CN110181165B - 激光预热退火***和方法 - Google Patents
激光预热退火***和方法 Download PDFInfo
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- CN110181165B CN110181165B CN201910446747.2A CN201910446747A CN110181165B CN 110181165 B CN110181165 B CN 110181165B CN 201910446747 A CN201910446747 A CN 201910446747A CN 110181165 B CN110181165 B CN 110181165B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Recrystallisation Techniques (AREA)
Abstract
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Priority Applications (1)
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CN201910446747.2A CN110181165B (zh) | 2019-05-27 | 2019-05-27 | 激光预热退火***和方法 |
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CN201910446747.2A CN110181165B (zh) | 2019-05-27 | 2019-05-27 | 激光预热退火***和方法 |
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CN110181165A CN110181165A (zh) | 2019-08-30 |
CN110181165B true CN110181165B (zh) | 2021-03-26 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111952160B (zh) * | 2020-08-17 | 2024-06-11 | 北京中科镭特电子有限公司 | 一种激光退火装置 |
CN112435920B (zh) * | 2020-11-05 | 2024-02-23 | 北京华卓精科科技股份有限公司 | 一种长波长激光退火方法及装置 |
CN112435921B (zh) * | 2020-11-05 | 2024-05-17 | 北京华卓精科科技股份有限公司 | 一种功率器件的激光退火方法和激光退火*** |
CN112501425B (zh) * | 2020-11-27 | 2021-08-27 | 山东大学 | 一种具有反高斯分布冲击波强度的激光表面强化方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104392914A (zh) * | 2014-12-03 | 2015-03-04 | 苏州德龙激光股份有限公司 | 双波长激光退火装置及其方法 |
JP2019046919A (ja) * | 2017-08-31 | 2019-03-22 | 株式会社ナ・デックス | レーザ光合成装置 |
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US7279721B2 (en) * | 2005-04-13 | 2007-10-09 | Applied Materials, Inc. | Dual wavelength thermal flux laser anneal |
US20090120924A1 (en) * | 2007-11-08 | 2009-05-14 | Stephen Moffatt | Pulse train annealing method and apparatus |
JP6028849B2 (ja) * | 2013-03-07 | 2016-11-24 | 三菱電機株式会社 | レーザアニール装置、半導体装置の製造方法 |
US9343307B2 (en) * | 2013-12-24 | 2016-05-17 | Ultratech, Inc. | Laser spike annealing using fiber lasers |
JP2016078047A (ja) * | 2014-10-14 | 2016-05-16 | 株式会社アマダホールディングス | ダイレクトダイオードレーザ加工装置及びこれを用いた板金加工方法 |
CN106158609B (zh) * | 2015-03-31 | 2019-07-23 | 上海微电子装备(集团)股份有限公司 | 一种激光退火装置及其退火方法 |
CN106935491B (zh) * | 2015-12-30 | 2021-10-12 | 上海微电子装备(集团)股份有限公司 | 一种激光退火装置及其退火方法 |
CN108406088B (zh) * | 2017-02-10 | 2020-04-10 | 上海微电子装备(集团)股份有限公司 | 激光退火装置及其退火方法 |
KR102342848B1 (ko) * | 2017-04-21 | 2021-12-23 | 삼성전자주식회사 | 레이저 어닐링 장비 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104392914A (zh) * | 2014-12-03 | 2015-03-04 | 苏州德龙激光股份有限公司 | 双波长激光退火装置及其方法 |
JP2019046919A (ja) * | 2017-08-31 | 2019-03-22 | 株式会社ナ・デックス | レーザ光合成装置 |
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Inventor after: Jiang Yiming Inventor after: Chen Jing Inventor after: Hou Xiaoyi Inventor after: Li Zhen Inventor after: Chen Wei Inventor after: Li Hong Inventor after: Sun Jinzhao Inventor after: Wang Jijun Inventor before: Jiang Yiming Inventor before: Zhou Jiong Inventor before: Chen Jing Inventor before: Hou Xiaoyi Inventor before: Li Zhen Inventor before: Chen Wei Inventor before: Li Hong Inventor before: Sun Jinzhao Inventor before: Wang Jijun Inventor before: Wu Diyi |
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Effective date of registration: 20211229 Address after: 100176 floor 2, building 2, yard 19, Kechuang 10th Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing (Yizhuang group, high-end industrial area of Beijing Pilot Free Trade Zone) Patentee after: BEIJING U-PRECISION TECH Co.,Ltd. Patentee after: Hangzhou Tianrui Precision Technology Co., Ltd Address before: Room b1009, Tsinghua University, Haidian District, Beijing 100084 Patentee before: BEIJING U-PRECISION TECH Co.,Ltd. |
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