CN110234199B - 一种耐高温pcb板及其制作工艺 - Google Patents
一种耐高温pcb板及其制作工艺 Download PDFInfo
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- CN110234199B CN110234199B CN201910630159.4A CN201910630159A CN110234199B CN 110234199 B CN110234199 B CN 110234199B CN 201910630159 A CN201910630159 A CN 201910630159A CN 110234199 B CN110234199 B CN 110234199B
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- pcb
- heat
- epoxy resin
- plate
- copper
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 56
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 37
- 239000000565 sealant Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 18
- 238000004382 potting Methods 0.000 claims abstract description 16
- 239000012790 adhesive layer Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims description 29
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 24
- 239000003063 flame retardant Substances 0.000 claims description 24
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 23
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 22
- 229910052698 phosphorus Inorganic materials 0.000 claims description 22
- 239000011574 phosphorus Substances 0.000 claims description 22
- 238000002156 mixing Methods 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 19
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 239000004519 grease Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 13
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 229910052582 BN Inorganic materials 0.000 claims description 12
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 claims description 12
- 229920002050 silicone resin Polymers 0.000 claims description 12
- 239000003365 glass fiber Substances 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 10
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000007791 dehumidification Methods 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 7
- 229920000877 Melamine resin Polymers 0.000 claims description 6
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 5
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000000191 radiation effect Effects 0.000 abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- 239000004743 Polypropylene Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
实施例1 | 实施例2 | 对比例1 | |
热导率/W·(m·K)<sup>-1</sup> | 0.88 | 0.86 | 0.2 |
实施例3 | 实施例4 | |
耐温性/℃ | 295 | 300 |
绍尔A硬度/度 | 68 | 74 |
热膨胀系数 | 98 | 96 |
实施例5 | 实施例6 | 对比例2 | 对比例3 | |
器件结温/℃ | 93.2 | 91.4 | 124.3 | 130.5 |
Claims (7)
Priority Applications (1)
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CN201910630159.4A CN110234199B (zh) | 2019-07-12 | 2019-07-12 | 一种耐高温pcb板及其制作工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910630159.4A CN110234199B (zh) | 2019-07-12 | 2019-07-12 | 一种耐高温pcb板及其制作工艺 |
Publications (2)
Publication Number | Publication Date |
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CN110234199A CN110234199A (zh) | 2019-09-13 |
CN110234199B true CN110234199B (zh) | 2021-11-19 |
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CN201910630159.4A Active CN110234199B (zh) | 2019-07-12 | 2019-07-12 | 一种耐高温pcb板及其制作工艺 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112937015A (zh) * | 2021-02-06 | 2021-06-11 | 厦门艾维逸新材料有限公司 | 一种具有纹理的硬质编织布及其生产工艺和应用 |
CN113873748B (zh) * | 2021-09-28 | 2022-05-10 | 广东合通建业科技股份有限公司 | 一种通透led显示屏的线路板及制作工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US8966747B2 (en) * | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
JP6164495B2 (ja) * | 2014-10-23 | 2017-07-19 | 株式会社オートネットワーク技術研究所 | 回路構成体及び回路構成体の製造方法 |
CN204929385U (zh) * | 2015-09-02 | 2015-12-30 | 深圳市领德辉科技有限公司 | 一种pcb线路板的新型防护结构 |
CN106476390B (zh) * | 2017-01-03 | 2018-08-07 | 山东金宝科创股份有限公司 | 一种纸基覆铜板的制备方法 |
CN208462136U (zh) * | 2018-07-16 | 2019-02-01 | 湖北荣宝电子科技有限公司 | 一种便于散热的pcb板 |
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Address after: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee after: ShenZhen Brightpcb Co.,Ltd. Address before: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MINGZHENGHONG ELECTRONICS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240205 Address after: 413000 Changchun Industrial Park, Ziyang District, Yiyang, Hunan Patentee after: YIYANG MINGZHENGHONG ELECTRONICS CO.,LTD. Country or region after: China Address before: 518000 No. 24, No. 1, No. 2 and No. 3, Shajing Dawangshan Second Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee before: ShenZhen Brightpcb Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |