CN110145728B - Enhanced heat dissipation composite structure and preparation method thereof - Google Patents
Enhanced heat dissipation composite structure and preparation method thereof Download PDFInfo
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- CN110145728B CN110145728B CN201910492168.1A CN201910492168A CN110145728B CN 110145728 B CN110145728 B CN 110145728B CN 201910492168 A CN201910492168 A CN 201910492168A CN 110145728 B CN110145728 B CN 110145728B
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- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
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- B32B7/04—Interconnection of layers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses a reinforced heat dissipation composite structure and a preparation method thereof, and the reinforced heat dissipation composite structure comprises a graphene film (2) and a metal layer (3) deposited on the upper surface of the graphene film (2), wherein the graphene film (2) and the metal layer (3) are provided with array through holes, and polyimide (4) is attached to the inner wall surfaces of the metal layer (3) and the array through holes. Compared with the traditional metal material, the invention improves the heat conductivity, is beneficial to promoting the conduction of heat on the whole radiation surface and improves the phenomenon of uneven temperature distribution on the radiation surface. Meanwhile, the solar heat collector has the characteristics of low solar absorptivity and high emissivity, so that the absorbed solar energy can be minimized, the heat can be quickly radiated to the space environment, and the integral heat dissipation efficiency is effectively improved.
Description
Technical Field
The invention belongs to the field of heat dissipation and cooling, and particularly relates to a reinforced heat dissipation composite structure and a preparation method thereof.
Background
The development of electronic equipment towards miniaturization and integration leads the heat flux density of a working device to be increased sharply, and an effective thermal control system is an important way for maintaining the working temperature of the device to be stable. In addition, as the exploration of space by human beings is deepened, the tasks carried by the satellite spacecraft are more and more complex. The electronic thermal control technology is also a technology which cannot be ignored for maintaining the stable working temperature of the spacecraft. In space without a medium, heat dissipation can only be carried out by thermal conduction and radiation. In order to adapt to the heat dissipation environment of the aerospace space, a measure is often taken to rapidly lead out the heat generated by the electronic device by using a metal material with slightly higher heat conductivity. It is noteworthy, however, that the thermal conductivity of the aluminum or copper plate is still low (<400W/m · K), and heat loss cannot be maximized. Meanwhile, the characteristics of the aluminum plate or the copper plate, such as difficult bending and high density, also limit the wide application of the aluminum plate or the copper plate.
Disclosure of Invention
Compared with the traditional metal material, the structure improves the heat conductivity, is beneficial to promoting the conduction of heat on the whole radiation surface and improving the phenomenon of uneven temperature distribution on the radiation surface. Meanwhile, the solar heat collector has the characteristics of low solar absorptivity and high emissivity, so that the absorbed solar energy can be minimized, the heat can be quickly radiated to the space environment, and the integral heat dissipation efficiency is effectively improved.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a composite structure for enhancing heat dissipation comprises a graphene film and a metal layer deposited on the upper surface of the graphene film, wherein array through holes are formed in the graphene film and the metal layer, and polyimide is attached to the inner wall surfaces of the metal layer and the array through holes.
Further, the metal layer is a silver layer or an aluminum layer.
Further, the thickness of the silver layer or the aluminum layer is 200 nm.
Furthermore, the diameter of each array through hole is 100-300 μm, and the center distance of the holes is 0.4-0.8 mm.
Further, the graphene film is replaced with highly oriented pyrolytic graphite.
The preparation method of the reinforced heat dissipation composite structure comprises the following steps:
the method comprises the following steps: preparing a graphene oxide solution by adopting a liquid phase stripping Hummers method, forming a graphene oxide film by self-assembly on a gas-liquid interface, and obtaining the graphene film by carbonization, graphitization and calendering;
step two: treating the graphene film obtained in the first step by using oxygen plasma, and depositing the metal layer on the graphene film by using a direct-current magnetron sputtering method;
step three: forming array through holes on the graphene film and the thin film of the metal layer formed in the step two by adopting a laser etching method, wherein the metal surface faces to the laser etching direction;
step four: preparing polyimide acid (PAA);
step five: coating the polyimide acid prepared in the fourth step on the film with the array through holes formed in the third step;
step six: performing suction filtration on the film coated with the polyimide acid prepared in the fifth step to enable the polyimide acid to permeate into the side wall of the array through hole;
step seven: and placing the film coated with the polyimide acid obtained in the sixth step in an atmosphere furnace, and heating in a step manner to imidize the polyimide acid so as to obtain the reinforced heat dissipation composite structure.
Further, the first step specifically includes: uniformly mixing 3g of 325-mesh natural crystalline flake graphite, 1.5g of sodium nitrate and 120ml of concentrated sulfuric acid in a water bath at the temperature of 0 ℃, adding 15g of potassium permanganate in batches to obtain a mixed solution, continuously stirring the mixed solution in the water bath at the temperature of 0 ℃ for 90min, then transferring the mixed solution to a constant-temperature water bath at the temperature of 35 ℃, fully stirring the mixed solution by using a mechanical stirrer, slowly adding 120ml of deionized water into the mixed solution after 4h for diluting until the temperature of the mixed solution is not more than 100 ℃, continuously stirring the obtained solution in the water bath at the temperature of 95 ℃ for 15min after the addition is finished to obtain a graphite oxide solution, washing the graphite oxide solution by 10 wt% of dilute hydrochloric acid and deionized water for multiple times to obtain a graphene oxide solution, slowly pouring 50ml of the graphene oxide solution with the concentration of 7mg/ml into a polytetrafluoroethylene mold with the bottom surface of 5cm multiplied by 5cm, drying the graphene oxide solution in a vacuum drying box set to, the graphene oxide film is formed by self-assembly on a liquid-gas interface, and the graphene oxide film is prepared by the processes of carbonization at 1000 ℃, graphitization at 2800 ℃ and mechanical calendering.
Further, the fourth step specifically includes: 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence to obtain a mixed solution, and the mixed solution is placed in a constant-temperature water bath at 0 ℃ and continuously stirred for 1h to finally obtain polyimide acid (PAA).
Further, the seventh step specifically includes: and horizontally placing the graphene film coated with the polyimide acid in the sixth step in an atmosphere furnace, introducing 500ml/min argon gas as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃ and 220 ℃ for 30min and at 250 ℃ for 60min to finish the imidization process, thereby finally obtaining the reinforced heat dissipation composite structure.
Compared with the prior art, the invention has the remarkable advantages that:
(1) the sandwich-like structure formed by the invention not only has the high heat conduction characteristic of a carbon film material, but also combines a flexible structure with high infrared emissivity and low solar absorptivity, and simultaneously, the array holes in the structure play roles of inhibiting layering and strengthening mechanical strength, under the same heat dissipation condition, the high heat conduction material can accelerate high heat flow density to diffuse from a hot point to the periphery, so that higher temperature distribution on a radiation surface is obtained, and the heat dissipation quantity Q is discharged according to surface radiationrThe calculation formula (1) has the advantages that high emissivity and larger temperature difference can bring more total heat dissipation, air channels formed by array holes can generate natural convection heat transfer effect and have certain heat, the structure overcomes the defects of carbon materials in the field of aerospace thermal control, and the structure is suitable for thermal control and thermal management of the temperature of systems and electronic equipment;
Qr＝σ(Td 4-Tspc 4) (1)
(2) the silver layer deposited by the direct current magnetron sputtering method is used as a mirror reflection layer, the thickness of the silver layer is about 200nm, the silver layer in the state can present stronger metallicity, the silver layer has higher reflectivity in both solar spectrum wave band and infrared wave band, and the radiation characteristic of an upper layer polymer can be improved;
(3) according to the array through hole formed by laser etching, the precursor liquid can permeate into the side wall of the array through hole under the action of pressure, and a composite structure that the upper-layer polymer extends into the graphite layer can be formed after high-temperature treatment.
(4) The invention has simple manufacturing process, easy control of the thickness of the polymer coating, easy large-scale production, large-area preparation, certain flexibility, suitability for a plurality of complex structures and great practical application value.
Drawings
Fig. 1 is a flow chart of the preparation of the enhanced heat dissipation composite structure of the present invention.
Fig. 2 is a schematic structural diagram and a schematic diagram of the enhanced heat dissipation composite structure of the present invention.
Detailed Description
The invention is further described with reference to the accompanying drawings.
With reference to fig. 2, the enhanced heat dissipation composite structure includes a graphene film 2 and a metal layer 3 deposited on the upper surface of the graphene film 2, the graphene film 2 and the metal layer 3 are provided with array through holes, and polyimide 4 is attached to the inner wall surfaces of the metal layer 3 and the array through holes.
Further, the metal layer 3 is a silver layer or an aluminum layer.
Further, the thickness of the silver layer or the aluminum layer is 200 nm.
Furthermore, the diameter of each array through hole is 100-300 μm, and the center distance of the holes is 0.4-0.8 mm.
Further, the graphene film 3 is replaced with highly oriented pyrolytic graphite.
With reference to fig. 1, a method for manufacturing the reinforced heat dissipation composite structure includes the following steps:
the method comprises the following steps: preparing a graphene oxide solution by adopting a liquid phase stripping Hummers method, forming a graphene oxide film by self-assembly on a gas-liquid interface, and obtaining a graphene film 2 by carbonization, graphitization and calendering, wherein the existence of the structure can accelerate heat conduction and effectively avoid local temperature rise;
step two: treating the graphene film 2 in the first step by using oxygen plasma, and depositing a mirror reflection layer of the metal layer 3 on the graphene film by using a direct-current magnetron sputtering method;
step three: forming array through holes on the films of the graphene film 2 and the metal layer 3 formed in the step two by adopting a laser etching method, wherein the metal surface faces to the laser etching direction;
step four: preparing a polymer precursor solution polyimide acid (PAA);
step five: coating the polyimide acid prepared in the fourth step on the film with the array through holes formed in the third step;
step six: performing suction filtration on the film coated with the polyimide acid prepared in the fifth step to enable the polyimide acid to permeate into the side wall of the array through hole, so that the bonding strength is improved, the array through hole is prevented from being blocked by precursor liquid, and in addition, the array through hole provides a good flow channel for air, so that heat generated by an illuminating lamp can be further taken away;
step seven: and placing the film coated with the polyimide acid obtained in the sixth step in an atmosphere furnace, and heating in a step manner to imidize the polyimide acid so as to obtain the reinforced heat dissipation composite structure.
The schematic diagram of the enhanced heat dissipation composite structure and the mechanism of accelerated heat dissipation in the present invention are shown in fig. 2. When the composite structure is pasted on a hot spot heat source 1 through heat-conducting silicone grease, the high heat conductivity of the bottom graphene film 2 enables high heat flow of the hot spot to be diffused quickly, the radiation heat exchange of the heat dissipation plane can be increased by combining the upper polyimide emission coating 4 with the mirror reflection layer 3, the upper polymer penetrates into the graphite film due to the existence of the array through holes, the mechanical performance of the composite structure is enhanced, the layering inhibiting effect is achieved, meanwhile, a good flow channel is improved for hot air, certain natural convection heat dissipation loss is generated, and the overall excellent heat dissipation characteristic is displayed.
Example 1
The preparation method of the reinforced heat dissipation composite structure comprises the following steps:
1. the method for preparing the graphene oxide solution by adopting the liquid-phase peeling Hummers method comprises the following specific operations: taking 3g of 325-mesh natural crystalline flake graphite, 1.5g of sodium nitrate and 120ml of concentrated sulfuric acid, uniformly mixing in a water bath at the temperature of 0 ℃, adding 15g of potassium permanganate in batches, and continuously stirring the mixed solution in the water bath at the temperature of 0 ℃ for 90 min. The reaction solution was then transferred to a constant temperature water bath at 35 ℃ and stirred well using a mechanical stirrer. After 4h, 120ml of deionized water was slowly added thereto for dilution, and the temperature of the reaction solution was not allowed to exceed 100 ℃. After the addition was complete, the resulting solution was stirred in a water bath at 95 ℃ for a further 15 min. Finally obtaining the graphite oxide solution. And washing with 10 wt% dilute hydrochloric acid twice and deionized water several times to obtain a graphene oxide solution. And slowly pouring 50ml of graphene oxide solution with the concentration of 7mg/ml into a polytetrafluoroethylene mold with the bottom surface of 5cm multiplied by 5cm, drying in a vacuum drying oven set to 35 ℃, and performing self-assembly on a liquid-gas interface to form a graphene oxide film. And then carrying out carbonization at 1000 ℃, graphitization at 2800 ℃ and mechanical calendering to obtain the graphene film with high thermal conductivity.
2. Respectively weighing 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) according to the stoichiometric ratio, dissolving the components in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence, and placing the mixed solution in a constant-temperature water bath at 0 ℃ to continuously stir for 1h to finally obtain a precursor solution PAA.
3. And (3) treating the high-thermal-conductivity graphene film prepared in the step (1) with oxygen plasma for 5min, and depositing a silver layer with the thickness of about 200nm on the graphene film by a magnetron sputtering method.
4. And (3) forming a through hole array with the diameter of about 150 mu m by the film in the step (3) through a laser etching method, wherein the number of the through holes per square centimeter is about 300, and the center distance of the through holes is about 0.5 mm.
5. And (3) dripping the precursor obtained in the step (2) on the surface of the silver layer of the film obtained in the step (4), and performing vacuum filtration for 10s to enable the precursor to permeate into the inner wall of the array hole under the action of pressure.
6. And (3) horizontally placing the graphene film coated with the PAA in the step (5) in an atmosphere furnace, introducing 500ml/min of argon as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃, 220 ℃ for 30min and at 250 ℃ for 60min to finish a high-temperature treatment process, thereby finally obtaining the enhanced heat dissipation composite structure.
Example 2
The preparation method of the reinforced heat dissipation composite structure comprises the following steps:
1. the graphene film described in example 1 was replaced with highly oriented pyrolytic graphite.
2. 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed according to the stoichiometric ratio, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence, and the mixed solution is placed in a constant temperature water bath at 0 ℃ and continuously stirred for 1 h. Finally obtaining a precursor solution PAA.
3. And (3) treating the high-thermal-conductivity graphite film in the step (1) with oxygen plasma for 5min, and depositing a silver layer with the thickness of about 200nm on the high-thermal-conductivity graphite film by a magnetron sputtering method.
4. And (3) forming a through hole array with the diameter of about 150 mu m by using the film in the step (3) through a laser etching method, wherein the number of the through holes per square centimeter is about 305, and the center distance of the through holes is about 0.5 mm.
5. And (3) dripping the precursor obtained in the step (2) on the surface of the silver layer of the film obtained in the step (4), and performing short suction filtration for 10s by adopting a vacuum suction filtration method to ensure that the precursor liquid permeates into the inner wall of the array hole under the action of pressure.
6. And (3) horizontally placing the graphene film coated with the PAA in the step (5) in an atmosphere furnace, introducing 500ml/min of argon as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃, 220 ℃ for 30min and at 250 ℃ for 60min to finish a high-temperature treatment process, thereby finally obtaining the enhanced heat dissipation composite structure. The heat conductivity of the bottom graphite film can reach 1600W/m.K. The solar band spectral absorptivity is 0.15, and the infrared emissivity is 0.86.
Example 3
The preparation method of the reinforced heat dissipation composite structure comprises the following steps:
1. the highly oriented pyrolytic graphite film was selected as the substrate highly thermally conductive film in example 2.
2. 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed according to the stoichiometric ratio, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence, and the mixed solution is placed in a constant temperature water bath at 0 ℃ and continuously stirred for 1 h. Finally obtaining a precursor solution PAA.
3. And (3) treating the high-thermal-conductivity graphite film in the step (1) by using oxygen plasma for 5min, and depositing a silver layer with the thickness of about 200nm by using a magnetron sputtering method.
4. And (3) forming a through hole array with the diameter of about 300 mu m by using the film in the step (3) through a laser etching method, wherein the number of the through holes per square centimeter is about 305, and the center distance of the through holes is about 0.6 mm.
5. And (3) dripping the precursor obtained in the step (2) on the surface of the silver layer of the film obtained in the step (4), and performing short suction filtration for 5s by adopting a vacuum suction filtration method to ensure that the precursor liquid permeates into the inner wall of the array hole under the action of pressure.
6. And (3) horizontally placing the graphene film coated with the PAA in the step (5) in an atmosphere furnace, introducing 500ml/min of argon as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃, 220 ℃ for 30min and at 250 ℃ for 60min to finish a high-temperature treatment process, thereby finally obtaining the enhanced heat dissipation composite structure.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The reinforced heat dissipation composite structure is characterized by comprising a graphene film (2) and a metal layer (3) deposited on the upper surface of the graphene film (2), wherein the graphene film (2) and the metal layer (3) are provided with array through holes, and polyimide (4) is attached to the inner wall surfaces of the metal layer (3) and the array through holes.
2. The structure as claimed in claim 1, wherein the metal layer (3) is a silver layer or an aluminum layer.
3. The structure as claimed in claim 2, wherein the silver or aluminum layer has a thickness of 200 nm.
4. The structure of claim 1, wherein the diameter of the through holes of the array is 100 μm to 300 μm, and the center-to-center distance of the through holes is 0.4mm to 0.8 mm.
5. The structure as claimed in claim 1, wherein the graphene film (2) is replaced with pyrolytic graphite.
6. A method for preparing the reinforced heat dissipation composite structure according to claim 1, comprising the following steps:
the method comprises the following steps: preparing a graphene oxide solution by adopting a liquid phase stripping Hummers method, forming a graphene oxide film by self-assembly on a gas-liquid interface, and obtaining a graphene film (2) by carbonization, graphitization and calendering;
step two: treating the graphene film (2) in the first step by using oxygen plasma, and depositing the metal layer (3) on the graphene film by using a direct-current magnetron sputtering method;
step three: forming array through holes on the films of the graphene film (2) and the metal layer (3) formed in the second step by adopting a laser etching method, wherein the metal surface faces to the laser etching direction;
step four: preparing polyimide acid (PAA);
step five: coating the polyimide acid prepared in the fourth step on the film with the array through holes formed in the third step;
step six: performing suction filtration on the film coated with the polyimide acid prepared in the fifth step to enable the polyimide acid to permeate into the side wall of the array through hole;
step seven: and placing the film coated with the polyimide acid obtained in the sixth step in an atmosphere furnace, and heating in a step manner to imidize the polyimide acid so as to obtain the reinforced heat dissipation composite structure.
7. The method according to claim 6, wherein the first step specifically comprises: uniformly mixing 3g of 325-mesh natural crystalline flake graphite, 1.5g of sodium nitrate and 120ml of concentrated sulfuric acid in a water bath at the temperature of 0 ℃, adding 15g of potassium permanganate in batches to obtain a mixed solution, continuously stirring the mixed solution in the water bath at the temperature of 0 ℃ for 90min, then transferring the mixed solution to a constant-temperature water bath at the temperature of 35 ℃, fully stirring the mixed solution by using a mechanical stirrer, slowly adding 120ml of deionized water into the mixed solution after 4h for diluting until the temperature of the mixed solution is not more than 100 ℃, continuously stirring the obtained solution in the water bath at the temperature of 95 ℃ for 15min after the addition is finished to obtain a graphite oxide solution, washing the graphite oxide solution by 10 wt% of dilute hydrochloric acid and deionized water for multiple times to obtain a graphene oxide solution, slowly pouring 50ml of the graphene oxide solution with the concentration of 7mg/ml into a polytetrafluoroethylene mold with the bottom surface of 5cm multiplied by 5cm, drying the graphene oxide solution in a vacuum drying box set to, and self-assembling at a liquid-gas interface to form a graphene oxide film, and then carrying out carbonization at 1000 ℃, graphitization at 2800 ℃ and mechanical calendering to obtain the graphene film (2).
8. The method according to claim 7, wherein the fourth step specifically comprises: 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence to obtain a mixed solution, and the mixed solution is placed in a constant-temperature water bath at 0 ℃ and continuously stirred for 1h to finally obtain polyimide acid (PAA).
9. The method according to claim 8, wherein the seventh step specifically comprises: and horizontally placing the graphene film coated with the polyimide acid in the sixth step in an atmosphere furnace, introducing 500ml/min argon gas as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃ and 220 ℃ for 30min and at 250 ℃ for 60min to finish the imidization process, thereby finally obtaining the reinforced heat dissipation composite structure.
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| CN2019101763173 | 2019-03-08 |
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| CN110145728B true CN110145728B (en) | 2020-08-11 |
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| WO2008149920A1 (en) * | 2007-06-07 | 2008-12-11 | Kaneka Corporation | Graphite composite film |
| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
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| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
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