CN110112090A - The method that unified micro-led component is orientated and the flood tide transfer method using it - Google Patents
The method that unified micro-led component is orientated and the flood tide transfer method using it Download PDFInfo
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- CN110112090A CN110112090A CN201910195872.0A CN201910195872A CN110112090A CN 110112090 A CN110112090 A CN 110112090A CN 201910195872 A CN201910195872 A CN 201910195872A CN 110112090 A CN110112090 A CN 110112090A
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- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000012546 transfer Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 31
- 239000007864 aqueous solution Substances 0.000 claims abstract description 21
- 230000009182 swimming Effects 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 79
- 230000001681 protective effect Effects 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000009514 concussion Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- RCEAADKTGXTDOA-UHFFFAOYSA-N OS(O)(=O)=O.CCCCCCCCCCCC[Na] Chemical compound OS(O)(=O)=O.CCCCCCCCCCCC[Na] RCEAADKTGXTDOA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 description 11
- 239000010980 sapphire Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229960000935 dehydrated alcohol Drugs 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of methods of the orientation of the micro-led component of unification, carry out hydrophilic treated or hydrophobic treatment including the substrate surface to each in multiple micro-led components；Each micro-led component after treatment is placed into aqueous solution, and aqueous solution is applied and is shaken, so that swimming in the substrate surface of each micro-led component on aqueous solution surface all upward or lower section.The present invention simultaneously discloses a kind of micro-led flood tide transfer method, wherein applying the method for unifying the orientation of micro-led component as described above.The present invention realizes quick unified orientation of the micro-led component in aqueous solution, and then each micro-led component after unified orientation as above quickly and accurately can be navigated to circuit substrate via reprinting mold, realize micro-led efficient, high-precision, rate of good quality rate and low cost reprinting.
Description
Technical field
The present invention relates to solid luminescent display field, the side of especially a kind of micro-led component orientation of unification
The flood tide transfer method of method and the microdiode using it.
Background technique
Light emitting diode is a kind of semiconductor components and devices that electric energy can be converted into specific wavelength electromagnetic wave, at present
It is widely used in the fields such as illumination, display.And it is micro-led refer to the light emitting diode of size in the micron-scale, it be by
Traditional LED structure carries out microminiaturization and matrixing, has many advantages, such as that self-luminous, structure are simple, small in size and energy saving, is differentiating
The various indexs such as rate, service life, contrast and energy consumption are all better than existing LCD and OLED technology.How will be ten hundreds of
Micro LED chip be transferred to and realized on drive circuit board each pixel addressing is controlled and is operated alone and becomes
The core technology problem that Micro LED faces in industrialization process.This is because the size of Micro LED is substantially all
Less than 50 μm, so traditional vacsorb branch mode is no longer applicable in, and flood tide transfer requires very high transfer yield
(~ 99.9999%) and accuracy (accuracy of single chip is within positive and negative 0.5 μm) so that flood tide transfer techniques at
In order to which current Micro LED realizes the roadblock of industrialization.
Summary of the invention
Based on micro-led component the flood tide transfer process the problem of, the present invention is in the first aspect
Propose a kind of method of the orientation of micro-led component of unification characterized by comprising
Hydrophilic treated or hydrophobic treatment are carried out to the substrate surface of each in multiple micro-led components；
Each micro-led component after the hydrophilic treated or hydrophobic treatment is placed into solution,
And concussion is added to the solution, so that swim in each micro-led component on the aqueous solution surface
The substrate surface is all upward or lower section；The solution is aqueous solution or oily solution.
The invention also provides a kind of methods of the orientation of the micro-led component of unification, which is characterized in that packet
It includes:
Hydrophilic treated or hydrophobic treatment are carried out to the electrode side surface of each in multiple micro-led components；
Each micro-led component after the hydrophilic treated or hydrophobic treatment is placed into solution,
And the solution is applied and is shaken, so that swimming in each micro-led component on the aqueous solution surface
The electrode side surface all upward or lower section；The solution is aqueous solution or oily solution.
Preferably, aqueous solution is deionized water, alcohol, oily solution is carbon tetrachloride.
The present invention proposes a kind of micro-led flood tide transfer method in the second aspect, wherein applying as above
The method of the orientation of the micro-led component of the unification.
In a preferred embodiment, the micro-led flood tide transfer method, being used for will be multiple miniature
Light emitting diode component is transferred on circuit substrate, and micro-led second gust is formed on the circuit substrate
Column, which comprises the following steps:
S1, micro-led first array of production, the electrode side surface of each micro-led component therein
With the contact of the first p-type and the contact of the first N-type；
S2, protective film is set on the electrode side surface；
S3, first solution of the configuration containing silicone couplet or fluorine silicone couplet, then by described micro-led first gust
Column are put into first solution, carry out hydrophobic treatment with the substrate side surface to micro-led component；
S4, to complete step S3 micro-led first array, remove the protective film, then cut, to obtain
Obtain each micro-led component；
S5, production have the reprinting mold of multiple holes, the arrangement of described hole and the micro-led second array
Unanimously；
S6, the reprinting mold is placed on the circuit substrate by alignment, the exposure of each described hole can be passed through
The contact of the first p-type and the contact of the first N-type for being electrically connected each micro-led component on the circuit substrate
Multiple second p-types contact and the second N-type contact；
With orientation of the reprinting mold above the circuit substrate, will be put with the circuit substrate for reprinting mold
It sets in the container for accommodating the second solution；And each micro-led component is put into second solution, it is right
Second solution applies concussion；Second solution is the aqueous solution；
S7, distance of the liquid level of second solution relative to the reprinting mold is controlled, so that described each miniature luminous two
Pole pipe component enters in each hole for reprinting mold；
By with each micro-led component the reprinting mold and the circuit substrate from described second
It is taken out in solution.
Optionally, the micro-led flood tide transfer method is used for multiple micro-led first devices
Part is transferred on circuit substrate, and micro-led second array is formed on the circuit substrate, which is characterized in that packet
Include following steps:
S1, micro-led first array of production, the electrode side surface of each micro-led component therein
With the contact of the first p-type and the contact of the first N-type；
S2, protective film is set on the electrode side surface；
S3, first solution of the configuration containing polyethylene glycol, polyvinyl alcohol, n-vinyl pyrrolidone or lauryl sodium sulfate,
Then micro-led first array is put into first solution, to micro-led component
Substrate side surface carries out hydrophilic treated；
S4, to complete step S3 micro-led first array, remove the protective film, then cut, to obtain
Obtain each micro-led component；
S5, production have the reprinting mold of multiple recessed portions, the arrangement of the recessed portion and described micro-led second
Array mirror image is symmetrically consistent；
The reprinting mold is placed into the container for accommodating the second solution by S6, the orientation with the recessed portion upward；
And each micro-led component is put into second solution, second solution is applied and is shaken；Described
Two solution are the aqueous solution；
S7, distance of the liquid level of second solution relative to the reprinting mold is controlled, so that described each miniature luminous two
Pole pipe component enters in each recessed portion for reprinting mold；
The reprinting mold with each micro-led component is taken out from second solution, and will
The circuit substrate is placed on the reprinting mold by alignment, so that each micro-led component first
P-type contact and the contact of the first N-type are contacted with each second p-type in the drive circuit substrate and the contact of the second N-type is right respectively
It is quasi-；
Remove the reprinting mold.
Further, the micro-led flood tide transfer method comprising:
The micro-led component of multiple transmitting feux rouges is transferred on circuit substrate, and the shape on the circuit substrate
At the micro-led second array of transmitting feux rouges；Wherein, mold is reprinted using first, for the multiple micro- of transmitting feux rouges
Type light emitting diode component executes step S1-S7, wherein described first reprints arrangement and the institute of multiple recessed portions on mold
It is with stating the micro-led second array mirror symmetry for emitting feux rouges on circuit substrate consistent；
The micro-led component of multiple transmitting green lights is transferred on the circuit substrate, and in the circuit substrate
The upper micro-led second array for forming transmitting green light；Wherein, mold is reprinted using second, for the more of transmitting green light
A micro-led component executes step S1-S7, wherein described second reprints the arrangement of multiple recessed portions on mold
It is with the micro-led second array mirror symmetry of transmitting green light on the circuit substrate consistent；And
The micro-led component of multiple transmitting blue lights is transferred on the circuit substrate, and in the circuit substrate
The upper micro-led second array for forming transmitting feux rouges；Wherein, mold is reprinted using third, for the more of transmitting blue light
A micro-led component executes step S1-S7, wherein the third reprints the arrangement of multiple recessed portions on mold
It is with the micro-led second array mirror symmetry of transmitting blue light on the circuit substrate consistent.
Further, in the step S7, the circuit substrate is being placed on the reprinting mold by alignment
Before, conducting resinl is coated in the contact of each second p-type and the contact of the second N-type on circuit substrate, or described each micro-
Conducting resinl is coated in the contact of type light emitting diode the first p-type of component and the contact of the first N-type.
Further, the micro-led flood tide transfer method further includes step S8, for filled with each
The circuit substrate of a micro-led component, using heating bonding pattern, so that each described miniature luminous two
The first p-type contact of pole pipe component and the first N-type are contacted to be contacted and the with each second p-type in the drive circuit substrate
Two N-types contact electrical connection, so that each described micro-led acquisition addressing is controlled and is operated alone.
Preferably, the first N-type side of making contact to annular of the micro-led component, the contact setting of the first p-type
In the centre of side's annular；Or
The first p-type side of making contact to annular of the micro-led component, the first N-type contact setting is in side's annular
Centre.
Preferably, described micro-led also comprising superlattice structure and electron barrier layer structure, the former purpose
It is the quality for improving luminescent quantum trap, the latter is that electronics is stopped to enter p type island region.
Preferably, the protective film is common photoresist, the preferable high molecular material of stability etc..
Further, in the step S4, the protection is removed in the way of acetone soln or RIE oxygen aura
Film.
Preferably, second solution is alcohol or deionized water.
Preferably, first solution includes lauryl sodium sulfate.
Preferably, the plan view shape of the micro-led component is square or rectangle.
Further, the container is placed on the insulated platform that can be shaken, by the insulated platform shaken to
Second solution applies concussion.
Preferably, the substrate of the micro-led component be Sapphire Substrate, silicon-based substrate, SiC substrate,
One of GaN substrate.
Preferably, hydrophobic or hydrophilic processing is carried out to the substrate surface by the method for chemistry or physics,
Described in the method for physics include that hydrophilic or hydrophobic processing is directly carried out to the substrate surface with physical means such as laser.
The invention proposes a kind of methods for fast implementing unified micro-led component orientation, and application should
The micro-led flood tide transfer method of method, using the method for chemistry or physics to micro-led component
Substrate surface carry out hydrophobic perhaps hydrophilic processing to realize that micro-led component can be aqueous or oily
Property solvent in realize quickly unified orientation, have many advantages, such as that simple process, at low cost, high-efficient and accuracy are high.
Detailed description of the invention
Design of the invention, feature and effect are done further specifically below in conjunction with the drawings and specific embodiments
It is bright:
Fig. 1 is a micro-led component array of the invention；
Fig. 2 is single micro-led component schematic diagram of the invention；
Fig. 3 be a micro-led component array of the invention surface on coat layer protecting film；
Fig. 4 is that a micro-led component array of the invention is immersed in silane coupler solution and carries out hydrophobic place
Reason；
Fig. 5 is a porous reprinting mold and circuit substrate of the invention；
Fig. 6 is second solution for being used to that micro-led component to be made to unify orientations of the invention and can shake
Insulated platform；
Fig. 7 is the one of the invention substrate that micro-led component is removed using laser lift-off technique；
Fig. 8 is another second solution for being used to that micro-led component to be made to unify orientations of the invention and can shake
The insulated platform swung；
Fig. 9 is to complete micro-led component by the second solution shown in Fig. 8 and the insulated platform that can be shaken to arrive it
On transfer after reprinting mold and circuit substrate.
Specific embodiment
Below in conjunction with attached drawing is illustrated, concrete technology method, parameter and principle are described in detail and are illustrated, with
Just design and feature of the invention are better understood on.The present invention can be able to body by many various forms of embodiments
Existing, protection scope of the present invention is not limited only to the embodiment mentioned in text.It is to be herein pointed out in order to enable illustrating more
Clearly, it is more convenient for understanding, some places suitably exaggerate parameters of operating part in attached drawing.
The micro-led flood tide transfer method of one kind proposed by the invention, comprising the following steps:
(1) micro-led first array is made
As shown in Figure 1, having the micro-led component that p-type and N-type contact by the production of the techniques such as photoetching, removing
Array, i.e., micro-led first array take the form of a piece of generally rectangular chip (referring to Fig. 1,4).
In this example, P/N type contact (i.e. electrode) preparation the same side (p-type end, i.e., it is shown in Fig. 2 single miniature to shine
The top of diode component) because prepare N-type contact when need to etch into N-type layer, it is therefore preferable that method be by
N-type contact is made in surrounding and p-type contacts then in centre.In order to contacted with the P/N on circuit substrate later (referring to Fig. 5,6) into
Row is distinguished, and the P/N contact on each micro-led component is known as the first P/N contact in the present embodiment, and will be electric
P/N contact on base board is known as the 2nd P/N contact.
In other embodiments of the invention, the P/N electrode (i.e. P/N type contacts) of micro-led component can also
Opposite flank or the opposing end surface of vertical structure is arranged in.
Structural schematic diagram such as Fig. 2 institute of single LED device in above-mentioned micro-led first array
Show, entire device includes Sapphire Substrate, N-type layer, multiple quantum well layer MQW, P-type layer, is also answered in addition to improving device performance
Superlattice structure is added on N-type layer and the structures such as electronic barrier layer are added below in P-type layer.
It should be noted that this is the array for making each micro-led component, specific arrangement can be with
The micro-led array for actual use of realization of goal of the present invention is same or different.In order to distinguish two battle arrays
Column, will be herein the array of each micro-led component is made to be known as micro-led first array, and incite somebody to action
It is known as micro-led second array for the micro-led array of actual use.
(2) protective film is coated
Next, above-mentioned micro-led first array with electrode surface (electrode side surface, i.e., it is shown in Fig. 2
The surface of micro-led first array where the top surface of single micro-led component) on coat one layer
Protective film, as described in Figure 3.Common photoresist can be used as protective film, fall off as long as the protective film does not dissolve in the solution,
And do not react with silane coupling agent, purpose be exactly protection with the first P/N type contact electrode one side, thus with
Only to the surface of Sapphire Substrate (where the bottom surface of single micro-led component i.e. shown in Fig. 2 in lower step
Micro-led first array surface) do hydrophobic treatment.
(3) micro-led first array hydrophobic treatment
Next, the solution containing silicone couplet or fluorine silicone couplet is prepared, it then will be by the micro- of above-mentioned coating protective film
Type light emitting diode matrix, which is put into the solution, carries out hydrophobic place to substrate terminal (substrate side surface, the i.e. surface of Sapphire Substrate)
Reason.
It should be noted that is handled herein is micro-led first array, not yet obtained by scribing each
Single micro-led component.Therefore, it after scribing steps later, obtains each single micro-led
Component, the side surface as shown in Figure 2 of these components are in fact not by hydrophobic treatment.But due to miniature light-emitting diodes
Pipe component is relatively thin structure, and for its top surface and bottom surface, side surface can be ignored.Therefore, it is not dredged
The side surface of water process has no effect on the implementation of technical solution of the present invention.
Specifically, it is configured to the first solution as shown in figure 4, silane coupling agent is dissolved in n-hexane solvent first, then
The Sapphire Substrate end of micro-led first array is immersed carry out hydrophobic treatment upward, wherein can be with machine
Tool is stirred to improve the uniformity of hydrophobic treatment.
Other solution also can be used in other embodiments of the invention, hydrophilic treated is carried out to above-mentioned bottom surface, this
What the technical staff in field can operate about hydrophobic treatment and the subsequent reprinting in the second solution according to the present embodiment
Related content will be readily understood that hydrophilic treated and its subsequent reprinting operation.Therefore, herein not to hydrophilic treated and its subsequent
Operation is reprinted to be described.
Alternatively, it is also possible to handle the Sapphire Substrate of micro-led first array using laser, plasma etc.
Surface equally can also obtain preferable hydrophobic (or hydrophilic) treatment effect.
(4) cutting of micro-led first array
After completing hydrophobic treatment, using the techniques such as organic solvent or oxygen aura to micro-led first array into
Row processing, to remove protective film.Then (i.e. scribing) is cut to the first array of light emitting diode, is obtained of the invention single
Micro-led component, be square or cuboid.Such component is highly convenient for miniature by cutting
The first array of light emitting diode obtains.
(5) mold is designed and produced
On the other hand, as shown in figure 5, production has the mold of pores array, pores array will be with micro-led second
Array pattern matches, wherein single hole size is more slightly larger than single micro-led component, so that rear
When continuing additional concussion, the micro-led component being collectively aligned can be smoothly and accurately by hole and circuit
Substrate is connected, to realize that the addressing to each micro-led component is controlled and is operated alone.
Here it is worth noting that being disposed with multiple 2nd P/N type contacts above circuit substrate, it is used for and each miniature hair
First P/N type of optical diode contacts electrical connection, therefore each 2nd P/N type contact pattern and single micro-led member
The first P/N type contact of device is consistent.Mold is used in the present invention, by the hole on mold to each miniature luminous two
Pole pipe device is positioned, and is obtained between circuit substrate and each micro-led component more preferably precisely in order to enabling
Electrical connection.
In another embodiment of the present invention, the circuit base that then mold with pores array is contacted with P/N type
Plate can also form combination, for example, mold and circuit substrate are combined together as similar to Figure 6.
(6) reprinting of micro-led component
Then the insulated platform that production one can shake, by foregoing circuit substrate and multiple micro-led components
Micro LED is put into the second solution, as shown in Figure 6.Second solution is aqueous solution, such as deionized water, dehydrated alcohol etc.,
At this moment the hydrophobic surface (Sapphire Substrate end) of each micro-led component can be unified upward under the action of earthquake, and
One end with the first P/N contact is then downward；Then height of water level is controlled, reduces it gradually, and is made under the action of earthquake
Each micro-led component fall into the hole of mold so that each micro-led component with
Corresponding driving circuit position corresponds on circuit substrate, is achieved in and disposably makes a large amount of micro-led members
Device is located on circuit substrate；Finally, positioning can be rejected not by optical check (passing through human eye or machine automatic identification)
Perfect micro-led component and micro-led component is put in unfilled empty place benefit.
Then using heating bonding pattern, so that the first P/N contact of each micro-led component and circuit
2nd P/N of substrate contacts electrical connection, so that each micro-led component obtains addressing control and individually
Driving.
For the embodiment for needing to remove on mold, mold can be removed, to next time after completing above-mentioned heating bonding
It uses；For not needing the mold removed, i.e., the previously mentioned mold that combination is formed with circuit substrate does not need it then
It removes.
In addition, being made a brief description here to the case where micro-led component using hydrophilic treated, these yuan
Orientation of the device in the second solution is that sapphire substrate surface is downward, as shown in Figure 8, it is therefore desirable to have recess using surface
Portion rather than the mold of hole above-mentioned, so as to by each micro-led component support in a mold；By shaking
After swinging and reducing the operation of liquid level, so that a large amount of miniature Light-Emitting Diode components enter the recessed portion of mold, by optics
After detection and trapping operation, circuit substrate is covered by alignment each micro-led component in a mold it
On, referring to Fig. 9, contact each 2nd P/N contact thereon with each first P/N of each micro-led component
It is aligned one by one, and after heating bonding, removes mold.
Preferably, before circuit substrate be placed by alignment reprinting on mold, on circuit substrate each the
Conducting resinl is coated in the contact of two p-types and the contact of the second N-type, or is contacted in each micro-led the first p-type of component
Conducting resinl is coated in the contact of the first N-type.Alternatively, it is also possible to not use conducting resinl, and pass through the low temperature of AuSi wafer bonding etc.
Bonding pattern realizes the electrical connection between above-mentioned electrode.
(7) removal of growth substrates
Finally, removing the growth substrates (i.e. Sapphire Substrate) of light emitting diode, as shown in Figure 7 using laser lift-off technique.Its
Middle laser is often used KrF molecular laser, and wavelength is 248 nm, and pulse is 25 ns, and intensity is 600 mJ/cm2, hot spot is big
Small is 1.2 × 1.2 mm2.When laser enters sapphire and the interface GaN from sapphire, can make GaN be decomposed into Ga and
N2, to realize the removing of substrate, the techniques such as then it is packaged.
Furthermore, it is contemplated that micro-led component has RGB(red, green, blue) three kinds of colors, it can be in three times
Process is transferred to different types of micro-led component on driving circuit.Specific steps are as follows: preparing filling the
When a type of micro-led, first the position of other two types light emitting diodes is covered, is then carried out
The fill process in face, prepare to insert second type it is micro-led when be also it is the same, other two types
The position of type covers, and the LED device of three types is transferred on driving circuit according to the method.
Furthermore it is possible to which there is recess using three by the above-mentioned micro-led component using hydrophilic treated
The micro-led component of transmitting feux rouges, green light, blue light is transferred on circuit substrate by the reprinting mold in portion respectively,
In particular:
1, the micro-led component of multiple transmitting feux rouges is transferred on circuit substrate, and is formed on circuit substrate
Emit the micro-led second array of feux rouges.Wherein, mold is reprinted using first, for the multiple miniature of transmitting feux rouges
Light emitting diode component, execute abovementioned steps, wherein used in first reprint mold on multiple recessed portions arrangement with
It is with emitting the micro-led second array mirror symmetry of feux rouges on circuit substrate consistent；
2, the micro-led component of multiple transmitting green lights is transferred on circuit substrate, and is formed on circuit substrate
Emit the micro-led second array of green light.Wherein, mold is reprinted using second, for the multiple miniature of transmitting green light
Light emitting diode component, execute abovementioned steps, wherein used in second reprint mold on multiple recessed portions arrangement with
It is with emitting the micro-led second array mirror symmetry of green light on circuit substrate consistent；And
3, the micro-led component of multiple transmitting blue lights is transferred on circuit substrate, and is formed on circuit substrate
Emit the micro-led second array of feux rouges.Wherein, mold is reprinted using third, for the multiple miniature of transmitting blue light
Light emitting diode component, execute abovementioned steps, wherein used in third reprint mold on multiple recessed portions arrangement with
It is with emitting the micro-led second array mirror symmetry of blue light on circuit substrate consistent.
Usually there is fuel shedding quality additionally, due to the surface Jing Guo hydrophilic treated, and the surface Jing Guo hydrophobic treatment usually has
Have water-wet behavior, this be especially adapted for use in by chemical mode handle surface, such as via it is above-mentioned by the first solution at
The substrate side surface of the micro-led component of reason.Therefore, it will be understood to those skilled in the art that for earlier figures
It, can be with using aqueous solution by the unified embodiment being orientated of the micro-led component Jing Guo hydrophobic treatment shown in 6
Alternatively using oily solution by the unified orientation of micro-led component Jing Guo hydrophilic treated, wherein each miniature
Orientation of the light emitting diode component in the second solution as oily solution be with it is completely the same shown in Fig. 6.In addition class
As, the micro-led component Jing Guo hydrophilic treated is unified into orientation using aqueous solution for shown in Fig. 8
Micro-led component unification Jing Guo hydrophobic treatment can be alternatively orientated using oily solution by embodiment,
Wherein orientation of each micro-led component in the second solution as oily solution is and shown in Fig. 8 complete one
It causes.Wherein, oily solution for example can be carbon tetrachloride.
Embodiment above-mentioned is all to carry out hydrophilic treated or hydrophobic place to the substrate surface of micro-led component
Reason, and preferably need that protective film is arranged (especially in the electrode side surface of micro-led component before treatment
When for carrying out corresponding hydrophilic or hydrophobic treatment by the first solution).But it in other embodiments, can also shine to miniature
The electrode side surface of diode component carries out hydrophilic or hydrophobic treatment, then similarly will be treated each miniature luminous
Diode component is put into aqueous solution or oily solution, so that the electrode side surface of each micro-led component
It is orientated with all facing upward or downward, is consistently transferred on circuit substrate so as to be orientated.Wherein, to micro-led
When the electrode side surface of component carries out hydrophilic or hydrophobic treatment, preferably using the table of the physics modes such as laser, plasma
Surface treatment, thus do not influence in subsequent technique on the electrode side surface of micro-led component the first p-type contact and
The contact of first N-type is contacted with the second p-type on circuit substrate and the electrical connection of the second N-type contact.
Example above illustrates implementation steps and relative theory of the invention, although only describing one to the present invention
The embodiment divided, is engaged in those skilled in the art it is to be appreciated that can make based on design of the invention and feature
Many modifications and variations.Therefore, above embodiments mode is that one of present invention illustrates, mode of the invention includes but not
It is confined to above-described embodiment mode, all related technical personnel are on the basis of purport of the invention and design by modifying, replacing, divide
The technical solution that analysis, reasoning or limited experiment obtain, all should be in covering scope of the invention.
Claims (10)
1. a kind of method of the orientation of the micro-led component of unification characterized by comprising
Hydrophilic treated or hydrophobic treatment are carried out to the substrate surface of each in multiple micro-led components；
Each micro-led component after the hydrophilic treated or hydrophobic treatment is placed into solution,
And the solution is applied and is shaken, so that swimming in each micro-led component on the aqueous solution surface
The substrate surface all upward or lower section；The solution is aqueous solution or oily solution.
2. a kind of method of the orientation of the micro-led component of unification characterized by comprising
Hydrophilic treated or hydrophobic treatment are carried out to the electrode side surface of each in multiple micro-led components；
Each micro-led component after the hydrophilic treated or hydrophobic treatment is placed into solution,
And the solution is applied and is shaken, so that swimming in each micro-led component on the aqueous solution surface
The electrode side surface all upward or lower section；The solution is aqueous solution or oily solution.
3. a kind of micro-led flood tide transfer method, unifies miniature hair wherein applying as claimed in claim 1 or 2
The method of the orientation of optical diode component.
4. micro-led flood tide transfer method as claimed in claim 3, is used for multiple micro-led members
Device is transferred on circuit substrate, and micro-led second array is formed on the circuit substrate, which is characterized in that
The following steps are included:
S1, micro-led first array of production, the electrode side surface of each micro-led component therein
With the contact of the first p-type and the contact of the first N-type；
S2, protective film is set on the electrode side surface；
S3, first solution of the configuration containing silicone couplet or fluorine silicone couplet, then by described micro-led first gust
Column are put into first solution, carry out hydrophobic treatment with the substrate side surface to micro-led component；
S4, to complete step S3 micro-led first array, remove the protective film, then cut, to obtain
Obtain each micro-led component；
S5, production have the reprinting mold of multiple holes, the arrangement of described hole and the micro-led second array
Unanimously；
S6, the reprinting mold is placed on the circuit substrate by alignment, the exposure of each described hole can be passed through
The contact of the first p-type and the contact of the first N-type for being electrically connected each micro-led component on the circuit substrate
Multiple second p-types contact and the second N-type contact；
With orientation of the reprinting mold above the circuit substrate, will be put with the circuit substrate for reprinting mold
It sets in the container for accommodating the second solution；And each micro-led component is put into second solution, it is right
Second solution applies concussion；Second solution is the aqueous solution；
S7, distance of the liquid level of second solution relative to the reprinting mold is controlled, so that described each miniature luminous two
Pole pipe component enters in each hole for reprinting mold；
By with each micro-led component the reprinting mold and the circuit substrate from described second
It is taken out in solution.
5. micro-led flood tide transfer method as claimed in claim 3, is used for multiple micro-led members
Device is transferred on circuit substrate, and micro-led second array is formed on the circuit substrate, which is characterized in that
The following steps are included:
S1, micro-led first array of production, the electrode side surface of each micro-led component therein
With the contact of the first p-type and the contact of the first N-type；
S2, protective film is set on the electrode side surface；
S3, first solution of the configuration containing polyethylene glycol, polyvinyl alcohol, n-vinyl pyrrolidone or lauryl sodium sulfate,
Then micro-led first array is put into first solution, to micro-led component
Substrate side surface carries out hydrophilic treated；
S4, to complete step S3 micro-led first array, remove the protective film, then cut, to obtain
Obtain each micro-led component；
S5, production have the reprinting mold of multiple recessed portions, the arrangement of the recessed portion and described micro-led second
Array mirror image is symmetrically consistent；
The reprinting mold is placed into the container for accommodating the second solution by S6, the orientation with the recessed portion upward；
And each micro-led component is put into second solution, second solution is applied and is shaken；Described
Two solution are the aqueous solution；
S7, distance of the liquid level of second solution relative to the reprinting mold is controlled, so that described each miniature luminous two
Pole pipe component enters in each recessed portion for reprinting mold；
The reprinting mold with each micro-led component is taken out from second solution, and will
The circuit substrate is placed on the reprinting mold by alignment, so that each micro-led component first
P-type contact and the contact of the first N-type are contacted with each second p-type in the drive circuit substrate and the contact of the second N-type is right respectively
It is quasi-；
Remove the reprinting mold.
6. micro-led flood tide transfer method as claimed in claim 5 characterized by comprising
The micro-led component of multiple transmitting feux rouges is transferred on circuit substrate, and the shape on the circuit substrate
At the micro-led second array of transmitting feux rouges；Wherein, mold is reprinted using first, for the multiple micro- of transmitting feux rouges
Type light emitting diode component executes step S1-S7, wherein described first reprints arrangement and the institute of multiple recessed portions on mold
It is with stating the micro-led second array mirror symmetry for emitting feux rouges on circuit substrate consistent；
The micro-led component of multiple transmitting green lights is transferred on the circuit substrate, and in the circuit substrate
The upper micro-led second array for forming transmitting green light；Wherein, mold is reprinted using second, for the more of transmitting green light
A micro-led component executes step S1-S7, wherein described second reprints the arrangement of multiple recessed portions on mold
It is with the micro-led second array mirror symmetry of transmitting green light on the circuit substrate consistent；And
The micro-led component of multiple transmitting blue lights is transferred on the circuit substrate, and in the circuit substrate
The upper micro-led second array for forming transmitting feux rouges；Wherein, mold is reprinted using third, for the more of transmitting blue light
A micro-led component executes step S1-S7, wherein the third reprints the arrangement of multiple recessed portions on mold
It is with the micro-led second array mirror symmetry of transmitting blue light on the circuit substrate consistent.
7. such as micro-led flood tide transfer method described in claim 5 or 6, which is characterized in that in the step
Each 2nd P in S7, before being placed into the circuit substrate on the reprinting mold by alignment, on circuit substrate
Conducting resinl is coated in type contact and the contact of the second N-type, or in each micro-led the first p-type of component contact
Conducting resinl is coated in the contact of the first N-type.
8. the micro-led flood tide transfer method as described in any one in claim 4-6, which is characterized in that also
Including step S8, for be filled with each micro-led component the circuit substrate, using heating bonding pattern,
So that the contact of the first p-type and the contact of the first N-type of each micro-led component and the drive circuit substrate
On the contact of each second p-type and the contact electrical connection of the second N-type so that each described micro-led is determined
Location controls and is operated alone.
9. the micro-led flood tide transfer method as described in any one in claim 4-6, which is characterized in that institute
It states container to be placed on the insulated platform that can be shaken, is applied by the insulated platform shaken to second solution and shaken
It swings.
10. the micro-led flood tide transfer method as described in any one in claim 4-6, which is characterized in that
The protective film is photoresist, and second solution is alcohol or deionized water.
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| CN201910195872.0A CN110112090A (en) | 2019-03-15 | 2019-03-15 | The method that unified micro-led component is orientated and the flood tide transfer method using it |
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| CN201910195872.0A CN110112090A (en) | 2019-03-15 | 2019-03-15 | The method that unified micro-led component is orientated and the flood tide transfer method using it |
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