CN110137165B - 显示器件及其制作方法 - Google Patents

显示器件及其制作方法 Download PDF

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Publication number
CN110137165B
CN110137165B CN201910318255.5A CN201910318255A CN110137165B CN 110137165 B CN110137165 B CN 110137165B CN 201910318255 A CN201910318255 A CN 201910318255A CN 110137165 B CN110137165 B CN 110137165B
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positive electrode
light
emitting element
chip mounting
grooves
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CN201910318255.5A
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CN110137165A (zh
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钟斌
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Purui Optoelectronics Xiamen Co ltd
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Kaistar Lighting Xiamen Co Ltd
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Priority to CN201910318255.5A priority Critical patent/CN110137165B/zh
Publication of CN110137165A publication Critical patent/CN110137165A/zh
Priority to US16/734,330 priority patent/US11316085B2/en
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Abstract

本公开提供一种显示器件及其制作方法，所述显示器件包括电路基材、多个发光元件及一封装材料。所述电路基材包括第一表面、与所述第一表面相对的第二表面以及贯穿所述第一表面和第二表面的多个通槽，所述多个通槽呈阶梯形，且将所述电路基材分割成芯片安装区、第一正极、第二正极、第三正极及公共阴极。所述多个发光元件包括沿直线依次安装于所述电路基材的第一发光元件、第二发光元件及第三发光元件，且分别与所述第一正极、第二正极及第三正极通过各焊线电性连接。所述封装材料包覆所述电路基材、所述多个发光元件及所述各焊线。所述显示器件在实现小尺寸的同时，还具有优良性能。

Description

显示器件及其制作方法
技术领域
本公开涉及显示技术领域，尤其涉及一种显示器件及其制作方法。
背景技术
随着显示技术的发展，人们对显示屏的显示效果具有更高的追求，对LED器件也提出了尺寸更小、色彩度更优的要求。然而，现有技术中的CHIP型器件的产品小型化具有较大阻力，一方面是由于CHIP型器件是在一大张BT板上先模压成型，然后用切割机切割成单颗器件，当切割尺寸越小的时候，器件的焊点离产品边缘越近，很容易影响到焊接性能；另一方面是工序中需要预留较多切割的空间，从而减少了固晶、焊线的空间，难以实现产品的小型化。
发明内容
本公开的实施例提供一种显示器件及其制作方法，在实现显示器件小尺寸的同时，还保证了显示器件具有优良的性能。
一方面，本公开实施例提供了一种显示器件，包括电路基材、多个发光元件及一封装材料。所述电路基材包括第一表面、与所述第一表面相对的第二表面以及贯穿所述第一表面和第二表面的多个通槽，所述多个通槽呈阶梯形，且将所述电路基材分割成多个区域，所述多个区域包括芯片安装区、第一正极、第二正极、第三正极及公共阴极。所述多个发光元件包括沿直线依次安装于所述芯片安装区的第一发光元件、第二发光元件及第三发光元件，所述第一发光元件、第二发光元件及第三发光元件分别与所述第一正极、第二正极及第三正极通过各焊线电性连接。所述封装材料包覆所述电路基材、所述多个发光元件及所述各焊线。
在一个实施例中，所述多个通槽暴露在第一表面的开口尺寸大于暴露在第二表面的开口尺寸。
在一个实施例中，所述第一发光元件、第二发光元件及第三发光元件安装于所述第二表面。
在一个实施例中，所述第一发光元件、第二发光元件及第三发光元件分别为红光LED、绿光LED及蓝光LED。
在一个实施例中，所述多个通槽均具有位于第一表面和第二表面之间的台阶面，所述台阶面平行于所述第一表面和第二表面，所述台阶面与第一表面的间距小于 0.05mm，所述第一表面和第二表面的间距小于0.15mm。
在一个实施例中，所述显示器件的长度为0.5mm-0.7mm，宽度为0.5mm-0.7mm，高度为0.5mm-0.6mm。
在一个实施例中，所述芯片安装区与公共阴极相连接。
在一个实施例中，所述第一正极和公共阴极位于所述芯片安装区的一侧，所述第二正极和第三正极位于所述芯片安装区的另一侧。
在一个实施例中，所述封装材料包括树脂基材和掺杂在所述树脂基材中的多个纳米级亚光颗粒。
另一方面，本公开实施例提供了一种如上所述的显示器件的制作方法，包括步骤：
提供导电基材；
蚀刻所述导电基材以形成导电电路，并裁切所述导电基材以获得导电支架，所述导电支架包括多个互相连接的电路基材，每个所述电路基材均包括第一表面、与所述第一表面相对的第二表面以及贯穿所述第一表面和第二表面的多个通槽，所述多个通槽呈阶梯形，所述多个通槽暴露在第一表面的开口尺寸大于暴露在第二表面的开口尺寸，所述多个通槽将所述电路基材分割成多个区域，所述多个区域包括芯片安装区、第一正极、第二正极、第三正极及公共阴极；
在所述第一表面贴覆防渗漏胶带；
在所述第二表面的芯片安装区安装多个发光元件，所述多个发光元件包括沿直线依次排列的第一发光元件、第二发光元件及第三发光元件，且分别与所述第一正极、第二正极及第三正极通过各焊线电性连接；
通过模压机使得封装材料包覆每个所述电路基材、所述多个发光元件及所述各焊线，所述封装材料包括树脂基材和多个纳米级亚光颗粒；
冲裁所述导电支架以分离所述多个电路基材；及
去除所述防渗漏胶带。
上述技术方案中的显示器件或者制造的显示器件在实现小尺寸的同时，还具有良好的性能，例如具有如下优点或有益效果：
第一，通槽为具有台阶面的阶梯槽结构，阶梯槽结构具有三个好处：一是加长了湿气渗入的路径，提高了器件的防湿气能力；二是加大了底部焊盘之间的距离，防止出现连锡短路现象；三是加大了功能区固晶、焊线的作业面积，有助于控制器件的封装品质。
第二，多个发光元件呈直线排列，在配光时有更好匹配性，从而改善了先前技术中发光元件呈“品”字形排列的缺点，保障了在左、右侧观看显示屏时不会出现颜色不一致的现象。
第三，共阴极的设计与共阳极的设计相比更加节能，经实验对比可以节能30％。
第四，电路基材直接沉底，减小了热量的传导路径，大幅提高了显示器件的散热能力。
第五，封装材料中掺杂了纳米级亚光粉，如此具有两个好处：一是当外界的光线入射时，显示器件也不会反射入射光，有效提高了显示屏的对比度；二是纳米级亚光粉可以提高封装材料与电路基材的密着度，还可以提高显示器件的防湿性能。
第六，相对于先前技术来说，本公开的显示器件具有相对简单的材料组成，减少了不同材料之间的应力影响，有助于提升产品品质。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开第一实施例提供的显示器件的结构示意图；
图2为本公开第一实施例提供的显示器件的剖视结构示意图；
图3为本公开第一实施例提供的显示器件的导电基材的第二表面的示意图；
图4为本公开第一实施例提供的显示器件的导电基材的第一表面的示意图；
图5为本公开第二实施例提供的显示器件的制作方法的流程示意图；
图6为本公开第二实施例提供的导电基材的剖视结构示意图；
图7为本公开第二实施例提供的导电支架的平面结构示意图；
图8为本公开第二实施例提供的在电路基材的第一表面贴覆防渗透胶带的剖视结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
第一实施例
如图1-4所示，本公开第一实施例提供一种显示器件1，包括电路基材10、多个发光元件20及封装材料30。
所述电路基材10包括第一表面101、与所述第一表面101相对的第二表面102以及贯穿所述第一表面101和第二表面102的多个通槽100。所述多个通槽100暴露在第一表面101的开口尺寸大于暴露在第二表面102的开口尺寸。具体地，所述多个通槽100呈阶梯形，即为阶梯槽，具有位于第一表面101和第二表面102之间的台阶面 103(在图3中，特别将台阶面103以斜线表示出)，所述台阶面103平行于所述第一表面101和第二表面102。所述台阶面103与第一表面101的间距小于0.05mm，例如可以为0.043mm。所述第一表面101和第二表面102的间距小于0.15mm，即电路基材 10的厚度小于0.15mm，例如可以为0.127mm。所述电路基材10可以呈长方形，其长、宽为0.5mm-0.7mm，例如为0.6mm。
所述多个通槽100将所述电路基材10分割成多个区域，所述多个区域包括芯片安装区11、第一正极12、第二正极13、第三正极14及公共阴极15。所述芯片安装区11位于电路基材10中部，且于公共阴极15相连接。所述第一正极12和公共阴极15 位于所述芯片安装区11的一侧，所述第二正极13和第三正极14位于所述芯片安装区 11的另一侧。即，第一正极12和第二正极13位于芯片安装区11的相对两侧，第三正极14和公共阴极15也位于芯片安装区11的相对两侧。所述第一正极12、第二正极13及第三正极14的尺寸可以相同。所述第一正极12和第二正极13的间距一般大于两倍的第一正极12的宽度，也大于两倍的第一正极12的长度。例如，在第一正极 12的尺寸为0.12mm*0.17mm时，所述第一正极12和第二正极13的间距可以大于 0.34mm，例如为0.36mm。所述第一正极12和公共阴极15的间距一般大于第一正极 12的长度，而小于两倍的第一正极12的宽度。例如，在第一正极12的尺寸为 0.12mm*0.17mm时，第一正极12和公共阴极15的间距可以为0.22mm。以上数据仅仅是生产设计中的一个举例而已，在具体生产制造时可根据具体情况具体设计产品尺寸。
所述多个发光元件20包括沿直线依次排列的第一发光元件21、第二发光元件22及第三发光元件23，所述第一发光元件21、第二发光元件22及第三发光元件23均安装于所述芯片安装区11，位于所述第二表面102，且分别与所述第一正极12、第二正极13及第三正极14通过各焊线25电性连接。所述第一发光元件21、第二发光元件 22及第三发光元件23例如分别为红光LED、绿光LED及蓝光LED。当然，可以理解的是，所述绿光LED、蓝光LED还与所述公共阴极15也通过焊线25连接，所述红光 LED也与公共阴极15电性连接，电性连接方式不限，例如可通过引脚连接。所述焊线25例如为金线。
所述封装材料30包覆所述电路基材10、安装在所述电路基材10上的所述多个发光元件20及所述各焊线25。所述封装材料30为混合材料，包括树脂基材和均匀缠在在树脂基材中的多个纳米级亚光颗粒。所述树脂基材例如为环氧树脂、硅树脂等，所述纳米级亚光颗粒可以为透光率小于95％的绝缘颗粒，由于纳米级颗粒与树脂基材之间具有充分的界面从而可以增加入射光线的路径，降低混合材料的反射率。所述混合材料的反射率例如小于20％。所述封装材料30的高度小于0.45mm，例如为0.4mm。
所述显示器件1整体尺寸较小，其长度为0.5mm-0.7mm，宽度为0.5mm-0.7mm，高度为0.5mm-0.6mm。例如，显示器件1的尺寸为0.6mm*0.6mm*0.527mm。
本公开的显示器件1具有如下优点：
第一，通槽100为具有台阶面103的阶梯槽结构，阶梯槽结构具有三个好处：一是加长了湿气渗入的路径，提高了器件的防湿气能力；二是加大了底部焊盘之间的距离，防止出现连锡短路现象；三是加大了功能区固晶、焊线的作业面积，有助于控制器件的封装品质。
第二，多个发光元件20呈直线排列，在配光时有更好匹配性，从而改善了先前技术中发光元件呈“品”字形排列的缺点，保障了在左、右侧观看显示屏时不会出现颜色不一致的现象。
第三，共阴极的设计与共阳极的设计相比更加节能，经实验对比可以节能30％。
第四，电路基材10直接沉底，减小了热量的传导路径，大幅提高了显示器件1的散热能力。
第五，封装材料30中掺杂了纳米级亚光粉，如此具有两个好处：一是当外界的光线入射时，显示器件1也不会反射入射光，有效提高了显示屏的对比度；二是纳米级亚光粉可以提高封装材料30与电路基材的密着度，还可以提高显示器件1的防湿性能。
第六，显示器件1相对于先前技术来说，具有相对简单的材料组成，减少了不同材料之间的应力影响，有助于提升产品品质。
如上所述，本公开的显示器件1在实现小尺寸的同时，还结构简单、性能优异。
第二实施例
请参阅5-8，本公开第二实施例提供如图1-4所示的显示器件1的制作方法，包括如下步骤。
S1，提供导电基材40，例如铜箔。
S2，蚀刻所述导电基材40形成导电电路，并裁切所述导电基材40以形成导电支架50，所述导电支架50包括多个相互连接的电路基材10。可以理解，所述导电支架 50的尺寸小于导电基材40的尺寸，例如导电支架50的尺寸为140mm*70mm。每个所述电路基材10的结构如前所述，此处不再赘述。
S3，在每个所述电路基材10的第一表面101贴覆防渗漏胶带60。
S4，在每个所述电路基材10的第二表面102的芯片安装区11安装多个发光元件20，所述多个发光元件20包括沿直线依次排列的第一发光元件21、第二发光元件22 及第三发光元件23，各发光元件分别与各正极通过各焊线25电性连接。
S5，通过模压机使得封装材料30包覆每个所述电路基材10、安装在所述电路基材10上的多个发光元件20及所述各焊线25。所述封装材料30包括树脂基材和纳米级亚光颗粒。
S6，冲裁所述导电支架50以分离所述多个电路基材10，从而获得各单颗器件。
S7，去除每颗器件所贴覆的所述防渗漏胶带60，获得显示器件产品。
获得的显示器件产品的优点如前所述，不但结构简单，而且性能优异，防湿、防短路、防反射。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (6)

1.一种显示器件，其特征在于，包括：
电路基材，所述电路基材包括第一表面、与所述第一表面相对的第二表面以及贯穿所述第一表面和第二表面的多个呈阶梯形的通槽，所述多个通槽将所述电路基材分割成芯片安装区、第一正极、第二正极、第三正极及公共阴极；
多个发光元件，所述多个发光元件包括沿直线依次安装于所述芯片安装区的第一发光元件、第二发光元件及第三发光元件，所述第一发光元件、第二发光元件及第三发光元件分别与所述第一正极、第二正极及第三正极通过各焊线电性连接；及
封装材料，所述封装材料包覆所述电路基材、所述多个发光元件及所述各焊线；
其中，所述芯片安装区与所述公共阴极相连接，所述第一正极和所述公共阴极位于所述芯片安装区的一侧，所述第二正极和第三正极位于所述芯片安装区的另一侧，所述多个通槽均具有位于第一表面和第二表面之间的台阶面，所述第一正极、所述公共阴极以及所述芯片安装区两两之间设置有所述通槽，所述第二正极、所述第三正极以及所述芯片安装区两两之间设置有所述通槽；
其中，所述封装材料包括树脂基材和掺杂在所述树脂基材中的多个纳米级亚光颗粒；
其中，所述第一正极、所述第二正极以及所述第三正极中的每一个的在垂直于所述电路基材的厚度方向的第一方向上且远离所述芯片安装区的三个侧面具有所述台阶面；
其中，所述多个通槽暴露在第一表面的开口尺寸大于暴露在第二表面的开口尺寸，所述芯片安装区、所述第一正极、所述第二正极和所述第三正极中的每一个在所述第一表面上的底部设置有焊盘，所述第一正极、所述第二正极和所述第三正极各自的所述焊盘的连续三个侧面处具有所述台阶面。
2.根据权利要求1所述的显示器件，其特征在于，所述第一发光元件、第二发光元件及第三发光元件安装于所述第二表面。
3.根据权利要求2所述的显示器件，其特征在于，所述第一发光元件、第二发光元件及第三发光元件分别为红光LED、绿光LED及蓝光LED。
4.根据权利要求1所述的显示器件，其特征在于，所述台阶面平行于所述第一表面和第二表面，所述台阶面与第一表面的间距小于0.05mm，所述第一表面和第二表面的间距小于0.15mm。
5.根据权利要求1所述的显示器件，其特征在于，所述显示器件的长度为0.5mm-0.7mm，宽度为0.5mm-0.7mm，高度为0.5mm-0.6mm，所述第一正极与第二正极的间距大于两倍的第一正极的长度，所述第一正极与公共阴极的间距大于第一正极的长度且小于两倍的第一正极的宽度。
6.根据权利要求1所述的显示器件的制作方法，其特征在于，包括步骤：
提供导电基材；
蚀刻所述导电基材以形成导电电路，并裁切所述导电基材以获得导电支架，所述导电支架包括多个互相连接的电路基材，每个所述电路基材均包括第一表面、与所述第一表面相对的第二表面以及贯穿所述第一表面和第二表面的多个阶梯形的通槽，所述多个通槽暴露在第一表面的开口尺寸大于暴露在第二表面的开口尺寸，所述多个通槽将所述电路基材分割成芯片安装区、第一正极、第二正极、第三正极及公共阴极；
在所述第一表面贴覆防渗漏胶带；
在所述第二表面的芯片安装区安装多个发光元件，所述多个发光元件包括沿直线依次排列的第一发光元件、第二发光元件及第三发光元件，且分别与所述第一正极、第二正极及第三正极通过各焊线电性连接；
以封装材料包覆每个所述电路基材、所述多个发光元件及所述各焊线，所述封装材料包括树脂基材和均匀掺杂在树脂基材中的多个纳米级亚光颗粒；
冲裁所述导电支架以分离所述多个电路基材；及
去除所述防渗漏胶带；
其中，所述芯片安装区与所述公共阴极相连接，所述第一正极和所述公共阴极位于所述芯片安装区的一侧，所述第二正极和第三正极位于所述芯片安装区的另一侧，所述多个通槽均具有位于第一表面和第二表面之间的台阶面，所述第一正极、所述公共阴极以及所述芯片安装区两两之间设置有所述通槽，所述第二正极、所述第三正极以及所述芯片安装区两两之间设置有所述通槽；
其中，所述第一正极、所述第二正极以及所述第三正极中的每一个的在垂直于所述电路基材的厚度方向的第一方向上且远离所述芯片安装区的三个侧面具有所述台阶面；
其中，所述多个通槽暴露在第一表面的开口尺寸大于暴露在第二表面的开口尺寸，所述芯片安装区、所述第一正极、所述第二正极和所述第三正极中的每一个在所述第一表面上的底部设置有焊盘，所述第一正极、所述第二正极和所述第三正极各自的所述焊盘的连续三个侧面处具有所述台阶面。
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