | 傾斜機能材料の製造方法およびこれを用いて製造されるピストン |
EP1231286A1 (en) * | 1999-09-27 | 2002-08-14 | Kubota Corporation | Preliminarily formed article and formed article and parts for internal-combustion engine |
CN101973144A (zh) * | 2010-09-15 | 2011-02-16 | 中国人民解放军国防科学技术大学 | 可激光焊接的层状铝硅-铝碳化硅复合材料及其制备方法 |
CN104964607A (zh) * | 2015-05-15 | 2015-10-07 | 中国航空工业集团公司北京航空材料研究院 | 一种带增强相梯度层的装甲板及其制备方法 |
CN108746637A (zh) * | 2018-06-26 | 2018-11-06 | 中南大学 | 铝硅/铝碳化硅梯度复合材料及其制备方法 |
CN109487130A (zh) * | 2018-12-26 | 2019-03-19 | 东莞理工学院 | 一种用于电子封装的铝硅复合材料及其制备方法 |
-
2019
- 2019-07-31 CN CN201910704060.4A patent/CN110303161B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1231286A1 (en) * | 1999-09-27 | 2002-08-14 | Kubota Corporation | Preliminarily formed article and formed article and parts for internal-combustion engine |
JP2002047504A (ja) * | 2000-07-31 | 2002-02-15 | Yanmar Diesel Engine Co Ltd | 傾斜機能材料の製造方法およびこれを用いて製造されるピストン |
CN101973144A (zh) * | 2010-09-15 | 2011-02-16 | 中国人民解放军国防科学技术大学 | 可激光焊接的层状铝硅-铝碳化硅复合材料及其制备方法 |
CN104964607A (zh) * | 2015-05-15 | 2015-10-07 | 中国航空工业集团公司北京航空材料研究院 | 一种带增强相梯度层的装甲板及其制备方法 |
CN108746637A (zh) * | 2018-06-26 | 2018-11-06 | 中南大学 | 铝硅/铝碳化硅梯度复合材料及其制备方法 |
CN109487130A (zh) * | 2018-12-26 | 2019-03-19 | 东莞理工学院 | 一种用于电子封装的铝硅复合材料及其制备方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110729251A (zh) * | 2019-11-12 | 2020-01-24 | 泰州铸鼎新材料制造有限公司 | 基于梯度硅铝合金的内置流道电子封装模块及其成形方法 |
CN110729251B (zh) * | 2019-11-12 | 2021-09-10 | 泰州铸鼎新材料制造有限公司 | 基于梯度硅铝合金的内置流道电子封装模块及其成形方法 |
CN113692198A (zh) * | 2021-08-26 | 2021-11-23 | 哈尔滨铸鼎工大新材料科技有限公司 | 一种硅铝合金内置冷却结构及其成型方法 |
CN114134373A (zh) * | 2021-11-16 | 2022-03-04 | 哈尔滨铸鼎工大新材料科技有限公司 | 一种具有高抗拉强度的硅铝合金封装材料及其制备方法 |
CN115974573A (zh) * | 2022-12-15 | 2023-04-18 | 中国科学院上海硅酸盐研究所 | 一种碳化硅连接件及激光辅助硅铝合金连接碳化硅陶瓷及其复合材料的方法 |
CN115974573B (zh) * | 2022-12-15 | 2023-11-10 | 中国科学院上海硅酸盐研究所 | 一种碳化硅连接件及激光辅助硅铝合金连接碳化硅陶瓷及其复合材料的方法 |
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CN110303161B (zh) | 2021-04-06 |
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Address after: 150000 Room 305, building a, No. 20, Xinghai Road, Pingfang District, Harbin City, Heilongjiang Province Applicant after: Harbin Ding Ding Institute of new Mstar Technology Ltd. Address before: 150000 Expo Road 298, Songbei District, Harbin City, Heilongjiang Province Applicant before: Harbin Ding Ding Institute of new Mstar Technology Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: Gradient silicon aluminum silicon aluminum carbide electronic packaging composite material and preparation method thereof Effective date of registration: 20210827 Granted publication date: 20210406 Pledgee: Heilongjiang Xinzheng financing guarantee Group Co.,Ltd. Pledgor: Harbin Ding Ding Institute of new Mstar Technology Ltd. Registration number: Y2021230000039 |
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Date of cancellation: 20211119 Granted publication date: 20210406 Pledgee: Heilongjiang Xinzheng financing guarantee Group Co.,Ltd. Pledgor: Harbin Ding Ding Institute of new Mstar Technology Ltd. Registration number: Y2021230000039 |
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Denomination of invention: A gradient silicon aluminum silicon carbide aluminum electronic packaging composite material and its preparation method Effective date of registration: 20230925 Granted publication date: 20210406 Pledgee: Heilongjiang Xinzheng financing guarantee Group Co.,Ltd. Pledgor: Harbin Ding Ding Institute of new Mstar Technology Ltd. Registration number: Y2023230000081 |