CN100376953C - Method for manufacturing light guiding plate core - Google Patents
Method for manufacturing light guiding plate core Download PDFInfo
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- CN100376953C CN100376953C CNB2003101176883A CN200310117688A CN100376953C CN 100376953 C CN100376953 C CN 100376953C CN B2003101176883 A CNB2003101176883 A CN B2003101176883A CN 200310117688 A CN200310117688 A CN 200310117688A CN 100376953 C CN100376953 C CN 100376953C
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- light guiding
- mould core
- substrate
- manufacture method
- guiding board
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Abstract
The present invention relates to a method for manufacturing a mold core of a light guiding plate, which comprises the following steps: providing a base plate with a V-shaped groove structure; coating a uniform light resistance layer on the V-shaped groove structure of the base plate; exposing the light resistance layer by utilizing a light cover with prearranged patterns and then developing so as to cause the top end of the V-shaped groove structure of the base plate to form a light resistance structure in a protrusion shape; plating a metal thin film layer on the base plate and the protrusion structure; forming a metal layer on the surface of the metal thin film layer by electrotyping; stripping the metal thin film layer and the metal layer from the base plate so as to obtain a metal light guiding plate with an air exhaust structure.
Description
[technical field]
The invention relates to a kind of manufacturing method for insert, refer in particular to a kind of light guiding board mould core manufacture method that is used for liquid crystal indicator.
[background technology]
In recent years, along with the colorize and the maximization of LCD, its application is more extensive, as mobile computer, various desk-top computer, LCD TV etc.Because LCD is a kind of passive component, itself can not be luminous, therefore need utilize a light source is the light source of system as LCD, as backlight module (BacklightModule), wherein, light guide plate is one of significant components in the backlight module, is used for guiding the transmission direction that emits beam from light source, converts line source or pointolite to the area source outgoing.
General light guide plate comprises at least one bottom surface and an exiting surface relative with this bottom surface, in order to improve the homogeneity of beam projecting, generally surface micro-structure is set in the bottom surface of light guide plate, as V-type groove structure, be used for destroying the total reflection condition of light in the light guide plate internal transmission, and make its scattering improve the homogeneity of light guide plate outgoing beam, and then promote the overall performance of backlight module.
At present, the manufacture method of light guide board microstructure roughly has following several: screen printing formula, sandblast and etching formula, machining formula and photoresistance photoetching mold formula, wherein photoresistance photoetching mold formula is to use the photoresistance coated substrate, photoresistance is after exposure, being developed in the shape that molds microstructure on the substrate, turn over mould mode moulding one die through electroforming again, utilize the mode formed light conductive plate of die again by plastics ejaculation or hot pressing.
Seeing also Fig. 1, is a kind of light guiding board mould core manufacture method that the TaiWan, China patent announcement of on Dec 21st, 2002 bulletin is disclosed for No. 514766, and its step comprises: apply one deck photoresist on a planar substrates; With aforementioned photoresist exposure imaging, to constitute some photoresistance patterns; Plant attached layer of copper crystal seed at this planar substrates and some photoresistance patterned surfaces; Become a die in the electroforming mode at this planar substrates surface electrical cast; This die and this substrate surface are broken away from; The copper crystal seed etching on this die surface is removed.
But, the light guiding board mould core of this kind manufacture method gained, when passing through the mode formed light conductive plate of plastics ejaculation or hot pressing again, because the V-type groove structure of made light guide plate is less, be generally 50～100 microns, penetrate or during hot pressing since the V-type groove structure that factors such as mould temperature, pressure and exhaust can cause light guide plate easy-formation not can't accurately obtain required V-type groove structure, thereby influence the light extraction efficiency of whole light guide plate.
[summary of the invention]
In order to overcome in the prior art on the light guide plate the not problem of easy-formation of microstructure, but the invention provides a kind of light guiding board mould core manufacture method of precise forming light guide plate V-type groove structure.
The technical scheme that technical solution problem of the present invention is adopted is: provide a kind of light guiding board mould core manufacture method may further comprise the steps: a substrate with V-type groove structure is provided; On the V-type groove structure of this substrate, apply a photoresist layer, to form the substrate that thickness has photoresist layer uniformly; Utilize a light shield with predetermined pattern that this photoresist layer is exposed, develop then, make the V-type groove structure top of this substrate form an overshooting shape light resistance structure; Plating one metal film layer on this substrate and this raised structures; Form a metal level through electroforming at this metallic film laminar surface; With this metal film layer and metal level and strippable substrate, obtain a metal light guiding board mould core with exhaust structure.
Compared to existing technology, the invention has the beneficial effects as follows: the metal light guiding board mould core of manufacturing method for insert gained of the present invention has an exhaust structure, when passing through the mode formed light conductive plate of plastics ejaculation or hot pressing again, can smoothly the gas between die and the light guide plate be discharged smoothly, make the die surface fit fully with the light guide plate surface, and by control suitable mould temperature and pressure, make the V-type groove structure of light guide plate be easy to moulding, promptly obtain the high V-type groove structure of degree of accuracy, thereby guarantee the light extraction efficiency of whole light guide plate.
[description of drawings]
Fig. 1 is a kind of prior art light guiding board mould core manufacture method process flow diagram.
Fig. 2 is a light guiding board mould core manufacture method process flow diagram of the present invention.
Fig. 3 is the substrate synoptic diagram of tool V-type groove structure of the present invention.
Fig. 4 is that the photoresistance of light guiding board mould core manufacture method of the present invention applies synoptic diagram.
Fig. 5 is the substrate synoptic diagram that light guiding board mould core manufacture method of the present invention obtains through overexposure, development.
Fig. 6 is the depositing metal films layer synoptic diagram of light guiding board mould core manufacture method of the present invention.
Fig. 7 is the electroforming synoptic diagram of light guiding board mould core manufacture method of the present invention.
Fig. 8 is the light guiding board mould core synoptic diagram of light guiding board mould core manufacture method gained of the present invention.
[embodiment]
Seeing also Fig. 2, is the manufacturing process of light guiding board mould core manufacture method of the present invention, and it may further comprise the steps: a substrate with V-type groove structure is provided; On the V-type groove structure of this substrate, apply a photoresist layer, to form the substrate that thickness has photoresist layer uniformly; Utilize a light shield with predetermined pattern that this photoresist layer is exposed, develop then, make the V-type groove structure top of this substrate form an overshooting shape light resistance structure; Plating one metal film layer on this substrate and this raised structures; Form a metal level through electroforming at this metallic film laminar surface; With this metal film layer and metal level and strippable substrate, obtain a metal light guiding board mould core with exhaust structure.
Please consult Fig. 3 together, one substrate 10 with V-type groove structure 11 is provided, wherein, this substrate 10 is polymethylmethacrylate (Poly Methyl Methacrylate, PMMA), also can adopt other materials such as glass, this substrate 10 has V-type groove structure 11, and this V-type groove structure 11 is to be made by methods such as traditional screen printing formula, sandblast and etching formula, machining formula or photoresistance photoetching mold formulas.
On the V-type groove structure 11 of this substrate 10, apply a photoresist layer 20, to form the substrate that thickness has photoresist layer uniformly, as shown in Figure 4.Wherein, this photoresist layer 20 is organic photoresist materials, can adopt positive photoresist, also can adopt negative photoresist.The painting method of this photoresist layer 20 adopts spin coating method, also can adopt other methods such as spraying process.
Please consult Fig. 5 together, utilize a light shield with predetermined pattern that this photoresist layer is exposed, develop then, make to form an overshooting shape light resistance structure 20a on the V-type groove structure 11 of this substrate.Light shield (figure does not show) is aimed at substrate 10, carried out step of exposure.Wherein, the light source of exposure is ultraviolet ray, adopts the exposure of projection exposure technology, and promptly this light shield is parallel to substrate 10.The light that light source sends sees through light shield through optical system (figure does not show) and exposes on the substrate 10 that applies photoresist layer 20, be subjected to the photoresistance generation photosensitized reaction of irradiate light, develop through developer, the photoresistance that photosensitized reaction takes place is not dissolved, forms an overshooting shape light resistance structure 20a.This overshooting shape light resistance structure 20a thickness is 1～10 micron, and the requirement of factor such as mould temperature and pressure is other value in the time of also can be according to the light guide plate moulding.This developer is a methyl isobutyl ketone, and spray developing liquid on substrate 10, and substrate remained static 30～60 seconds, and it is fully reacted can be with the design transfer of light shield to substrate 10.
As shown in Figure 6, plating one metal film layer 30 on this substrate 10 and this photoresistance raised structures 20a.Substrate 10 after developing is put into sputter machine (figure does not show) cavity, set working pressure 0.05torr, substrate 10 is heated to 150 ℃, feed electricity slurry reacting gas, the control reaction time, surface deposition one layer thickness at substrate 10 and this photoresistance raised structures 20a is the metal film layer 30 of 200～500 , and this metal film layer 30 also can be obtained by other deposition processs such as evaporations, and this metallic film is a copper.
As shown in Figure 7, form a metal level 40 through electroforming on these metal film layer 30 surfaces.Substrate 10 is inserted in the electroforming solution, carry out electrodeless electroforming step to form metal level 40.Wherein, this electroforming solution provides the potpourri of metal ion solution, hypophosphites and promoter etc.It is nickel phosphide solution that metal ion solution is provided, and also can be other solution such as nickelous sulfate or nickel chloride; Promoter is alkali halide.In addition, this electroforming solution can comprise also that PH correctives, wetting agent, polishing material wait and strengthens the electroforming effect.This electroforming solution is an acid solution, also can be alkaline solution.The time that this substrate 10 is placed on electroforming solution is provided with according to required metal level 40 thickness.Metal level 40 thickness of present embodiment can reach 0.4～2mm, and by electrodeless electroforming, this metal level 40 is formed on this metal film layer 30.
As shown in Figure 8, this metal film layer 30 and metal level 40 and this substrate 10 are peeled off, obtained a metal light guiding board mould core 60 with exhaust structure 50.This metal film layer 30 and metal level 40 are peeled off with substrate 10 and this photoresistance projection 20a of mechanism, obtain cubic metal characters or patterns structural model by metal film layer 30 and metal level 40 integration, this model is die 60, this die 60 has an exhaust structure 50, the degree of depth of this exhaust structure 50 is the thickness of this overshooting shape light resistance structure 20a, and the requirement of factor such as mould temperature and pressure changes in the time of also can be according to the light guide plate moulding.
The metal light guiding board mould core of manufacturing method for insert gained of the present invention has an exhaust structure, when passing through the mode formed light conductive plate of plastics ejaculation or hot pressing, can smoothly the gas between die and the light guide plate be discharged smoothly, make the die surface fit fully with the light guide plate surface, and by control suitable mould temperature and pressure, make the V-type groove structure of light guide plate be easy to moulding, promptly obtain the high V-type groove structure of degree of accuracy, thereby guarantee the light extraction efficiency of whole light guide plate.
Claims (10)
1. light guiding board mould core manufacture method, it may further comprise the steps: a substrate with V-type groove structure is provided; On the V-type groove structure of this substrate, apply a photoresist layer, to form the substrate that thickness has photoresist layer uniformly; Utilize a light shield with predetermined pattern that this photoresist layer is exposed, develop then, make the V-type groove structure top of this substrate form an overshooting shape light resistance structure; Plating one metal film layer on this substrate and this raised structures; Form a metal level through electroforming at this metallic film laminar surface; With this metal film layer and metal level and strippable substrate, obtain a metal light guiding board mould core with exhaust structure.
2. light guiding board mould core manufacture method according to claim 1 is characterized in that: this substrate is to be made by polymethylmethacrylate.
3. light guiding board mould core manufacture method according to claim 1 is characterized in that: this V-type groove structure is to adopt photoresistance photoetching mold to make.
4. light guiding board mould core manufacture method according to claim 1 is characterized in that: the painting method of this photoresist layer is to adopt spin coating method.
5. light guiding board mould core manufacture method according to claim 1 is characterized in that: this photoresist layer is positive photoresist.
6. light guiding board mould core manufacture method according to claim 1 is characterized in that: the thickness of this overshooting shape light resistance structure is 1 micron to 10 microns.
7. light guiding board mould core manufacture method according to claim 1 is characterized in that: the electroplate liquid that this electroforming step is used is an acid solution.
8. light guiding board mould core manufacture method according to claim 1 is characterized in that: the electroplate liquid that this electroforming step is used is a nickel phosphide solution.
9. light guiding board mould core manufacture method according to claim 1 is characterized in that: the electroplate liquid that this electroforming step is used is nickelous sulfate or nickel chloride solution.
10. light guiding board mould core manufacture method according to claim 1 is characterized in that: this metal layer thickness is 0.4mm to 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101176883A CN100376953C (en) | 2003-12-26 | 2003-12-26 | Method for manufacturing light guiding plate core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101176883A CN100376953C (en) | 2003-12-26 | 2003-12-26 | Method for manufacturing light guiding plate core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1635406A CN1635406A (en) | 2005-07-06 |
| CN100376953C true CN100376953C (en) | 2008-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2003101176883A Expired - Fee Related CN100376953C (en) | 2003-12-26 | 2003-12-26 | Method for manufacturing light guiding plate core |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101169589B (en) * | 2006-10-26 | 2010-05-12 | 中强光电股份有限公司 | Method for manufacturing light guide plate cavity |
| CN101875532B (en) * | 2009-04-30 | 2013-03-20 | 鸿富锦精密工业（深圳）有限公司 | Manufacturing method of lens mould |
| CN103171247B (en) * | 2011-12-23 | 2016-03-02 | 昆山允升吉光电科技有限公司 | A kind of electro-forming method of electrode of solar battery printing mask version |
| CN103424799B (en) * | 2012-05-15 | 2015-11-18 | 慧芳股份有限公司 | The method for making of guide plate die core component and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0488239B1 (en) * | 1990-11-28 | 1997-07-30 | Sharp Kabushiki Kaisha | Method for manufacturing a stamper |
| US5776636A (en) * | 1995-06-16 | 1998-07-07 | Kuraray Co., Ltd. | Method of manufacturing light-transmitting plates |
| CN1372161A (en) * | 2001-02-26 | 2002-10-02 | 兴隆发电子股份有限公司 | Light guiding board mould core and making method thereof |
| CN1396483A (en) * | 2001-07-13 | 2003-02-12 | 兴隆发电子股份有限公司 | Optical guide plate and method for making its module core |
| JP2003245925A (en) * | 2002-02-26 | 2003-09-02 | Towa Corp | Processing method for mold for molding light guide plate, die and light-guide plate |
-
2003
- 2003-12-26 CN CNB2003101176883A patent/CN100376953C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0488239B1 (en) * | 1990-11-28 | 1997-07-30 | Sharp Kabushiki Kaisha | Method for manufacturing a stamper |
| US5776636A (en) * | 1995-06-16 | 1998-07-07 | Kuraray Co., Ltd. | Method of manufacturing light-transmitting plates |
| CN1372161A (en) * | 2001-02-26 | 2002-10-02 | 兴隆发电子股份有限公司 | Light guiding board mould core and making method thereof |
| CN1396483A (en) * | 2001-07-13 | 2003-02-12 | 兴隆发电子股份有限公司 | Optical guide plate and method for making its module core |
| JP2003245925A (en) * | 2002-02-26 | 2003-09-02 | Towa Corp | Processing method for mold for molding light guide plate, die and light-guide plate |
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| CN1635406A (en) | 2005-07-06 |
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