CN109764321B - Cooling structure of LED illuminating lamp and preparation method thereof - Google Patents
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Abstract
The invention discloses a cooling structure of an LED illuminating lamp and a preparation method thereof, wherein the cooling structure comprises a copper plate (2) and a thermal control flexible thin film arranged above the copper plate (2), the thermal control flexible thin film comprises a graphene film (3) and a metal layer (4) deposited on the upper surface of the graphene film (3), the graphene film (3) and the metal layer (4) are provided with array through holes, polyimide (5) is attached to the inner wall surfaces of the metal layer (4) and the array through holes, and the thermal control flexible thin film is bonded and fixed with the upper surface of the copper plate (2) through heat conduction silicone grease (6) on the lower surface. The invention increases the total heat dissipation capacity by improving heat conduction, strengthening heat convection of air and increasing the radiation blackness of the surface, and effectively relieves the problem of higher temperature of the illuminating lamp in the use process.
Description
Technical Field
The invention belongs to the field of illumination lamp cooling, and particularly relates to a cooling structure of an LED illumination lamp and a preparation method thereof.
Background
In the late 60 s of the 19 th century, humans began to step into the "electrical age". Today, the economy is increasingly developed, and the power system is also rapidly developed, so that the colorful world is created. According to the relevant data, 20% of the global power consumption is used for illumination. Currently, Light Emitting Diode (LED) light sources in electric lighting are receiving attention due to their high luminous efficiency. However, although the luminous efficiency of the new illumination light source is effectively improved compared with the conventional light source, only 25% of the electric energy is converted into light energy, and other parts are dissipated in a heat mode. If such high heat is not dissipated in time, the luminous efficiency of the illumination lamp is seriously affected, and the service life of the illumination lamp is shortened. By adopting a reasonable and efficient heat dissipation mode, the service life of the illuminating lamp can be effectively prolonged, the luminous efficiency is improved, and energy conservation and emission reduction are promoted. From the three heat dissipation methods of heat conduction, heat convection and heat radiation, the main heat dissipation mode of the illuminating lamp can be divided into the promotion of heat convection and the conversion of natural convection heat dissipation to forced convection heat dissipation; the heat conduction is promoted by the main measures of heat pipe radiation, liquid cooling radiation and microchannel radiation. The three modes for promoting heat conduction mainly carry out heat diffusion through an external radiator technology, have obvious heat dissipation effect and are suitable for high-power illuminating lamps. And to the conversion of natural convection to forced convection can increase the heat dissipation to a certain extent to low-power light, but generally all need external fan to accomplish, bring certain trouble to holistic encapsulation. Meanwhile, due to the miniaturization of the equipment, the convection heat dissipation loss is difficult to increase by increasing the heat dissipation area. In addition, although the use of metal structures has some effect on the heat dissipation of the lamp, the heat conduction capability of the metal is still insufficient (thermal conductivity <400W/m · K), and in addition, the surface blackness of the metal is extremely low (<0.1), making it difficult to perform effective heat dissipation by means of heat radiation.
Disclosure of Invention
The invention provides a cooling structure of an LED illuminating lamp and a preparation method thereof, which can increase the total heat dissipation capacity by improving heat conduction, strengthening heat convection of air and increasing surface radiation blackness, and effectively relieve the problem of higher temperature of the illuminating lamp in the using process.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the utility model provides a cooling structure of LED light, includes the copper and set up in the flexible film of thermal control of copper top, the flexible film of thermal control include the graphite alkene membrane with deposit in the metal level of graphite alkene membrane upper surface, graphite alkene membrane and metal level are provided with the array through-hole, metal level and array through-hole internal face are adhered to there is polyimide, the flexible film of thermal control is fixed through the heat conduction silicone grease of lower surface and the upper surface bonding of copper.
Further, the metal layer is a silver layer or an aluminum layer.
Further, the thickness of the silver layer or the aluminum layer is 200 nm.
Furthermore, the diameter of each array through hole is 100-300 μm, and the center distance of the holes is 0.4-0.8 mm.
Further, the graphene film is replaced with highly oriented pyrolytic graphite.
A preparation method of the cooling structure of the LED illuminating lamp comprises the following steps:
the method comprises the following steps: preparing a graphene oxide solution by adopting a liquid phase stripping Hummers method, forming a graphene oxide film by self-assembly on a gas-liquid interface, and obtaining the graphene film by carbonization, graphitization and calendering;
step two: treating the graphene film obtained in the first step by using oxygen plasma, and depositing the metal layer on the graphene film by using a direct-current magnetron sputtering method;
step three: forming array through holes on the graphene film and the thin film of the metal layer formed in the step two by adopting a laser etching method, wherein the metal surface faces to the laser etching direction;
step four: preparing polyimide acid (PAA);
step five: coating the polyimide acid prepared in the fourth step on the film with the array through holes formed in the third step;
step six: performing suction filtration on the film coated with the polyimide acid prepared in the fifth step to enable the polyimide acid to permeate into the side wall of the array through hole;
step seven: placing the film coated with the polyimide acid obtained in the sixth step in an atmosphere furnace, and carrying out stepped temperature rise to enable the polyimide acid to finish imidization so as to obtain a thermal control flexible film;
step eight: and C, adhering the thermal control flexible film obtained in the step seven to the upper surface of the copper plate by using heat-conducting silicone grease.
The method specifically comprises the steps of uniformly mixing 3g of 325-mesh natural flake graphite, 1.5g of sodium nitrate and 120ml of concentrated sulfuric acid in a water bath at the temperature of 0 ℃, adding 15g of potassium permanganate in batches to obtain a mixed solution, continuously stirring the mixed solution in the water bath at the temperature of 0 ℃ for 90min, then transferring the mixed solution to a constant-temperature water bath at the temperature of 35 ℃, sufficiently stirring the mixed solution by using a mechanical stirrer, slowly adding 120ml of deionized water into the mixed solution for dilution after 4h, keeping the temperature of the mixed solution not more than 100 ℃, continuously stirring the obtained solution in the water bath at the temperature of 95 ℃ for 15min to obtain a graphite oxide solution, washing the graphite oxide solution twice by using 10 wt% of dilute hydrochloric acid and multiple times of deionized water to obtain the graphite oxide solution, slowly pouring 50ml of the graphite oxide solution with the concentration of 7mg/ml into a polytetrafluoroethylene mold with the bottom surface of 5cm × 5cm, drying the graphite oxide solution in a vacuum drying oven set at the temperature of 35 ℃, self-assembling on a liquid-gas interface surface to form a graphene oxide film, carbonizing the graphene oxide film at the temperature of 1000 ℃, and mechanically pressing the graphene film to obtain.
Further, the fourth step specifically includes: 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence to obtain a mixed solution, and the mixed solution is placed in a constant-temperature water bath at 0 ℃ and continuously stirred for 1h to finally obtain polyimide acid (PAA).
Further, the seventh step specifically includes: and horizontally placing the graphene film coated with the polyimide acid in the sixth step in an atmosphere furnace, introducing 500ml/min argon gas as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃ and 220 ℃ for 30min and at 250 ℃ for 60min to finish the imidization process, thereby finally obtaining the thermal control flexible film.
Compared with the prior art, the invention has the remarkable advantages that:
(1) the invention overcomes the characteristics of low heat conduction and low emissivity of the traditional metal material, realizes the rapid diffusion of heat and the increase of radiation heat exchange quantity on the basis of not adding complex additional components, improves the integral heat dissipation quantity of the illuminating lamp, improves the cooling effect by 35 percent compared with the traditional metal, effectively controls the working temperature of the illuminating lamp, and is beneficial to prolonging the service life of the illuminating lamp;
(2) the array holes in the cooling structure are beneficial to improving the bonding strength, and serve as a heat convection channel of air, so that the heat convection between a heat source of the illuminating lamp and the air is enhanced;
(3) the invention has simple manufacturing process, certain flexibility, no limit to the specification of a test piece, easy large-scale production, large-area use and great practical application value.
Drawings
Fig. 1 is a flow chart of the preparation of the cooling structure of the LED illumination lamp of the present invention.
Fig. 2 is a schematic structural diagram and an enhanced heat dissipation schematic diagram of a cooling structure of an LED lighting lamp according to the present invention.
Fig. 3 is a schematic diagram of the distribution of the array through holes in the cooling structure of the LED lighting lamp according to the present invention.
Detailed Description
The invention is further described with reference to the accompanying drawings.
With reference to fig. 2, the cooling structure of the LED lighting lamp comprises a copper plate 2 and a thermal control flexible film arranged above the copper plate 2, wherein the thermal control flexible film comprises a graphene film 3 and a metal layer 4 deposited on the upper surface of the graphene film 3, the graphene film 3 and the metal layer 4 are provided with array through holes, polyimide 5 is attached to the inner wall surfaces of the metal layer 4 and the array through holes, and the thermal control flexible film is bonded and fixed with the upper surface of the copper plate 2 through a heat conduction silicone grease 6 on the lower surface.
Further, the metal layer 4 is a silver layer or an aluminum layer.
Further, the thickness of the silver layer or the aluminum layer is 200 nm.
Furthermore, the diameter of each array through hole is 100-300 μm, and the center distance of the holes is 0.4-0.8 mm.
Further, the graphene film 3 is replaced with highly oriented pyrolytic graphite.
With reference to fig. 1, a method for manufacturing a cooling structure of an LED lighting lamp according to the foregoing description includes the following steps:
the method comprises the following steps: preparing a graphene oxide solution by adopting a liquid phase stripping Hummers method, forming a graphene oxide film by self-assembly on a gas-liquid interface, and obtaining a graphene film 3 by carbonization, graphitization and calendering, wherein the existence of the structure can accelerate heat conduction and effectively avoid local temperature rise;
step two: treating the graphene film 3 in the first step by using oxygen plasma, and depositing the metal layer 4 on the graphene film by using a direct-current magnetron sputtering method;
step three: forming array through holes on the films of the graphene film 3 and the metal layer 4 formed in the step two by adopting a laser etching method, wherein the metal surface faces to the laser etching direction;
step four: preparing a precursor solution polyimide acid (PAA);
step five: coating the polyimide acid prepared in the fourth step on the film with the array through holes formed in the third step;
step six: performing suction filtration on the film coated with the polyimide acid prepared in the fifth step to enable the polyimide acid to permeate into the side wall of the array through hole, so that the bonding strength is improved, the array through hole is prevented from being blocked by precursor liquid, and in addition, the array through hole provides a good flow channel for air, so that heat generated by an illuminating lamp can be further taken away;
step seven: placing the film coated with the polyimide acid obtained in the sixth step in an atmosphere furnace, and carrying out stepped temperature rise to enable the polyimide acid to finish imidization so as to obtain a thermal control flexible film;
step eight: and adhering the thermal control flexible film obtained in the seventh step to the upper surface of the copper plate 2 by using heat-conducting silicone grease 6.
The structure of the invention is schematically shown in figure 2. The lighting lamp 1 is attached to the copper plate 2, and the thermal control flexible film is adhered to the surface of the copper plate through the heat conduction silicone grease 6. The graphene film 3 with high thermal conductivity can rapidly disperse the heat of the central heat source, so that the surface temperature tends to be uniform. The metal reflecting layer 4 and the polyimide 5 film have high emissivity characteristics, so that the total amount of radiation heat exchange of the surface can be increased. The distribution of the through holes in the array in the composite structure is shown in fig. 3, wherein the reference sign a represents the hole pitch and the reference sign b represents the hole diameter. Due to the existence of the array through holes, a part of precursor liquid permeates into the graphite film layer, and a composite structure with upper-layer polymers extending to the graphite layer is formed through high-temperature treatment, so that the mechanical property of the composite structure is improved, and delamination is inhibited. Heat Q dissipated by surface radiationrCompared with the original situation that only the heat dissipation copper plate exists, the cooling composite structure disclosed by the invention has the advantages that the high-thermal-conductivity graphene film can accelerate heat conduction on the surface of the copper plate, eliminate local high temperature, improve the average temperature on a heat dissipation plane and increase the heat exchange temperature difference. Secondly, the emissivity of the copper surface is only 0.01-0.02, but the emissivity of the surface of the method provided by the invention can reach 0.86, and the radiation heat exchange quantity of the surface is increased. Thirdly, the presence of the array holes in the present invention provides a flow for the hot airThe movable channel can further increase the heat dissipation capacity.
Example 1
The preparation method of the cooling structure of the LED illuminating lamp comprises the following steps:
1. the method comprises the following steps of uniformly mixing 3g of 325-mesh natural flake graphite, 1.5g of sodium nitrate and 120ml of concentrated sulfuric acid in a water bath at the temperature of 0 ℃, adding 15g of potassium permanganate in batches, continuously stirring the mixed solution in the water bath at the temperature of 0 ℃ for 90min, then transferring the reaction solution into a constant-temperature water bath at the temperature of 35 ℃, fully stirring the reaction solution by using a mechanical stirrer, slowly adding 120ml of deionized water into the reaction solution for dilution after 4h, keeping the temperature of the reaction solution not exceeding 100 ℃, continuously stirring the obtained solution in the water bath at the temperature of 95 ℃ for 15min after the addition is finished, finally obtaining a graphite oxide solution, washing the graphite oxide solution by using 10 wt% of dilute hydrochloric acid and several times of deionized water twice to obtain the graphite oxide solution, pouring 50ml of the graphite oxide solution with the concentration of 7mg/ml into a polytetrafluoroethylene mold with the bottom surface of 5cm × 5cm, drying the graphite oxide solution in a vacuum drying mode set to be 35 ℃, carrying out surface self-assembly in a liquid-gas box to form a graphene oxide film, carrying out mechanical carbonization at the temperature of 1000 ℃, carrying out mechanical graphitization, and carrying out the process of the graphene film forming process of the invention.
2. Respectively weighing 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) according to the stoichiometric ratio, dissolving the components in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence, and placing the mixed solution in a constant-temperature water bath at 0 ℃ to continuously stir for 1h to finally obtain a precursor solution PAA.
3. And (3) treating the high-thermal-conductivity graphene film prepared in the step (1) with oxygen plasma for 5min, and depositing a silver layer with the thickness of about 200nm on the graphene film by a magnetron sputtering method.
4. And (3) forming a through hole array with the diameter of about 150 mu m by the film in the step (3) through a laser etching method, wherein the number of the through holes per square centimeter is about 300, and the center distance of the through holes is about 0.5 mm.
5. And (3) dripping the precursor obtained in the step (2) on the surface of the silver layer of the film obtained in the step (4), and performing vacuum filtration for 10s to enable the precursor to permeate into the inner wall of the array hole under the action of pressure.
6. And (3) horizontally placing the graphene film coated with the PAA in the step (5) in an atmosphere furnace, introducing 500ml/min of argon as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃, 220 ℃ for 30min and at 250 ℃ for 60min to finish a high-temperature treatment process, thereby finally obtaining the thermal control flexible film.
7. And (3) sticking the thermal control flexible film obtained in the step (6) on the surface of a heat dissipation copper plate of the illuminating lamp through a thermal interface material (heat conduction silicone grease). The cooling structure in this example can improve the overall heat dissipation capacity by 35% compared to the structure with only the heat-dissipating copper plate.
Example 2
The preparation method of the cooling structure of the LED illuminating lamp comprises the following steps:
1. the graphene film described in example 1 was replaced with highly oriented pyrolytic graphite.
2. 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed according to the stoichiometric ratio, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence, and the mixed solution is placed in a constant temperature water bath at 0 ℃ and continuously stirred for 1 h. Finally obtaining a precursor solution PAA.
3. And (3) treating the high-thermal-conductivity graphite film in the step (1) with oxygen plasma for 5min, and depositing a silver layer with the thickness of about 200nm on the high-thermal-conductivity graphite film by a magnetron sputtering method.
4. And (3) forming a through hole array with the diameter of about 150 mu m by using the film in the step (3) through a laser etching method, wherein the number of the through holes per square centimeter is about 305, and the center distance of the through holes is about 0.5 mm.
5. And (3) dripping the precursor obtained in the step (2) on the surface of the silver layer of the film obtained in the step (4), and performing short suction filtration for 10s by adopting a vacuum suction filtration method to ensure that the precursor liquid permeates into the inner wall of the array hole under the action of pressure.
6. And (3) horizontally placing the graphene film coated with the PAA in the step (5) in an atmosphere furnace, introducing 500ml/min of argon as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃, 220 ℃ for 30min and at 250 ℃ for 60min to finish a high-temperature treatment process, thereby finally obtaining the thermal control flexible film.
7. And (3) sticking the thermal control flexible film obtained in the step (6) on the surface of a heat dissipation copper plate of the illuminating lamp through a thermal interface material (heat conduction silicone grease).
Example 3
The preparation method of the cooling structure of the LED illuminating lamp comprises the following steps:
1. the highly oriented pyrolytic graphite film was selected as the substrate highly thermally conductive film in example 2.
2. 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed according to the stoichiometric ratio, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence, and the mixed solution is placed in a constant temperature water bath at 0 ℃ and continuously stirred for 1 h. Finally obtaining a precursor solution PAA.
3. And (3) treating the high-thermal-conductivity graphite film in the step (1) by using oxygen plasma for 5min, and depositing a silver layer with the thickness of about 200nm by using a magnetron sputtering method.
4. And (3) forming a through hole array with the diameter of about 300 mu m by using the film in the step (3) through a laser etching method, wherein the number of the through holes per square centimeter is about 305, and the center distance of the through holes is about 0.6 mm.
5. And (3) dripping the precursor obtained in the step (2) on the surface of the silver layer of the film obtained in the step (4), and performing short suction filtration for 5s by adopting a vacuum suction filtration method to ensure that the precursor liquid permeates into the inner wall of the array hole under the action of pressure.
6. And (3) horizontally placing the graphene film coated with the PAA in the step (5) in an atmosphere furnace, introducing 500ml/min of argon as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃, 220 ℃ for 30min and at 250 ℃ for 60min to finish a high-temperature treatment process, thereby finally obtaining the thermal control flexible film.
7. And (3) sticking the thermal control flexible film obtained in the step (6) on the surface of a heat dissipation copper plate of the illuminating lamp through a thermal interface material (heat conduction silicone grease).
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a cooling structure of LED light, its characterized in that, including copper (2) and set up in the flexible film of thermal control of copper (2) top, the flexible film of thermal control include graphene film (3) and deposit in metal level (4) of graphene film (3) upper surface, graphene film (3) and metal level (4) are provided with the array through-hole, metal level (4) and array through-hole internal face are adhered to and have polyimide (5), the flexible film of thermal control is fixed with the upper surface bonding of copper (2) through heat conduction silicone grease (6) of lower surface.
2. The cooling structure of the LED lighting lamp according to claim 1, wherein the metal layer (4) is a silver layer or an aluminum layer.
3. The cooling structure of the LED lighting lamp according to claim 2, wherein the thickness of the silver layer or the aluminum layer is 200 nm.
4. The cooling structure of the LED illuminating lamp according to claim 1, wherein the diameter of the array through holes is 100-300 μm, and the center distance of the holes is 0.4-0.8 mm.
5. The cooling structure of the LED lighting lamp according to claim 1, wherein the graphene film (3) is replaced with pyrolytic graphite.
6. A method for manufacturing a cooling structure of an LED lighting lamp according to claim 1, characterized by comprising the steps of:
the method comprises the following steps: preparing a graphene oxide solution by adopting a liquid phase stripping Hummers method, forming a graphene oxide film by self-assembly on a gas-liquid interface, and then obtaining a graphene film (3) by carbonization, graphitization and calendering;
step two: treating the graphene film (3) in the first step by using oxygen plasma, and depositing the metal layer (4) on the graphene film by using a direct-current magnetron sputtering method;
step three: forming array through holes on the films of the graphene film (3) and the metal layer (4) formed in the second step by adopting a laser etching method, wherein the metal surface faces to the laser etching direction;
step four: preparing polyimide acid (PAA);
step five: coating the polyimide acid prepared in the fourth step on the film with the array through holes formed in the third step;
step six: performing suction filtration on the film coated with the polyimide acid prepared in the fifth step to enable the polyimide acid to permeate into the side wall of the array through hole;
step seven: placing the film coated with the polyimide acid obtained in the sixth step in an atmosphere furnace, and carrying out stepped temperature rise to enable the polyimide acid to finish imidization so as to obtain a thermal control flexible film;
step eight: and (4) adhering the thermal control flexible film obtained in the step seven to the upper surface of the copper plate (2) by using heat-conducting silicone grease (6).
7. The method as claimed in claim 6, wherein the first step comprises the steps of uniformly mixing 3g of 325-mesh natural flake graphite, 1.5g of sodium nitrate and 120ml of concentrated sulfuric acid in a water bath at a temperature of 0 ℃, adding 15g of potassium permanganate in batches to obtain a mixed solution, continuously stirring the mixed solution in the water bath at the temperature of 0 ℃ for 90min, then transferring the mixed solution to a constant-temperature water bath at a temperature of 35 ℃, fully stirring the mixed solution by using a mechanical stirrer, slowly adding 120ml of deionized water into the mixed solution for dilution after 4h, keeping the temperature of the mixed solution to be not more than 100 ℃, continuously stirring the obtained solution in the water bath at a temperature of 95 ℃ for 15min after the addition is finished to obtain a graphite oxide solution, washing the graphite oxide solution by 10 wt% of dilute hydrochloric acid and deionized water for multiple times to obtain the graphite oxide solution, slowly pouring 50ml of the graphite oxide solution with a concentration of 7mg/ml into a polytetrafluoroethylene mold with a bottom surface of 5cm × 5cm, drying the graphite oxide solution in a vacuum drying oven set at a temperature of 35 ℃, self-assembling the graphite oxide film in a liquid-gas interface box, and performing mechanical graphitization at a temperature of 1000 ℃, and a mechanical graphitization process.
8. The method according to claim 7, wherein the fourth step specifically comprises: 0.72 g of 4,4' -diaminodiphenyl ether (ODA) and 1 g of pyromellitic dianhydride (PMDA) are respectively weighed, dissolved in 14 g of N, N-dimethylacetamide (DMAc) solution in sequence to obtain a mixed solution, and the mixed solution is placed in a constant-temperature water bath at 0 ℃ and continuously stirred for 1h to finally obtain polyimide acid (PAA).
9. The method according to claim 8, wherein the seventh step specifically comprises: and horizontally placing the graphene film coated with the polyimide acid in the sixth step in an atmosphere furnace, introducing 500ml/min argon gas as a protective gas, heating at a heating rate of 0.5 ℃/min, and preserving heat at 80 ℃, 110 ℃, 140 ℃, 170 ℃, 200 ℃ and 220 ℃ for 30min and at 250 ℃ for 60min to finish the imidization process, thereby finally obtaining the thermal control flexible film.
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