CN110049633B - Binding material, Micro LED substrate and binding method - Google Patents

Binding material, Micro LED substrate and binding method Download PDF

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Publication number
CN110049633B
CN110049633B CN201910319117.9A CN201910319117A CN110049633B CN 110049633 B CN110049633 B CN 110049633B CN 201910319117 A CN201910319117 A CN 201910319117A CN 110049633 B CN110049633 B CN 110049633B
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China
Prior art keywords
chip
binding
back plate
driving back
driving
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CN201910319117.9A
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CN110049633A (en
Inventor
王美丽
王磊
徐婉娴
王飞
梁轩
王慧娟
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN201910319117.9A priority Critical patent/CN110049633B/en
Publication of CN110049633A publication Critical patent/CN110049633A/en
Priority to PCT/CN2020/076746 priority patent/WO2020211539A1/en
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

The invention discloses a binding material, a Micro LED substrate and a binding method, relates to the technical field of display, and mainly aims to bind a chip with a smaller size. The main technical scheme of the invention is as follows: the binding material is used for pre-binding and binding the chip and the driving back plate; the bonding material includes a conductive component having a size less than or equal to a size of a pin of the chip. According to the binding material provided by the invention, the binding material comprises the conductive components with the size smaller than or equal to the chip pins, so that the binding material can be used for binding a chip with a small size, such as a micro LED chip, so as to bind the chip with the small size, and can be pre-bound before binding, so that dislocation in the subsequent binding process of heating and pressurizing the chip and the driving back plate can be prevented, and the binding of the chip and the driving back plate is realized.

Description

Binding material, Micro LED substrate and binding method
Technical Field
The invention relates to the technical field of display, in particular to a binding material, a Micro LED substrate and a binding method.
Background
The traditional LED chip mostly adopts an ACF (Anisotropic Conductive Film) process to bind the LED chip. However, the currently used micro led chip is micron-sized, and the traditional ACF-based bonding process is difficult to bond such a chip with a small size as the micro led chip.
Therefore, how to bind the chips with smaller size becomes an urgent problem to be solved.
Disclosure of Invention
In view of this, embodiments of the present invention provide a bonding material, a Micro LED substrate, and a bonding method, and mainly aim to bond a chip with a smaller size.
In order to achieve the purpose, the invention mainly provides the following technical scheme:
on one hand, the embodiment of the invention provides a binding material, which is used for pre-binding and binding a chip and a driving back plate;
the bonding material includes a conductive component having a size less than or equal to a size of a pin of the chip.
In this technical solution, the binding material further includes an adhesive component, and the adhesive component is used to adhere the chip and the driving back plate, so that the chip and the driving back plate are pre-bound.
In the technical scheme, after the chip or the driving back plate is heated, the viscous component volatilizes;
and after the chip or the driving back plate is pressurized, the chip is bound with the driving back plate.
In this technical solution, the conductive component includes a conductive particle or a one-dimensional structural material or a two-dimensional structural material.
On the other hand, the embodiment of the invention also provides a Micro LED substrate, which comprises the binding material; a back plate and Micro LEDs;
the binding material is arranged between the chip and the driving back plate.
In another aspect, an embodiment of the present invention further provides a binding method, where the binding method includes:
arranging a binding material on the chip or the driving back plate, wherein the binding material comprises a conductive component, and the size of the conductive component is smaller than or equal to that of the pins of the chip;
pre-binding the chip and the driving back plate;
and binding the chip and the driving back plate.
In this technical solution, the pre-binding the chip and the driving backplane includes:
aligning the chip loaded with the binding material with the binding metal of the driving back plate;
arranging the driving back plate on the binding material so as to pre-bind the chip and the driving back plate; or
Aligning the binding metal of the driving back plate loaded with the binding material with the chip;
and arranging the chip on the binding material so as to pre-bind the chip and the driving back plate.
In this technical solution, the binding material further includes an adhesive component, and the adhesive component is used to adhere the chip and the driving back plate, so that the chip and the driving back plate are pre-bound.
In this technical solution, the binding the chip and the driving backplane includes:
heating the chip and/or the driving back plate to volatilize the viscous component;
and pressurizing the chip and/or the driving back plate, and binding the chip and the driving back plate through the conductive component.
In this technical solution, the setting of the binding material on the chip or the driving backplane includes:
and setting a binding material on the chip or the driving back plate through printing or silk screen printing.
In this technical solution, the setting of the binding material on the chip or the driving backplane includes:
the conductive component comprises conductive particles or a one-dimensional structural material or a two-dimensional structural material.
The embodiment of the invention provides a binding material, a Micro LED substrate and a binding method, wherein the binding material is arranged between a chip and a driving backboard and is used for pre-binding and binding the chip and the driving backboard in sequence, the binding material comprises a conductive component, the size of the conductive component is smaller than or equal to that of a chip pin, so that the binding material can bind the chip with smaller size and the driving backboard, and the chip and the driving backboard are pre-bound before the chip and the driving backboard are bound. The binding material in the prior art is micron-sized because the micro LED chip is small in size, so that the binding process of the ACF in the prior art cannot bind the micro LED chip, and the binding material provided by the invention comprises conductive components with the size smaller than or equal to the chip pin, so that the binding material can be used for binding the micro LED chip with a small size, binding the chip with a small size, preventing errors from being generated in the binding process, and binding the chip and the driving backboard.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
FIG. 1 is a top view of a portion of a Micro LED substrate according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a partial Micro LED substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a Micro LED substrate according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a Micro LED substrate after being bound according to an embodiment of the present invention;
fig. 5 is a flowchart of a binding method according to an embodiment of the present invention;
fig. 6 is a flowchart of another binding method according to an embodiment of the present invention;
FIG. 7 is a flowchart of a further binding method according to an embodiment of the present invention;
fig. 8 is a flowchart of another binding method according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the binding material, Micro LED substrate and binding method according to the present invention, and the specific implementation, structure, features and effects thereof will be made with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1 to 4, an embodiment of the present invention provides a bonding material 12 for bonding a chip 14 and a driving back plate, wherein the bonding material 12 includes a conductive component 122, and a size of the conductive component 122 is smaller than or equal to a size of a pin of the chip 14.
The binding material 12 provided by the embodiment of the invention is arranged between a chip 14 and a driving backboard, the binding material 12 is used for pre-binding and binding the chip and the driving backboard in sequence, the binding material 12 comprises a conductive component 122, and the size of the conductive component 122 is smaller than or equal to that of a pin of the chip 14, so that the binding material 12 can bind the chip 14 with a smaller size and the driving backboard, and the chip and the driving backboard are pre-bound before the chip and the driving backboard are bound, the technical scheme provided by the invention is mainly used for the chip with the smaller size, and even if the displacement of the chip with the smaller size is smaller, the chip with the smaller size has a larger influence on the chip due to the small size, the technical scheme provided by the invention can prevent errors caused by the displacement by pre-binding before the binding, the problem that the bonding material 12 in the prior art cannot bond the micro LED chip in the ACF bonding process in the prior art because the micro LED chip is micron-sized and the micro LED chip is small in size is solved, according to the bonding material 12 provided by the invention, the bonding material 12 comprises the conductive component 122 with the size smaller than or equal to the pin of the chip 14, so that the bonding material 12 can be used for bonding the chip 14 with the small size of the micro LED chip 14, the bonding of the chip 14 with the small size is realized, errors can be prevented from being generated in the bonding process, and the bonding of the chip 14 and the driving back plate is further realized.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1 to 3, in the embodiment of the present invention, the binding material 12 further includes an adhesive component 124, and the adhesive component 124 is used for adhering the chip 14 to the driving back plate, so as to pre-bind the chip 14 to the driving back plate.
In this embodiment, the binding material 12 is made of a conductive adhesive component, the binding material 12 includes a conductive component 122 and an adhesive component 124, the binding material 12 is placed on the chip 14 by printing or screen printing, and then the driving back plate is disposed on the binding material 12, so as to complete adhesion between the chip 14 and the driving back plate, thereby realizing pre-binding between the chip and the driving back plate, and the pre-binding can prevent dislocation in the subsequent binding process of heating and pressurizing the chip and the driving back plate, thereby preventing errors from being generated in the binding process, and realizing binding between the chip and the driving back plate.
In the embodiment of the invention, after the chip or the driving back plate is heated, the viscous component volatilizes;
when the chip or the driving back plate is pressurized, the chip is bound with the driving back plate.
In this embodiment, the binding material 12 is made of a conductive adhesive component, the binding material 12 includes a conductive component 122 and an adhesive component 124, the binding material 12 binds the chip 14 and the driving back plate by placing the binding material 12 on the chip 14 by printing or screen printing, as shown in fig. 1 and fig. 2, wherein the binding material 12 includes a conductive component 122 and an adhesive component 124, as shown in fig. 3, precisely aligning the chip 14 with the binding material 12 with the binding metal 16 of the driving back plate, after precisely aligning the chip 14 with the binding metal 16 of the driving back plate, placing the driving back plate on the binding material 12, and completing the adhesion between the chip 14 and the driving back plate, thereby pre-binding the chip and the driving back plate, and preventing the chip and the driving back plate from being misaligned during the subsequent binding process of heating and pressing, as shown in fig. 4, then, the driving back plate or the chip 14 is heated, the heating temperature is between 100 and 250 ℃, the heating temperature can be other temperatures, the heating temperature is higher than the boiling point of the viscous component 124 and can volatilize the viscous component 124, the heating time is also higher than the volatilizing temperature of the viscous component 124, the viscous component 124 in the binding material 12 is volatilized for the purpose of heating the chip 14 or the driving back plate, so that the impedance of the binding material 12 is reduced, only the conductive component 122 remains between the chip 14 and the driving back plate, then the chip 14 or the driving back plate is pressurized, the magnitude and the duration of pressurization are both in order to finish the binding of the conductive component 122 with the chip 14 and the driving back plate respectively, the chip 14 and the driving back plate are bound through the conductive component 122 of the binding material 12 through the pressurization, and the binding of the chip and the driving back plate is realized through the conductive component in the binding material 12, and finishing the binding.
Optionally, the bonding process between the chip 14 and the driving backplate may also be that the bonding material 12 is placed on the bonding metal 16 of the driving backplate by printing or screen printing, wherein the bonding material 12 includes a conductive component 122 and a viscous component 124, the bonding metal 16 of the driving backplate loaded with the bonding material 12 is precisely aligned with the chip 14, after the precise alignment between the chip 14 and the bonding metal 16 of the driving backplate is achieved, the chip 14 is disposed on the bonding material 12, the bonding between the chip 14 and the driving backplate is completed, so as to achieve the pre-bonding between the chip and the driving backplate, and the pre-bonding between the chip and the driving backplate achieved by bonding can prevent the subsequent dislocation in the bonding process of heating and pressurizing the chip and the driving backplate, and then the driving backplate or the chip 14 is heated at a temperature of 100 to 250 ℃, so as to heat the chip 14 or the driving backplate and volatilize the viscous component 124 in the bonding material 12, so that only the conductive component 122 remains between the chip 14 and the driving back plate, and then the chip 14 or the driving back plate is pressurized, so that the chip 14 and the driving back plate are bonded by the conductive component in the bonding material 12.
Optionally, the driving back plate or chip 14 may be heated and pressurized simultaneously to reduce the time required for the chip 14 to bind with the driving back plate.
In this embodiment, the first substrate 18 is disposed on the side of the driving back plate away from the chip 14, the second substrate 20 is also disposed on the side of the chip 14 away from the driving back plate, and when the chip 14 or the driving back plate is heated and pressurized, the chip 14 or the driving back plate is heated and pressurized by heating and pressurizing the first substrate 18 or the second substrate 20.
In an embodiment of the present invention, the conductive elements 122 comprise conductive particles or one-dimensional structural materials or two-dimensional structural materials.
In this embodiment, the conductive component 122 includes a conductive particle, a one-dimensional structural material, or a two-dimensional structural material, where the conductive particle, the one-dimensional structural material, or the two-dimensional structural material is a nanoscale material, the conductive particle includes a conductive particle such as gold, silver, or graphite, the one-dimensional structural material includes a nanowire, a nanorod, or a nanotube, and the two-dimensional structural material includes a disk-shaped material, a sheet-shaped material, or the like.
Optionally, the chip 14 is a micro led chip with dimensions in the micrometer range, and the conductive component 122 of the binding material 12 provided by the present invention has dimensions in the nanometer range. When the chip is of other sizes, the conductive component may also be of other sizes, as long as the size of the conductive component is less than or equal to the size of the chip.
As shown in fig. 3, another embodiment of the present invention provides a Micro LED substrate 1, including the aforementioned binding material 12, a driving back plate, and a Micro LED chip; the binding material 12 is disposed between the Micro LED chip and the driving back plate.
In the embodiment of the invention, the Micro LED substrate 1 comprises a binding material 12, a driving back plate and a Micro LED chip, the binding material 12 is arranged between the Micro LED chip and the driving back plate, the binding material 12 is used for pre-binding and binding the Micro LED chip and the driving back plate in sequence, the binding material 12 comprises a conductive component 122 and a viscous component, the size of the conductive component 122 is smaller than or equal to the size of a pin of the Micro LED chip, so that the binding material 12 can bind the Micro LED chip with smaller size with the driving back plate, and the Micro LED chip and the driving back plate are pre-bound through the viscous component before the Micro LED chip and the driving back plate are bound, thereby preventing errors caused by displacement, solving the problem that the ACF binding material 12 in the prior art cannot bind the Micro LED chip because the Micro LED chip is micron size and the LED chip has smaller size, so the binding process in the prior art cannot bind the Micro LED chip, the Micro LED substrate 1 provided by the invention comprises the binding material 12, wherein the binding material 12 is arranged between a Micro LED chip and a driving back plate, and the binding material 12 comprises the conductive component 122 with the size smaller than or equal to that of a pin of the Micro LED chip, so that the binding material 12 can be used for binding the Micro LED chip with a small size, the Micro LED chip is bound, errors can be prevented from being generated in the binding process, and the Micro LED chip in the Micro LED substrate 1 is bound with the driving back plate.
In the embodiment of the invention, the binding process of the Micro LED substrate 1 is that the binding metal 16 or the Micro LED chip of the driving back plate is placed with the binding material 12 by printing or silk screen printing, wherein the binding material 12 comprises the conductive component 122 and the viscous component 124, then the binding metal 16 of the driving back plate loaded with the binding material 12 is precisely aligned with the Micro LED chip or the Micro LED chip loaded with the binding material 12 is precisely aligned with the binding metal 16 of the driving back plate, after the precise alignment of the Micro LED chip and the binding metal 16 of the driving back plate is realized, the Micro LED chip is arranged on the binding material 12 or the driving back plate is arranged on the Micro LED chip, the adhesion of the Micro LED chip and the driving back plate is completed, thereby the pre-binding of the Micro LED chip and the driving back plate is realized, and the pre-binding of the Micro LED chip and the driving back plate by the adhesion can prevent the dislocation in the subsequent heating and pressurizing process of the Micro LED chip and the driving back plate, and then heating the driving back plate or the core Micro LED chip at a temperature of between 100 and 250 ℃, volatilizing the viscous component 124 in the binding material 12 for the purpose of heating the Micro LED chip or the driving back plate, so that only the conductive component 122 is left between the Micro LED chip and the driving back plate, and then pressurizing the Micro LED chip or the driving back plate, so that the Micro LED chip in the Micro LED substrate 1 and the driving back plate are bound through the conductive component in the binding material 12.
In this embodiment, the Micro LED substrate 1 further includes a first substrate 18 disposed on a side of the driving back plate away from the Micro LED chips, and a second substrate 20 disposed on a side of the Micro LED chips away from the driving back plate, and when the Micro LED chips or the driving back plate are heated and pressurized, the heating and pressurizing of the Micro LED chips or the driving back plate can be realized by heating and pressurizing the first substrate 18 or the second substrate 20.
As shown in fig. 5, another aspect of the embodiment of the present invention provides a binding method, including:
101: setting a binding material on the chip or the driving back plate, wherein the binding material comprises a conductive component, and the size of the conductive component is smaller than or equal to that of a pin of the chip;
in the embodiment of the invention, the binding material is arranged on the chip or the driving backboard and used for binding the chip and the driving backboard, wherein the binding material comprises a conductive component, and the size of the conductive component is smaller than or equal to that of the chip pin, so that the binding material can be used for binding the chip with the size larger than that of the conductive component in the binding material, and the binding of the chip and the driving backboard is realized through the binding material.
102: and pre-binding the chip and the driving back plate.
In the embodiment of the invention, before the binding, the chip and the driving backboard are bound, so that the chip and the driving backboard are prevented from shifting or misplacing in the subsequent binding process.
103: and binding the chip with the driving back plate.
After the chip and the driving back plate are pre-bound, the chip and the driving back plate are bound to realize the binding of the chip and the driving back plate.
The invention provides a binding method, which is characterized in that binding materials are arranged on a chip or a driving backboard, and then the chip and the driving backboard are pre-bound, the technical scheme provided by the invention is mainly used for a chip with a smaller size, and even if the displacement of the chip with the smaller size is smaller, the chip and the driving backboard are greatly influenced due to the small size of the chip, the chip and the driving backboard are bound by the pre-binding before the binding, so that errors caused by the displacement can be prevented, and then the chip and the driving backboard are bound, wherein the binding materials comprise conductive components, the size of the conductive components is smaller than or equal to the size of chip pins, the binding method in the prior art cannot realize the binding of the micro LED chip with the smaller size because the micro LED chip is in a micron-sized size and the micron-sized size is smaller, and the binding materials in the binding method provided by the invention comprise the conductive components with the size smaller than the size of the chip pins, therefore, the binding material can be used for binding the micro LED chip with a small size, can prevent errors in the binding process, and realizes the binding of the chip and the driving back plate.
As shown in fig. 6, a binding method provided by the present invention further includes:
setting a binding material on the chip or the driving back plate, wherein the binding material comprises a conductive component, and the size of the conductive component is smaller than or equal to that of a pin of the chip;
202, aligning the chip loaded with the binding material with the binding metal of the driving back plate;
203, arranging the driving back plate on the binding material to pre-bind the chip and the driving back plate;
and 204, binding the chip and the driving backboard.
In this embodiment, as shown in fig. 1 to 3, a binding material is first set on the chip, and then the binding metal of the chip and the driving back plate is precisely aligned, so as to ensure that the binding position of the subsequent chip and the driving back plate is correct, and then the driving back plate is set on the binding material, so as to realize pre-binding of the chip and the driving back plate, thereby preventing errors caused by displacement, and then the chip and the driving back plate are bound.
As shown in fig. 7, another binding method provided by the present invention includes:
301, arranging a binding material on the chip or the driving back plate, wherein the binding material comprises a conductive component, and the size of the conductive component is smaller than or equal to that of the pin of the chip;
302, aligning the binding metal of the driving back plate loaded with the binding material with the chip;
303, arranging the chip on the binding material to pre-bind the chip and the driving back plate;
and 304, binding the chip with the driving backboard.
In this embodiment, as shown in fig. 1 to 3, a binding material is first set on the driving backplate, then the binding metal of the driving backplate and the chip are precisely aligned, so as to ensure that the binding position of the subsequent chip and the driving backplate is correct, and then the driving backplate is set on the binding material, so as to realize the pre-binding of the chip and the driving backplate, thereby preventing errors caused by displacement, and then binding the chip and the driving backplate.
In this embodiment, the step of providing the binding material between the chip and the driving back plate includes the steps of firstly providing the binding material on the binding metal on the driving back plate, then precisely aligning the driving back plate loaded with the binding material with the chip to ensure that the subsequent binding position between the chip and the driving back plate is correct, and then providing the chip on the binding material to ensure that the binding material is provided between the chip and the driving back plate.
In an embodiment of the invention, the binding material is made of an electrically conductive adhesive composition, which further comprises an adhesive composition.
In this embodiment, the binding material is made of an electrically conductive adhesive composition, the binding material comprises an electrically conductive composition and an adhesive composition, the chip is bonded with the driving backboard through the viscous component of the binding material, and then the binding of the chip and the driving backboard is completed, the binding process comprises the steps of firstly arranging the binding material on the chip to enable the chip to be bonded with the binding material, then accurately aligning the chip loaded with the binding material with the binding metal of the driving back plate, after the accurate alignment of the bonding metal between the chip and the driving back plate is realized, the driving back plate is arranged on the bonding material to bond the driving back plate and the bonding material, thereby realizing the pre-binding of the chip and the driving backboard, then binding the chip and the driving backboard, and the pre-binding of the chip and the driving back plate realized by adhesion can prevent dislocation in the subsequent binding process of heating and pressurizing the chip and the driving back plate.
Optionally, the binding material is arranged on the driving back plate to enable the binding material to be bonded with the driving back plate, then the binding metal of the driving back plate loaded with the binding material is accurately aligned with the chip, after the accurate alignment of the binding metal of the driving back plate and the chip is achieved, the chip is arranged on the binding material to enable the chip to be bonded on the binding material, then the chip is bonded with the driving back plate, and then the chip is bonded with the driving back plate.
In the embodiment of the present invention, the binding the chip and the driving backplane includes: the chip and/or the driving back plate are heated to volatilize the viscous component.
In the embodiment of the present invention, the binding the chip and the driving backplane further includes: and pressurizing the chip and/or the driving back plate so as to bind the chip and the driving back plate.
As shown in fig. 8, a binding method provided by the present invention includes:
401, setting a binding material on the chip or the driving back plate by printing or silk screen printing, wherein the size of the conductive component is smaller than or equal to that of the chip pin;
402, aligning the chip and the binding metal of the driving backboard on the binding material;
403, arranging a driving back plate on the binding material;
404, heating the chip and/or the driving back plate;
the chip and/or the drive back plate are pressurized 405.
In the embodiment, the binding material is made of conductive adhesive components and comprises conductive components and adhesive components, the binding method of the chip and the driving back plate comprises the steps of placing the binding material on the chip by printing or screen printing, wherein the binding material comprises the conductive components and the adhesive components, precisely aligning the chip loaded with the binding material with the binding metal of the driving back plate, arranging the driving back plate on the binding material after precisely aligning the binding metal of the chip and the driving back plate, adhering the chip and the driving back plate, pre-binding the chip and the driving back plate, preventing dislocation in the subsequent binding process of heating and pressurizing the chip and the driving back plate, preventing errors in the binding process, pre-binding the chip and the driving back plate, and heating the driving back plate or the chip, the heating temperature is between 100 and 250 ℃, wherein the heating temperature can be other temperatures, the heating temperature is based on the temperature which is higher than the boiling point of the viscous component and can volatilize the viscous component, the heating time is based on the time that the viscous component can be volatilized, the viscous component in the binding material is volatilized for the purpose of heating the chip or the driving back plate, only the residual conductive component is left between the chip and the driving back plate, the impedance of the binding material is reduced, then the chip or the driving back plate is pressurized, the pressurizing size and the pressurizing duration are based on the purpose that the conductive component can be bound with the chip and the driving back plate respectively, the chip and the driving back plate are bound through the conductive component of the binding material through pressurization, the binding of the chip and the driving back plate is realized through the conductive component in the binding material, and the binding is completed.
Optionally, the binding process of the chip and the driving back plate can also be that binding materials are placed on binding metal of the driving back plate in a printing or screen printing mode, wherein the binding materials comprise conductive components and viscous components, then the driving back plate binding metal loaded with the binding materials is accurately aligned with the chip, the chip is arranged on the binding materials after the accurate alignment of the chip and the driving back plate binding metal is realized, the bonding of the chip and the driving back plate is completed, then the driving back plate or the chip is heated, the heating temperature is 100-250 ℃, the viscous components in the binding materials are volatilized in the heating purpose of the chip or the driving back plate, only the conductive components are left between the chip and the driving back plate, then the chip or the driving back plate is pressurized, and the chip and the driving back plate are bound through pressurization.
Optionally, the driving back plate or the chip can be heated and pressurized at the same time to reduce the time required for binding the chip with the driving back plate.
In this embodiment, a first substrate is disposed on a side of the driving backplate away from the chip, and a second substrate is also disposed on a side of the chip away from the driving backplate, so that when the chip or the driving backplate is heated and pressurized, the chip or the driving backplate can be heated and pressurized by heating and pressurizing the first substrate or the second substrate.
In an embodiment of the invention, the conductive component comprises conductive particles or a one-dimensional structural material or a two-dimensional structural material.
In this embodiment, the conductive component includes a conductive particle, a one-dimensional structural material, or a two-dimensional structural material, where the size of the conductive component is nanometer, the conductive particle, the one-dimensional structural material, or the two-dimensional structural material is a nanometer material, the conductive particle includes a conductive particle such as gold, silver, or graphite, the one-dimensional structural material includes a nanowire, a nanorod, or a nanotube, and the two-dimensional structural material includes a disk-shaped material, a sheet-shaped material, or the like.
Optionally, the chip is a micro led chip, the size of which is micron-scale, and the size of the conductive component of the binding material provided by the invention is nanometer-scale. When the chip is of other sizes, the conductive component may also be of other sizes, as long as the size of the conductive component is less than or equal to the size of the chip.
The embodiment of the invention provides a binding material, a Micro LED substrate and a binding method, wherein the binding material comprises a binding material, the binding material is arranged between a chip and a driving backboard and is used for pre-binding and binding the chip and the driving backboard in sequence, the binding material comprises a conductive component, the size of the conductive component is smaller than or equal to that of a chip pin, so that the binding material can bind the chip with smaller size and the driving backboard, and the chip and the driving backboard are pre-bound before the chip and the driving backboard are bound. In the ACF binding process in the prior art, the micro LED chip is micron-sized and is small in size, so that the binding of the micro LED chip cannot be realized.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (4)

1. A binding material characterized in that,
the binding material is used for pre-binding and binding the chip and the driving back plate;
the binding material comprises a conductive component, and the size of the conductive component is smaller than or equal to that of a pin of the chip;
the binding material further comprises an adhesive component, and the adhesive component is used for bonding the chip and the driving back plate so as to pre-bind the chip and the driving back plate;
after the chip or the driving back plate is heated, the viscous component volatilizes;
when the chip or the driving back plate is pressurized, the chip is bound with the driving back plate;
the conductive component comprises conductive particles or a one-dimensional structural material or a two-dimensional structural material;
the conductive particles or the one-dimensional structural material or the two-dimensional structural material are all nano-scale materials.
2. A Micro LED substrate is characterized by comprising a driving back plate and a Micro LED chip; and
the binding material of claim 1;
the binding material is arranged between the Micro LED chip and the driving back plate and binds the chip and the driving back plate.
3. A binding method, characterized in that the binding method comprises:
arranging a binding material on the chip or the driving back plate, wherein the binding material comprises a conductive component, and the size of the conductive component is smaller than or equal to that of the pins of the chip;
pre-binding the chip and the driving back plate;
binding the chip and the driving back plate;
the pre-binding the chip and the driving back plate comprises:
aligning the chip loaded with the binding material with the binding metal of the driving back plate;
arranging the driving back plate on the binding material so as to pre-bind the chip and the driving back plate; or
Aligning the binding metal of the driving back plate loaded with the binding material with the chip;
arranging the chip on the binding material so as to pre-bind the chip and the driving back plate;
the binding material further comprises an adhesive component for adhering the chip and the driving back plate so as to pre-bind the chip and the driving back plate;
the binding the chip and the driving back plate comprises:
heating the chip and/or the driving back plate to volatilize the viscous component;
pressurizing the chip and/or the driving back plate, and binding the chip and the driving back plate through the conductive component;
the conductive component comprises conductive particles or a one-dimensional structural material or a two-dimensional structural material;
the conductive particles or the one-dimensional structural material or the two-dimensional structural material are all nano-scale materials.
4. The bonding method according to claim 3, wherein the disposing of the bonding material on the chip or the driving backplane comprises:
and setting a binding material on the chip or the driving back plate through printing or silk screen printing.
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CN110049633B (en) * 2019-04-19 2021-05-07 京东方科技集团股份有限公司 Binding material, Micro LED substrate and binding method
CN110707197A (en) * 2019-09-11 2020-01-17 深圳市华星光电半导体显示技术有限公司 LED substrate and manufacturing method of LED display panel
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