CN110174414A - A kind of Micro-OLED product optical detection apparatus and wafer chip detection method - Google Patents
A kind of Micro-OLED product optical detection apparatus and wafer chip detection method Download PDFInfo
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- CN110174414A CN110174414A CN201910595662.0A CN201910595662A CN110174414A CN 110174414 A CN110174414 A CN 110174414A CN 201910595662 A CN201910595662 A CN 201910595662A CN 110174414 A CN110174414 A CN 110174414A
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- 238000001514 detection method Methods 0.000 title claims abstract description 73
- 230000003287 optical effect Effects 0.000 title claims abstract description 47
- 238000012360 testing method Methods 0.000 claims abstract description 30
- 239000000523 sample Substances 0.000 claims abstract description 24
- 230000035939 shock Effects 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 238000007689 inspection Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010998 test method Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 13
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- 238000001914 filtration Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
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- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
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Abstract
The present invention relates to semiconductor detection technique field, in particular to a kind of Micro-OLED product optical detection apparatus and wafer chip detection method.Wherein, optical detection apparatus includes detection system, control system and display system；Detection system includes filter, and filter is connect with optical detection darkroom, and internal includes beam splitting type spectrometer interconnected and CCD；Beam splitting type spectrometer is connect with three-axis moving mould group；The bottom side in optical detection darkroom is provided with probe station；Detection system is connect with control system signal, and control system includes control cabinet, electric control module, SMU module, industrial computer and CCD control module.The present invention provides a kind of Micro-OLED product optical detection apparatus cooperation test method for the first time and can detect to Micro-OLED wafer, with inspection high resolution, test effect can reach 3-4 seconds average/die, equipment dependability and stable height, have important practical application value in the optical detection of Micro-OLED product.
Description
Technical field
The present invention relates to semiconductor detection technique field, in particular to a kind of Micro-OLED product optical detection apparatus and
Wafer chip detection method.
Background technique
Panel is the important carrier of AR/VR technology.Before since AR/VR technology itself is not also perfect, lead to market opposite
The demand of plate does not have that urgent but present situation is different, and AR/VR technology is outer in addition to the application in terms of amusement, it is medical,
The fields such as military affairs, industrial maintenance, urban construction have investment to apply.The market AR/VR gradually expands, and the requirement for panel is also got over
Come higher, old LCD display and OLED display and does not catch up with the higher and higher market demand.As this demand is cured
Add urgently, manufacturers will can find new screen display technology to substitute existing LCD or OLED display, and this new
Technology is exactly Organic Light Emitting Diode micro display technology Micro-OLED.
Compared to common OLED display device using glass as backboard, OLED micro-display device uses monocrystalline silicon wafer crystal
It (Wafer) is backboard, except with OLED self-luminous, the spies such as thickness is thin, light weight, visual angle is big, the response time is short, luminous efficiency is high
Property outside, it is easier to realize that high PPI (pixel density), small in size, the excellent characteristics such as be easy to carry about with one, be low in energy consumption, be particularly suitable for application
Equipment is shown in AR/VR such as Helmet Mounted Display, stereo display and glasses type displayers.That is, Micro-OLED energy
It allows people to abandon the stereotype that AR/VR display device screen is thick and heavy in their previous mind, allows AR/VR technology more in people
It is popularized in group, drives bigger product demand.In the case where country is to supply the background that side structure reform leads industrial transformation to upgrade,
Novel display industry for promoted China information technology, material technology, equipment technology, systems technology and in terms of
It has very important significance；Therefore, how automatic test is realized to Micro-OLED product, is that this field needs to solve
Technical problem.
Summary of the invention
To solve the problems, such as above-mentioned background technique, the present invention provides a kind of Micro-OLED product optical detection and sets
It is standby, including detection system, control system and display system；
The detection system includes filter, and the filter is connect with optical detection darkroom, the optical detection darkroom
Surrounding is provided with outline border, and internal includes beam splitting type spectrometer interconnected and ccd image controller；The beam splitting type spectrum
Instrument is connect with three-axis moving mould group；
The bottom side in the optical detection darkroom is provided with probe station；
The detection system is connect with the control system signal, and the control system includes control cabinet, electric-controlled molding
Block, SMU module, industrial computer and CCD control module；
The detection system is connect with display system signals.
Based on the above technical solution, further, the bottom side of the probe station is provided with shock mount.
Based on the above technical solution, further, the set-up of control system has UPS uninterruptible power supply.
Based on the above technical solution, further, the detection system and detection system use CIM agreement and work
The connection of factory's system interaction.
Based on the above technical solution, further, the filter is FFU filter.
Based on the above technical solution, further, the ccd image controller is 4300M_CCD image control
Device.
Based on the above technical solution, further, dress industrial personal computer and electric fittings are provided in the control cabinet.
The present invention also provides a kind of using the wafer that as above any Micro-OLED product optical detection apparatus carries out
Chip detection method, comprising the following steps:
Step a, trial product to be measured is placed in probe station feeding port, and control system controls probe station and realizes automatic loading/unloading；
Step b, control system control SMU module is powered to the die product above wafer, and is detected by circuit
Detect electric current, voltage parameter requirement whether up to specification；
Step c, control system control three-axis moving mould group and probe station realize that spectrometer carries out optical parameter to die product
Test, and judge to detect coloration requirement whether up to specification；
Step d, control system control three-axis moving mould group and probe station realize that ccd image controller carries out Die product
Optical parameter test, and judge the requirement whether up to specification of the AOI optical parameter of pixel scale brightness and point-line-surface, Mura；
Step e, control system is according to SMU module, the testing result of spectrometer and ccd image controller, to test product
Carry out comprehensive descision.
Based on the above technical solution, further, in step e, control system believes the detection of Die on wafer
Breath carries out imaging output using different colors, and product information report is formed in the display system.
The present invention provides a kind of Micro-OLED product optical detection apparatus of offer for the first time, can be to Micro-OLED
Wafer is detected, and is had and is checked high resolution, and test effect can reach 3-4 seconds average/die, equipment dependability and stabilization
Height has important practical application value in the optical detection of Micro-OLED product.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is Micro-OLED product optical detection apparatus structural schematic diagram provided by the invention；
Fig. 2 is MIT main circuit diagram；
Fig. 3 is the partial enlarged view of A in Fig. 2；
Fig. 4 is MIT auxiliary circuit figure；
Fig. 5 is the partial enlarged view of B in Fig. 4；
Fig. 6 is product testing flow chart；
Fig. 7 is that product report is schemed as the result is shown.
Appended drawing reference:
10 filter, 20 optical detection darkroom, 21 outline border
22 beam splitting type spectrometer 23CCD image controller, 24 three-axis moving mould group
30 probe station, 41 control cabinet, 42 electric control module
44 industrial computer 45CCD control module of 43SMU module
50 display system, 60 shock mount
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
Limitation of the invention.In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply opposite
Importance.
The present invention provides a kind of Micro-OLED product optical detection apparatus, including detection system, control system and display
System；
The detection system includes filter 10, and the filter 10 is connect with optical detection darkroom 20, the optics inspection
It surveys 20 surrounding of darkroom and is provided with outline border 21, internal includes beam splitting type spectrometer 22 interconnected and ccd image controller 23；
The beam splitting type spectrometer 22 is connect with three-axis moving mould group 24；The bottom side in the optical detection darkroom 20 is provided with probe station
30；The detection system is connect with the control system signal, and the control system includes control cabinet 41, electric control module
42, SMU module 43, industrial computer 44, CCD control module 45；The detection system is connect with 50 signal of display system, described aobvious
Show that existing display apparatus can be used in system；Preferably, the bottom side of the probe station is provided with shock mount 60.
Specifically, filter dust for filtering air, can use blower fan filtering unit (full name in English Fan
Filter Unit, abbreviation FFU) it is used as filter；CCD (Charge-coupled Device, the abbreviation CCD) image control
Device can use 4300M_CCD image controller；Wherein, electric control module electric system for controlling devices；Institute
Source measuring unit (abbreviation SMU) module is stated for providing current source and voltage source to test product；The industrial computer can be with
The circuit connecting mode connection that the three-axis moving mould group may be implemented using those skilled in the art, for controlling three axis
The movement of mould group is moved, and the three-axis moving mould group can control mechanism for testing and spatially be moved；The CCD controls mould
Block is connect with ccd image controller using the circuit connecting mode that those skilled in the art may be implemented, for controlling ccd image
The position of controller is mobile, and the ccd image controller is used for the optical parameter of test product；The beam splitting type spectrometer is used for
The brightness of test product；The probe station can use P8 probe station, and probe is used for contact product, and trial product to be measured is placed in spy
Needle platform feeding port carries out feeding；Wherein, the shock mount can use sotoMD500 shock mount, can eliminate external shock shadow
Ring test；Preferably, the set-up of control system has UPS uninterruptible power supply, it can be ensured that machine control system does not power off；Into one
Step ground, the detection system and detection system are interconnected using CIM agreement and factory system；Dress is provided in the control cabinet
Industrial personal computer and electric fittings.
In Micro-OLED product optical detection apparatus provided by the invention, the electric operation control circuit figure of use such as Fig. 2-5 institute
Show, wherein Fig. 2 is MIT main circuit diagram, and in conjunction with Fig. 3, which is used for the trajectory motion control of complete machine；In figure ,-V1 is power supply
Switch, S1 are servo motor 400W, and S2 is servo motor 200W strap brake, and S3 is servo motor 200W, and P1, P2 are socket, FU
For fuse, D1 is terminal block, and-Q1 is that electric leakage is spaced apart, and F is that list P is spaced apart, and H is indicator light.
Fig. 4 is MIT auxiliary circuit figure, and in conjunction with Fig. 5, which indicates or control for the port of motor brake line and instrument
System；In figure, XA is AC220 power supply, and XB is servo motor UVW line, and X1 is debugging port, and X2A, X2B are EtherCAT communication
Mouthful, X4 is pulse bonding wire PIN foot, and X6 is encoded servo device mouth.
Micro-OLED product optical detection apparatus provided by the invention can examine Micro-OLED wafer
It surveys, has and check high resolution, test effect can reach 3-4 seconds average/die, in the optical detection of Micro-OLED product
With important practical application value.
The present invention also provides a kind of using the wafer that as above any Micro-OLED product optical detection apparatus carries out
Chip detection method, comprising the following steps:
Step a, trial product to be measured is placed in probe station feeding port, and control system controls probe station and realizes automatic loading/unloading；
Step b, control system control SMU module is powered to the die product above wafer, and is detected by circuit
Detect electric current, voltage parameter requirement whether up to specification；
For example, voltage is -1~-5 (V) after lighting product and being powered, electric current -1~-20 (mA) is corresponding according to client's setting
After specification, whether electric current, the voltage data for determining that product testing obtains meet corresponding specification requirement；
Step c, control system control three-axis moving mould group and probe station realize that spectrometer carries out optical parameter to die product
Test, and judge to detect coloration requirement whether up to specification；
For example, lighting coloration after product is powered is x:0.2-0.4, y:0.3-0.4, ultimate criterion sets corresponding according to client
After specification, determine whether the chroma data that product testing obtains meets corresponding specification requirement；
Step d, control system control three-axis moving mould group and probe station realize that ccd image controller carries out Die product
Optical parameter test, and judge the requirement whether up to specification of the AOI optical parameter of pixel scale brightness and point-line-surface, Mura, have
Requirement of the body according to client to above-mentioned parameter determines.
Step e, control system is according to SMU module, the testing result of spectrometer and ccd image controller, to test product
Carry out comprehensive descision.
The detailed process of product testing can be as shown in Figure 6.
Equipment binding test method provided by the invention, as shown in the table to the embodiment result of product test:
Table 1
Wherein, Result.Die indicates the testing result of this product；Result.SMU indicates that the detection of SMU module determines
As a result；Result.SRUL2 indicates coloration, the testing result of brightness；Examining Result.Radiant indicates the testing result of appearance；
And sentenced again by QC it is found that the scheme provided by the invention accuracy rate judged bad to product is 100%, judgement bad item is quasi-
True rate is 91%；In addition, the scheme provided through the invention can reach 3-4 seconds average/Die to the test effect of product, have
Marked improvement.
Preferably, in step e, the detection information of Die on wafer is imaged control system using different colors
Output, and product information report is formed in the display system；Specifically, as shown in fig. 7, dark (can also use other face
Color replaces, such as red) Die on corresponding wafer is represented as NG, light color (can also be replaced with other colors, such as green) represents
Die on corresponding wafer is that OK can learn the information of test result and wafer with this solution at a glance.
Although more herein used such as filter, optical detection darkroom, outline border, beam splitting type spectrometer, CCD figure
As controller, three-axis moving mould group, probe station, control cabinet, electric control module, SMU module, industrial computer, CCD control mould
The terms such as block, display system, shock mount, but it does not exclude the possibility of using other terms.It the use of these terms is only to be
It is more convenient to describe and explain essence of the invention；Being construed as any additional limitation all is and present invention essence
What mind was disagreed.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (9)
1. a kind of Micro-OLED product optical detection apparatus, it is characterised in that: including detection system, control system and display system
System；
The detection system includes filter, and the filter is connect with optical detection darkroom, optical detection darkroom surrounding
It is provided with outline border, internal includes beam splitting type spectrometer interconnected and ccd image controller；The beam splitting type spectrometer with
The connection of three-axis moving mould group；
The bottom side in the optical detection darkroom is provided with probe station；
The detection system is connect with the control system signal, the control system include control cabinet, electric control module,
SMU module, industrial computer and CCD control module；
The detection system is connect with display system signals.
2. Micro-OLED product optical detection apparatus according to claim 1, it is characterised in that: the bottom of the probe station
Side is provided with shock mount.
3. Micro-OLED product optical detection apparatus according to claim 1, it is characterised in that: the control system is set
It is equipped with UPS uninterruptible power supply.
4. Micro-OLED product optical detection apparatus according to claim 1, it is characterised in that: the detection system with
Detection system is interconnected using CIM agreement and factory system.
5. Micro-OLED product optical detection apparatus according to claim 1, it is characterised in that: the filter is
FFU filter.
6. Micro-OLED product optical detection apparatus according to claim 1, it is characterised in that: the ccd image control
Device processed is 4300M_CCD image controller.
7. Micro-OLED product optical detection apparatus according to claim 1, it is characterised in that: set in the control cabinet
It is equipped with dress industrial personal computer and electric fittings.
8. a kind of wafer detection side using the Micro-OLED product optical detection apparatus as described in claim any one of 1-7
Method, which comprises the following steps:
Step a, trial product to be measured is placed in probe station feeding port, and control system controls probe station and realizes automatic loading/unloading；
Step b, control system control SMU module is powered to the die product above wafer, and is detected by circuit
The requirement whether up to specification of electric current, voltage parameter；
Step c, control system control three-axis moving mould group and probe station realize that spectrometer carries out optical parameter survey to die product
Examination, and judge to detect coloration requirement whether up to specification；
Step d, control system control three-axis moving mould group and probe station realize that ccd image controller carries out optics to Die product
Parameter testing, and judge the requirement whether up to specification of the AOI optical parameter of pixel scale brightness and point-line-surface, Mura；
Step e, control system carries out test product according to SMU module, the testing result of spectrometer and ccd image controller
Comprehensive descision.
9. the wafer chip detection method of Micro-OLED product optical detection apparatus according to claim 8, feature exist
In: in step e, the detection information of Die on wafer is carried out imaging output using different colors by control system, and described
Product information report is formed in display system.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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