CN110202256A - Three axis scanning galvanometer laser aids, cell processing device and its control method - Google Patents
Three axis scanning galvanometer laser aids, cell processing device and its control method Download PDFInfo
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- CN110202256A CN110202256A CN201910568767.7A CN201910568767A CN110202256A CN 110202256 A CN110202256 A CN 110202256A CN 201910568767 A CN201910568767 A CN 201910568767A CN 110202256 A CN110202256 A CN 110202256A
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- 238000004519 manufacturing process Methods 0.000 abstract description 25
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- 210000004027 cell Anatomy 0.000 description 22
- 238000005516 engineering process Methods 0.000 description 12
- 238000011161 development Methods 0.000 description 7
- 238000010248 power generation Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
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- 230000003287 optical effect Effects 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013083 solar photovoltaic technology Methods 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- 230000001131 transforming effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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Abstract
The invention discloses three axis scanning galvanometer laser aids, cell processing device and its control methods, wherein three axis scanning galvanometer laser aids include laser (1), the first reflecting mirror (31), the second reflecting mirror (32), expand reshaper (2) and three axis scanning galvanometers (3)；The laser beam (4) of laser transmitting successively by the first reflecting mirror, the second reflecting mirror, expand reshaper, Z axis mobile focusing lens, X-axis rotation galvanometer and Y-axis rotation galvanometer after the multiple processing platforms of directive；The laser beam that one laser of the present invention issues passes through three axis scanning galvanometers, the successively multiple processing platforms of directive, processing is located at the wafer on multiple processing platforms in turn, reduce the totle drilling cost of complete equipment, save the time that machined wafer is replaced with undressed wafer, reduce laser processing wait time, the utilization rate of improving laser, increase laser equipment production capacity to 8000-8500 piece per hour.
Description
Technical field
The present invention relates to the process equipments of the cell piece of PERC/SE technology in photovoltaic industry, more particularly to one kind
Three axis scanning galvanometer laser aids and cell processing device and its control method with the laser aid.
Background technique
Since oil crisis is broken out in whole world the 1970s, solar photovoltaic technology draws in western developed country
Great attention is played, national governments are from the angle of environmental protection and energy sustainable development strategy, numerous and confused policies drum
It encourages and supports solar photovoltaic technology, photovoltaic industry to rapidly develop in the whole world, remove solar cells made of crystalline silicon, amorphous silicon
Outside solar battery, various compound semiconductor solar batteries, and the layer being made of two kinds of solar batteries are had also appeared
The novel solar batteries such as product type solar battery.Solar energy becomes substitution tradition because it is with spatter property and reproducibility
One of preferred plan of the energy.With research and technological development for many years, solar photovoltaic assembly price has declined to a great extent, and
Solar conversion efficiency be also improved make it possible solar energy power generating commercial development and application.
Currently, photovoltaic industry by spelling scale, spells speed, spelling price from extensive style to the new stage of fining development
To the new stage for spelling quality, spelling technology, spelling benefit transformation, relied on from subsidy to the new stage for gradually realizing that par changes.It is closed
Luminous energy president and CEO Gao Jifan are also indicated that, 10 years following, and the photovoltaic industry in China should pursue high quality development,
With less resource input, higher value is created.
There is some evidence that with the propulsion that " high quality " develops, photovoltaic industry prospect is considerable.Although photovoltaic industry after
Setback, but its scale, in sustainable growth, application range is all using in continuous enlargement, the substantially any area in the whole world, this says
Bright speciality possessed by Mingguang City's volt itself, makes it that can continue to develop and grow in setback each time.High-efficiency solar
Battery laser process equipment market situation
Photovoltaic power generation cheap internet access trend is obvious, and electricity price constantly declines, and will further speed up photovoltaic power generation industry growth rate, light
Volt electricity power enterprise faces the market opportunity；It surfs the Net at a competitive price at the same time and photovoltaic power generation electricity charge tender price is brought to continue to decline, industry
Competitive pressure increases.Photovoltaic power generation enterprise need to further be dropped by modes such as the more efficient battery components of application in this context
Low cost of electricity-generating；Photovoltaic cell manufacturing enterprise then pointedly releases the efficient solar battery products such as PERC battery, passes through
It creates and reconstructs the modes such as original producing line and expand high performance solar batteries production capacity rapidly.Concrete condition is as follows:
1, high performance solar batteries technology can be obviously improved cell power generation efficiency
High performance solar batteries technical matters mainly includes PERC, SE, MWT etc. at present, and above-mentioned three kinds of technique can be same
It is overlapped in producing line, efficiency enhancement effect is as shown in the table:
2, high performance solar batteries technology can bring notable benefits for photovoltaic plant
By taking PERC technique as an example, under the conditions of existing market, photovoltaic plant application PERC battery component will be relatively with tradition
Photovoltaic cell component generates larger income, can degree of making electricity cost decrease by the level of 0.01-0.02 member.In March, 2018
The middle target leader photovoltaic power generation project of newest announcement, acceptance of the bid enterprise all use PERC technology, and rate for incorporation into the power network is
0.41-0.45 member/degree, median are 0.43 yuan/degree, embody the advantage of PERC technology.
3, high performance solar batteries technology can bring notable benefits for battery manufacturer
By taking PERC technique as an example, under existing market environment, transforming conventional batteries producing line as PERC battery producing line income can
It sees, i.e. recoverable equipment investment, demand of the photovoltaic cell manufacturer to PERC battery laser process equipment are thus quick in 1 year
Increase.Furthermore be conducive to photovoltaic cell manufacturing enterprise using advanced technologies such as PERC and promote properties of product, increase selected " neck
The chance of runner's plan " is conducive to the brand value for promoting photovoltaic cell manufacturing enterprise.
4, high performance solar batteries technical market scale calculation
To 2020, photovoltaic cell production capacity is up to 138 gigawatts, and PERC battery production capacity is expected to be 73 gigawatts or so, and accounting is about
53%.Consider that the newly-increased corresponding laser equipment of PERC production capacity includes the equipment such as PERC, breaking machine, according to PERC battery to 2020
73 gigawatt of production capacity calculate, the associated laser process equipment total market size will be more than 1,900,000,000 yuan.Other high performance solar batteries processing
Technique is also in cultivation and development, and including MWT, SE etc., MWT, SE technique can be superimposed with PERC technique, it is contemplated that 2020,
MWT, SE and other laser process equipment total market sizes will be more than 1,800,000,000 yuan.
5, market competition structure
In high performance solar batteries laser process equipment industry, it is capable of providing competitive high performance solar batteries at present and swashs
Light process equipment only has several enterprises, including German Luo Fen, Germany InnoLas Solutions, Wuhan Supreme Being you, Changzhou
Laser laser, Suzhou step be, big nation, friend Chao Nengyuan etc., formd the competing of the Ji Jia manufacturer with Wuhan Supreme Being based on you at present
Strive pattern.
Equipment is the soul of semiconductor technology, and why China's photovoltaic industry can obtain extremely fast development, with equipment
Technological progress is inseparable with production domesticization.2018, PERC cell piece production capacity in China was further promoted, apparatus for production line
It is gradually substituted by home equipment, production technology is more mature.
After PERC technology produces maturing, high selective emission electrode (SE) technology of cost performance will also become light
Lie prostrate the first choice of enterprise, it is contemplated that stabilized growth to 2020, is occupied 50% or more PERC Battery Market share by SE.
With the continuous fast development of photovoltaic industry, need that the manufacturer of major solar battery sheet production promotes production capacity
It asks and is also continuously improved.The production capacity of PERC laser equipment in 2016 be 4500 per hour, the end of the year 2017 were promoted to 5500 per small
When, it was promoted by 2018 to 6000 per hour, at the beginning of 2019, you provide production capacity 6500 per hour to Wuhan Supreme Being, and the later period changes
7500 off-line device types hourly can be promoted to by making upgrading.From the point of view of the trend of industry, matched with PERC laser equipment
The production capacity of screen printing apparatus be also continuously improved, the manufacturer of major solar battery sheet production is for laser equipment production capacity
The demand of promotion is also increasing.Currently, the production capacity of screen printing apparatus double track has reached 8000 per hour, and and silk screen
The matched laser on-line/off-line equipment of printing equipment is not matched completely also, and the promotion of integral device production capacity is restrict.
In the generating process of solar battery sheet, a procedure is put into wafer in PERC laser equipment, uses laser
Wafer is processed.Existing processing method is the stream of a laser aid corresponding processing platform and a loading and unloading
Wafer is moved into processing platform piecewise and is laser machined by road, runner, has been added after to be processed with untreated wafer replacement
The wafer that work is crossed.Such processing method, laser equipment will stop working in wafer replacement process, lead to whole equipment capacity not
Height, and acquisition cost is higher.
Therefore, how the production capacity of improving laser equipment is industry technical problem urgently to be resolved.
Summary of the invention
In order to solve drawbacks described above existing in the prior art, the present invention propose a kind of three axis scanning galvanometer laser aids,
And cell processing device and its control method with the laser aid.
The technical solution adopted by the present invention is that designing a kind of three axis scanning galvanometer laser aids, including laser, first are instead
It penetrates mirror, the second reflecting mirror, expand reshaper and three axis scanning galvanometers；The three axis scanning galvanometer include Z axis mobile focusing lens,
X-axis rotates galvanometer and Y-axis and rotates galvanometer, the laser beam of the laser transmitting successively pass through the first reflecting mirror, the second reflecting mirror,
It expands reshaper, Z axis mobile focusing lens, X-axis rotation galvanometer and Y-axis and rotates the multiple processing platforms of directive after galvanometer；Industrial personal computer
Control the laser, Z axis mobile focusing lens, X-axis rotation galvanometer and Y-axis rotation galvanometer work.
A kind of cell processing device has also been devised in the present invention comprising three axis scanning galvanometer described in claim 1 swashs
Electro-optical device is respectively arranged below with A platform and B platform in three axis scanning galvanometer laser aids, and is replaced with unprocessed wafer
The A runner for changing wafer machined on A platform, with the B runner of wafer machined on unprocessed wafer replacement B platform；Institute
It states three axis scanning galvanometer laser aids and processes the wafer being located on A platform and B platform in turn；Divide below the A platform and B platform
Not She You positioning camera module, wafer position information issued the industrial personal computer by the positioning camera module.
The A platform includes A1 platform and A2 platform, and the B platform includes B1 platform B2 platform, is divided below each platform
Not She You positioning camera module, wafer position information issued the industrial personal computer by the positioning camera module.
The A platform and B platform use transparent material.
The A runner and B runner use identical structure, all include the feeding side transmission belt being successively connected, machining position transmission
Band and blanking side transmission belt, the wafer can be placed in three sections of transmission belt upper surfaces and be transmitted；Machining position transmission belt is mounted on top
It rises on device；Machining position transmission belt can rise to and feeding side transmission belt and blanking side transmission belt guarantor under the driving of jacking apparatus
The neat or decline that maintains an equal level is submerged in the A platform or B platform.
The A platform and B platform use identical structure, all include the escape groove for avoiding the machining position transmission belt, platform
On be also distributed multiple vacuum sucking holes, the vacuum sucking holes connect vacuum generating device, when machining position transmission belt sinks to the evacuation
When in slot, the wafer is laid on platform, and the wafer can be sucked in the vacuum sucking holes.
This three sections of transmission belts of feeding side transmission belt, machining position transmission belt and blanking side transmission belt are all parallel by two
Belt constitute, the wafer is placed on belt and transmitted；The corresponding escape groove also includes two parallel elongated slots, with
Avoid the belt.
The vacuum generating device, feeding side transmission belt, machining position transmission belt and blanking side transmission belt are by variable program control
Device control processed, variable program controller and the industrial personal computer carry out signal interaction.
A kind of control method of above-mentioned cell processing device has also been devised in the present invention, passes through the unprocessed crystalline substance of A runner
Machined wafer, replaces wafer machined on B platform with unprocessed wafer by B runner on circle replacement A platform；With three
Axis scanning galvanometer laser aid processes the wafer being located on A platform and B platform in turn.
The control method is comprising the following specific steps the lifting device in the first step, A runner drives machining position transmission belt
Rise, feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt, on unprocessed wafer replacement A platform
Machined wafer, then three transmission belts all stop operating, and lifting device drives the sinking of machining position transmission belt will be unprocessed
Wafer is shelved on A platform, and wafer is sucked in vacuum sucking holes, the positioning camera module photograph wafer position below A platform；Meanwhile
Three axis scanning galvanometer laser aids guide the wafer on laser beam processing B platform according to wafer position；In second step, B runner
Lifting device drives machining position transmission belt to rise, feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt, with not
Machined wafer on the wafer replacement B platform of processing, then three transmission belts all stop operating, and lifting device drives processing
Unprocessed wafer is shelved on B platform by position transmission belt sinking, and wafer, the positioning camera below B platform is sucked in vacuum sucking holes
Module photograph wafer position；Meanwhile three axis scanning galvanometer laser aid according to wafer position guide laser beam processing A platform on
Wafer.
The A platform includes A1 platform and A2 platform, and the B platform includes B1 platform B2 platform；In the first step, three
Axis scanning galvanometer laser aid guides laser beam successively to process the wafer on B1 platform and B2 platform according to wafer position；
In the second step, three axis scanning galvanometer laser aids guide laser beam to the crystalline substance on A1 platform and A2 platform according to wafer position
Circle is successively processed.
The beneficial effect of the technical scheme provided by the present invention is that:
The laser beam that one laser of the present invention issues passes through three axis scanning galvanometers, successively the multiple processing platforms of directive, in turn
Processing is located at the wafer on multiple processing platforms, reduces the totle drilling cost of complete equipment, saves with the replacement of undressed wafer
The time of wafer is processed, the time that laser processing waits is reduced, the utilization rate of improving laser increases laser equipment production capacity extremely
8000-8500 piece is per hour.
Detailed description of the invention
Below with reference to embodiment and attached drawing, the present invention is described in detail, in which:
Fig. 1 is three axis scanning galvanometer laser aid schematic illustrations；
Fig. 2 is cell processing device schematic illustration；
Fig. 3 is two station runner top views；
Fig. 4 is four station runner top views；
Fig. 5 is present pre-ferred embodiments control circuit functional block diagram；
Fig. 6 is present pre-ferred embodiments control flow chart.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is described in further detail.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, not
For limiting the present invention.
The invention discloses a kind of three axis scanning galvanometer laser aids, referring to schematic illustration shown in fig. 1 comprising swash
Light device 1, the second reflecting mirror 32, expands reshaper 2 and three axis scanning galvanometers 3 at first reflecting mirror 31；The three axis scanning galvanometer packet
Z axis mobile focusing lens 3a, X-axis rotation galvanometer 3b and Y-axis rotation galvanometer 3c are included, the laser beam 4 of the laser transmitting is successively
By the first reflecting mirror, the second reflecting mirror, expand reshaper, Z axis mobile focusing lens, X-axis rotation galvanometer and Y-axis rotation galvanometer
The multiple processing platforms of directive afterwards, processing in turn are located at the cell piece (namely wafer) on processing platform.
Industrial personal computer controls the laser, Z axis mobile focusing lens, X-axis rotation galvanometer and Y-axis rotation galvanometer work.Swash
Light device generates laser beam under the control of industrial personal computer.In three axis scanning galvanometers, by finely tuning Z axis mobile focusing lens 3a, come
Realize focus-compensating, X-axis rotation galvanometer and Y-axis rotation galvanometer rotated under the control of industrial personal computer, it is guided focused after laser beam
Directive processing platform.Structure whereby, the range that three axis scanning galvanometers can be such that laser beam processes become very big, can process multiple
Wafer on processing platform.In the preferred embodiment of this patent, which is used for the process equipment of cell piece, should
Solving this is citing, and three axis scanning galvanometer laser aids also can be used in other equipment.
The invention also discloses a kind of cell processing device, referring to Fig. 2 shows the signal of cell processing device principle
Figure comprising above-mentioned three axis scanning galvanometer laser aid is respectively arranged below with A platform 6 in three axis scanning galvanometer laser aids
With B platform 7, and with the A runner of machined wafer on unprocessed wafer replacement A platform, B is replaced with unprocessed wafer
The B runner of machined wafer on platform；The three axis scanning galvanometer laser aid is processed in turn to be located on A platform and B platform
Wafer.It is replaced the time that machined wafer needs loading and unloading with unprocessed wafer, the time of loading and unloading and laser processing
The time of wafer is substantially suitable, and such three axis scanning galvanometer laser aid can work always.One is swashed compared to the prior art
The runner of electro-optical device corresponding a processing platform and a loading and unloading, the present invention can save one or more laser aids, subtract
Few equipment cost reduces the time that laser processing waits, and the utilization rate of improving laser increases laser equipment production capacity to 8000-
8500 per hour.
The A platform 6 and B platform 7 are respectively arranged below with positioning camera module 10, and the positioning camera module is by wafer position
Confidence breath issues the industrial personal computer.Industrial personal computer obtains the accurate location of wafer, and the wafer of scanning galvanometer can control to carry out accurate add
Work.In some embodiments, the size of wafer is greater than the size of A platform (or B platform), although so positioning camera module is pacified
Mounted in the lower section of platform, wafer can be also shot, to the position of industrial personal computer feedback wafer.It in the preferred embodiment, is preferably anti-
The position of wafer is reflected, the laser processing platform uses transparent material.
Referring to Fig. 2 shows cell processing device schematic illustration, 5 meaning of icon is the scanning area of laser beam,.
Embodiment shown in referring to Fig. 3, there are two processing stations, i.e. A platform 6 and B platform 7.
Referring to embodiment shown in Fig. 4, there are four processing stations.The A platform 6 includes A1 platform 6a and A2 platform 6b,
The B platform 7 includes B1 platform 7a and B2 platform 7b, and each platform is respectively arranged below with positioning camera module 10, the positioning
Wafer position information is issued the industrial personal computer by camera model.
In the preferred embodiment, the A platform 6 and B platform 7 use transparent material.
The preferred embodiment shown referring to Fig. 3, the A runner and B runner use identical structure, all include successively being connected
Feeding side transmission belt 21, machining position transmission belt 22 and blanking side transmission belt 23, the wafer can be placed in three sections of transmission belt upper surfaces
It is transmitted；Machining position transmission belt is mounted on jacking apparatus 24；Machining position transmission belt can rise under the driving of jacking apparatus
It is submerged in the A platform 6 or B platform 7 to or decline concordant with feeding side transmission belt and the holding of blanking side transmission belt.
The A platform 6 and B platform 7 use identical structure, all include the escape groove for avoiding the machining position transmission belt, put down
Multiple vacuum sucking holes are also distributed on platform, the vacuum sucking holes connect vacuum generating device, when machining position transmission belt sinks to described keep away
When allowing in slot, the wafer is laid on platform, and the wafer can be sucked in the vacuum sucking holes.
This three sections of transmission belts of feeding side transmission belt 21, machining position transmission belt 22 and blanking side transmission belt 23 are all by two
The parallel belt 20 of item is constituted, and the wafer is placed on belt and is transmitted；The corresponding escape groove also includes two parallel
Elongated slot, to avoid the belt 20.
Referring to the preferred embodiment shown in Fig. 4, there are four processing stations.The A platform 6 includes A1 platform 6a and A2 platform
6b, the B platform 7 include B1 platform 7a and B2 platform 7b, and the wafer is placed in three sections of transmission belt upper surfaces and is transmitted；Processing
Position transmission belt is mounted on jacking apparatus 24；Machining position transmission belt can rise under the driving of jacking apparatus to be transmitted with feeding side
Band is concordant with the holding of blanking side transmission belt or decline is submerged in the A platform 6 or B platform 7.Machining position transmission belt is transmitted every time,
Two machined wafers can be replaced with two undressed wafers.
Referring to the preferred embodiment control circuit functional block diagram shown in Fig. 5, the vacuum generating device, feeding side transmission belt
21, machining position transmission belt 22 and blanking side transmission belt 23 are by variable program controller control (PLC in figure), variable program control
Device and the industrial personal computer carry out signal interaction.By the signal interaction of the two, complete machine Collaborative Control forms an entirety.
The invention also discloses a kind of control methods of above-mentioned cell processing device, pass through the unprocessed crystalline substance of A runner
Machined wafer, replaces wafer machined on B platform with unprocessed wafer by B runner on circle replacement A platform；With three
Axis scanning galvanometer laser aid processes the wafer being located on A platform and B platform in turn.
Referring to the flow chart of the preferred embodiment control shown in Fig. 6, the control method of the cell processing device includes
Step in detail below:
Lifting device in the first step, A runner drives machining position transmission belt to rise, feeding side transmission belt, machining position transmission belt and
The rotation of blanking side transmission belt, with the machined wafer on unprocessed wafer replacement A platform, then three transmission belts all stop
Rotation, lifting device drive the sinking of machining position transmission belt that unprocessed wafer is shelved on A platform, and crystalline substance is sucked in vacuum sucking holes
Round, below A platform positioning camera module photograph wafer position；Meanwhile three axis scanning galvanometer laser aid according to wafer position
Guide the wafer on laser beam processing B platform；
Lifting device in second step, B runner drives machining position transmission belt to rise, feeding side transmission belt, machining position transmission belt and
The rotation of blanking side transmission belt, with the machined wafer on unprocessed wafer replacement B platform, then three transmission belts all stop
Rotation, lifting device drive the sinking of machining position transmission belt that unprocessed wafer is shelved on B platform, and crystalline substance is sucked in vacuum sucking holes
Round, below B platform positioning camera module photograph wafer position；Meanwhile three axis scanning galvanometer laser aid according to wafer position
Guide the wafer on laser beam processing A platform.
It is described by above-mentioned process it is found that two runners of assembly and two processing are put down under three axis scanning galvanometer laser aids
Platform, it is not synchronous driving that dual channel, which transmits wafer to processing platform,.After cooked mode starts, it is flat to A that A runner transports wafer
Platform, the machining position transmission belt for being at this moment initially located in low level increase under the work of lifting device so that machining position transmission belt with it is upper
Expect that side transmission belt is concordant with blanking side transmission belt, machined wafer is transported to blanking side transmission belt from machining position transmission belt, rises
Falling unit decline, unprocessed wafer are fallen on A platform, and the work of A platform vacuum generating device adsorbs fixed wafer, positions phase
Machine module is taken pictures positioning, and then three axis scanning galvanometer laser aids start the wafer processed on A platform.In laser processing A platform
While wafer, the machining position transmission belt in B runner rises in the work of lifting device, and unprocessed wafer is transmitted from feeding side
Band is transferred into machining position transmission belt, lifting device decline, and wafer is fallen on B platform, inhales vacuum, and camera is taken pictures, and completes positioning,
Wafer laser on A platform after processing is completed, laser under the adjustment of shaft galvanometer, laser by A optical path-deflecting to B optical path,
Laser goes to B platform, and laser is not necessarily to excessively stop the time difference that light out waits loading and unloading time-consuming, to stand after optical path-deflecting
Quarter processes the wafer on B platform, and in the same time, A platform vacuum breaker, lifting device rises, and machined wafer is from adding
Station transmission belt is sent to blanking side transmission belt, and then wafer is sent out by A runner.Simultaneously from feeding side transmission belt transmit into
Carry out new wafer to machining position transmission belt, lifting device declines, and undressed wafer is fallen on A platform, subsequently completes fixation, camera
Positioning；After processing is completed, laser goes to A platform and is laser machined the wafer of B tabletop of platform.B platform vacuum breaker, lifting device
Rise, machined wafer is sent to blanking side transmission belt from machining position transmission belt, is then sent out by B runner；It transmits simultaneously
New wafer is sent to machining position transmission belt, lifting device decline from feeding side transmission belt, and wafer drops down onto B platform, completes to fix
It is positioned with camera, it is reciprocal with this.
In the present invention, the time for laser machining wafer is about 0.85 second, and wafer is positioned from platform, fixed and camera is sent to
Time also to reach 0.85 second or so, therefore two step alternate cycles in control flow, laser processing is carrying out always, subtracts
The waiting time for having lacked laser processing, the utilization rate of laser is greatly increased, the process time of single-wafer has also obtained greatly
Big reduction.
In the preferred embodiment, the A platform 6 includes A1 platform 6a and A2 platform 6b, and the B platform 7 includes B1 platform
7a and B2 platform 7b.In the first step, three axis scanning galvanometer laser aids guide laser beam to B1 platform according to wafer position
Wafer on 7a and B2 platform 7b is successively processed, i.e., first process B1 platform 7a(or B2 platform 7b) on wafer, then again
Process B2 platform 7b(or B1 platform 7a) on wafer；It is reprocessed on A platform after two wafer completion of processing on B platform
Two wafers.In the second step, three axis scanning galvanometer laser aids guide laser beam to A1 platform 6a according to wafer position and
Wafer on A2 platform 6b is successively processed, i.e., first process A1 platform 6a(or A2 platform 6b) on wafer；To two on A platform
After wafer completion of processing, two wafers on B platform are reprocessed.Whereby with a laser to the crystalline substance on 4 processing platforms
Circle is processed in turn, greatly improves working efficiency.
Above embodiments are by way of example only, non-to provide constraints.It is any without departing from the application spirit and scope, and to it
The equivalent modifications or change of progress, shall be included in the scope of claims of this application.
Claims (11)
1. a kind of three axis scanning galvanometer laser aids, including laser (1), which is characterized in that further include the first reflecting mirror (31),
Second reflecting mirror (32) expands reshaper (2) and three axis scanning galvanometers (3)；The three axis scanning galvanometer, which includes that Z axis is mobile, to be focused
Lens (3a), X-axis rotation galvanometer (3b) and Y-axis rotation galvanometer (3c), the laser beam (4) of laser transmitting successively pass through the
One reflecting mirror, the second reflecting mirror, expand reshaper, Z axis mobile focusing lens, X-axis rotation galvanometer and Y-axis rotation galvanometer after directive
Multiple processing platforms；Industrial personal computer controls the laser, Z axis mobile focusing lens, X-axis rotation galvanometer and Y-axis and rotates galvanometer work
Make.
2. a kind of cell processing device, which is characterized in that including three axis scanning galvanometer laser aid described in claim 1,
It is respectively arranged below with A platform (6) and B platform (7) in three axis scanning galvanometer laser aids, and is replaced with unprocessed wafer
The A runner of machined wafer on A platform, with the B runner of wafer machined on unprocessed wafer replacement B platform；It is described
Three axis scanning galvanometer laser aids process the wafer being located on A platform and B platform in turn；Below the A platform and B platform respectively
Equipped with positioning camera module (10), wafer position information is issued the industrial personal computer by the positioning camera module.
3. cell processing device as claimed in claim 2, which is characterized in that the A platform (6) include A1 platform (6a) and
A2 platform (6b), the B platform (7) includes B1 platform (7a) B2 platform (7b), and each platform is respectively arranged below with positioning camera
Wafer position information is issued the industrial personal computer by module (10), the positioning camera module.
4. cell processing device as claimed in claim 3, which is characterized in that the A platform (6) and B platform (7) are using saturating
Bright material.
5. cell processing device as claimed in claim 2, which is characterized in that the A runner and B runner use identical knot
Structure all includes feeding side transmission belt (21), machining position transmission belt (22) and the blanking side transmission belt (23) being successively connected, the crystalline substance
Circle can be placed in three sections of transmission belt upper surfaces and be transmitted；Machining position transmission belt is mounted on jacking apparatus (24)；Machining position transmission
Band can rise to or decline concordant with feeding side transmission belt and the holding of blanking side transmission belt under the driving of jacking apparatus and submerge institute
It states in A platform (6) or B platform (7).
6. cell processing device as claimed in claim 5, which is characterized in that the A platform (6) and B platform (7) use phase
Same structure all includes the escape groove for avoiding the machining position transmission belt, and multiple vacuum sucking holes are also distributed on platform, and the vacuum is inhaled
Hole connects vacuum generating device, and when machining position transmission belt is sunk in the escape groove, the wafer is laid on platform, institute
The wafer can be sucked by stating vacuum sucking holes.
7. cell processing device as claimed in claim 6, which is characterized in that feeding side transmission belt (21), machining position
Transmission belt (22) is all that the belt parallel by two (20) is constituted with this three sections of transmission belts of blanking side transmission belt (23), the wafer
It is placed on belt and is transmitted；The corresponding escape groove also includes two parallel elongated slots, to avoid the belt.
8. cell processing device as claimed in claim 6, which is characterized in that the vacuum generating device, the transmission of feeding side
Band (21), machining position transmission belt (22) and blanking side transmission belt (23) are controlled by variable program controller, variable program controller
Signal interaction is carried out with the industrial personal computer.
9. a kind of control method of any one of claim 2 to 8 cell processing device, which is characterized in that pass through A runner
With wafer machined on unprocessed wafer replacement A platform, is replaced by B runner with unprocessed wafer and added on B platform
The wafer of work；Process the wafer being located on A platform and B platform in turn with three axis scanning galvanometer laser aids.
10. the control method of cell processing device as claimed in claim 9, which is characterized in that comprising the following specific steps
Lifting device in the first step, A runner drives machining position transmission belt to rise, feeding side transmission belt, machining position transmission belt and
The rotation of blanking side transmission belt, with the machined wafer on unprocessed wafer replacement A platform, then three transmission belts all stop
Rotation, lifting device drive the sinking of machining position transmission belt that unprocessed wafer is shelved on A platform, and crystalline substance is sucked in vacuum sucking holes
Round, below A platform positioning camera module photograph wafer position；Meanwhile three axis scanning galvanometer laser aid according to wafer position
Guide the wafer on laser beam processing B platform；
Lifting device in second step, B runner drives machining position transmission belt to rise, feeding side transmission belt, machining position transmission belt and
The rotation of blanking side transmission belt, with the machined wafer on unprocessed wafer replacement B platform, then three transmission belts all stop
Rotation, lifting device drive the sinking of machining position transmission belt that unprocessed wafer is shelved on B platform, and crystalline substance is sucked in vacuum sucking holes
Round, below B platform positioning camera module photograph wafer position；Meanwhile three axis scanning galvanometer laser aid according to wafer position
Guide the wafer on laser beam processing A platform.
11. the control method of cell processing device as claimed in claim 10, which is characterized in that the A platform (6) includes
A1 platform (6a) and A2 platform (6b), the B platform (7) include B1 platform (7a) B2 platform (7b)；
In the first step, three axis scanning galvanometer laser aids guide laser beam flat to B1 platform (7a) and B2 according to wafer position
Wafer on platform (7b) is successively processed；
In the second step, three axis scanning galvanometer laser aids guide laser beam flat to A1 platform (6a) and A2 according to wafer position
Wafer on platform (6b) is successively processed.
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