CN110099539A - Heat radiating fin structure and its manufacturing method - Google Patents
Heat radiating fin structure and its manufacturing method Download PDFInfo
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- CN110099539A CN110099539A CN201810088206.2A CN201810088206A CN110099539A CN 110099539 A CN110099539 A CN 110099539A CN 201810088206 A CN201810088206 A CN 201810088206A CN 110099539 A CN110099539 A CN 110099539A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
For the present invention about a kind of heat radiating fin structure and its manufacturing method, this heat radiating fin structure includes a substrate, a ceramics layer and a graphene layer, and substrate has a radiating surface and a heat-absorbent surface；Ceramics layer is layered on radiating surface, and ceramics layer with hot-cast socket at the ceramic powder of light ability by being constituted, and the thickness of ceramics layer is less than 100 μm；Graphene layer is layered between radiating surface and ceramics layer or is coated in heat-absorbent surface, and graphene layer is made of graphene material.Whereby, have hot-cast socket at light ability using ceramics layer, graphene layer can quickly and uniformly conduct heat to entire radiating surface, to increase the radiation efficiency of the entire radiating surface of ceramics layer, have heat radiating fin structure of the present invention compared with traditional heat-dissipating piece radiating efficiency more quickly.
Description
Technical field
The present invention is about a kind of radiator structure, espespecially a kind of heat radiating fin structure and its manufacturing method.
Background technique
Stablize in order to which electronic component operates, it will usually amplexiform a cooling fin in electronic component, and will be electric by cooling fin
Among the heat convection to atmosphere of subcomponent.Wherein, traditional heat-dissipating piece is made by materials such as the materials such as copper, aluminium of high conductance,
And then heat is efficiently conducted to atmosphere convection with the heat exchange pattern of high conductance.
However, under the requirement of modern electronic product functional diversities and efficiency ultimate attainmentization, it is only common by such as copper, aluminium etc.
Cooling fin is made in the metal of high conductance, and energy saving save space, the product essence that can not have reached electronic component of new generation be short and small, heat dissipation
High-efficient equal requirement.
Summary of the invention
The purpose of the present invention is to provide a kind of heat radiating fin structure and its manufacturing methods, to solve cooling fin in the prior art
The defect that volume is big and radiating efficiency is low.
To achieve the above object, the present invention provides a kind of heat radiating fin structure, comprising: a substrate, the substrate have a heat dissipation
Face and a heat-absorbent surface；One ceramics layer, the ceramics layer are layered on the radiating surface, and the ceramics layer with far infrared by putting
The ceramic powder for penetrating ability is constituted, and the thickness system of the ceramics layer is less than 100 μm；And a graphene layer, the graphene
Layer stackup is between the radiating surface and the ceramics layer or is coated in the heat-absorbent surface, and the graphene layer is by graphene material institute structure
At.
Heat radiating fin structure of the present invention, wherein the radiating surface is formed in top surface and the lateral circle surface of the substrate, the heat absorption
Face is formed in the bottom surface of the substrate.
Heat radiating fin structure of the present invention, wherein the substrate is aluminium or copper.
Heat radiating fin structure of the present invention, wherein the ceramic powder includes clay, phyllite or tourmaline.
Heat radiating fin structure of the present invention, wherein the ceramic powder includes potassium feldspar, albite, schreyerite stone or oxygen
Change copper.
To achieve the above object, the present invention also provides a kind of manufacturing method of heat radiating fin structure, step includes: a) to provide
One substrate and a graphene layer, the substrate have a radiating surface, which are coated on the radiating surface；B) providing has
One ceramic powder of far infrared irradiation ability carries out surfaction operation to the ceramic powder, which is used for
Partial size, crystal phase or the appearance of the ceramic powder are adjusted, to improve the mobility of the ceramic powder；And c) by the ceramic powder with
Spraying method is coated on the graphene layer and forms a ceramics layer.
The manufacturing method of heat radiating fin structure of the present invention, wherein the substrate also has a heat-absorbent surface in step a), should
Radiating surface is formed in top surface and the lateral circle surface of the substrate, which is formed in the bottom surface of the substrate.
To achieve the above object, the present invention provides a kind of manufacturing method of heat radiating fin structure, and step includes: d) to provide tool
There is a ceramic powder of far infrared irradiation ability, surfaction operation is carried out to the ceramic powder, which uses
In the partial size, crystal phase or the appearance that adjust the ceramic powder, to improve the mobility of the ceramic powder；E) one substrate, the base are provided
Plate has a radiating surface and a heat-absorbent surface, by the ceramic powder with spraying method is coated on the radiating surface and forms a ceramic powder
Layer；And a graphene layer f) is provided, which is coated on the heat-absorbent surface.
The manufacturing method of heat radiating fin structure of the present invention, wherein the radiating surface is formed in the substrate in step d)
Top surface and lateral circle surface, the heat-absorbent surface are formed in the bottom surface of the substrate.
The present invention also has effects that following, has hot-cast socket at light ability using ceramics layer, graphene layer can quickly and
Entire radiating surface is uniformly conducted heat to, to increase the radiation efficiency of the entire radiating surface of ceramics layer, dissipates the present invention
Fin structure has small in size and radiating efficiency more quickly.Ceramic powder is with spraying method is coated on graphene layer and is formed
Ceramics layer, because spraying processing procedure is available thin and uniform cladding layer structure, and spraying method is to form the smallest system of thermal resistance
Journey mode allows graphene layer energy in addition the thickness of ceramics layer and crystallization degree control and graphene layer is coated on radiating surface
It is fixedly combined on substrate, makes heat radiating fin structure excellent ground radiating efficiency.
Detailed description of the invention
Fig. 1 is the flow chart of the production method of heat radiating fin structure of the present invention.
Fig. 2 is the stereogram exploded view of heat radiating fin structure of the present invention.
Fig. 3 is the flow chart of the production method of another embodiment of heat radiating fin structure of the present invention.
Fig. 4 is the stereogram exploded view of another embodiment of heat radiating fin structure of the present invention.
Wherein, appended drawing reference:
10 ... heat radiating fin structures
1 ... substrate
11 ... radiating surfaces
12 ... heat-absorbent surfaces
13 ... top surfaces
14 ... lateral circle surfaces
15 ... bottom surfaces
2 ... ceramics layers
3 ... graphene layers
100 ... heat-generating units
A~f ... step
Specific embodiment
Detailed description for the present invention and technology contents will cooperate Detailed description of the invention as follows, however the only conduct of appended attached drawing
Illustrative purposes are not intended to the limitation present invention.
It please refers to shown in Fig. 1 to Fig. 2, the present invention provides a kind of heat radiating fin structure and its manufacturing method, and step is specifically
It is bright as follows.
As shown in the step a~c and Fig. 2 of Fig. 1, a substrate 1 and a graphene layer 3 are provided in a step, substrate 1 has one
Graphene layer 3 can be sprayed or chemical vapor deposition manner is coated on radiating surface 11 by radiating surface 11, allow 3 energy of graphene layer
It is fixedly combined on substrate；The ceramic powder for having far infrared irradiation ability is provided in b step, ceramic powder is carried out
Surfaction operation, surfaction operation is used to adjust partial size, crystal phase or the appearance of ceramic powder, to improve the ceramic powder
Mobility；Ceramic powder can be coated on graphene layer 3 in a manner of cold spraying or thermal spraying in step c and form a ceramic powder
Layer 2.
Detailed description are as follows, and surfaction is also known as surface-treated or surface processing, and its object is to further adjust
The physically or chemically characteristic on ceramic powder surface.Since the invention reside in by the above-mentioned ceramic powder with far infrared irradiation ability
Body coating takes shape on graphene layer 3, therefore the operation of surfaction must be carried out for ceramic powder, to adjust ceramic powder
Partial size, appearance parameter so that its be more easily coated in graphene layer 3 and have preferable binding force；On the other hand, pass through
This reforming step can adjust the crystal phase of ceramic powder simultaneously, such as using a heat treatment process, make the crystal phase shape of ceramic powder
At most useful for follow-up process, or make ceramics layer 2 that there is the effect of higher radiating efficiency.Furthermore this surfaction step
It may also include a coating processing procedure, at one shell of covering surface of ceramic powder (figure do not indicate), shell (figure does not indicate) can be with
It provides the preferable flow behavior of ceramic powder (also known as lubricity), and then improves the progress of subsequent coating step, such as available
The lower melting-point shells of modes coating one such as plating, electroless plating or chemical conversion treatment, the shell of low melting point can be in coating below
In the process compared with ceramic powder first to melt, and forms a fluid and be filled in the gap between ceramic powder, and by this ceramic powder
The mobility of body increases, and can strengthen the characteristic of ceramics layer 2.
In addition, above-mentioned thermal spraying (thermal spray, also known as hot melt spray or hot melt are penetrated) technology is adding by heating source
Heat, after being intended to the material heating melting of coating, and covering material can be the form of wire rod, bar or powder, then pass through gas
Thrust by melt or semi-molten material spraying to work piece surface formed coating layer technology.In an embodiment of the present invention,
Using flame combustion, as flame meltallizing (Elame spray), high-speed flame meltallizing (Hifh velocity oxy-euel,
The mode that modes or electric energy provide such as HVOE), such as plasma-based meltallizing (Plasma spray), electric arc meltallizing (Arc spray) system
Journey, by the ceramic powder of the far-infrared ray material of step c be heated to melting or semi-molten state, then with high pressure draught atomization and it is defeated
It serves and states molten state or semi-molten particle in the surface of graphene layer 3, the ceramic powder of molten state or semi-molten particle is via height
Pressure gas stream hits 3 surface of graphene layer, and to form flat particle, and flat ceramic powder particle is then through heap in layer
It is folded, then via the ceramics layer 2 of cooling step one spray mo(u)lding of formation.
On the other hand, above-mentioned cold spraying (cold spray, also known as sloppy heat spray or sloppy heat are penetrated) is a kind of spraying skill of innovation
Ceramic powder is not dissolved or gasifies and it is made to keep original solid state shape to make it with supersonic flow along with not active gases by art
It impacts the surface to graphene layer 3 and forms ceramics layer 2, the dusty material under supersonic speed impact surmounts critical speed
Particle ontology can generate plastic deformation and form epithelium, and be different from the heat spraying method generally recognized, what material was notheated
It influences and generates characteristic variations, the oxidation of epithelium can control minimum limit.Therefore above-mentioned cold spraying can have above-mentioned
The ceramic powder of far infrared irradiation is continuously coated on graphene layer 3 to form ceramics layer 2.Since the processing procedure of cold spraying can
To import cooling air, therefore process temperatures can be effectively reduced, while cold spraying form of construction work is for workpiece surface size shape
Limitation it is smaller, and the film layer stackeding speed of cold spraying is fast, the thickness of ceramics layer 2 is uniform, therefore is very suitable to automation
Mode carries out successional spraying operation.
Though being converted into being easier to the far infrared of radiation it is worth noting that, far-infrared ray material can absorb heat, with radiation
Mode have the function that reinforce heat dissipation, but the thermal conductivity ratio substrate 1 of ceramics layer 2 be it is low, make the thickness of substrate 1 must be one
Determine in range, not so the blocked up heat transfer that will cause integral heat sink chip architecture 10 of 2 film thickness of ceramics layer reduces, although increasing heat
Radiation effect, but whole heat dissipation is measured one's own ability and may not be promoted.
Also, far infrared is in the nature light, as long as radiation effect, therefore heat radiating fin structure can be obtained in coating thin layer
Ceramics layer 2 on 10 should thinning as far as possible, but the mechanism of the radiation effects of far-infrared ray material is from crystalline texture, too thin
Coating film layer be difficult to obtain good crystalline texture, cause the reduction of far infrared irradiation rate, therefore the pottery of far-infrared ray material
Porcelain bisque 2 should have lower thickness.In the present embodiment, ceramics layer 2 has a uniform predetermined thickness, this predetermined thickness is less than
100 μm, the reduction of heat conduction efficiency is caused to avoid too thick coating layer, and be slightly less than 100 μm of items in the thickness of ceramics layer 2
Under part, crystalline texture is up to good far-infrared radiation effect.
Referring again to shown in Fig. 2, a kind of heat radiating fin structure 10 can be made in aforementioned production method, this heat radiating fin structure 10 is main
Including a substrate 1, a ceramics layer 2 and a graphene layer 3.
Substrate 1 has radiating surface 11 and heat-absorbent surface 12, and radiating surface 11 is formed in top surface 13 and the lateral circle surface 14 of substrate 1, inhales
Hot face 12 is formed in the bottom surface 15 of substrate 1.Wherein, substrate 1 can be plate made by the high conductive metal materials such as aluminium or copper
Workpiece.
Ceramics layer 2 is layered on radiating surface 11, and ceramics layer 2 is by the ceramic powder institute with far infrared irradiation ability
It constitutes, and the thickness of ceramics layer 2 is less than 100 μm, and the infrared emission rate that ceramics layer 2 is possessed is identical to ceramic powder
Predetermined infrared emission rate.Wherein, ceramic powder includes clay, phyllite or tourmaline, is further described below, ceramic powder
Include potassium feldspar, albite, schreyerite stone, copper oxide or DK2001.
In addition, far-infrared ray material is often selected from ore, and chemical composition complexity is not easy to control, most of dilute containing radioactivity
Earthy element or heavy metal, rare earth element can stimulus material far infrared release；It is many to have far infrared function inorganic matter,
Powder color not necessarily, except tourmaline, volcanic rock or by Meng Zongzhu, coconut husk through 1000 DEG C Celsius or more high temperature, also has far infrared
Line function.Therefore correlation analysis and experiment first must be carried out for far-infrared ray material in the present invention, the present invention is first just various remote red
Outside material carries out constituent analysis and crystal phase observation, and by above-mentioned analysis as a result, prepare the ceramic powder of far-infrared ray material,
And ceramic powder has a predetermined infrared emission rate, scheduled infrared emission rate can be equal to selected far infrared wire rod
The infrared emission rate of material.
Furthermore in the present embodiment, ceramic powder is as made by the ceramic material with far infrared irradiation ability, such as
The ceramic material mixes for clay, it by the clay of weight percent 10 to 15, weight percent 10 to 20 phyllite,
The tourmaline of weight percent 40 to 50, the potassium feldspar of weight percent 5 to 10, the albite of weight percent 5 to 10, weight
The DK2001 organic matter institute of the schreyerite stone of percentage 5 to 10, the copper oxide of weight percent 5 to 10 and weight percent 10
Composition, by crushing, sieving, mixing, stirring, granulation, drying, sintering, crushing, reconciles, but above-mentioned composition ratio is only
Citing is used, and is not intended to limit the invention.Above-mentioned constituent is formed by ceramic powder, that is, can be used to coating and be incorporated into
On the radiating surface 11 of substrate 1.
Graphene layer 3 is layered between radiating surface 11 and ceramics layer 2 or is coated in heat-absorbent surface 12, and graphene layer 3 is by stone
Black alkene material is constituted.Wherein, graphene layer 3 itself has high-termal conductivity, so the heat transfer efficiency of graphene layer 3 is higher than metal
The heat transfer efficiency of material, graphene layer 3 can conduct heat to ceramics layer 2 quickly to increase the heat radiation of ceramics layer 2 effect
It answers.
The combination and use state of heat radiating fin structure 10 of the present invention have radiating surface 11 and heat-absorbent surface 12 using substrate 1；
Ceramics layer 2 is layered on radiating surface 11, and ceramics layer 2 is made of the ceramic powder with far infrared irradiation ability, and
The thickness of ceramics layer 2 is less than 100 μm；And graphene layer 3, it is layered between radiating surface 11 and ceramics layer 2 or is coated in
Heat-absorbent surface 12, graphene layer 3 are made of graphene material.Therefore the corresponding heat-generating units 100 of heat radiating fin structure 10 are when amplexiforming, fever
The heat of unit 100 is removed outward by the good substrate 1 of conductibility, and graphene layer 3 itself has high-termal conductivity, so graphene
The heat transfer efficiency of layer 3 is higher than the heat transfer efficiency of metal material, and graphene layer 3 can conduct heat to ceramics layer 2 quickly to increase
Add the thermoradiation efficiency of ceramics layer 2, and ceramics layer 2 is a kind of carrier of energy conversion, is led to by the heat that substrate 1 is conducted
The electron transition that ceramics layer 2 is formed by the crystal structure of tool far infrared radiation function and is formed is crossed, to be converted to one
The form of energy of kind radiative property: far infrared electromagnetic radiation to scatter outward, and launch wavelength is 2~18 μm, emissivity
Up to 93%；Namely ceramics layer 2 can convert heat to not by metal material absorb electromagnetic radiation in the form of light quantum and
To excessive the effect of dissipating, reaching rapid cooling, and then the cooling effect to heat-generating units 100 is improved, improves fever list to reach
The service life of member 100.Therefore, ceramics layer 2 has far-infrared heat radiation effect, and graphene layer 3 itself has high thermal conductivity
Property, so ceramics layer 2 has hot-cast socket into light ability, graphene layer 3 can quickly and uniformly conduct heat to entire surface, with
The thermal emissivity rate for increasing the entire surface of ceramics layer 2 makes heat radiating fin structure 10 of the present invention have excellent ground radiating efficiency.
It please referring to shown in Fig. 3 to Fig. 4, the present invention provides another embodiment of a kind of heat radiating fin structure and its manufacturing method,
The embodiment of Fig. 3 to Fig. 4 is roughly the same with the embodiment of Fig. 1 to Fig. 2, the embodiment of Fig. 3 to Fig. 4 and the embodiment of Fig. 1 to Fig. 2
The difference is that ceramic powder is coated on radiating surface 11 and forms ceramics layer 2, graphene layer 3 is coated on heat-absorbent surface 12
On.
It is further described below, as shown in the step d~f and Fig. 4 of Fig. 3, providing in Step d has far infrared irradiation energy
The ceramic powder of power carries out surfaction operation to ceramic powder, and surfaction operation is used to adjust partial size, the crystalline substance of ceramic powder
Phase or appearance, to improve the mobility of ceramic powder；Substrate 1 is provided in step e, substrate 1 has radiating surface 11 and heat-absorbent surface 12,
By ceramic powder with spraying method is coated on radiating surface 11 and forms ceramics layer 2；Graphene layer 3 is provided in f step, by stone
Black alkene layer 3 is coated on heat-absorbent surface 12.
In addition, the surfaction operation of the present embodiment, spraying method and etc. it is roughly the same with the embodiment of Fig. 1 to Fig. 2,
But the embodiment difference of the present embodiment and Fig. 1 to Fig. 2 are before spraying process to further include a pre-treatment program.Pre-treatment journey
The step of sequence mainly carries out a cleaning action and a roughing in surface to radiating surface 11, to improve radiating surface 11 and molten state or fritting
Melt the contact area of particulate ceramic powder, and then improves the spraying application quality of ceramics layer 2.
Wherein, cleaning is to remove moisture, oxidation film or other greases, dirt of radiating surface 11 etc., utilizes grease removal
Solvent removes insoluble greasy dirt, grease and some dirts sticked or clast etc., and except cleaning function caused by fatsolvent
Above-mentioned impurity can be removed and greatly improve coating film with by the binding force of coating workpiece；In addition, in order to reach coating film and quilt
Physical bond between coating workpiece, it is necessary to which the surface roughness for improving radiating surface 11 makes above-mentioned molten state or semi-molten particle
Ceramic powder when hitting with air-flow to radiating surface 11, can be and surface (the rough surface characteristics) of higher rugosity
Preferably occlusion property is obtained, while improving the bond strength on ceramics layer 2 surface and radiating surface 11.
Referring again to shown in Fig. 4, another embodiment of heat radiating fin structure 10 can be made in aforementioned production method, wherein ceramic powder
Layer 2 is layered on radiating surface 11, and graphene layer 3 is coated in heat-absorbent surface 12, and graphene layer 3 is made of graphene material.Therefore it dissipates
When the corresponding heat-generating units 100 of fin structure 10 amplexiform, if heat-generating units 100 are that the heats such as transistor easily concentrate fever on one point
Element, this graphene layer 3 can will focus on the heat of any to external diffusion and quick conduction is to substrate 1, and heat passes through substrate 1 again
To ceramics layer 2, last ceramics layer 2 converts heat to electromagnetic radiation in the form of light quantum and dissipates to excessive for conduction, reaches
The effect of to rapid cooling.
In addition, supplementary explanation is as follows, the area of graphene layer 3 is 3 × 3~4 × 4cm2About reduce by 1% temperature of traditional heat sinks
It spends, the area of graphene layer 3 is 5 × 5~6 × 6cm2About reduce by 2% temperature of traditional heat sinks, graphene layer 3 area be 7 ×
7~8 × 8cm2About reduce by 3% temperature of traditional heat sinks, the area of graphene layer 3 is 9 × 9cm2Traditional heat-dissipating can be about reduced above
5% temperature of device concentrates on heat source to avoid such as traditional heat sinks heat, and heat source temperature is caused not radiate effectively.Therefore this case
Heat source temperature can be conducted to cooling fin gross area, heat source is avoided to concentrate, so area is got over by the characteristic of graphene high conduction
Big cooling fin, effect is better, and this case heat radiating fin structure 10 is made effectively to achieve the effect that samming cools down.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding changes and modifications, but these corresponding changes and modifications can be made according to the present invention by knowing those skilled in the art
It all should belong to the protection scope of the claims in the present invention.
Claims (9)
1. a kind of heat radiating fin structure, which is characterized in that the heat radiating fin structure includes:
One substrate, the substrate have a radiating surface and a heat-absorbent surface；
One ceramics layer, the ceramics layer are layered on the radiating surface, and the ceramics layer is by with far infrared irradiation ability
Ceramic powder is constituted, and the thickness of the ceramics layer is less than 100 μm；And
One graphene layer, the graphene layer are layered between the radiating surface and the ceramics layer or are coated in the heat-absorbent surface, the stone
Black alkene layer is made of graphene material.
2. the heat radiating fin structure according to weighing and require 1, which is characterized in that the radiating surface is formed in top surface and the side week of the substrate
Face, the heat-absorbent surface are formed in the bottom surface of the substrate.
3. heat radiating fin structure according to claim 1, which is characterized in that the substrate is aluminium or copper.
4. heat radiating fin structure according to claim 1, which is characterized in that the ceramic powder includes clay, phyllite or electricity
Gas stone.
5. heat radiating fin structure according to claim 1, which is characterized in that the ceramic powder includes potassium feldspar, albite, vanadium
Titanium ore or copper oxide.
6. a kind of manufacturing method of heat radiating fin structure, which is characterized in that step includes:
A) substrate and a graphene layer are provided, which has a radiating surface, which is coated on the radiating surface；
B) ceramic powder for having far infrared irradiation ability is provided, surfaction operation, the table are carried out to the ceramic powder
Face modification operation is used to adjust partial size, crystal phase or the appearance of the ceramic powder, to improve the mobility of the ceramic powder；And
C) by the ceramic powder with spraying method is coated on the graphene layer and forms a ceramics layer.
7. the manufacturing method of heat radiating fin structure according to claim 6, which is characterized in that the substrate also has in step a)
One heat-absorbent surface, the radiating surface are formed in top surface and the lateral circle surface of the substrate, which is formed in the bottom surface of the substrate.
8. a kind of manufacturing method of heat radiating fin structure, which is characterized in that step includes:
D) ceramic powder for having far infrared irradiation ability is provided, surfaction operation, the table are carried out to the ceramic powder
Face modification operation is used to adjust partial size, crystal phase or the appearance of the ceramic powder, to improve the mobility of the ceramic powder；
E) substrate is provided, which has a radiating surface and a heat-absorbent surface, which is coated on this with spraying method
A ceramics layer is formed on radiating surface；And
F) one graphene layer is provided, which is coated on the heat-absorbent surface.
9. the manufacturing method of heat radiating fin structure according to claim 8, which is characterized in that the radiating surface is formed in step d)
Top surface and lateral circle surface in the substrate, the heat-absorbent surface are formed in the bottom surface of the substrate.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114010066A (en) * | 2021-11-11 | 2022-02-08 | 中山市晋盈电器有限公司 | IH inner container for electric cooker and preparation method thereof |
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Application publication date: 20190806 |