CN110040972A - Glass and preparation method thereof and its application is thinned - Google Patents
Glass and preparation method thereof and its application is thinned Download PDFInfo
- Publication number
- CN110040972A CN110040972A CN201910315467.8A CN201910315467A CN110040972A CN 110040972 A CN110040972 A CN 110040972A CN 201910315467 A CN201910315467 A CN 201910315467A CN 110040972 A CN110040972 A CN 110040972A
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- China
- Prior art keywords
- thinned
- face
- glass substrate
- glass
- preparation
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
Abstract
The present invention relates to a kind of thinned glass and preparation method thereof and its application.The preparation method that glass is thinned includes the following steps: to provide glass substrate, and the glass substrate is free of potassium, sodium ion, and the glass substrate has face to be thinned and is relatively fixed face with the face to be thinned, and the face to be thinned is with preset to thinning area；Adherency offers the antiacid visbreaking film of through-hole on the face to be thinned described in the glass substrate, and the position of the through-hole is corresponding with the position to thinning area；With etching solution etch the glass substrate described in face to be thinned；The glass substrate and the etching solution are separated, and water mist is sprayed to face to be thinned described in the glass substrate.The thinned glass being prepared by the preparation method of above-mentioned thinned glass, through detecting, without water ripples bad phenomenon in groove, while concave edge sawtooth is unobvious.
Description
Technical field
The present invention relates to photoelectric glass production fields, answer more particularly to a kind of thinned glass and preparation method thereof with it
With.
Background technique
With the development of liquid crystal technology, people are higher and higher to the requirement that electronic equipment is lightening, so in electronic equipment
TFT (Thin film transistor, thin film transistor (TFT)) glass production during, it usually needs TFT glass is subtracted
Thin processing.
The TFT glass handled using conventional etch reduction process, etched recesses edge there are serious sawtooth, in slot
It is bad that there are water ripples.
Summary of the invention
Based on this, a kind of few sawtooth, the preparation method without the undesirable thinned glass of water ripples are provided.
In addition, also providing a kind of thinned glass and its application.
A kind of preparation method of thinned glass, includes the following steps:
There is provided glass substrate, the glass substrate be free of potassium, sodium ion, the glass substrate have face to be thinned and with institute
It states face to be thinned to be relatively fixed face, the face to be thinned has preset to thinning area；
Adherency offers the antiacid visbreaking film of through-hole, the position of the through-hole on the face to be thinned described in the glass substrate
It sets corresponding with the position to thinning area；
With etching solution etch the glass substrate described in face to be thinned；
The glass substrate and the etching solution are separated, and water mist is sprayed to face to be thinned described in the glass substrate.
The antiacid visbreaking film is antiacid UV visbreaking film in one of the embodiments,.
It is calculated in one of the embodiments, according to percent by volume, the etching solution includes following composition: 22%~
37% hydrofluoric acid, 3%~18% sulfuric acid (70 ω %) and 45%~75% pure water.
In one of the embodiments, the amount of substance concentration of hydrofluoric acid described in the etching solution be 6.5mol/L~
7.6mol/L。
It is calculated in one of the embodiments, according to percent by volume, the etching solution includes following composition: 22% hydrogen
Fluoric acid, 3% sulfuric acid (70 ω %) and pure water surplus.
It is calculated in one of the embodiments, according to percent by volume, the etching solution includes following composition: 24% hydrogen
Fluoric acid, 6% sulfuric acid (70 ω %) and pure water surplus.
The water mist is obtained by pure water or deionized water by atomization process in one of the embodiments,.
The method of the atomization process is selected from supersonic atomization, adding pressure type atomization and vortex in one of the embodiments,
One of formula atomization.
Described the step of spraying water mist to face to be thinned described in the glass substrate, wraps in one of the embodiments,
It includes: with the water mist pressure of 0.03MPa~0.12MPa, water mist 60s~300s being sprayed to the face to be thinned.
In one of the embodiments, it is described to face to be thinned described in the glass substrate spray water mist the step of it
Afterwards, further include the steps that stripping the antiacid visbreaking film.
A kind of thinned glass is prepared by the preparation method of thinned glass described in any of the above embodiments.
Application of the above-mentioned thinned glass in production electronic equipment TFT display panel.
The thinned glass being prepared by the preparation method of above-mentioned thinned glass, through detecting, without water ripples in groove
Bad phenomenon, while concave edge sawtooth is less.
Detailed description of the invention
Fig. 1 is the flow chart of the preparation method of the thinned glass of an embodiment；
Fig. 2 is the water ripples situation inspection principle figure of the thinned glass of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
Body embodiment purpose, be not be limit the present invention.
The glass substrate for " being free of potassium, sodium ion " applied by below, refers to and is used to prepare TFT or TFT- in the industry
The alkali-free glass of LCD, with alkali-free aluminosilicate glass (Alumino Silicate Glass, principal component SiO2、Al2O3、B2O
And BaO etc.) based on, alkali metal total content therein is 1% hereinafter, not making excessive demands in completely zero.
As shown in Figure 1, the preparation method of the thinned glass of an embodiment, includes the following steps:
Step S110: provide glass substrate, the glass substrate be free of potassium, sodium ion, and have face to be thinned and with wait subtract
Sake is relatively fixed face, should face to be thinned with preset to thinning area.
Glass substrate in step S110 have passed through the programs such as this field routine quality inspection before preparing to be thinned.
Step S120: adherency offers the antiacid visbreaking film of through-hole, the through-hole on the face to be thinned of above-mentioned glass substrate
Position it is corresponding with the above-mentioned position to thinning area.
In step S120, adhering to has the antiacid of position through-hole corresponding with the default thinning area in glass substrate face to be thinned
The purpose of visbreaking film is to shield non-weakened region.
Above-mentioned antiacid visbreaking film is antiacid UV visbreaking film in one of the embodiments,.Antiacid UV visbreaking film can lead to
It crosses and irradiates the UV light of certain energy and stripped.
Step S130: the face to be thinned of above-mentioned glass substrate is etched with etching solution.
It should be noted that in the actual production process, in order to efficiently produce in batches and avoid acid solution to work people
Member injury, glass substrate is usually fixed into (modes such as adhesive tape adherency, vacuum suction) on one piece of backboard, be inserted into as
Chinese patent CN206345793U (Jiangxi Wo Ge photoelectric technology limited liability company is adjustable rack assembly and etching basket tool [P]
.2016.12.22. in the etching basket tool) announced, then in such a way that sprinkling, dipping or the two combine, to above-mentioned
Glass substrate is etched thinned.The time of entire etching process depending on actual glass substrate thickness, be intended to thinned thickness with
And the formula of acid solution determines.
It is calculated in one of the embodiments, according to percent by volume, above-mentioned etching solution includes following composition: 22%~
37% hydrofluoric acid, 3%~18% sulfuric acid (70 ω %) and 45%~75% pure water.Preferably, above-mentioned etching solution packet
Include following composition: 22%~28% hydrofluoric acid, 11%~18% sulfuric acid (70 ω %) and pure water surplus；Preferably, above-mentioned
Etching solution includes following composition: 24%~34% hydrofluoric acid, 6%~14% sulfuric acid (70 ω %) and pure water (or go from
Son, similarly hereinafter) surplus.
Preferably, the amount of substance concentration of hydrofluoric acid is 6.5mol/L~7.6mol/L in above-mentioned etching solution.
Step S140: above-mentioned glass substrate and etching solution are separated, and water mist is sprayed to the face to be thinned of glass substrate.
Specifically, step S140 includes: the above-mentioned glass substrate and etching solution of separation, immediately after with 0.03~
The water mist pressure of 0.12MPa treats thinned face sprinkling water mist 60s~300s.
Preferably, the pressure of above-mentioned water mist is 0.08~0.12MPa, treats thinned face sprinkling water mist 60s~180s.
The glass chip being deposited in etching groove and residual acid can be handled in time by the spraying treatment in step S140, from
And avoid water ripples bad and serious sawtooth.
It is above-mentioned in one of the embodiments, spraying to be obtained by pure water or deionized water by atomization process.
The method of above-mentioned atomization process is atomization method commonly used in the art in one of the embodiments,.For example, super
Velocity of sound atomization, adding pressure type atomization or eddy current type atomization.
Step S150: above-mentioned antiacid visbreaking film is stripped.
It is appreciated that after the step s 150, using the process (cleaning, drying, quality inspection, polishing etc.) of this field routine
Processing can be obtained by thinned glass finished-product.
A kind of thinned glass is prepared by the preparation method of thinned glass described in any of the above embodiments.
The thinned glass being prepared by the preparation method of above-mentioned thinned glass, through detecting, without water ripples in groove
Bad phenomenon, while recess edge sawtooth is less or unobvious.
Application of the above-mentioned thinned glass in production electronic equipment TFT display panel.
The following are specific embodiment parts:
In the examples below, as without special explanation, the content of each substance is volume percent content.
The following table 1 is the etching formula of liquid and related process parameters table of each embodiment and comparative example.
Table 1
Embodiment 1
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 22%
Hydrofluoric acid, 3% sulfuric acid (70 ω %) and 75% pure water.
(4) above-mentioned glass substrate and etching solution are separated and treats thinned face immediately after with the water mist pressure of 0.06MPa
Spray water mist 120s.
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Embodiment 2
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 24%
Hydrofluoric acid, 6% sulfuric acid (70 ω %) 70% pure water.
(4) above-mentioned glass substrate and etching solution are separated and treats thinned face immediately after with the water mist pressure of 0.08MPa
Spray water mist 300s.
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Embodiment 3
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 22%
Hydrofluoric acid, 11% sulfuric acid (70 ω %) and 67% pure water.
(4) above-mentioned glass substrate and etching solution are separated and treats thinned face immediately after with the water mist pressure of 0.08MPa
Spray water mist 60s.
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Embodiment 4
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 34%
Hydrofluoric acid, 14% sulfuric acid (70 ω %) and 52% pure water.
(4) above-mentioned glass substrate and etching solution are separated and treats thinned face immediately after with the water mist pressure of 0.10MPa
Spray water mist 60s.
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Embodiment 5
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 28%
Hydrofluoric acid, 18% sulfuric acid (70 ω %) and 54% pure water.
(4) above-mentioned glass substrate and etching solution are separated and treats thinned face immediately after with the water mist pressure of 0.08MPa
Spray water mist 120s.
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Embodiment 6
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 37%
Hydrofluoric acid, 18% sulfuric acid (70 ω %) and 45% pure water.
(4) above-mentioned glass substrate and etching solution are separated and treats thinned face immediately after with the water mist pressure of 0.12MPa
Spray water mist 60s.
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Comparative example 1
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 28%
Hydrofluoric acid and 72% pure water.
(4) above-mentioned glass substrate and etching solution are separated and treats thinned face immediately after with the water mist pressure of 0.08MPa
Spray water mist 120s.
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Comparative example 2
(1) glass substrate is provided, which has face to be thinned and be relatively fixed face with face to be thinned, this is wait subtract
Sake has preset to thinning area.
(2) the antiacid UV visbreaking film for offering through-hole, the position of the through-hole are adhered on the face to be thinned of above-mentioned glass substrate
It sets corresponding with the above-mentioned position to thinning area.
(3) face to be thinned of above-mentioned glass substrate is etched with etching solution, wherein etching solution includes following composition: 37%
Hydrofluoric acid, 18% sulfuric acid (70 ω %) and 45% pure water.
(4) above-mentioned glass substrate and etching solution are separated；
(5) antiacid UV visbreaking film is stripped, obtains that glass is thinned.
Part of detecting
Water ripples are examined: using the progress naked eye inspection of fluorescent lamp reflection source, 45 ° of light inspections should be faced or be met to product when inspection
It tests (as shown in Figure 2), does not allow product holding up (warpage) and examine.Inspection result is divided into without, slight, serious three grades.
The sawtooth method of inspection: on the basis of facing, naked eye inspection is carried out to recess edge using fluorescent lamp reflection source
And the width using film tooth measurement highest sawtooth to edge.
Test result: it see the table below.
Each embodiment and the thinned glass test data table of comparative example preparation
From upper table data: the thinned glass of Examples 1 to 6 preparation, without water ripples bad phenomenon or only in groove
There are slight water ripples bad, while recess edge sawtooth is unobvious.The especially thinned glass for preparing of embodiment 2, in groove
Without water ripples bad phenomenon and sawtooth it is smaller.And the thinned glass that comparative example 1 is prepared, although water ripples are all right,
It is that there is serious sawtooth；The thinned glass that comparative example 2 is prepared, both there is serious water ripples are bad in groove,
There is serious sawtooth again.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of preparation method of thinned glass, which comprises the steps of:
There is provided glass substrate, the glass substrate be free of potassium, sodium ion, the glass substrate have face to be thinned and with it is described to
Thinned face is relatively fixed face, and the face to be thinned has preset to thinning area；
Adherency offers the antiacid visbreaking film of through-hole on the face to be thinned described in the glass substrate, the position of the through-hole with
The position to thinning area is corresponding；
With etching solution etch the glass substrate described in face to be thinned；
The glass substrate and the etching solution are separated, and water mist is sprayed to face to be thinned described in the glass substrate.
2. the preparation method of thinned glass according to claim 1, which is characterized in that the antiacid visbreaking film is antiacid UV
Visbreaking film.
3. the preparation method of thinned glass according to claim 1, which is characterized in that calculated according to percent by volume, institute
Stating etching solution includes following composition: 22%~37% hydrofluoric acid, 3%~18% sulfuric acid (70 ω %) and 45%~75%
Pure water.
4. the preparation method of thinned glass according to claim 3, the amount of substance of hydrofluoric acid described in the etching solution are dense
Degree is 6.5mol/L~7.6mol/L.
5. the preparation method of thinned glass according to claim 1, which is characterized in that the water mist is by pure water or deionization
Water is obtained by atomization process.
6. the preparation method of thinned glass according to claim 5, which is characterized in that the method for the atomization process is selected from
One of supersonic atomization, adding pressure type atomization and eddy current type atomization.
7. the preparation method of thinned glass according to claim 1, which is characterized in that the institute to the glass substrate
The step of stating sprinkling water mist in face to be thinned includes: the water mist pressure with 0.03MPa~0.12MPa, is sprayed to the face to be thinned
Water mist 60s~300s.
8. the preparation method of thinned glass according to claim 1, which is characterized in that described to the glass substrate
After the step of sprinkling water mist in face to be thinned, further include the steps that stripping the antiacid visbreaking film.
9. a kind of thinned glass, which is characterized in that the thinned glass is by thinned glass according to any one of claims 1 to 8
Preparation method be prepared.
10. application of the thinned glass as claimed in claim 9 in production electronic equipment TFT display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910315467.8A CN110040972A (en) | 2019-04-17 | 2019-04-17 | Glass and preparation method thereof and its application is thinned |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910315467.8A CN110040972A (en) | 2019-04-17 | 2019-04-17 | Glass and preparation method thereof and its application is thinned |
Publications (1)
| Publication Number | Publication Date |
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| CN110040972A true CN110040972A (en) | 2019-07-23 |
Family
ID=67277895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910315467.8A Pending CN110040972A (en) | 2019-04-17 | 2019-04-17 | Glass and preparation method thereof and its application is thinned |
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| CN112897889A (en) * | 2021-01-29 | 2021-06-04 | 江西沃格光电股份有限公司 | Glass single-side film-covering thinning method |
| CN113292236A (en) * | 2021-05-21 | 2021-08-24 | 江西沃格光电股份有限公司 | Mini-LED substrate through hole forming method and electronic equipment |
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| CN113292236A (en) * | 2021-05-21 | 2021-08-24 | 江西沃格光电股份有限公司 | Mini-LED substrate through hole forming method and electronic equipment |
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