CN110055501A - A kind of method of semidry method continuous type PVD plated film plastic metal temperature control - Google Patents
A kind of method of semidry method continuous type PVD plated film plastic metal temperature control Download PDFInfo
- Publication number
- CN110055501A CN110055501A CN201910309904.5A CN201910309904A CN110055501A CN 110055501 A CN110055501 A CN 110055501A CN 201910309904 A CN201910309904 A CN 201910309904A CN 110055501 A CN110055501 A CN 110055501A
- Authority
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- China
- Prior art keywords
- plated film
- temperature control
- continuous type
- metal temperature
- vacuum coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000002184 metal Substances 0.000 title claims abstract description 15
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 25
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 17
- 238000005477 sputtering target Methods 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 238000004544 sputter deposition Methods 0.000 claims abstract description 11
- 239000000498 cooling water Substances 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 claims abstract description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A kind of method that the present invention discloses semidry method continuous type PVD plated film plastic metal temperature control, comprising the following steps: step 1: drying plastic workpiece under the conditions of temperature is 55 DEG C ± 5 DEG C, transported by mechanical arm and AGV trolley to cooling hothouse；Step 2: at least after ten minutes by the dry cooling of plastic workpiece, being sent into coating chamber, wherein drying condition is 20-25 DEG C of temperature and humidity < 40%；Step 3: selecting the column sputtering target of target pipe diameter 100mm to 150mm by the modified progress medium frequency magnetron sputtering plated film of aura, being passed through 20 DEG C to 28 DEG C of cooling water, and mid frequency sputtering supply frequency is adjusted downward to 500Hz between 10000Hz；Step 4: completing semidry method vacuum coating process, temperature rise is controlled within 20 DEG C, so that the maximum temperature after workpiece plated film is no more than 60 DEG C, prevents workpiece size from deforming exception.
Description
Technical field
The present invention relates to a kind of methods of semidry method continuous type PVD plated film plastic metal temperature control.
Background technique
When existing semidry method continuous type PVD vacuum coating producing line carries out continuous quickly production, since excessive heat cannot
It is controlled and is evacuated, occurred size distortion so that product temperature rise is excessively high and scrap, therefore have to stop after producing a period of time
Line waits the cooling of producing line inner cavity, wastes a large amount of valuable working hour and occurs the undesirable plastic workpiece of size frequently.
Summary of the invention
In order to solve the above-mentioned technical problem, the purpose of the present invention is to provide a kind of semidry method continuous type PVD plated film plastic cement
The method of metallization temperature control.
The present invention is achieved through the following technical solutions:
A kind of method of semidry method continuous type PVD plated film plastic metal temperature control, comprising the following steps:
Step 1: drying plastic workpiece under the conditions of temperature is 55 DEG C ± 5 DEG C, pass through mechanical arm and AGV trolley
(Automated Guided Vehicle, automatic guided vehicle) is transported to cooling hothouse；
Step 2: at least after ten minutes by the dry cooling of plastic workpiece, being sent into coating chamber, wherein drying condition is temperature
20-25 DEG C and humidity < 40%；
Step 3: selecting target pipe diameter 100mm to 150mm's by the modified progress medium frequency magnetron sputtering plated film of aura
Column sputtering target, is passed through 20 DEG C to 28 DEG C of cooling water, and by mid frequency sputtering supply frequency be adjusted downward to 500Hz to 10000Hz it
Between；
Step 4: completing semidry method vacuum coating process, temperature rise is controlled within 20 DEG C, so that the highest after workpiece plated film
Temperature is no more than 60 DEG C, prevents workpiece size from deforming exception.
Preferably, the coating chamber is three continuous arrangements and the identical vacuum coating cavity of structure.
Preferably, the vacuum coating inside cavity is arranged with column sputtering target, the vacuum coating cavity inner wall setting
There is cavity liner plate, the cavity liner plate need to all be close to cavity inner wall.
Preferably, the vacuum coating cavity inner wall is cooling using cooling water.
Preferably, vacuum coating cavity side has vacuum pump group.
Preferably, the vacuum coating cavity bottom has mid frequency sputtering power supply.
Preferably, it is 0-3000KHz that the mid frequency sputtering power supply, which adjusts frequency range,.
Preferably, the vacuum coating inside cavity has two groups of column sputtering target groups, and every group of column sputtering target group is four
The column sputtering target of a arrangement that is square.
Of the invention has the following beneficial effects: that the present invention makes product to control continuous type PVD vacuum coating producing line
At being more than to stop line and deformation of products caused by 60 DEG C of temperature rise；So that plastic parts do not adsorbed in temperature-fall period humid air and
Steam；Productive temp is enabled to have the progress of fixed beat.
Detailed description of the invention
It, below will be to required in embodiment or description of the prior art in order to illustrate more clearly of technical solution of the present invention
The attached drawing used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, right
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Its attached drawing.
Fig. 1 is top view of the invention.
Fig. 2 is the enlarged diagram in Fig. 1 at A.
Fig. 3 is main view of the invention.
In figure: 1, cooling hothouse；2, No. 1 chamber；3, No. 2 chambers；4, No. 3 chambers；5, No. 4 chambers；6, No. 5 chambers；
7, No. 6 chambers；8, glow discharge electrode；9, vacuum pump group；10, cavity inner wall installs liner plate；11, column sputtering target；12, vacuum coating
Cavity；13, mid frequency sputtering power supply.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, carries out to the technical solution in inventive embodiments clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on this
The embodiment of invention, those of ordinary skill in the art's every other reality obtained without making creative work
Example is applied, shall fall within the protection scope of the present invention.
Reference book attached drawing 1-3, a kind of semidry method continuous type PVD plated film plastic metal equipment, including cooling drying
Room and 1-6 chamber, each cavity centre pass through a Transfer pipe connection.Wherein No. 3 chambers include vacuum coating cavity,
The vacuum coating inside cavity is arranged with column sputtering target, and the vacuum coating cavity inner wall is provided with cavity liner plate, described
Cavity liner plate need to all be close to cavity inner wall, and the cavity inner wall is cooling using cooling water, and the heat for enabling liner plate to absorb is fast
Speed passes to furnace wall and cooling water by heat transfer, cannot be transferred away in time with this thermal energy for preventing liner plate from absorbing and be changed into heat
Radiation returns vacuum environment and is absorbed by workpiece, and workpiece temperature rise is caused further to increase, and No. 3 cavity sides have vacuum pump
For group for keeping the vacuum state of inside cavity, No. 3 cavity bottoms have mid frequency sputtering power supply, are used for and Vacuum Deposition membrane cavity
To generate electromagnetic field, it is 0-3000KHz that the mid frequency sputtering power supply, which adjusts frequency range, for intracorporal column sputtering target electrical connection.Its
Middle No. 3-5 is coating chamber, and structure having the same.
Corresponding to the method that above-mentioned semidry method continuous type PVD plated film plastic metal equipment carries out temperature control, including following step
It is rapid:
Step 1: temperature be 55 DEG C ± 5 DEG C under the conditions of dry plastic workpiece, by mechanical arm and AGV trolley transport to
Cooling hothouse；
Step 2: at least after ten minutes by the dry cooling of plastic workpiece, being sent into coating chamber, wherein drying condition is temperature
20-25 DEG C and humidity < 40%；
Step 3: selecting target pipe diameter 100mm to 150mm's by the modified progress medium frequency magnetron sputtering plated film of aura
Column sputtering target, is passed through 20 DEG C to 28 DEG C of cooling water, and by mid frequency sputtering supply frequency be adjusted downward to 500Hz to 10000Hz it
Between；
Step 4: completing semidry method vacuum coating process, temperature rise is controlled within 20 DEG C, so that the highest after workpiece plated film
Temperature is no more than 60 DEG C, prevents workpiece size from deforming exception.
The preferred embodiment of the present invention has shown and described in above description, as previously described, it should be understood that the present invention is not office
Be limited to form disclosed herein, should not be regarded as an exclusion of other examples, and can be used for various other combinations, modification and
Environment, and can be changed within that scope of the inventive concept describe herein by the above teachings or related fields of technology or knowledge
It is dynamic.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be appended by the present invention
In scope of protection of the claims.
Claims (8)
1. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control, which comprises the following steps:
Step 1: drying plastic workpiece under the conditions of temperature is 55 DEG C ± 5 DEG C, transported by mechanical arm and AGV trolley to cooling
Hothouse；
Step 2: at least after ten minutes by the dry cooling of plastic workpiece, being sent into coating chamber, wherein drying condition is temperature 20-
25 DEG C and humidity < 40%；
Step 3: selecting the column of target pipe diameter 100mm to 150mm by the modified progress medium frequency magnetron sputtering plated film of aura
Sputtering target is passed through 20 DEG C to 28 DEG C of cooling water, and mid frequency sputtering supply frequency is adjusted downward to 500Hz between 10000Hz；
Step 4: completing semidry method vacuum coating process, temperature rise is controlled within 20 DEG C, so that the maximum temperature after workpiece plated film
No more than 60 DEG C, prevent workpiece size from deforming exception.
2. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control according to claim 1, feature exist
In the coating chamber is three continuous arrangements and the identical vacuum coating cavity of structure.
3. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control according to claim 2, feature exist
In the vacuum coating inside cavity is arranged with column sputtering target, and the vacuum coating cavity inner wall is provided with cavity liner plate, institute
Cavity inner wall need to be all close to by stating cavity liner plate.
4. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control according to claim 3, feature exist
In the vacuum coating cavity inner wall is cooling using cooling water.
5. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control according to claim 4, feature exist
In vacuum coating cavity side has vacuum pump group.
6. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control according to one of claim 2-5,
It is characterized in that, the vacuum coating cavity bottom has mid frequency sputtering power supply.
7. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control according to claim 6, feature exist
In it is 0-3000KHz that the mid frequency sputtering power supply, which adjusts frequency range,.
8. a kind of method of semidry method continuous type PVD plated film plastic metal temperature control according to claim 3, feature exist
In the vacuum coating inside cavity has two groups of column sputtering target groups, and every group of column sputtering target group is four arrangements that are square
Column sputtering target.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309904.5A CN110055501A (en) | 2019-04-17 | 2019-04-17 | A kind of method of semidry method continuous type PVD plated film plastic metal temperature control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309904.5A CN110055501A (en) | 2019-04-17 | 2019-04-17 | A kind of method of semidry method continuous type PVD plated film plastic metal temperature control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110055501A true CN110055501A (en) | 2019-07-26 |
Family
ID=67319339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910309904.5A Pending CN110055501A (en) | 2019-04-17 | 2019-04-17 | A kind of method of semidry method continuous type PVD plated film plastic metal temperature control |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110055501A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020063054A1 (en) * | 2000-07-27 | 2002-05-30 | Marshall Michael L. | Low temperature cathodic magnetron sputtering |
| CN102127764A (en) * | 2011-01-28 | 2011-07-20 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
| CN103122452A (en) * | 2013-03-11 | 2013-05-29 | 大连理工大学 | Surface metallization method for foamed plastic by adopting high-power pulse magnetron sputtering |
| JP2013221186A (en) * | 2012-04-17 | 2013-10-28 | Nikuni:Kk | Sputtering film deposition method |
| CN109338320A (en) * | 2018-11-19 | 2019-02-15 | 江阴市光科光电精密设备有限公司 | A kind of technique for plastic part surface magnetron sputtering plating |
| CN109402597A (en) * | 2018-10-30 | 2019-03-01 | 厦门建霖健康家居股份有限公司 | Vacuum coating system is directly electroplated in a kind of semidry method processing plastic cement |
-
2019
- 2019-04-17 CN CN201910309904.5A patent/CN110055501A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020063054A1 (en) * | 2000-07-27 | 2002-05-30 | Marshall Michael L. | Low temperature cathodic magnetron sputtering |
| CN102127764A (en) * | 2011-01-28 | 2011-07-20 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
| JP2013221186A (en) * | 2012-04-17 | 2013-10-28 | Nikuni:Kk | Sputtering film deposition method |
| CN103122452A (en) * | 2013-03-11 | 2013-05-29 | 大连理工大学 | Surface metallization method for foamed plastic by adopting high-power pulse magnetron sputtering |
| CN109402597A (en) * | 2018-10-30 | 2019-03-01 | 厦门建霖健康家居股份有限公司 | Vacuum coating system is directly electroplated in a kind of semidry method processing plastic cement |
| CN109338320A (en) * | 2018-11-19 | 2019-02-15 | 江阴市光科光电精密设备有限公司 | A kind of technique for plastic part surface magnetron sputtering plating |
Non-Patent Citations (1)
| Title |
|---|
| 张亚非 等编著: "《集成电路制造技术》", 上海交通大学出版社, pages: 118 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 361000 First and Five Floors of Main Building of No. 198-204 Yingyao Road, Jimei District, Xiamen City, Fujian Province Applicant after: XIAMEN APISI INTELLIGENT MANUFACTURING SYSTEM Co.,Ltd. Address before: 618, 621 and 622, 6th floor, 1616 Guankou Middle Road, Jimei District, Xiamen City, Fujian Province, 361000 Applicant before: XIAMEN APISI INTELLIGENT MANUFACTURING SYSTEM Co.,Ltd. |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190726 |