CN110164833A - 一种芯片散热片的封装方法及芯片封装产品 - Google Patents
一种芯片散热片的封装方法及芯片封装产品 Download PDFInfo
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Abstract
本发明涉及一种芯片散热片的封装方法及芯片封装产品,所述封装方法包括步骤:S1:采用倒装的方式将芯片焊接在引线框或基板上;S2:用塑封料对芯片和引线框或基板进行塑封;S3:把芯片上方的塑封料去除掉,使芯片露出全部或部分上表面;S4:在芯片上方印刷焊接料;S5:把散热片放置在焊接料上,并进行回流焊接,使散热片和芯片焊接固定。采用塑封工艺,芯片保护性及产品结构坚固性都非常好,能够将芯片和湿气、粉尘隔离;在组装散热片之前进行塑封工艺,跟常规的塑封工艺一样,非常简单容易;在将芯片上方的塑封料去除后,进行印刷焊接料,厚度及面积都容易控制,放置散热片时也不易倾斜,回流焊后固定牢靠,导热性好,散热效率有保证。
Description
技术领域
本发明涉及半导体封装技术领域,尤其涉及一种芯片散热片的封装方法及芯片封装产品。
背景技术
在传统的半导体封装产品中,一些大功率芯片封装时需要设置散热片,模块运行中产生的热量通过散热片及时散出,避免热量累计,影响模块工作性能。如专利号为200320113725.9、名称为“倒装芯片散热封装结构”的中国实用新型专利中,就公开了一种散热片的封装结构,载板与芯片通过底胶和侧面黏着层固定。此种封装结构的缺点是没有采用塑封工艺,芯片保护性及产品结构坚固性较差,无法将芯片和湿气、粉尘隔离;芯片顶部焊接面焊接料覆盖面积难以控制,过多会在芯片边缘溢出,过少会影响散热性,焊接料厚度控制困难,散热片容易倾斜。如果想要采用塑封工艺,芯片顶部散热片在组装无法实现塑封,因为如果产品过高,塑封模具会压坏芯片,产品过低,塑封料会流到散热片上方,固化后会遮盖散热片,严重影响散热,所以需要进一步改进。
发明内容
本发明的目的在于提供一种芯片散热片的封装方法及芯片封装产品,采用塑封工艺,产品结构坚固而且散热性好。
本发明是这样实现的:一种芯片散热片的封装方法,包括以下步骤:
S1:采用倒装的方式将芯片焊接在引线框或基板上;
S2:用塑封料对芯片和引线框或基板进行塑封;
S3:把芯片上方的塑封料去除掉,使芯片露出全部或部分上表面;
S4:在芯片上方印刷焊接料;
S5:把散热片放置在焊接料上,并进行回流焊接,使散热片和芯片焊接固定。
其中,在S3中,通过激光开口的方式去除芯片上方的塑封料。
其中,利用激光对芯片上表面处的塑封料进行点烧,直至芯片上表面裸露;或者利用金属盖板掩盖封装产品,在金属盖板上设置与芯片位置相对应的孔,进行面烧,直至芯片上表面裸露。
其中,在S3中,通过机械加工磨削的方式去除芯片上方的塑封料。
其中,所述芯片上表面的塑封料的厚度为50-200μm。
本发明提供的另一种技术方案为:一种根据上面所述封装方法制作的芯片封装产品,包括芯片、散热片、塑封料和引线框或基板,所述芯片采用倒装的方式焊接在引线框或基板上,所述塑封料对芯片和引线框或基板进行塑封,所述芯片上方的塑封料还加工出开口,使芯片上表面裸露,所述开口处印刷有焊接料,所述散热片和芯片通过所述焊接料焊接固定。
本发明的有益效果为:本发明所述芯片散热片的封装方法是在组装散热片之前,先采用塑封工艺对芯片和引线框或基板进行封装,然后在把芯片上方的塑封料去除掉,然后在芯片上方印刷焊接料,再组装散热片,进行回流焊焊接固定。由于采用了塑封工艺,芯片保护性及产品结构坚固性都非常好,能够将芯片和湿气、粉尘隔离;在组装散热片之前进行塑封工艺,跟常规的塑封工艺一样,不需要特别处理,所以非常简单容易;在将芯片上方的塑封料去除后,进行印刷焊接料,厚度及面积都容易控制,放置散热片时也不易倾斜,回流焊后固定牢靠,导热性好,散热效率有保证,而且散热片的材质、形状、厚度、尺寸根据实际需要均可以自由设计,几乎不受限制,相比现有技术,具有显著的进步。
附图说明
图1是本发明所述芯片封装产品的结构示意图;
图2是本发明所述封装方法把芯片焊接到引线框的示意图;
图3是本发明所述封装方法把芯片和引线框进行塑封的示意图;
图4是本发明所述封装方法把芯片上方的塑封料去除掉的结构示意图;
图5是本发明所述封装方法在芯片上方印刷焊接料的结构示意图;
图6是本发明所述封装方法把散热片放置在焊接料上的结构示意图;
图7是本发明所述封装方法把芯片上方的塑封料去除掉的另一实施例的结构示意图;
图8是本发明所述封装方法把芯片上方的塑封料去除掉的第三实施例的结构示意图。
其中,1、芯片;2、引线框;3、塑封料;31、开口;4、焊接料;5、散热片;6、激光。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
作为本发明所述芯片散热片的封装方法的实施例,如图1至图6所示,包括以下步骤:
S1:采用倒装的方式将芯片1焊接在引线框2上(也可以为基板);
S2:用塑封料3对芯片1和引线框2进行塑封;
S3:把芯片1上方的塑封料去除掉,使芯片1露出全部或部分上表面;
S4:在芯片1上方印刷焊接料4;
S5:把散热片5放置在焊接料4上,并进行回流焊接,使散热片5和芯片1焊接固定。
作为本发明根据上面所述封装方法制作的芯片封装产品,如图1所示,包括芯片1、散热片5、塑封料3和引线框2(也可以为基板),所述芯片1采用倒装的方式焊接在引线框2上,所述塑封料3对芯片1和引线框2进行塑封,所述芯片1上方的塑封料还加工出开口31,使芯片1上表面裸露,所述开口31处印刷有焊接料4,所述散热片5和芯片1通过所述焊接料4焊接固定。
本发明所述芯片散热片的封装方法是在组装散热片5之前,先采用塑封工艺对芯片1和引线框2(或基板)进行封装,然后在把芯片1上方的塑封料去除掉,然后在芯片1上方印刷焊接料4,再组装散热片5,进行回流焊焊接固定。由于采用了塑封工艺,芯片1保护性及产品结构坚固性都非常好,能够将芯片1和湿气、粉尘隔离;在组装散热片5之前进行塑封工艺,跟常规的塑封工艺一样,不需要特别处理,所以非常简单容易;在将芯片1上方的塑封料去除后,进行印刷焊接料4,厚度及面积都容易控制,放置散热片5时也不易倾斜,回流焊后固定牢靠,导热性好,散热效率有保证,而且散热片5的材质、形状、厚度、尺寸根据实际需要均可以自由设计,几乎不受限制,相比现有技术,具有显著的进步。
在本实施例中,所述芯片1上表面的塑封料的厚度为50-200μm。理论上芯片上表面的塑封料越薄越易于后期去除工作,但设计越薄,对塑封模具设计精度也越高,芯片上方的塑封料流动也越困难,从而影响塑封料对芯片的整体保护强度,本申请人通过研究试验,确定芯片上表面的塑封料的厚度优选值为50-200μm。
在本实施例中,在步骤S3中,通过激光6(烧蚀)开口的方式去除芯片1上方的塑封料,速度快,效率高,开口31形状精度高。具体到细节,可以利用激光对芯片上表面处的塑封料进行点烧,从点到线,从线到面,直至芯片上表面裸露;或者利用金属盖板掩盖封装产品,在金属盖板上设置与芯片位置相对应的孔,进行面烧,直至芯片上表面裸露,此种方式需要设计专用的金属盖板,但加工效率高。
当然,在步骤S3中,也可以通过机械加工磨削的方式去除芯片上方的塑封料,能达到相同的技术效果。
所述焊接料4可依据散热要求选择不同导热率的焊接料,不仅仅为锡膏,也可以采用其它的焊接材料。
图7是本发明所述封装方法把芯片上方的塑封料去除掉的另一实施例的结构示意图,与上述实施例不同之处在于并没有把芯片1上方的塑封料全部去除,而是保留了一部分,这样芯片1的保护效果更好一些。
图8是本发明所述封装方法把芯片上方的塑封料去除掉的第三实施例的结构示意图,与上述实施例不同之处在于不仅把芯片1上方的塑封料全部去除,还把芯片1上方四周的塑封料也全部去除掉,此种方式非常适合机械加工磨削工艺,整个面进行整体磨削去除塑封料,加工效率高。
在本发明中,还可以在芯片底部也设置散热片,在塑封工艺完成后,把芯片下表面的塑封料去除掉,然后印刷焊接料,放置底部散热片,然后进行回流焊,将芯片与底部散热片固定。此种方法可以实现芯片底部和底部两面都焊接散热片,这是本方案的一大优势,是现有技术中的封装方法无法实现的,产品双面暴露(顶部和底部)无法通过塑封工艺直接实现,因为产品双面同时紧贴塑封模具底面和顶部,产品过高模具会压坏芯片,产品过低会出现塑封料包裹掩盖散热片,所以塑封只能保证一面暴露。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (6)
1.一种芯片散热片的封装方法,其特征在于,包括以下步骤:
S1:采用倒装的方式将芯片焊接在引线框或基板上;
S2:用塑封料对芯片和引线框或基板进行塑封;
S3:把芯片上方的塑封料去除掉,使芯片露出全部或部分上表面;
S4:在芯片上方印刷焊接料;
S5:把散热片放置在焊接料上,并进行回流焊接,使散热片和芯片焊接固定。
2.根据权利要求1所述的封装方法,其特征在于,在S3中,通过激光开口的方式去除芯片上方的塑封料。
3.根据权利要求2所述的封装方法,其特征在于,利用激光对芯片上表面处的塑封料进行点烧,直至芯片上表面裸露;或者利用金属盖板掩盖封装产品,在金属盖板上设置与芯片位置相对应的孔,进行面烧,直至芯片上表面裸露。
4.根据权利要求1所述的封装方法,其特征在于,在S3中,通过机械加工磨削的方式去除芯片上方的塑封料。
5.根据权利要求1所述的封装方法,其特征在于,所述芯片上表面的塑封料的厚度为50-200μm。
6.一种根据权利要求1至5任一项所述封装方法制作的芯片封装产品,其特征在于,包括芯片、散热片、塑封料和引线框或基板,所述芯片采用倒装的方式焊接在引线框或基板上,所述塑封料对芯片和引线框或基板进行塑封,所述芯片上方的塑封料还加工出开口,使芯片上表面裸露,所述开口处印刷有焊接料,所述散热片和芯片通过所述焊接料焊接固定。
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