CN110195166A - A kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method - Google Patents

A kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method Download PDF

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CN110195166A
CN110195166A CN201910306870.4A CN201910306870A CN110195166A CN 110195166 A CN110195166 A CN 110195166A CN 201910306870 A CN201910306870 A CN 201910306870A CN 110195166 A CN110195166 A CN 110195166A
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temperature
alloy
gas
melting
nickel
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彭丽军
刘峰
黄国杰
马吉苗
杨振
冯雪
尹向前
廖骏骏
雷伏庆
蒋志晶
朱太恒
陈军
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NINGBO XINGYE SHENGTAI GROUP CO Ltd
GRIMN Engineering Technology Research Institute Co Ltd
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NINGBO XINGYE SHENGTAI GROUP CO Ltd
GRIMN Engineering Technology Research Institute Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/03—Making non-ferrous alloys by melting using master alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Physics & Mathematics (AREA)
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  • Crystallography & Structural Chemistry (AREA)
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Abstract

The present invention relates to a kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing methods, include Ni:1.0~2.5%, Co:0.5~2.5%, Si:0.3~1.2% by mass parts, and remainder is made of wherein Cu and inevitable impurity.

Description

A kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method
Technical field
The present invention relates to a kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method, the CuNiCoSi systems Alloy product can be applied to high reliability lead frame, discrete component, bend resistance elasticity component and automotive electronics component Deng belonging to non-ferrous metals processing field.
Background technique
Information age causes IT industry to have swept the globe, and integrated circuit is the core of hyundai electronics information technology, and lead Frame is the important component of integrated circuit, plays support chip, connect external circuit, distribute heat, power distribution etc. and make With.The basic material of integrated circuit (IC) is chip, lead frame and encapsulating material.With Integrated circuit IC to ultra-large and Great scale rapidly develops, and the highly integrated densification of route, lead frame also develops to short, small, light, thin direction, and manufacture is drawn The copper alloy band of wire frame frame material not only has strict requirements on dimensional accuracy, surface quality and template, but also to have good Good thermally conductive, electric conductivity, higher intensity, elasticity, hardness and softening temperature will also have good heat-resisting, anti-corrosion, antioxygen A series of excellent composite basis performances such as change, weldability, plastic packaging performance and repeated bending performance.
From the point of view of high-intensitive and high conductivity, as blaster fuse frame material copper alloy, precipitation strength type copper is closed The usage amount of gold is increasing, and is in the past the solution strengthening type copper alloy of representative with phosphor bronze, brass etc. to replace.For precipitating Strengthened copper alloy by carrying out ageing treatment to the supersaturated solid solution by solutionizing processing, and keeps fine precipitate equal Disperse evenly, the intensity of alloy is improved, while the solid solution element amount in copper is reduced, and electric conductivity improves.Therefore, available The engineering properties such as intensity, elasticity are excellent and the good material of electric conductivity, thermal conductivity.In precipitation strength type copper alloy, Cu-Ni-Si Series copper alloy is the representative copper alloy for having both high electrical conductivity, intensity and processing performance, and is being collected in copper alloy industry One of the alloy of middle exploitation.The copper alloy is come by the way that fine Ni-Si series intermetallic compound particle is precipitated in Copper substrate Realize the raising of intensity and conductivity.
In order to further improve the comprehensive performance of Cu-Ni-Si alloy, the positive exploitation for carrying out following various technologies: addition Alloying component other than Ni and Si carries out purifying processing to alloy bath composition, the optimization of crystalline structure, precipitated phase it is excellent Change, processing technology is improved etc..For example, as it is known that by addition Co or control in parent phase the second phase particles that are precipitated come Comprehensive performance is improved, the patent content nearest as Cu-Ni-Co-Si series copper alloy is listed below.
A kind of forging copper alloy is described in patent CN102812138A, it includes nickel: 1~2.5 wt %, cobalt: 0.5~ Total content of 2.0 wt%, silicon: 0.5~1.5wt% and copper and inevitable impurity as remainder, nickel and cobalt is The ratio of 1.7~4.3wt%, (Ni+Co)/Si are 2: 1~7: 1, and the forging copper alloy is with the conduction for being more than 40%IACS Property.Cobalt in alloy is combined with silicon, can be limited particle growth and be improved its softening resistant performance, therefore forms that facilitate timeliness hard The silicide of change.And the patent document describes in its manufacturing process, the process comprising successively carrying out following processing: solid It is cold worked after dissolving processing without centre, but with to the effective multiple timeliness of the second phase is precipitated, to being essentially single-phase Above-mentioned alloy implement an aging anneal, and formed have silicide heterogeneous alloy, and to heterogeneous alloy implement be cold worked, Secondary ageing processing is carried out, with the effective temperature to increase precipitation particles distribution (when wherein, the second age anneal temperature is than first It is low to imitate annealing temperature) and the time, secondary ageing annealing is implemented to heterogeneous alloy.In addition, the patent document also describes at solid solution Reason is carried out 10 seconds~1 hour with 750 DEG C~1050 DEG C of temperature；Timeliness carries out 30 points with 350 DEG C~600 DEG C of temperature Clock~30 hour；It is cold worked with 5~50% working modulus；Secondary ageing is carried out 10 seconds at 350 DEG C~600 DEG C of temperature ~30 hours.
It is excellent that a kind of intensity, conductivity, bendability, stress relaxation characteristics are disclosed in patent CN102245787B Copper alloy, it is characterised in that: contain Ni:0.5~4.0wt%, Co:0.5~2.0wt%, Si:0.3~1.5wt%, and remainder It is made of Cu and inevitable impurity；The sum of Ni amount and Co amount, ratio (Ni+Co)/Si with Si amount are the 2~7, the 2nd phase Density (number of per unit area) be 108~1012/mm2；Wherein, the 2nd phase density of 50~1000nm size is 104~108/mm2.According to the patent document, by making the density (number of per unit area) of the 2nd phase be 108~1012 A/mm2, it can be achieved that excellent each characteristic.In addition, the density 104~108 of the second phase by making 50~1000nm size A/mm2, the second phase can be made to disperse, thus waited at 850 DEG C or more in the solution heat treatment under high temperature, can inhibit the coarse of crystal grain, So as to improve bendability.On the other hand, when the size of the second phase is less than 50nm, inhibit the effect of particle growth It is lower, it is thus not preferred.The patent also describes above-mentioned copper alloy can be hot by carrying out the homogenization of ingot casting at 900 DEG C or more Processing, and 850 DEG C are cooled to 0.5~4 DEG C/sec of cooling velocity in hot-working later, then each progress 1 time or more Heat treatment and cold working.
A kind of Cu-Ni-Si-Co series copper alloy is disclosed in patent CN102227510B, can be realized with high level strong Degree and conductivity, while resistance to permanent deformation is also excellent.Copper alloy for electronic material, be containing Ni:1.0~2.5 mass %, Mass %, Si:0.3 of Co:0.5~2.5~1.2 mass %, and the electronics that remainder is made of Cu and inevitable impurity Material copper alloy, wherein in the second phase particles being precipitated in parent phase, partial size is the number of 5nm or more, 50nm particle below Density is 1 × 1012~1 × 1014A/mm3；Partial size be 5nm or more, less than the particle of 20nm a number density relative to partial size It is indicated for the ratio of a number density of 20nm or more, 50nm particle below, is 3~6.The patent, which also describes, makes material temperature Degree is the heating of 950 DEG C or more, 1050 DEG C or less progress 1 hour or more, then carries out hot rolling, then by any cold rolling after, The process that material temperature is heated to 950 DEG C or more, 1050 DEG C or less progress solution treatment；Then at 400 DEG C or more, 500 DEG C Below heat the ageing treatment of progresss in 1~12 hour, then carry out reduction ratio be 30~50% cold rolling, then progress 300 DEG C with Above, 400 DEG C or less heating 3~36 hours, make 3~10 times of the heating time in ageing treatment of the heating time Secondary ageing treatment process.
A kind of copper alloy bar is disclosed in patent 201180059363.7, be containing Ni:1.0~2.5 wt%, Co:0.5 ~2.5wt%, Si:0.3~1.2wt%, the copper alloy for electronic material that remainder is made of Cu and inevitable impurity Item, wherein resulting as a result, meeting following (a) and (b) two according to the X ray diffraction polar diagram measurement on the basis of rolling surface Person :(a) { 200 } in pole figure, α=20 ° are scanned in resulting diffraction peak intensity using β, the peak heights that 145 ° of β angle relative to The peak heights of standard copper powders are 5.2 times or less；(b) in { 111 } pole figure, resulting diffraction maximum is scanned using β in α=75 ° In intensity, the peak heights that 185 ° of β angle are 3.4 times or more relative to the peak heights of standard copper powders.The patent also describes To the material 950 DEG C or more and 1050 DEG C or less heat 1 hour more than after progress hot rolling, make the temperature at the end of hot rolling 850 DEG C or more, the average cooling rate from 850 DEG C to 400 DEG C is 15 DEG C/s or more to be cooled down；Or from 850 DEG C or more and 1050 DEG C or less progress solution treatment, make material temperature be reduced to 650 DEG C of 1 DEG C/s of average cooling rate more than and less than 15 DEG C/s is cooled down, and is made cold to carry out from the 15 DEG C/s or more of average cooling rate when being reduced to 400 DEG C for 650 DEG C But；Then carry out cold rolling；Ageing treatment twice is then carried out, first time ageing treatment is carried out at 425 DEG C more than and less than 475 DEG C 1~24 hour, second of ageing treatment carried out 1~48 hour at 100 DEG C more than and less than 350 DEG C.
Patent CN101646791B discloses the Cu-Ni-Si-Co system that a kind of generation of coarse second phase particles is inhibited Alloy.In the manufacturing step of Cu-Ni-Si-Co system alloy, hot rolling be heated at 950 DEG C~1050 DEG C 1 hour or more it is laggard Row is made the temperature at the end of hot rolling at 850 DEG C or more, is cooled down with the cooling velocity of 15 DEG C/s or more, and solution treatment exists It carries out at 850 DEG C~1050 DEG C, is then cooled down with the cooling velocity of 15 DEG C/s or more.According to the present invention, it is possible to provide a kind of Copper alloy for electronic material, it is remaining containing Ni:1.0~2.5wt%, Co:0.5~2.5wt%, Si:0.30~1.20wt% Part includes Cu and inevitable impurity, wherein there is no the second phase particles that partial size is more than 10 μm, are being parallel to calendering On the section in direction, the second phase particles that partial size is 5 μm~10 μm are 50/mm2 or less.
Patent CN101541987B discloses a kind of intensity, conductivity and the excellent Cu-Ni-Si-Co system conjunction of punching property Gold.The present invention be a kind of copper alloy for electronic material, containing Ni:1.0~2.5wt%, Co:0.5~2.5wt%, Si:0.30~ 1.2wt%, remainder is made of Cu and inevitable impurity, when being observed on the section for be parallel to rolling direction, For partial size the composition of 0.1 μm or more, 1 μm second phase particles below difference and the area ratio, (Ni+Co+Si) amount in Between be worth: ρ (wt%) be 20 (wt%)≤ρ≤60 (wt%), standard deviation: σ (Ni+Co+Si) be σ (Ni+Co+Si)≤ 30 (wt%), the area ratio: S (%) is 1%≤S≤10%.
Although higher intensity and electric conductivity can be obtained in the copper alloy that patent documents above is recorded, but still have some raisings Space.Moreover, patent documents above is to consider the raising of the basic property for such Cu alloy material, without examining Consider its service performance in product device, especially buckling performance, such product is due to its high mechanical properties, after bending Easily there is fine crack, brittle failure, orange peel fracture etc., leads to occur failure, short circuit in products application, eventually lead to The damage of device or even entire circuit.
Although patent CN102245787B improves it using the way of the second phase number of control and restriction of unit area Bendability, but high reliability still can not be provided well for ultimately forming the buckling performance after product.
Although patent CN102227510B study and has been limited to the number of precipitated phases different in a volume, its Which kind of is not screened mutually, and its precipitated phase is limited using 50nm as boundary, there is precipitated phase above or below 50nm, at this In alloy system, precipitated phase is greater than after 50nm, although being easy to get preferable tensile property, can lose its buckle resistance Energy, the especially bending performance of wide-angle.
Summary of the invention
In view of the deficienciess of the prior art, the present invention is intended to provide a kind of Cu-Ni-Co-Si copper alloy and its manufacturer Method can have excellent warping resistance performance while reaching high intensity and conductivity.
To achieve the above object, the present invention provides the following technical solutions:
A kind of warping resistance CuNiCoSi used for lead frame system alloy, by mass parts include Ni:1.0~2.5 %, Co:0.5~ The % of 2.5 %, Si:0.3~1.2, remainder are made of wherein Cu and inevitable impurity.
A kind of manufacturing method for processing above-mentioned warping resistance CuNiCoSi used for lead frame system alloy comprising successively carry out with Lower process:
1) melting, the addition sequence of alloy, melting: are carried out using vacuum induction furnace are as follows: cathode copper, pure nickel, pure cobalt, nisiloy close Temperature is raised to 1245~1255 DEG C by gold, until going out after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Furnace casting, cast temperature are 1139~1160 DEG C；
2) it, mills face: milling face being carried out to alloy, upper and lower surface respectively mills 1mm；
3), hot rolling: heating alloy, heating temperature be 900 DEG C, soaking time 1h, hot rolling general working rate be 92~ 95%；
4), solid solubility temperature T is heated to by vertical or horizontal annealing furnace1, gas cooling is then quickly carried out, cooling gas is adopted For the mixed gas of nitrogen and argon gas, mixed proportion is according to the difference of ingredient and working modulus in N2Between/Ar=1 ~ 3.5, gas Temperature≤20 DEG C are heated to temperature T using bell-type annealing furnace2, 1 ~ 8 hour then is kept the temperature, gas is cold quickly carrying out But, the cooling gas in this stage is using the mixed gas of nitrogen and argon gas, and mixed proportion is according to ingredient and working modulus Difference is in N2Between/Ar=2 ~ 3.2, temperature is then risen to T between 5 DEG C ~ 30 DEG C/min by gas temperature≤20 DEG C3, heat preservation 1 Hour, it then carries out furnace cooling and alloy particle is precipitated, the grain size of alloy particle is between 85~180 μm, the crystalline substance of precipitation In grain, the NiSi phase number density that partial size is 3nm ~ 10nm is 8 × 1013~6 × 1014A/mm3, CoSi phase number density be 4 × 105~6 × 108A/mm3；The NiSi phase number density of 10nm ~ 20nm is 3 × 1010~4 × 1012A/mm3, CoSi phase number is close Degree is 3 × 106~7 × 109A/mm3；The NiSi phase number density of 20nm-30nm is 8 × 109~2 × 1011A/mm3, CoSi Phase number density is 8 × 107~2 × 1010A/mm3；The NiSi phase number density of 30nm or more is 6 × 105~9 × 107A/ mm3, CoSi phase number density is 3 × 109~2 × 1012A/mm3；But maximum precipitation particles diameter NiSi phase is no more than 45nm, CoSi phase is no more than 50nm；Minimum spacing between two 30nm or more NiSi precipitated phases is more than or equal to 105nm, two 30nm with Minimum spacing between upper CoSi precipitated phase is more than or equal to 140nm, two 30nm or more NiSi precipitated phases and CoSi precipitated phase it Between minimum spacing be more than or equal to 110nm.
As the improvement of above-mentioned manufacturing method, T1Range be 880 DEG C ~ 1020 DEG C.
Preferred, T as above-mentioned manufacturing method2Temperature range be 420 DEG C ~ 490 DEG C.
As the further improvement of above-mentioned manufacturing method, T3Temperature range be 150 DEG C ~ 320 DEG C.
Compared with the prior art, the advantages of the present invention are as follows: warping resistance CuNiCoSi used for lead frame system conjunction of the invention The tensile strength sigma b of gold can reach 860~915MPa, and conductivity is 42~50%IACS.It is with high resiliency, high intensity, good Electric conductivity, excellent stress relaxation resistance, while its buckling performance is excellent, laterally longitudinal in R/T=0.2, bending 90 degree do not occur any defect, and laterally longitudinal in R/T=0.5, bending 180 degree is not broken, and can be applied to reliability In demanding lead frame and automotive electronics component.
Detailed description of the invention
Fig. 1-Fig. 3 is the alloying component formula (wt%) of 1 embodiment 1-60 of table；
Fig. 4-Figure 12 is the alloying component formula (wt%) of 2 embodiment 1-60 of table.
Specific embodiment
Hereafter in the present invention warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method do furtherly It is bright.
A kind of warping resistance CuNiCoSi used for lead frame system alloy, it contains following chemical component: Ni:1.5~2.2 The wt% of wt%, Si:0.3~1.0 of wt%, Co:0.5~1.2, and remainder is made of Cu and inevitable impurity.
The effect of institute's addition element:
Cobalt: mainly in conjunction with silicon, forming cobalt silicon precipitated phase makes alloy that ageing strengthening occur, and inhibits crystal grain to grow up and does not connect with crystal boundary Continue reaction, may additionally form a kind of compound resistant to high temperatures with copper, is conducive to the stress relaxation resistance for improving alloy.
Nickel: nickel can reduce solubility of the cobalt in copper, while crystal grain can also be inhibited to grow up with formation nisiloy precipitated phase With crystal boundary discontinuous reaction, but excessive nickel can make occur β phase in alloy, drastically influence the stress relaxation-resistant and fatigue of alloy Performance, therefore, the composition range of nickel should be 1.5~2.2%.
Silicon: it can play the role of refining crystal grain and improve alloy comprehensive performance, addition of suitable silicon in copper can be with Nickel and cobalt form precipitated phase to improve the mechanical property of alloy.
It is a further object of the present invention to provide a kind of structure property tune of warping resistance CuNiCoSi used for lead frame system alloy Prosecutor method.
To achieve the above object, following technical scheme is taken:
Which kind of after carrying out alloy melting, regardless of the processing technology of preparing using method, on the basis of product demand, ensure After general working rate reaches 92% or more,
Solid solubility temperature T is heated to by vertical or horizontal annealing furnace1(according to the difference of ingredient and general working rate, 880 DEG C ~ Between 1020 DEG C) and quickly carry out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion is according to ingredient and working modulus Difference is in N2Between/Ar=1 ~ 3.5, gas temperature≤20 DEG C), temperature T is heated to using bell-type annealing furnace2(according to ingredient And the difference of general working rate, between 420 DEG C ~ 490 DEG C) after heat preservation 1 ~ 8 hour, quickly carry out gas cooling (nitrogen and argon The mixed gas of gas, mixed proportion is according to the difference of ingredient and working modulus in N2Between/Ar=2 ~ 3.2, gas temperature≤20 DEG C), Temperature is then risen into temperature T with certain speed (according to the difference of ingredient and general working rate, between 5 DEG C ~ 30 DEG C/min)3 (according to the difference of ingredient and general working rate, between 150 DEG C ~ 320 DEG C) heat preservation 1 hour, then carries out furnace cooling, so that brilliant Grain size is between 85~180 μm, in the second phase particles of precipitation, NiSi phase number density that partial size be 3nm ~ 10nm for 8 × 1013~6 × 1014A/mm3, CoSi phase number density is 4 × 105~6 × 108A/mm3；The NiSi phase number of 10nm ~ 20nm is close Degree is 3 × 1010~4 × 1012A/mm3, CoSi phase number density is 3 × 106~7 × 109A/mm3；The NiSi of 20nm-30nm Phase number density is 8 × 109~2 × 1011A/mm3, CoSi phase number density is 8 × 107~2 × 1010A/mm3；30nm or more NiSi phase number density be 6 × 105~9 × 107A/mm3, CoSi phase number density is 3 × 109~2 × 1012A/mm3；But Maximum precipitation particles diameter NiSi phase is no more than 45nm, and CoSi phase is no more than 50nm；Between two 30nm or more NiSi precipitated phases Minimum spacing be more than or equal to 105nm, the minimum spacing between two 30nm or more CoSi precipitated phases is more than or equal to 140nm, two Minimum spacing between a 30nm or more NiSi precipitated phase and CoSi precipitated phase is more than or equal to 110nm, not only can achieve such The combination of the excellent basic property of alloy, and available excellent buckling performance.
Below by way of specific example, the technical scheme of the present invention will be further described.
Embodiment 1:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 1.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 1 in 2.
Embodiment 2:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 2.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1245 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 15min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1160 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 2 in 2.
Embodiment 3:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 3.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1246 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 12min, being sufficiently stirred after melt is completely melt, standing 6min Casting, cast temperature are 1145 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 3 in 2.
Embodiment 4:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 4.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1247 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 16min, being sufficiently stirred after melt is completely melt, standing 8min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 4 in 2.
Embodiment 5:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 5.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1247 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 22min, being sufficiently stirred after melt is completely melt, standing 6min Casting, cast temperature are 1156 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 5 in 2.
Embodiment 6:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 6.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1248 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 11min, being sufficiently stirred after melt is completely melt, standing 3min Casting, cast temperature are 1165 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 6 in 2.
Embodiment 7:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 7.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1249 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 14min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1155 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 7 in 2.
Embodiment 8:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 8.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1252 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 12min, being sufficiently stirred after melt is completely melt, standing 3min Casting, cast temperature are 1139 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 8 in 2.
Embodiment 9:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 9.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1253 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 16min, being sufficiently stirred after melt is completely melt, standing 6min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 9 in 2.
Embodiment 10:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 10.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1255 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 12min, being sufficiently stirred after melt is completely melt, standing 3min Casting, cast temperature are 1146 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 10 in 2.
Embodiment 11:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 11.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93.5%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 11 in 2.
Embodiment 12:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 12.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 94.2%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 12 in 2.
Embodiment 13:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 13.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 94.8%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 13 in 2.
Embodiment 14:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 14.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 95.1%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 14 in 2.
Embodiment 15:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 15.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 95.7%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 15 in 2.
Embodiment 16:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 16.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 96.3%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 16 in 2.
Embodiment 17:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 17.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 97%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 17 in 2.
Embodiment 18:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 18.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 98.2%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 18 in 2.
Embodiment 19:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 19.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 99.3%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 19 in 2.
Embodiment 20:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 20.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 99.6%。
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 20 in 2.
Embodiment 21:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 21.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 5 DEG C/min rise to 320 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 21 in 2.
Embodiment 22:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 22.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1.2, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 22 in 2.
Embodiment 23:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 23.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 900 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1.4, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 23 in 2.
Embodiment 24:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 24.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 910 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1.6, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 24 in 2.
Embodiment 25:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 25.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 920 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1.8, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 25 in 2.
Embodiment 26:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 26.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 930 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2.1, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 26 in 2.
Embodiment 27:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 27.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 940 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2.2, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 27 in 2.
Embodiment 28:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 28.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 950 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=3.5, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 28 in 2.
Embodiment 29:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 29.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 970 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2.8, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 29 in 2.
Embodiment 30:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 30.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 980 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2.8, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 30 in 2.
Embodiment 31:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 31.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 990 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=3.0, gas temperature≤20 DEG C), 450 DEG C of temperature are heated to using bell-type annealing furnace After heat preservation 4 hours, gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N are quickly carried out2/ Ar=2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 31 in 2.
Embodiment 32:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 32.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. being heated to 1000 DEG C of solid solubility temperature by horizontal annealing furnace and quickly carrying out gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=3.2, gas temperature≤20 DEG C), temperature 450 is heated to using bell-type annealing furnace DEG C heat preservation 4 hours after, quickly carry out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N2/ Ar=2, gas temperature ≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, more than After the working processes such as melting, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 32 in 2.
Embodiment 33:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 33.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. being heated to 1010 DEG C of solid solubility temperature by horizontal annealing furnace and quickly carrying out gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=3.0, gas temperature≤20 DEG C), temperature 450 is heated to using bell-type annealing furnace DEG C heat preservation 4 hours after, quickly carry out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N2/ Ar=2, gas temperature ≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, more than After the working processes such as melting, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 33 in 2.
Embodiment 34:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 34.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. being heated to 1020 DEG C of solid solubility temperature by horizontal annealing furnace and quickly carrying out gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=3.5, gas temperature≤20 DEG C), temperature 450 is heated to using bell-type annealing furnace DEG C heat preservation 4 hours after, quickly carry out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N2/ Ar=2, gas temperature ≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, more than After the working processes such as melting, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 34 in 2.
Embodiment 35:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 35.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. being heated to 1000 DEG C of solid solubility temperature by horizontal annealing furnace and quickly carrying out gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2.3, gas temperature≤20 DEG C), temperature 450 is heated to using bell-type annealing furnace DEG C heat preservation 4 hours after, quickly carry out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N2/ Ar=2, gas temperature ≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, more than After the working processes such as melting, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 35 in 2.
Embodiment 36:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 36.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 420 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 8 hours2/ Ar=2.2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 36 in 2.
Embodiment 37:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 37.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 430 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 7.5 hours2/ Ar=2.4, gas temperature ≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, more than After the working processes such as melting, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 37 in 2.
Embodiment 38:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 38.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 440 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 7 hours2/ Ar=2.6, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 38 in 2.
Embodiment 39:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 39.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 460 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 6 hours2/ Ar=2.8, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 39 in 2.
Embodiment 40:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 40.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 470 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=3.2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 40 in 2.
Embodiment 41:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 41.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 480 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 2 hours2/ Ar=3.1, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 41 in 2.
Embodiment 42:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 42.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 490 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 1 hour2/ Ar=3.2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 42 in 2.
Embodiment 43:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 43.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 3 hours2/ Ar=2.2, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 43 in 2.
Embodiment 44:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 44.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 460 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2.6, gas temperature≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 44 in 2.
Embodiment 45:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 45.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 880 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=1, gas temperature≤20 DEG C), 480 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 2.5 hours2/ Ar=3.1, gas temperature ≤ 20 DEG C), temperature is then risen to 320 DEG C of temperature with 5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, more than After the working processes such as melting, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 45 in 2.
Embodiment 46:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 46.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 6 DEG C/min rise to 310 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 46 in 2.
Embodiment 47:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 47.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 300 DEG C of temperature with 7.5 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 47 in 2.
Embodiment 48:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 48.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), then by temperature with 8 DEG C/min rise to 290 DEG C of temperature keep the temperature 1 hour, then carry out furnace cooling, by the above melting, After the working processes such as milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 48 in 2.
Embodiment 49:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 49.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 280 DEG C of temperature with 10 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 49 in 2.
Embodiment 50:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 50.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 270 DEG C of temperature with 13 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 50 in 2.
Embodiment 51:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 51.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 260 DEG C of temperature with 15 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 51 in 2.
Embodiment 52:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 52.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 240 DEG C of temperature with 18 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 52 in 2.
Embodiment 53:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 53.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 220 DEG C of temperature with 20 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 53 in 2.
Embodiment 54:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 54.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 200 DEG C of temperature with 22 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 54 in 2.
Embodiment 55:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 55.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 190 DEG C of temperature with 24 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 55 in 2.
Embodiment 56:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 56.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 180 DEG C of temperature with 24 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 56 in 2.
Embodiment 57:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 57.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 150 DEG C of temperature with 27 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 57 in 2.
Embodiment 58:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 58.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 150 DEG C of temperature with 28 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 58 in 2.
Embodiment 59:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 59.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 150 DEG C of temperature with 29 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 59 in 2.
Embodiment 60:
Alloy of the invention uses following raw material melting: cathode copper, pure nickel, pure cobalt, nickel silicon alloy.The ingredient of alloy is shown in Table 1 Embodiment 60.
1. melting: carrying out melting using vacuum induction furnace.The addition sequence of alloy are as follows: cathode copper, pure nickel, pure cobalt, nickel Temperature is raised to 1250 DEG C by silicon alloy, until coming out of the stove after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Casting, cast temperature are 1150 DEG C.
2. milling face: carrying out milling face to alloy, upper and lower surface respectively mills 1mm.
3. hot rolling: being heated to alloy, heating temperature is 900 DEG C, soaking time 1h, and hot rolling general working rate is 93%.
4. by horizontal annealing furnace be heated to 890 DEG C of solid solubility temperature and quickly progress gas cooling (nitrogen and argon gas Mixed gas, mixed proportion N2/ Ar=2, gas temperature≤20 DEG C), 450 DEG C of temperature guarantors are heated to using bell-type annealing furnace Temperature quickly carried out gas cooling (mixed gas of nitrogen and argon gas, mixed proportion N after 4 hours2/ Ar=2, gas temperature≤20 DEG C), temperature is then risen to 150 DEG C of temperature with 30 DEG C/min and keeps the temperature 1 hour, furnace cooling is then carried out, by melting above After the working processes such as refining, milling face, hot rolling, solid solution aging, performance and microstructure are shown in Table the embodiment 60 in 2.
Patent CN102227510B is compared, we take preparation method and extend aging time and increase aging temp So that part precipitated phase is greater than after 50nm, strength character is slightly lost, although maximum intensity performance is lower than its maximum intensity 915MPa, but the present invention can obtain the conductivity that electric conductivity is 50%IACS, it is higher than its electric conductivity, especially bend resistance Performance, the present invention is in R/T=0.2, and 90 degree of bending, when R/T=0.5, in the experiment of bending 180 degree, none is broken, And in sample of the precipitated phase greater than 50nm, when R/T=0.2, when 90 degree of bending of sample fracture ratio is up to 45%, R/T=0.5, The sample fracture ratio of bending 180 degree is up to 80%, therefore, the present invention for the raising of such alloy buckling performance be it is unique and Irreplaceable.

Claims (5)

1. a kind of warping resistance CuNiCoSi used for lead frame system alloy includes Ni:1.0~2.5 %, Co:0.5 by mass parts The % of~2.5 %, Si:0.3~1.2, remainder are made of wherein Cu and inevitable impurity.
2. a kind of manufacturing method for processing warping resistance CuNiCoSi used for lead frame system alloy as claimed in claim comprising according to It is secondary to carry out following process:
1) melting, the addition sequence of alloy, melting: are carried out using vacuum induction furnace are as follows: cathode copper, pure nickel, pure cobalt, nisiloy close Temperature is raised to 1245~1255 DEG C by gold, until going out after after keeping the temperature 18min, being sufficiently stirred after melt is completely melt, standing 5min Furnace casting, cast temperature are 1139~1160 DEG C；
2) it, mills face: milling face being carried out to alloy, upper and lower surface respectively mills 1mm；
3), hot rolling: heating alloy, heating temperature be 900 DEG C, soaking time 1h, hot rolling general working rate be 92~ 95%；
4), solid solubility temperature T is heated to by vertical or horizontal annealing furnace1, gas cooling is then quickly carried out, cooling gas is adopted For the mixed gas of nitrogen and argon gas, mixed proportion is according to the difference of ingredient and working modulus in N2Between/Ar=1 ~ 3.5, gas Temperature≤20 DEG C are heated to temperature T using bell-type annealing furnace2, 1 ~ 8 hour then is kept the temperature, gas is cold quickly carrying out But, the cooling gas in this stage is using the mixed gas of nitrogen and argon gas, and mixed proportion is according to ingredient and working modulus Difference is in N2Between/Ar=2 ~ 3.2, temperature is then risen to T between 5 DEG C ~ 30 DEG C/min by gas temperature≤20 DEG C3, heat preservation 1 Hour, it then carries out furnace cooling and alloy particle is precipitated, the grain size of alloy particle is between 85~180 μm, the crystalline substance of precipitation In grain, the NiSi phase number density that partial size is 3nm ~ 10nm is 8 × 1013~6 × 1014A/mm3, CoSi phase number density be 4 × 105~6 × 108A/mm3；The NiSi phase number density of 10nm ~ 20nm is 3 × 1010~4 × 1012A/mm3, CoSi phase number is close Degree is 3 × 106~7 × 109A/mm3；The NiSi phase number density of 20nm-30nm is 8 × 109~2 × 1011A/mm3, CoSi Phase number density is 8 × 107~2 × 1010A/mm3；The NiSi phase number density of 30nm or more is 6 × 105~9 × 107A/ mm3, CoSi phase number density is 3 × 109~2 × 1012A/mm3；But maximum precipitation particles diameter NiSi phase is no more than 45nm, CoSi phase is no more than 50nm；Minimum spacing between two 30nm or more NiSi precipitated phases is more than or equal to 105nm, two 30nm with Minimum spacing between upper CoSi precipitated phase is more than or equal to 140nm, two 30nm or more NiSi precipitated phases and CoSi precipitated phase it Between minimum spacing be more than or equal to 110nm.
3. manufacturing method according to claim 2, it is characterised in that: T1Range be 880 DEG C ~ 1020 DEG C.
4. manufacturing method according to claim 2, it is characterised in that: T2Temperature range be 420 DEG C ~ 490 DEG C.
5. manufacturing method according to claim 2, it is characterised in that: T3Temperature range be 150 DEG C ~ 320 DEG C.
CN201910306870.4A 2019-04-17 2019-04-17 A kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method Pending CN110195166A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179377A (en) * 1991-12-27 1993-07-20 Kobe Steel Ltd High strength copper alloy excellent in bendability and its production
CN102549180A (en) * 2009-09-28 2012-07-04 Jx日矿日石金属株式会社 Cu-Ni-Si-Co copper alloy for electronic material and process for producing same
CN107267803A (en) * 2016-03-31 2017-10-20 Ｊｘ金属株式会社 The manufacture method of copper alloy plate and copper alloy plate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179377A (en) * 1991-12-27 1993-07-20 Kobe Steel Ltd High strength copper alloy excellent in bendability and its production
CN102549180A (en) * 2009-09-28 2012-07-04 Jx日矿日石金属株式会社 Cu-Ni-Si-Co copper alloy for electronic material and process for producing same
CN107267803A (en) * 2016-03-31 2017-10-20 Ｊｘ金属株式会社 The manufacture method of copper alloy plate and copper alloy plate

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