CN110158142A - A kind of anodic phosphorous copper balls and preparation method thereof - Google Patents
A kind of anodic phosphorous copper balls and preparation method thereof Download PDFInfo
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- CN110158142A CN110158142A CN201810277251.2A CN201810277251A CN110158142A CN 110158142 A CN110158142 A CN 110158142A CN 201810277251 A CN201810277251 A CN 201810277251A CN 110158142 A CN110158142 A CN 110158142A
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- copper balls
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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Abstract
The invention discloses a kind of anodic phosphorous copper balls and preparation method thereof, including phosphorous copper balls ontology, the phosphorous copper balls body surface is provided with through-hole, and run through phosphorous copper balls ontology, the phosphorous copper balls ontology includes episphere and lower semisphere, episphere bottom margin position is provided with the first U-lag, and lower semisphere top edge position is provided with the first U-shaped fixture block, and first U-lag is matched with the first U-shaped fixture block.The present invention is by using cavity type hollow design for phosphorous copper balls, and the first convex block is set in hollow layer inner wall, phosphorous copper balls ontology can be greatly increased and the contact area of tank liquid is electroplated, to improve the copper ion quantity released from phosphor-copper ball surface, simultaneously, for traditional solid phosphorous copper balls, phosphorous copper balls size and quality under same use condition can be greatly reduced, to reduce production cost and produce the consumption of the raw material of phosphorous copper balls.
Description
Technical field
The present invention relates to metal material processing method field, in particular to a kind of anodic phosphorous copper balls and preparation method thereof.
Background technique
It is also higher and higher to the q&r requirement of electroplated product with high-tech development, develop a new generation
Anodic phosphorous copper material is even more the industry matter of great urgency.Anodic phosphorous copper balls are the main plated materials in copper-plating technique, are that copper ion produces
Raw root, the phosphorous copper balls that the preparation method of the phosphorous copper balls of existing plating is prepared all are the phosphorous copper balls of solid shape, and
The surface of phosphorous copper balls is smooth.The smooth phosphorous copper balls in this surface are easy to appear following problems when being electroplated and using: 1,
Phosphorous copper balls surface area is fixed, and can only have fixed copper ion to release from the surface of phosphorous copper balls；2, the fixed phosphor-copper of surface area
Ball makes phosphorous copper balls uniformly generate phosphorus film, therefore need to waste the copper ion used in advance since use at the beginning needs first false plating；
3, to high current in use, since phosphorous copper balls surface area is fixed, the copper ball that surface area can only be selected bigger, therefore phosphorous copper balls use ruler
It is very little to become larger；4, due to being solid and smooth surface phosphorous copper balls, heavier mass, higher cost.
Therefore, it is necessary to solve the above problems that a kind of anodic phosphorous copper balls and preparation method thereof are invented.
Summary of the invention
The purpose of the present invention is to provide a kind of anodic phosphorous copper balls and preparation method thereof, to solve to mention in above-mentioned background technique
Out the problem of.
To achieve the above object, the invention provides the following technical scheme: a kind of anodic phosphorous copper balls, including phosphorous copper balls ontology,
The phosphorous copper balls body surface is provided with through-hole, and runs through phosphorous copper balls ontology, and the phosphorous copper balls ontology includes episphere and lower half
Ball, episphere bottom margin position are provided with the first U-lag, and lower semisphere top edge position is provided with the first U-shaped
Fixture block, first U-lag are matched with the first U-shaped fixture block.
Preferably, the phosphorous copper balls body interior hollow setting is provided with the first convex block in the hollow layer, and first is convex
Block end face is set as spherical face.
Preferably, first number of slugs is provided with multiple, and is evenly distributed on episphere and lower semisphere inner wall.
Preferably, the first convex block length is equal to the half of phosphorous copper balls ontology radius, and uniformly divides in episphere under
The line between the first convex block endpoint on hemisphere inner wall can form a spheroidal cavity just.
The present invention also provides a kind of preparation method of anodic phosphorous copper balls, concrete operation steps are as follows:
Step 1: copper raw material is added in Medium Frequency Induction Heating Furnace, meanwhile, thereto add degasser phosphorus, tin and other
The raw material metal of the compositions such as microelement such as iron, zinc carries out congruent melting and handles to prepare phosphorous copper balls mother liquor；
Step 2: the phosphorous copper balls mother liquor in step 1 is stirred using magnetic stirring apparatus, so that each in phosphorous copper balls mother liquor
Component is sufficiently mixed uniformly；
Step 3: the phosphorous copper balls mother liquor being uniformly mixed in step 2 being introduced into holding furnace and is kept the temperature, meanwhile, continue to use magnetic
Power blender is stirred phosphorous copper balls mother liquor, deposited to avoid part of component influence together phosphorous copper balls at quality
Amount；
Step 4: the type that the phosphorous copper balls mother liquor in step 4 is injected into mold is intracavitary, the episphere ball embryo of phosphorous copper balls is made
With lower semisphere ball embryo；
Step 5: in step 4 episphere ball embryo and lower semisphere ball embryo successively polished, at deburring, cleaning and drying
Reason；
Step 6: episphere and lower semisphere are carried out by seamless soldering by the technique of electric-resistance seam-welding, so that anode phosphorus be made
Copper ball.
Preferably, in the phosphorous copper balls mother liquor of the step 1, copper content quality percentage is ﹥ 99.9%, phosphorus content quality percentage
Than for 0.04~0.065% and other constituent content mass percent ﹤ 0.03%.
Preferably, temperature of the phosphorous copper balls mother liquor in holding furnace is 1000~1600 DEG C.
Preferably, mold used in the step 4 includes the first upper mold, the second upper mold and lower mold, and described the
One upper mold and the second upper mold bottom are provided with the second convex block, and second lug surface is uniformly distributed the first groove,
The second groove is provided on the lower mold, second convex block is matched with the second groove, and second groove inner wall is uniform
It is laid with third convex block.
Preferably, the first upper mold bottom margin position is provided with the second U-shaped fixture block, second upper mold bottom
Second recess edge position of marginal position and lower die top is provided with the second U-lag, the second U-shaped fixture block and
Two U-lags match.
Technical effect and advantage of the invention:
1, phosphorous copper balls are used into cavity type hollow design, and the first convex block is set in hollow layer inner wall, phosphor-copper can be greatly increased
The contact area of ball ontology and plating tank liquid, and under the phosphorous copper balls of equal diameter, more existing solid and surface light
Sliding smooth phosphorous copper balls have bigger surface area, and copper ion can be released from outer surface and phosphorous copper balls inner volume surface simultaneously
Copper ion, so that the copper ion that phosphorous copper balls of the invention are released under identical conditions is more, it is bigger to bear circulating current, can be big
The big time for shortening plating, in addition, phosphorous copper balls of the invention also have the advantages that light weight, at low cost；
2, phosphorous copper balls are manufactured using merotype, the consumption of raw material can be greatly reduced, reduce producting process difficulty；
3, phosphorous copper balls are welded by using the technique of electric-resistance seam-welding, is greatly improved welding production efficiency, and weldment
Deform it is small, meanwhile, may make the anodic phosphorous copper balls produced more attractive.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is entirety sectional view of the invention；
Fig. 3 is episphere and lower semisphere junction structural schematic diagram of the invention；
Fig. 4 is mold structure diagram of the invention；
Fig. 5 is the portion A enlarged drawing in Fig. 4 of the invention；
Fig. 6 is the portion B enlarged drawing in Fig. 4 of the invention；
Fig. 7 is the portion C enlarged drawing in Fig. 4 of the invention；
Fig. 8 is electric-resistance seam-welding schematic diagram of the invention；
In figure: 1 phosphorous copper balls ontology, 101 epispheres, 102 lower semispheres, 2 through-holes, 3 weld seams, 4 first convex blocks, 5 first U-lags, 6
One U-shaped fixture block, 7 molds, 71 first upper molds, 72 second upper molds, 73 lower molds, 8 second convex blocks, 9 first grooves, 10 second
Groove, 11 third convex blocks, 12 second U-shaped fixture blocks, 13 second U-lags.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1:
A kind of anodic phosphorous copper balls according to shown in Fig. 1-3, including phosphorous copper balls ontology 1,1 surface of phosphorous copper balls ontology are provided with logical
Hole 2, and run through phosphorous copper balls ontology 1, the phosphorous copper balls ontology 1 includes episphere 101 and lower semisphere 102, the phosphorous copper balls ontology 1
Inner hollow setting, is provided with the first convex block 4 in the hollow layer, and 4 end face of the first convex block is set as spherical face, and described first
4 quantity of convex block is provided with multiple, and is evenly distributed on 102 inner wall of episphere 101 and lower semisphere, 4 length of the first convex block
Equal to the half of 1 radius of phosphorous copper balls ontology, and uniformly divide 4 endpoint of the first convex block on 102 inner wall of episphere 101 and lower semisphere
Between line can form a spheroidal cavity just, can greatly increase phosphorous copper balls ontology 1 and plating tank liquid
Contact area, to improve the copper ion quantity that releases from phosphor-copper ball surface, meanwhile, compared to traditional solid phosphorous copper balls
Speech, can greatly reduce phosphorous copper balls size and quality under same use condition, to reduce production cost and production phosphorous copper balls
The consumption of raw material, the 101 bottom margin position of episphere are provided with the first U-lag 5,102 top of lower semisphere
Marginal position is provided with the first U-shaped fixture block 6, and first U-lag 5 matches with the first U-shaped fixture block 6, can be used for reducing former material
The consumption of material reduces producting process difficulty, and for facilitating the subsequent operation for carrying out electric-resistance seam-welding.
The present invention also provides a kind of preparation method of anodic phosphorous copper balls, concrete operation steps are as follows:
Step 1: copper raw material is added in Medium Frequency Induction Heating Furnace, meanwhile, thereto add degasser phosphorus, tin and other
The raw material metal of the compositions such as microelement such as iron, zinc carries out congruent melting and handles to prepare phosphorous copper balls mother liquor, wherein copper content quality
Percentage is ﹥ 99.9%, phosphorus content mass percent is 0.04% and other constituent content mass percent ﹤ 0.03%；
Step 2: the phosphorous copper balls mother liquor in step 1 is stirred using magnetic stirring apparatus, so that each in phosphorous copper balls mother liquor
Component is sufficiently mixed uniformly；
Step 3: the phosphorous copper balls mother liquor being uniformly mixed in step 2 is introduced into holding furnace and is kept the temperature, holding temperature is
Temperature is 1000 DEG C, meanwhile, continue to be stirred phosphorous copper balls mother liquor with magnetic stirring apparatus, to avoid part of component deposition
To the final product quality for influencing phosphorous copper balls together；
Step 4: the type that the phosphorous copper balls mother liquor in step 4 is injected into mold 7 is intracavitary, the episphere 101 of phosphorous copper balls is made
102 ball embryo of ball embryo and lower semisphere；
Step 5: in step 4 101 ball embryo of episphere and 102 ball embryo of lower semisphere successively polished, deburring, cleaning and
Drying and processing；
Step 6: episphere 101 and lower semisphere 102 are carried out by seamless soldering by the technique of electric-resistance seam-welding, to be made
Anodic phosphorous copper balls.
Used mold 7, the mold 7 include in a kind of preparation method of anodic phosphorous copper balls according to Fig. 4-7
First upper mold 71, the second upper mold 72 and lower mold 73, first upper mold 71 and 72 bottom of the second upper mold are respectively provided with
There is the second convex block 8,8 surface of the second convex block is uniformly distributed the first groove 9, is provided with the second groove on the lower mold 73
10, second convex block 8 is matched with the second groove 10, and the 71 bottom margin position of the first upper mold is provided with the second U-shaped
10 marginal position of the second groove of fixture block 12,73 top of the 72 bottom margin position of the second upper mold and lower mold is respectively provided with
There is the second U-lag 13, the second U-shaped fixture block 12 is matched with the second U-lag 13, and 10 inner wall of the second groove is uniformly distributed
There is third convex block 11.
Embodiment 2:
A kind of anodic phosphorous copper balls according to shown in Fig. 1-3, including phosphorous copper balls ontology 1,1 surface of phosphorous copper balls ontology are provided with logical
Hole 2, and run through phosphorous copper balls ontology 1, the phosphorous copper balls ontology 1 includes episphere 101 and lower semisphere 102, the phosphorous copper balls ontology 1
Inner hollow setting, is provided with the first convex block 4 in the hollow layer, and 4 end face of the first convex block is set as spherical face, and described first
4 quantity of convex block is provided with multiple, and is evenly distributed on 102 inner wall of episphere 101 and lower semisphere, 4 length of the first convex block
Equal to the half of 1 radius of phosphorous copper balls ontology, and uniformly divide 4 endpoint of the first convex block on 102 inner wall of episphere 101 and lower semisphere
Between line can form a spheroidal cavity just, can greatly increase phosphorous copper balls ontology 1 and plating tank liquid
Contact area, to improve the copper ion quantity that releases from phosphor-copper ball surface, meanwhile, compared to traditional solid phosphorous copper balls
Speech, can greatly reduce phosphorous copper balls size and quality under same use condition, to reduce production cost and production phosphorous copper balls
The consumption of raw material, the 101 bottom margin position of episphere are provided with the first U-lag 5,102 top of lower semisphere
Marginal position is provided with the first U-shaped fixture block 6, and first U-lag 5 matches with the first U-shaped fixture block 6, can be used for reducing former material
The consumption of material reduces producting process difficulty, and for facilitating the subsequent operation for carrying out electric-resistance seam-welding.
The present invention also provides a kind of preparation method of anodic phosphorous copper balls, concrete operation steps are as follows:
Step 1: copper raw material is added in Medium Frequency Induction Heating Furnace, meanwhile, thereto add degasser phosphorus, tin and other
The raw material metal of the compositions such as microelement such as iron, zinc carries out congruent melting and handles to prepare phosphorous copper balls mother liquor, wherein copper content quality
Percentage is ﹥ 99.9%, phosphorus content mass percent is 0.05% and other constituent content mass percent ﹤ 0.03%；
Step 2: the phosphorous copper balls mother liquor in step 1 is stirred using magnetic stirring apparatus, so that each in phosphorous copper balls mother liquor
Component is sufficiently mixed uniformly；
Step 3: the phosphorous copper balls mother liquor being uniformly mixed in step 2 is introduced into holding furnace and is kept the temperature, holding temperature is
Temperature is 1400 DEG C, meanwhile, continue to be stirred phosphorous copper balls mother liquor with magnetic stirring apparatus, to avoid part of component deposition
To the final product quality for influencing phosphorous copper balls together；
Step 4: the type that the phosphorous copper balls mother liquor in step 4 is injected into mold 7 is intracavitary, the episphere 101 of phosphorous copper balls is made
102 ball embryo of ball embryo and lower semisphere；
Step 5: in step 4 101 ball embryo of episphere and 102 ball embryo of lower semisphere successively polished, deburring, cleaning and
Drying and processing；
Step 6: episphere 101 and lower semisphere 102 are carried out by seamless soldering by the technique of electric-resistance seam-welding, to be made
Anodic phosphorous copper balls.
Used mold 7, the mold 7 include in a kind of preparation method of anodic phosphorous copper balls according to Fig. 4-7
First upper mold 71, the second upper mold 72 and lower mold 73, first upper mold 71 and 72 bottom of the second upper mold are respectively provided with
There is the second convex block 8,8 surface of the second convex block is uniformly distributed the first groove 9, is provided with the second groove on the lower mold 73
10, second convex block 8 is matched with the second groove 10, and the 71 bottom margin position of the first upper mold is provided with the second U-shaped
10 marginal position of the second groove of fixture block 12,73 top of the 72 bottom margin position of the second upper mold and lower mold is respectively provided with
There is the second U-lag 13, the second U-shaped fixture block 12 is matched with the second U-lag 13, and 10 inner wall of the second groove is uniformly distributed
There is third convex block 11.
Embodiment 3:
A kind of anodic phosphorous copper balls according to shown in Fig. 1-3, including phosphorous copper balls ontology 1,1 surface of phosphorous copper balls ontology are provided with logical
Hole 2, and run through phosphorous copper balls ontology 1, the phosphorous copper balls ontology 1 includes episphere 101 and lower semisphere 102, the phosphorous copper balls ontology 1
Inner hollow setting, is provided with the first convex block 4 in the hollow layer, and 4 end face of the first convex block is set as spherical face, and described first
4 quantity of convex block is provided with multiple, and is evenly distributed on 102 inner wall of episphere 101 and lower semisphere, 4 length of the first convex block
Equal to the half of 1 radius of phosphorous copper balls ontology, and uniformly divide 4 endpoint of the first convex block on 102 inner wall of episphere 101 and lower semisphere
Between line can form a spheroidal cavity just, can greatly increase phosphorous copper balls ontology 1 and plating tank liquid
Contact area, to improve the copper ion quantity that releases from phosphor-copper ball surface, meanwhile, compared to traditional solid phosphorous copper balls
Speech, can greatly reduce phosphorous copper balls size and quality under same use condition, to reduce production cost and production phosphorous copper balls
The consumption of raw material, the 101 bottom margin position of episphere are provided with the first U-lag 5,102 top of lower semisphere
Marginal position is provided with the first U-shaped fixture block 6, and first U-lag 5 matches with the first U-shaped fixture block 6, can be used for reducing former material
The consumption of material reduces producting process difficulty, and for facilitating the subsequent operation for carrying out electric-resistance seam-welding.
The present invention also provides a kind of preparation method of anodic phosphorous copper balls, concrete operation steps are as follows:
Step 1: copper raw material is added in Medium Frequency Induction Heating Furnace, meanwhile, thereto add degasser phosphorus, tin and other
The raw material metal of the compositions such as microelement such as iron, zinc carries out congruent melting and handles to prepare phosphorous copper balls mother liquor, wherein copper content quality
Percentage is ﹥ 99.9%, phosphorus content mass percent is 0.065% and other constituent content mass percent ﹤ 0.03%；
Step 2: the phosphorous copper balls mother liquor in step 1 is stirred using magnetic stirring apparatus, so that each in phosphorous copper balls mother liquor
Component is sufficiently mixed uniformly；
Step 3: the phosphorous copper balls mother liquor being uniformly mixed in step 2 is introduced into holding furnace and is kept the temperature, holding temperature is
Temperature is 1600 DEG C, meanwhile, continue to be stirred phosphorous copper balls mother liquor with magnetic stirring apparatus, to avoid part of component deposition
To the final product quality for influencing phosphorous copper balls together；
Step 4: the type that the phosphorous copper balls mother liquor in step 4 is injected into mold 7 is intracavitary, the episphere 101 of phosphorous copper balls is made
102 ball embryo of ball embryo and lower semisphere；
Step 5: in step 4 101 ball embryo of episphere and 102 ball embryo of lower semisphere successively polished, deburring, cleaning and
Drying and processing；
Step 6: episphere 101 and lower semisphere 102 are carried out by seamless soldering by the technique of electric-resistance seam-welding, to be made
Anodic phosphorous copper balls.
Used mold 7, the mold 7 include in a kind of preparation method of anodic phosphorous copper balls according to Fig. 4-7
First upper mold 71, the second upper mold 72 and lower mold 73, first upper mold 71 and 72 bottom of the second upper mold are respectively provided with
There is the second convex block 8,8 surface of the second convex block is uniformly distributed the first groove 9, is provided with the second groove on the lower mold 73
10, second convex block 8 is matched with the second groove 10, and the 71 bottom margin position of the first upper mold is provided with the second U-shaped
10 marginal position of the second groove of fixture block 12,73 top of the 72 bottom margin position of the second upper mold and lower mold is respectively provided with
There is the second U-lag 13, the second U-shaped fixture block 12 is matched with the second U-lag 13, and 10 inner wall of the second groove is uniformly distributed
There is third convex block 11.
It can be seen that by the comparison of embodiment 1-3, when phosphorus content mass percent is 0.05% in phosphorous copper balls mother liquor, and phosphorus
When temperature of the copper ball mother liquor in holding furnace is 1400 DEG C, the phosphorous copper balls produced are as anodization material in the course of work
In, the earth of positive pole amount of generation is minimum, and the practical application effect under same use condition is best.
Embodiment 4:
The technique of used electric-resistance seam-welding in a kind of preparation method of anodic phosphorous copper balls according to Fig. 8 is carrying out resistance
When seam weld, first the surface to be welded of welded part is fit together, and places nugget at the binding face of welded part, then will be welded
Part is pressed between two electrodes, and passes to electric current, will using the resistance heat that electric current flows through work piece interface and adjacent domain generation
Nugget is heated to fusing or mecystasis, is allowed to form metal bonding, and such welding method, high production efficiency, weldment deformation is small,
Meanwhile it may make the anodic phosphorous copper balls produced more attractive.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (9)
1. a kind of anodic phosphorous copper balls, including phosphorous copper balls ontology (1), it is characterised in that: phosphorous copper balls ontology (1) surface is provided with
Through-hole (2), and run through phosphorous copper balls ontology (1), the phosphorous copper balls ontology (1) includes episphere (101) and lower semisphere (102), institute
It states episphere (101) bottom margin position to be provided with the first U-lag (5), lower semisphere (102) the top edge position is provided with
First U-shaped fixture block (6), first U-lag (5) match with the first U-shaped fixture block (6).
2. a kind of anodic phosphorous copper balls according to claim 1, it is characterised in that: phosphorous copper balls ontology (1) inner hollow
It is arranged, is provided with the first convex block (4) in the hollow layer, and the first convex block (4) end face is set as spherical face.
3. a kind of anodic phosphorous copper balls according to claim 2, it is characterised in that: the first convex block (4) quantity is provided with
It is multiple, and be evenly distributed on episphere (101) and lower semisphere (102) inner wall.
4. a kind of anodic phosphorous copper balls according to claim 2, it is characterised in that: the first convex block (4) length is equal to phosphorus
The half of copper ball ontology (1) radius, and uniformly divide the first convex block (4) end on episphere (101) and lower semisphere (102) inner wall
Line between point can form a spheroidal cavity just.
5. a kind of preparation method of anodic phosphorous copper balls, concrete operation step described in -4 according to claim 1 are as follows:
Step 1: copper raw material is added in Medium Frequency Induction Heating Furnace, meanwhile, thereto add degasser phosphorus, tin and other
The raw material metal of the compositions such as microelement such as iron, zinc carries out congruent melting and handles to prepare phosphorous copper balls mother liquor；
Step 2: the phosphorous copper balls mother liquor in step 1 is stirred using magnetic stirring apparatus, so that each in phosphorous copper balls mother liquor
Component is sufficiently mixed uniformly；
Step 3: the phosphorous copper balls mother liquor being uniformly mixed in step 2 being introduced into holding furnace and is kept the temperature, meanwhile, continue to use magnetic
Power blender is stirred phosphorous copper balls mother liquor, deposited to avoid part of component influence together phosphorous copper balls at quality
Amount；
Step 4: the type that the phosphorous copper balls mother liquor in step 4 is injected into mold (7) is intracavitary, the episphere of phosphorous copper balls is made
(101) ball embryo and lower semisphere (102) ball embryo；
Step 5: in step 4 episphere (101) ball embryo and lower semisphere (102) ball embryo successively polished, it is deburring, clear
It washes and drying and processing；
Step 6: carrying out seamless soldering for episphere (101) and lower semisphere (102) by the technique of electric-resistance seam-welding, thus
Anodic phosphorous copper balls are made.
6. a kind of preparation method of anodic phosphorous copper balls according to claim 5, it is characterised in that: the phosphor-copper of the step 1
In ball mother liquor, copper content quality percentage is ﹥ 99.9%, phosphorus content mass percent is 0.04~0.065% and other components contain
Measure mass percent ﹤ 0.03%.
7. a kind of preparation method of anodic phosphorous copper balls according to claim 5, it is characterised in that: the phosphorous copper balls mother liquor exists
Temperature in holding furnace is 1000~1600 DEG C.
8. a kind of preparation method of anodic phosphorous copper balls according to claim 5, it is characterised in that: used in the step 4
Mold (7) include the first upper mold (71), the second upper mold (72) and lower mold (73), first upper mold (71) and the
Two upper molds (72) bottom is provided with the second convex block (8), and the second convex block (8) surface is uniformly distributed the first groove (9),
It being provided with the second groove (10) on the lower mold (73), second convex block (8) matches with the second groove (10), and described
Two grooves (10) inner wall is uniformly distributed third convex block (11).
9. used mold (7) in a kind of preparation method of anodic phosphorous copper balls according to claim 8, feature exists
In: the first upper mold (71) bottom margin position is provided with the second U-shaped fixture block (12), the second upper mold (72) bottom
The second groove (10) marginal position at the top of marginal position and lower mold (73) is provided with the second U-lag (13), and described
Two U-shaped fixture blocks (12) are matched with the second U-lag (13).
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| CN113684523A (en) * | 2021-08-31 | 2021-11-23 | 江西江南新材料科技股份有限公司 | Hollow phosphor copper ball for electroplating and preparation method thereof |
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| CN104790019A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper ball for PCB and processing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113684523A (en) * | 2021-08-31 | 2021-11-23 | 江西江南新材料科技股份有限公司 | Hollow phosphor copper ball for electroplating and preparation method thereof |
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Application publication date: 20190823 |