CN110108770B - High-flux electric card test system based on space thermal imaging technology - Google Patents
High-flux electric card test system based on space thermal imaging technology Download PDFInfo
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- CN110108770B CN110108770B CN201910389148.1A CN201910389148A CN110108770B CN 110108770 B CN110108770 B CN 110108770B CN 201910389148 A CN201910389148 A CN 201910389148A CN 110108770 B CN110108770 B CN 110108770B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
Abstract
The embodiment of the invention provides a high-flux electric card testing system based on a space thermal imaging technology, which comprises: the system comprises a sample constant temperature table, a temperature controller, a thermal infrared imager, a high-voltage amplifier and a waveform generator, wherein the sample constant temperature table is used for bearing a high-flux electric card sample; the surface of the sample constant temperature table is provided with a heat conduction insulating plate, and the high-flux electric card sample is placed on the heat conduction insulating plate on the surface of the sample constant temperature table; and a shading dark box is arranged on the sample constant temperature table and is arranged on the upper surface of the sample constant temperature table so as to form a closed test space with the upper surface of the sample constant temperature table, and the thermal infrared imager and the high-flux electric card sample are arranged in the test space.
Description
Technical Field
The invention relates to the field of material testing, in particular to a high-flux electric card testing system based on a space thermal imaging technology.
Background
In modern society, in order to provide comfortable living conditions for people or to ensure effective operation of various devices, the environmental temperature needs to be accurately controlled, and the refrigeration technology is an extremely important technology in the field of temperature control. The conventional refrigeration technology adopts compressed gas for refrigeration, and the conventional refrigeration technology not only has low refrigeration efficiency, but also has to utilize Freon refrigerant which can cause serious environmental and ecological crisis. Statistically, more than 20% of the worldwide energy consumption comes from the refrigeration field, and the refrigeration technology has become the main field of energy consumption, so that the high-efficiency clean refrigeration technology is urgently needed.
In the last decade, ferroelectric refrigeration technology based on the electric card effect has attracted much attention. The refrigeration device has the advantages of high energy efficiency, easiness in miniaturization, low cost, environmental friendliness, simple device structure, convenience in operation and control and the like, and is considered to be a refrigeration technology with bright development prospect.
The electrocaloric effect refers to the phenomenon that a polar material generates adiabatic temperature change or isothermal entropy change under the change of an external electric field; therefore, the adiabatic temperature change value is considered as one of important parameters for evaluating the performance of the electric card material. The existing test of the insulation temperature change value of the electric card mainly comprises an indirect method and a direct method; the indirect method is obtained by measuring the electric hysteresis loop of the material at different temperatures and calculating by a Maxwell relationship. However, the indirect method often greatly differs from the actual value in calculating the adiabatic temperature change of the antiferroelectric, relaxor ferroelectric, and defect-containing ferroelectric. Therefore, practical and reliable direct electric card measurement is becoming more and more important in electric card research.
For example, chinese patent document CN106404830A discloses an electrical card performance testing method using a temperature sensor to collect heat exchanged between a material to be tested and the environment in a measurement chamber and transmit the heat to an external signal collecting system. Chinese patent document CN106324026A and chinese patent document CN206057229U disclose a method for acquiring heat flux on the surface of an electrical card material by using a heat flux sensor, and further acquiring the performance of the electrical card of the material to be measured by using a temperature acquisition display. However, the current direct method electrical card test can only test a single sample at a time, and each test requires a long test period, which seriously affects the development efficiency of electrical card materials.
Disclosure of Invention
Aiming at the defects in the current electric card material testing field, the embodiment of the invention provides a high-flux electric card testing system based on a space thermal imaging technology, which can more efficiently test a high-flux electric card sample.
In order to solve the above problems, an embodiment of the present invention provides a high-throughput electrical card testing system based on a spatial thermal imaging technology, including: the system comprises a sample constant temperature table, a temperature controller, a thermal infrared imager, a high-voltage amplifier and a waveform generator, wherein the sample constant temperature table is used for bearing a high-flux electric card sample;
the surface of the sample constant temperature table is provided with a heat conduction insulating plate, and the high-flux electric card sample is placed on the heat conduction insulating plate on the surface of the sample constant temperature table; a light-shading dark box is arranged on the upper surface of the sample constant temperature table to form a closed test space with the upper surface of the sample constant temperature table, and the thermal infrared imager and the high-flux electric card sample are arranged in the test space;
the surface of the high-flux electric card sample is provided with a conductive electrode, the conductive electrode is connected with a high-voltage amplifier through a lead, and the high-voltage amplifier is connected with a waveform generator, so that the waveform generator and the high-voltage amplifier transmit the voltage of a preset waveform to the high-flux electric card sample; wherein the waveform generator and the high-voltage amplifier are both connected with the main controller;
wherein the temperature controller is connected with a main controller to control the temperature in the test space;
wherein the high-throughput electrocaloric samples have different compositions and/or different gradients.
The high-flux electric card sample is formed by splicing four sub-samples to be tested made of different materials, wherein the four sub-samples to be tested are squares with the same shape, and the sub-samples to be tested of the four squares are sintered into porcelain through solid phase reaction.
The high-flux electric card sample is formed by integrally molding a raw material made of a material, and one surface of the high-flux electric card sample forms a continuously-transitional inclined plane so as to form a wedge-shaped high-flux electric card sample.
The high-flux electric card sample is formed by splicing at least two sub-samples to be tested, which are made of different materials, and is sintered into porcelain by a solid-phase reaction method; and the corresponding side wall of the sub-sample to be tested is an inclined plane, so that one surface of the spliced high-flux electric card sample forms a continuously transitional inclined plane to form a wedge-shaped high-flux electric card sample.
The surface of the high-flux electric card sample is coated with a gold electrode layer with a preset thickness by a magnetron sputtering technology to form a conductive electrode, and the conductive electrode is connected with a high-voltage amplifier by a high-temperature-resistant insulated enameled wire.
Wherein, a layer of anti-reflection layer is coated outside the conductive electrode of the high-flux electric card sample; wherein the anti-reflection layer can be carbon ink or any other infrared antireflection material.
The conductive electrode is electrically connected with the high-temperature-resistant insulating enameled bag through conductive paste, and the conductive paste can be conductive silver paste or any other conductive electrode material.
The high-flux electric card sample is fixed on the sample constant-temperature table through a polyimide adhesive tape, and an aluminum oxide heat-conducting insulating plate is arranged between the high-flux electric card sample and the sample constant-temperature table.
The sample constant temperature table is provided with a lifting mechanism for adjusting the distance between the high-flux electric card sample and the thermal infrared imager.
The technical scheme of the invention has the following advantages:
the scheme provides a convenient, easy-to-operate and non-contact type high-flux electric card performance direct testing system, and the temperature change of the high-flux electric card material in the voltage applying and removing periods is directly represented by an infrared thermal imaging technology with high spatial resolution. On one hand, the method avoids the deviation caused by theoretical hypothesis limitation and the calculation process in an indirect method and the error caused by the thermal contact resistance between a sensor and a sample in a contact type direct method (a thermistor, a thermocouple, a heat flow sensor and the like), and can obtain a more accurate performance test result of the electric card; on the other hand, the electric card performance of materials with different chemical compositions under different electric field strengths can be rapidly obtained at one time, the research and development period of the electric card material can be greatly shortened, and convenience is provided for research and development of the electric card material.
Drawings
The technical solutions and effects of the present invention will become more apparent and more easily understood from the following description of a preferred embodiment of the present invention, taken in conjunction with the accompanying drawings. Wherein:
FIG. 1 is a schematic structural diagram of a high-throughput electrical card testing system according to an embodiment of the present invention
FIGS. 2a, 2b and 2c are schematic structural diagrams of different types of high-throughput electric card samples to be tested, which are used in the embodiment of the invention;
fig. 3 is a schematic cross-sectional view of a sample electrical card provided by an embodiment of the present invention.
Reference numerals:
1, high-throughput electrocaloric samples;
2, heat-conducting insulating plates;
3, a sample constant temperature table;
4, a temperature controller;
5, infrared thermal imaging system;
6 shading a dark box;
7, a lifting knob;
8, insulating enameled wires with high temperature resistance;
9 a high voltage amplifier;
10 a waveform generator;
11 a master controller;
12 a conductive electrode layer;
13 conductive paste;
14 an anti-reflection layer.
Detailed Description
A preferred embodiment of the present invention will be described below with reference to the accompanying drawings.
As shown in fig. 1, the high-throughput electronic card sample 1 is a sample specially made for satisfying the high-throughput electronic card test, and includes samples with different components, samples with different gradients of the same component, samples with different gradients of different components, and the like.
The high-flux electric card sample with different components is shown in fig. 2a, ferroelectric ceramics with four different components of a, b, c and d are respectively sintered into ceramics according to a traditional solid phase reaction method, and are sequentially ground and polished into small blocks with the size of 5mm multiplied by 0.4mm through sand paper of 300#, 600#, 1000#, and 2000#, and then are horizontally paved and adhered into large blocks with the size of 10mm multiplied by 0.4mm through high-temperature resistant glue. When a certain voltage is applied to the thickness direction of the big square, the electric card effect of the four electric card materials with different components under the same electric field condition can be obtained at one time.
The high-flux electric card sample with the same components and different gradients is shown in fig. 2b, and the ferroelectric ceramics of the component a is sintered into ceramics according to a traditional solid-phase reaction method, and is ground and polished into small wedge-shaped blocks with the thickness of 10mm multiplied by (0.2-1 mm) through sand paper of 300#, 600#, 1000#, and 2000 #. When a certain voltage (1000V) is applied to the thickness direction of the wedge-shaped block, the electric clamping effect of the high-flux electric clamping sample under different electric field strengths (10-50 kV/cm) can be obtained at one time.
The high-flux electric card sample with different components and different gradients is shown in fig. 2c, wherein (1) ferroelectric ceramics of three different components, namely a component a, a component b and a component c, can be sintered into ceramics by a traditional solid phase reaction method, and are ground and polished into small wedge-shaped blocks with continuously changed thickness of 10mm multiplied by 3mm multiplied by 0.2-1 mm by sand paper of 300#, 600#, 1000#, and 2000#, and then are bonded into large wedge-shaped blocks with high temperature resistance of 10mm multiplied by 9mm multiplied by 0.2-1 mm by glue water. (2) Or the ferroelectric ceramic powder of three unused components of a, b and c can be laminated, pressed and molded, sintered into porcelain by the traditional solid phase reaction method, and then directly ground and polished into large wedge-shaped blocks with different components in the depth direction and trapezoid in the length direction by sand paper of 300#, 600#, 1000#, and 2000#, wherein the large wedge-shaped blocks are polished into the large wedge-shaped blocks with different components in the depth direction and the large wedge-shaped blocks are 10mm multiplied by 9mm multiplied by 0.2-1 mm. When a certain voltage (1000V) is applied to the thickness direction of the wedge-shaped block, the electric clamping effect of three electric clamping materials with different components under different electric field strengths (10-50 kV/cm) can be obtained at one time.
The embodiment of the invention provides a high-flux electric card testing system shown in figure 1, which comprises a sample constant temperature table 3 for bearing a high-flux electric card sample 1, wherein a heat-conducting insulating plate 2 is arranged on the surface of the sample constant temperature table 3, and the high-flux electric card sample 1 is placed on the heat-conducting insulating plate 2 on the surface of the sample constant temperature table 3. As shown in fig. 1, the device further comprises a temperature controller 4 for testing the high-flux electric card sample 1, a thermal infrared imager 5, a high-voltage amplifier 9 and a waveform generator 10; wherein the outer surface of the high-flux electric card sample 1 is covered with a conductive electrode 12, the conductive electrode 12 is connected with a high-voltage amplifier 9 through a lead, and the high-voltage amplifier 9 is connected with a waveform generator 10; the waveform generator 10 and the high voltage amplifier 9 generate voltages with different waveforms such as sine and cosine waves, triangular waves, rectangular waves, pulse waves and the like, so as to test the high-flux electric card sample 1 to be tested.
In one embodiment of the present invention, the conductive electrode 12 is a gold electrode coated on the surface of the sample of the electric card to be tested by a magnetron sputtering technique, wherein the thickness of the gold electrode can be in the order of hundreds of nanometers. The electrocaloric sample with the electrodes is connected with the high-temperature-resistant insulated enameled wire 8 through the conductive paste 13, wherein the conductive paste 13 can be conductive silver paste, and the high-temperature-resistant insulated enameled wire 8 can be a C + grade pure copper enameled wire with the wire diameter of 0.16mm, the high temperature resistance of 180 ℃ and the voltage resistance of 2000V. One end of the high-temperature resistant insulated enameled wire 8 is connected with an electric card sample with an electrode, and the other end of the high-temperature resistant insulated enameled wire is connected with a waveform generator 10 through a high-voltage amplifier 9.
As shown in fig. 3, in order to realize effective voltage application, conductive electrodes 12 are coated on the upper and lower surfaces of the high-throughput electronic card sample 1 in advance. Preferably, the conductive electrode 12 is formed by magnetron sputtering and spraying a layer of gold electrode with a thickness of hundreds of nanometers. Then, an electric card sample with an electrode is connected with a high-temperature-resistant insulated enameled wire 8 by using a conductive paste 13, preferably, the conductive paste is conductive silver paste, and the high-temperature-resistant insulated enameled wire is a C + grade pure copper enameled wire with the wire diameter of 0.16mm, the high temperature resistance of 180 ℃ and the voltage resistance of 2000V. The other end of the high-temperature resistant insulated enameled wire 8 is connected with the high-voltage amplifier 9, preferably, the range of the high-voltage amplifier 9 is 10000V. Preferably, the high voltage amplifier 9 is connected to the waveform generator 10 through a connection line, and can provide voltages with different waveforms, such as sine-cosine wave, triangular wave, rectangular wave, and pulse wave.
In the embodiment of the invention, in order to meet the test requirements of the electric card effect at different temperatures, the high-flux electric card sample 1 is fixed on the sample constant temperature table 3 through a polyimide adhesive tape, and preferably, the high-flux electric card sample 1 is isolated from the sample constant temperature table 3 through an alumina heat-conducting insulating plate 2 so as to protect the sample constant temperature table 3 at a high voltage. In order to realize accurate control of constant temperature conditions, the sample constant temperature stage 3 is connected with the high-precision temperature controller 4, preferably, the temperature control precision of the high-precision temperature controller 4 is +/-0.01 ℃, and the range is room temperature-200 ℃. In particular, the test at lower temperature can be realized by semiconductor refrigeration, liquid nitrogen refrigeration and other modes.
The thermal infrared imager 5 can realize temperature testing of different radiation areas through a spatial thermal imaging technology, preferably, the thermal infrared imager 5 has a spatial resolution precision of 25 μm, a temperature resolution precision of 0.02 ℃ and a temperature testing range of-40 ℃ to 650 ℃. In order to reduce the interference of indoor light to infrared measurement, the lens of the thermal infrared imager 5 and the constant-temperature sample stage 3 are placed in a shading dark box 6. Meanwhile, in order to reduce the surface reflectivity of the high-flux electrocaloric sample 1, after the high-flux electrocaloric sample 1 is connected with the high-temperature resistant insulated enameled wire 8, an anti-reflection layer 14 needs to be coated on the surface. Preferably, the anti-reflection layer 14 is carbon ink.
In order to facilitate focusing and obtain a clearer temperature distribution image, a combination of coarse focusing and fine focusing is adopted in the embodiment. Wherein the coarse focusing distance is realized by lifting the sample constant temperature table 3; this sample constant temperature platform is equipped with elevating system, makes sample constant temperature platform 3 wholly go up and down or bear the partial lift of high flux electricity card sample 1 through rotatory lift knob 7 to realize the focus adjustment. And the fine focusing can be realized by adopting the thermal infrared imager 5, which specifically comprises the following steps: after the distance between the high-flux electric card sample 1 on the sample constant-temperature table 3 and the lens of the thermal infrared imager 5 is adjusted to a proper position through the lifting mechanism, the precise fine adjustment is realized through a built-in program of the thermal infrared imager 5. The thermal infrared imager 5 in the embodiment of the invention is connected with the main controller 11 so as to automatically test the electric card effect through the main controller 11.
The inventive concept can be implemented in different ways as the technology advances, as will be clear to a person skilled in the art. The embodiments of the invention are not limited to the above-described embodiments but may vary within the scope of the claims.
Claims (7)
1. A high-throughput electric card testing system based on a spatial thermal imaging technology is characterized by comprising: the system comprises a high-flux electric card sample, a thermal infrared imager, a sample constant temperature table for bearing the high-flux electric card sample, a temperature controller, a high-voltage amplifier and a waveform generator;
wherein the high-throughput electric card sample is specially manufactured for meeting the high-throughput electric card test and has different components and/or different gradients;
the high-flux electric card sample is formed by splicing four sub-samples to be tested, which are made of different materials, wherein the four sub-samples to be tested are all square blocks with the same shape, and the four sub-samples to be tested in the square blocks are sintered into porcelain through solid phase reaction; a conductive electrode is formed on the surface of the high-flux electric card sample, and an anti-reflection layer is coated outside the conductive electrode of the high-flux electric card sample; wherein the anti-reflection layer is carbon ink or any other infrared anti-reflection material;
the thermal infrared imager can realize temperature tests of different radiation areas through a space thermal imaging technology to obtain a surface temperature distribution image of the high-flux electric card sample;
the surface of the sample constant temperature table is provided with a heat conduction insulation plate, and the high-flux electric card sample is placed on the heat conduction insulation plate on the surface of the sample constant temperature table; a light-shading dark box is arranged on the upper surface of the sample constant temperature table to form a closed test space with the upper surface of the sample constant temperature table, and the thermal infrared imager and the high-flux electric card sample are arranged in the test space;
the conductive electrode is connected with a high-voltage amplifier through a lead, and the high-voltage amplifier is connected with a waveform generator, so that the waveform generator and the high-voltage amplifier transmit the voltage of a preset waveform to the high-flux electric card sample; the waveform generator and the high-voltage amplifier are both connected with a main controller; wherein the temperature controller is connected with a main controller to control the temperature in the test space.
2. A high-throughput electric card testing system based on a spatial thermal imaging technology is characterized by comprising: the system comprises a high-flux electric card sample, a thermal infrared imager, a sample constant temperature table for bearing the high-flux electric card sample, a temperature controller, a high-voltage amplifier and a waveform generator;
the high-flux electric card sample is formed by integrally forming a raw material made of one material, a continuously transitional inclined plane is formed on one surface of the high-flux electric card sample to form a wedge-shaped high-flux electric card sample, and the wedge-shaped sub-sample to be tested is sintered into porcelain through solid-phase reaction; a conductive electrode is formed on the surface of the high-flux electric card sample, and an anti-reflection layer is coated outside the conductive electrode of the high-flux electric card sample; wherein the anti-reflection layer is carbon ink or any other infrared anti-reflection material;
the thermal infrared imager can realize temperature tests of different radiation areas through a space thermal imaging technology to obtain a surface temperature distribution image of the high-flux electric card sample;
the surface of the sample constant temperature table is provided with a heat conduction insulation plate, and the high-flux electric card sample is placed on the heat conduction insulation plate on the surface of the sample constant temperature table; a light-shading dark box is arranged on the upper surface of the sample constant temperature table to form a closed test space with the upper surface of the sample constant temperature table, and the thermal infrared imager and the high-flux electric card sample are arranged in the test space;
the conductive electrode is connected with a high-voltage amplifier through a lead, and the high-voltage amplifier is connected with a waveform generator, so that the waveform generator and the high-voltage amplifier transmit the voltage of a preset waveform to the high-flux electric card sample; the waveform generator and the high-voltage amplifier are both connected with a main controller; wherein the temperature controller is connected with a main controller to control the temperature in the test space.
3. A high-throughput electric card testing system based on a spatial thermal imaging technology is characterized by comprising: the system comprises a high-flux electric card sample, a thermal infrared imager, a sample constant temperature table for bearing the high-flux electric card sample, a temperature controller, a high-voltage amplifier and a waveform generator;
the high-flux electric card sample is formed by splicing at least two sub-samples to be tested, which are made of different materials, and is sintered into porcelain by a solid-phase reaction method; the corresponding side wall of the sub-sample to be tested is an inclined plane, so that one surface of the spliced high-flux electric card sample forms a continuously-transitional inclined plane to form a wedge-shaped high-flux electric card sample; a conductive electrode is formed on the surface of the high-flux electric card sample, and an anti-reflection layer is coated outside the conductive electrode of the high-flux electric card sample; wherein the anti-reflection layer is carbon ink or any other infrared anti-reflection material;
the thermal infrared imager can realize temperature tests of different radiation areas through a space thermal imaging technology to obtain a surface temperature distribution image of the high-flux electric card sample;
the surface of the sample constant temperature table is provided with a heat conduction insulation plate, and the high-flux electric card sample is placed on the heat conduction insulation plate on the surface of the sample constant temperature table; a light-shading dark box is arranged on the upper surface of the sample constant temperature table to form a closed test space with the upper surface of the sample constant temperature table, and the thermal infrared imager and the high-flux electric card sample are arranged in the test space;
the conductive electrode is connected with a high-voltage amplifier through a lead, and the high-voltage amplifier is connected with a waveform generator, so that the waveform generator and the high-voltage amplifier transmit the voltage of a preset waveform to the high-flux electric card sample; the waveform generator and the high-voltage amplifier are both connected with a main controller; wherein the temperature controller is connected with a main controller to control the temperature in the test space.
4. The high-throughput electric card testing system based on the spatial thermal imaging technology according to any one of claims 1 to 3, wherein the surface of the high-throughput electric card sample is coated with a gold electrode layer with a preset thickness by a magnetron sputtering technology to form a conductive electrode, and the conductive electrode is connected with a high-voltage amplifier by a high-temperature resistant insulated enameled wire.
5. The high-throughput electric card testing system based on the spatial thermal imaging technology according to claim 4, wherein the conductive electrode is electrically connected to the high-temperature-resistant insulated enameled wire through a conductive paste, and the conductive paste can be a conductive silver paste or any other conductive electrode material.
6. The high-throughput electric card testing system based on the spatial thermal imaging technology as claimed in claim 1, wherein the high-throughput electric card sample is fixed on the sample constant temperature table through polyimide tape, and an alumina heat-conducting insulating plate is arranged between the high-throughput electric card sample and the sample constant temperature table.
7. The high-throughput electrical card testing system based on the spatial thermal imaging technology as claimed in claim 1, wherein the sample thermostatic stage has a lifting mechanism for adjusting the distance between the high-throughput electrical card sample and the thermal infrared imager.
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| CN111855736B (en) * | 2020-03-18 | 2022-02-18 | 同济大学 | Electricity card performance test system |
| CN113740377A (en) * | 2021-09-03 | 2021-12-03 | 杭州泰默检测技术有限公司 | Flat-plate-shaped sample heat-conducting property testing device based on thermal imaging |
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| WO2007099279A1 (en) * | 2006-03-01 | 2007-09-07 | Alexandr Mishchenko | Thick and thin films for power generation and cooling |
| WO2013043169A1 (en) * | 2011-09-21 | 2013-03-28 | Empire Technology Development Llc | Heterogeneous electrocaloric effect heat transfer |
| CN106440483A (en) * | 2016-09-13 | 2017-02-22 | 奈申（上海）智能科技有限公司 | Electric card refrigerating device |
| CN206057229U (en) * | 2016-09-29 | 2017-03-29 | 奈申（上海）智能科技有限公司 | A kind of direct method measures the device of material electric card performance |
| CN106404830B (en) * | 2016-09-29 | 2019-03-29 | 奈申（上海）智能科技有限公司 | A kind of electric card measuring device |
| CN206990487U (en) * | 2017-04-26 | 2018-02-09 | 清华大学 | The thermoelectricity capability measuring system of nano material |
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