CN110205630A - A kind of micro-corrosion liquid that can be used for impurity removing - Google Patents
A kind of micro-corrosion liquid that can be used for impurity removing Download PDFInfo
- Publication number
- CN110205630A CN110205630A CN201910607661.3A CN201910607661A CN110205630A CN 110205630 A CN110205630 A CN 110205630A CN 201910607661 A CN201910607661 A CN 201910607661A CN 110205630 A CN110205630 A CN 110205630A
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- China
- Prior art keywords
- micro
- impurity removing
- corrosion liquid
- sulphathiazole
- sulfuric acid
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses it is a kind of can be used for impurity removing micro-corrosion liquid, including component have: sulfuric acid, ethanol amine, 1,2-PD, heptyl amice, sulphathiazole, urazole, sodium alginate, polypropylene glycol, water.By the above-mentioned means, the micro-corrosion liquid that can be used for impurity removing of the invention, is easy progress slot allocation and builds bath, using upper convenience, the impurity generated during microetch can be removed, drainage sunk well is simple, with a variety of usage modes, can be applied in copper surface treatment in print circuit plates making engineering.
Description
Technical field
The present invention relates to circuit board machining fields, more particularly to a kind of micro-corrosion liquid that can be used for impurity removing.
Background technique
The galvanic circle that circuit is made of plain conductor and electrical, electronic component, makes in circuit input end plus power supply
Input terminal generates potential difference, and when circuit communication can work.Circuit board can make circuit miniaturization, intuitiveization, can be realized to solid
Determine the batch production and optimization electrical appliance layout of circuit.Circuit board is that electric system, control system, communication system, computer are hard
The chief component of the electric systems such as part, generation, transmission, conversion, control, processing and storage with electric energy and electric signal etc. are made
With.In the production process of circuit board, needs to use micro-corrosion liquid and carry out microetch processing.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of micro-corrosion liquids that can be used for impurity removing, have extraordinary
Application effect.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: provide it is a kind of can be used for impurity removing
Micro-corrosion liquid, including component have: sulfuric acid, ethanol amine, 1,2-PD, heptyl amice, sulphathiazole, urazole, sodium alginate, poly- third
Glycol, water.
In a preferred embodiment of the present invention, the content of the micro-corrosion liquid each component that impurity removing can be used for are as follows: with
Mass fraction meter, sulfuric acid 4-7%, ethanol amine 1-3%, 1,2-PD 0.5-2%, heptyl amice 4-6%, sulphathiazole 2-4%, urine
Azoles 2-4%, sodium alginate 8-12%, polypropylene glycol 1-3%, water surplus.
In a preferred embodiment of the present invention, the content of the micro-corrosion liquid each component that impurity removing can be used for are as follows: with
Mass fraction meter, sulfuric acid 5.5%, ethanol amine 2%, 1,2-PD 1%, heptyl amice 5%, sulphathiazole 3%, urazole 3%, seaweed
Sour sodium 10%, polypropylene glycol 2%, water 68.5%.
In a preferred embodiment of the present invention, the micro-corrosion liquid that can be used for impurity removing is answered by sprinkling or immersion
With.
In a preferred embodiment of the present invention, the micro-corrosion liquid that can be used for impurity removing mixes application with hydrogen peroxide.
In a preferred embodiment of the present invention, the quality of the micro-corrosion liquid that impurity removing can be used for and the hydrogen peroxide
Than for 1:2.
In a preferred embodiment of the present invention, the use temperature of the micro-corrosion liquid that can be used for impurity removing is 20-40
℃。
The beneficial effects of the present invention are: the micro-corrosion liquid that can be used for impurity removing of the invention, is easy progress slot allocation and builds bath, make
With convenience, the impurity generated during microetch can be removed, drainage sunk well is simple, has a variety of usage modes, can be in printing electricity
It is applied in copper surface treatment on the plate fabrication of road.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment one:
There is provided it is a kind of can be used for impurity removing micro-corrosion liquid, including component have: sulfuric acid, ethanol amine, 1,2-PD, heptyl amice,
Sulphathiazole, urazole, sodium alginate, polypropylene glycol, water.The content of the micro-corrosion liquid each component that can be used for impurity removing are as follows:
Based on mass fraction, sulfuric acid 5.5%, ethanol amine 2%, 1,2-PD 1%, heptyl amice 5%, sulphathiazole 3%, urazole 3%, sea
Mosanom 10%, polypropylene glycol 2%, water 68.5%.
Embodiment two:
There is provided it is a kind of can be used for impurity removing micro-corrosion liquid, including component have: sulfuric acid, ethanol amine, 1,2-PD, heptyl amice,
Sulphathiazole, urazole, sodium alginate, polypropylene glycol, water.The content of the micro-corrosion liquid each component that can be used for impurity removing are as follows:
Based on mass fraction, sulfuric acid 4%, ethanol amine 3%, 1,2-PD 0.5%, heptyl amice 6%, sulphathiazole 2%, urazole 4%, sea
Mosanom 8%, polypropylene glycol 3%, water surplus.
Embodiment three:
There is provided it is a kind of can be used for impurity removing micro-corrosion liquid, including component have: sulfuric acid, ethanol amine, 1,2-PD, heptyl amice,
Sulphathiazole, urazole, sodium alginate, polypropylene glycol, water.The content of the micro-corrosion liquid each component that can be used for impurity removing are as follows:
Based on mass fraction, sulfuric acid 7%, ethanol amine 1%, 1,2-PD 2%, heptyl amice 4%, sulphathiazole 4%, urazole 2%, seaweed
Sour sodium 12%, polypropylene glycol 1%, water surplus.
During microetch, the sulfuric acid can be such that pH value of solution stabilizes, while dissolve pyrrole；It is the ethanol amine, described
Heptyl amice interaction, can adjust the rate of etching；The 1,2-PD and polypropylene glycol interaction, can adjust etching
Deviation；The sulphathiazole, the urazole interaction form copper complex, form roughness；The sodium alginate can adjust photograph
Spend change in shape.The micro-corrosion liquid each component interaction that can be used for impurity removing, has extraordinary effect.
The application method of the micro-corrosion liquid that can be used for impurity removing: slot allocation ratio is used to carry out for 2-3%v/L using adding
Added-time is used together with hydrogen peroxide, can add in mass ratio for the ratio of 1:2, and tank liquor temperature is 20-40 DEG C at this time.Make
During, it is to be ensured that hydrogen peroxide concentration, sulfuric acid concentration and copper concentration.
The micro-corrosion liquid that can be used for impurity removing can apply in the pre-treatment of dry film press mold, before the green paint of solder-mask printing
In processing, organic coat technique, organic guarantor are welded in the pre-treatment of membrane process, tin spray process.It is described to be used for the micro- of impurity removing
The appearance for losing liquid is colourless transparent liquid, and specific gravity is the 1.055-1.070 at 25 DEG C, and it is 2.00-3.00 that pH, which is at 25 DEG C,.Institute
The micro-corrosion liquid that impurity removing can be used for by stating can have a variety of usage modes by spraying or impregnating application.It is kept in dark place, it is separate
High temperature and high fever.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (7)
1. a kind of micro-corrosion liquid that can be used for impurity removing, which is characterized in that including component have: sulfuric acid, ethanol amine, 1,2- the third two
Alcohol, heptyl amice, sulphathiazole, urazole, sodium alginate, polypropylene glycol, water.
2. the micro-corrosion liquid according to claim 1 that impurity removing can be used for, which is characterized in that described to be used for impurity removing
Micro-corrosion liquid each component content are as follows: based on mass fraction, sulfuric acid 4-7%, ethanol amine 1-3%, 1,2-PD 0.5-2%,
Heptyl amice 4-6%, sulphathiazole 2-4%, urazole 2-4%, sodium alginate 8-12%, polypropylene glycol 1-3%, water surplus.
3. the micro-corrosion liquid according to claim 2 that impurity removing can be used for, which is characterized in that described to be used for impurity removing
Micro-corrosion liquid each component content are as follows: based on mass fraction, sulfuric acid 5.5%, ethanol amine 2%, 1,2-PD 1%, heptyl amice
5%, sulphathiazole 3%, urazole 3%, sodium alginate 10%, polypropylene glycol 2%, water 68.5%.
4. the micro-corrosion liquid according to claim 1 that impurity removing can be used for, which is characterized in that described to be used for impurity removing
Micro-corrosion liquid by sprinkling or impregnate application.
5. the micro-corrosion liquid according to claim 1 that impurity removing can be used for, which is characterized in that described to be used for impurity removing
Micro-corrosion liquid application is mixed with hydrogen peroxide.
6. the micro-corrosion liquid according to claim 5 that impurity removing can be used for, which is characterized in that described to be used for impurity removing
Micro-corrosion liquid and the hydrogen peroxide mass ratio be 1:2.
7. the micro-corrosion liquid according to claim 1 that impurity removing can be used for, which is characterized in that described to be used for impurity removing
Micro-corrosion liquid use temperature be 20-40 DEG C.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810902679 | 2018-08-09 | ||
| CN2018109026791 | 2018-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110205630A true CN110205630A (en) | 2019-09-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910607661.3A Pending CN110205630A (en) | 2018-08-09 | 2019-07-08 | A kind of micro-corrosion liquid that can be used for impurity removing |
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| CN (1) | CN110205630A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112877694A (en) * | 2020-12-31 | 2021-06-01 | 南通赛可特电子有限公司 | Micro-etching solution for treating copper surface |
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|---|---|---|---|---|
| CN101137768A (en) * | 2005-03-11 | 2008-03-05 | 日立化成工业株式会社 | Surface treatment method for copper and copper |
| CN101381872A (en) * | 2007-09-04 | 2009-03-11 | 广东省石油化工研究院 | Dry film pasting promotor and its use method |
| CN104498951A (en) * | 2014-12-11 | 2015-04-08 | 深圳新宙邦科技股份有限公司 | Oxydol etching solution for copper-molybdenum alloy films |
| CN105453711A (en) * | 2013-08-16 | 2016-03-30 | 乐思股份有限公司 | Adhesion promotion in printed circuit boards |
| CN106906474A (en) * | 2015-12-22 | 2017-06-30 | 易案爱富科技有限公司 | Copper etching liquid composition |
| CN107151795A (en) * | 2017-06-02 | 2017-09-12 | 苏州晶瑞化学股份有限公司 | A kind of copper-molybdenum alloy film etching solution |
| CN107858685A (en) * | 2017-11-15 | 2018-03-30 | 深圳市华星光电技术有限公司 | Etching solution and its application for copper/molybdenum film layer |
-
2019
- 2019-07-08 CN CN201910607661.3A patent/CN110205630A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101137768A (en) * | 2005-03-11 | 2008-03-05 | 日立化成工业株式会社 | Surface treatment method for copper and copper |
| CN101381872A (en) * | 2007-09-04 | 2009-03-11 | 广东省石油化工研究院 | Dry film pasting promotor and its use method |
| CN105453711A (en) * | 2013-08-16 | 2016-03-30 | 乐思股份有限公司 | Adhesion promotion in printed circuit boards |
| CN104498951A (en) * | 2014-12-11 | 2015-04-08 | 深圳新宙邦科技股份有限公司 | Oxydol etching solution for copper-molybdenum alloy films |
| CN106906474A (en) * | 2015-12-22 | 2017-06-30 | 易案爱富科技有限公司 | Copper etching liquid composition |
| CN107151795A (en) * | 2017-06-02 | 2017-09-12 | 苏州晶瑞化学股份有限公司 | A kind of copper-molybdenum alloy film etching solution |
| CN107858685A (en) * | 2017-11-15 | 2018-03-30 | 深圳市华星光电技术有限公司 | Etching solution and its application for copper/molybdenum film layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112877694A (en) * | 2020-12-31 | 2021-06-01 | 南通赛可特电子有限公司 | Micro-etching solution for treating copper surface |
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Application publication date: 20190906 |