CN110039381B - Ultra-precision polishing method for cylindrical roller - Google Patents
Ultra-precision polishing method for cylindrical roller Download PDFInfo
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- CN110039381B CN110039381B CN201910328527.XA CN201910328527A CN110039381B CN 110039381 B CN110039381 B CN 110039381B CN 201910328527 A CN201910328527 A CN 201910328527A CN 110039381 B CN110039381 B CN 110039381B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B35/00—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
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- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The ultra-precision polishing method of the cylindrical roller comprises the steps of roughly polishing and finely polishing the cylindrical surface of the cylindrical roller by adopting a double-plane polishing device, wherein an upper polishing disc and a lower polishing disc which are installed on the double-plane polishing device are semi-fixed abrasive particle polishing discs, a semi-fixed abrasive particle polishing layer comprises 31-36 wt% of α -alumina particles, 22-25 wt% of cerium oxide particles, 23-27 wt% of colloidal silica and the balance of a bonding agent, the particle size of the α -alumina particles is 0.02-15 micrometers, the particle size of the cerium oxide particles is 0.01-5 micrometers, the bonding agent comprises an adhesive and an additive, and the adhesive accounts for 60-80 wt%.
Description
Technical Field
The invention relates to the technical field of ultra-precision machining, in particular to an ultra-precision polishing method for a cylindrical roller.
Background
The bearing is an important and key basic part in the equipment manufacturing industry, directly determines the performance, quality and reliability of important equipment and host products, and is known as a heart part for equipment manufacturing. The precision cylindrical roller is used as a key part of the bearing, and the surface quality (precision, consistency and the like) of the precision cylindrical roller plays an important role in the working performance and the service life of the bearing.
At present, abrasive grain polishing and centerless polishing are main means for ultra-precision polishing of cylindrical rollers. The abrasive polishing can be roughly classified into free abrasive polishing and fixed abrasive polishing. The fixed abrasive particle polishing has higher material removal efficiency, and along with the development of the technology, the polishing precision of the fixed abrasive particle polishing is close to the free abrasive particle polishing increasingly. However, the polishing of the fixed abrasive particles requires expensive high-precision and high-rigidity equipment, and the service performance and service life of the product are seriously affected due to a deeper processing deterioration layer caused by forced feeding. The requirement of free abrasive particle polishing on the precision of equipment is not high, the polishing precision is high, and a processing deterioration layer is shallow or even has no. However, the material removal rate of free abrasive particles is low and the quality and consistency of polishing is closely related to the cleanliness of the processing environment. Once the hard large particles intrude into the processing area, deep scratches are generated on the surface of the cylindrical roller, resulting in an increase in rework rate and rejection rate, thereby limiting an increase in polishing efficiency.
The double-plane polishing equipment is used for processing planes at first, and has the characteristics of high processing efficiency and high parallelism after processing because the double-plane polishing equipment can process an upper plane and a lower plane simultaneously, and is widely used in plane processing. Later, biplane polishing equipment was also used to polish machined cylindrical surfaces, such as: a research team led by professor yun julong, an industrial university of zhejiang is used for polishing the cylindrical surface of the cylindrical roller. However, the polishing of cylindrical surfaces by using a double-plane polishing device is still limited to the free abrasive machining, and generally three processes of grinding, rough polishing and finish polishing are required, so that the machining efficiency needs to be improved.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the ultra-precision polishing method of the cylindrical roller, which has the advantages of high polishing precision, high processing efficiency, high surface smoothness of the processed cylindrical roller and good consistency of processed workpiece batches.
The technical scheme includes that the ultra-precision polishing method of the cylindrical roller comprises the steps of roughly polishing the cylindrical surface of the cylindrical roller by adopting double-plane polishing equipment, finely polishing the cylindrical surface of the roughly polished cylindrical roller by adopting the double-plane polishing equipment, wherein the double-plane polishing equipment comprises an upper polishing disk, a lower polishing disk, an outer gear ring, an inner gear ring and a planet wheel retainer, rotating shafts of the upper polishing disk, the lower polishing disk, the inner gear ring and the outer gear ring are concentrically arranged and are respectively and independently driven, inner and outer rings of the planet wheel retainer are respectively meshed with the inner gear ring and the outer gear ring, a flow channel for conveying polishing liquid is arranged on the upper polishing disk, a hole for placing the cylindrical roller is arranged on the planet wheel retainer, the cylindrical roller is placed in the hole when polishing, the upper polishing disk and the lower polishing disk are both semi-fixed polishing disks in the polishing process, the semi-fixed polishing disk is formed by a base disk and a semi-fixed polishing layer adhered to the surface of the base disk, polishing slurry is formed by mixing a polishing adhesive, wherein the semi-fixed polishing slurry is formed by mixing a polishing slurry I, a polishing slurry, a slurry is formed by mixing slurry, wherein the slurry, the slurry is formed by mixing slurry, the slurry is formed by adding a slurry, the slurry is formed by mixing slurry, the slurry is formed by adding a slurry, the slurry is used for forming slurry forming.
Compared with the prior art, the ultra-precision polishing method for the cylindrical surface of the cylindrical roller adopts the polishing disk with the polishing layer with semi-fixed abrasive particles to remove materials on the surface of a workpiece, the abrasive particles are bonded together in a semi-fixed mode through a bonding agent (the bonding agent needs to be a soft bonding agent, hard bonding agents such as metal and ceramic cannot be used, or a semi-fixed state cannot be obtained), the bonding strength is between free and fixed, the semi-fixed abrasive particle polishing layer is provided with the abrasive particles with different particle sizes and hardness, the large abrasive particles play a role in a framework in the polishing layer, and the small abrasive particles fill pores among the large abrasive particles, so that the structural strength of the polishing layer is greatly increased, and equipment can set higher downward pressure and higher rotating speed to perform polishing processing when the cylindrical roller is processed, so that higher polishing efficiency is obtained; the semi-fixed abrasive particle polishing pad has a trap effect on hard large particles, the hard large particles intruding into a processing area sink into the surface layer of the grinding tool and share the same load as the abrasive particles, so that the damage of the hard large particles to a workpiece can be effectively relieved, the processing quality and batch consistency are ensured, and the rework rate and the rejection rate are reduced; in addition, the semi-fixed abrasive particle polishing layer has a specific component formula, and the polishing liquid combined with the specific component formula has high chemical mechanical composite polishing efficiency, so that the polishing processing efficiency is further improved.
For optimization, during rough polishing, the rotating speed of the upper polishing disk is-120 to-150 rpm, the rotating speed of the lower polishing disk is 150 to 180rpm, the rotating speed of the inner gear ring is-15 to-20 rpm, and the rotating speed of the outer gear ring is 40 to 45 rpm; the down force of the upper polishing disk is 25-40N/roller. At the moment, the machining quality can be guaranteed, and meanwhile the machining efficiency is further improved. As a further optimization, the components of the polishing solution used in the rough polishing process may be: 1 wt% citric acid, 0.025 wt% hydrogen peroxide and balance water. The content of the catalyst in the polishing solution for rough polishing is low, and the polishing solution is matched with equipment which runs at a high speed during rough polishing, so that the rough polishing has a high material removal rate, and meanwhile, the polishing solution provides cooling and lubricating effects, and the cylindrical roller is prevented from being damaged by abrasive particles in the high-speed rough polishing process.
For optimization, during fine polishing, the rotating speed of the upper polishing disk is-90 to-120 rpm, the rotating speed of the lower polishing disk is 120 to 140rpm, the rotating speed of the inner gear ring is-10 to-15 rpm, and the rotating speed of the outer gear ring is 30 to 45 rpm; the down pressure of the upper polishing disk is 20-30N/roller. At the moment, the machining efficiency can be further improved while higher machining quality is ensured. As a further optimization, the components of the polishing solution used in the finish polishing process may be: 0.5 wt% citric acid, 1.5 wt% hydrogen peroxide, 0.01 wt% anionic surfactant and balance water. Compared with the polishing solution for rough polishing, the polishing solution for fine polishing is additionally provided with an anionic surfactant, so that the polishing solution plays a role in cleaning in the polishing process, prevents abrasive particles from damaging the cylindrical roller, and further ensures the processing precision.
The adhesive is formed by mixing a vegetable gum adhesive, a resin adhesive and a starch adhesive, and the mass ratio of each component in the adhesive is not less than 5 wt%; the additive is formed by mixing a waterproof agent, a filling agent and a defoaming agent, and the mass ratio of each component in the additive is not less than 15 wt%. The adhesives are soft bonding agents, can ensure that the polishing layer has the structural characteristic of semi-fixation, and have stronger bonding force to ensure the structural strength of the semi-fixation abrasive particle polishing layer; the waterproof agent, the filling agent and the defoaming agent can greatly reduce gaps and bubbles in the semi-fixed abrasive particle polishing layer, improve the structural strength and prolong the service life. In the additive, the mass ratio of the waterproof agent is 25-35 wt%, and the mass ratio of the filler is 45-50 wt%; the bulking agent comprises xylitol; in the filler, the mass ratio of xylitol is 20-35 wt%. The waterproof agent prepared according to the proportion can prevent, reduce and delay the early plastic cracking of the semi-fixed abrasive grain polishing layer, greatly improve the toughness and prolong the service life; xylitol is added into the filling agent, and during high-speed polishing, the xylitol is gradually released along with the abrasion of the polishing disc and absorbs a large amount of heat after meeting water in the polishing liquid, so that the cooling effect is achieved, a deeper processing deterioration layer is prevented from being generated on the surface of the cylinder due to local overheating, and higher processing quality is facilitated.
Preferably, the substrate can be made of silicon nitride ceramics; in the manufacturing process of the semi-fixed abrasive particle polishing disk, the semi-fixed abrasive particle polishing disk is solidified through microwave heating after being subjected to cold press molding. The silicon nitride ceramic contains Si3N4The ceramic is a high-temperature ceramic which has high-temperature strength, high hardness, wear resistance, corrosion resistance and self-lubrication, has extremely small linear expansion coefficient, and can effectively work for a long time in a corrosive environment (the polishing solution has certain corrosivity) as a base plate. By adopting microwave heating and curing, the situation of cracking or warping caused by uneven heating in the heating process can be prevented, and the method has the advantage of high curing speed. As a further optimization scheme, the thickness of the semi-fixed abrasive particle polishing layer is 10-20 mm; and controlling the surface temperature of the semi-fixed abrasive grain polishing layer to be 110 +/-5 ℃ during microwave heating. The thickness is not only uniformly heated and cured by utilizing microwave, but also is beneficial to obtaining higher polishing precision.
The particle size of the α -alumina particles is 3000 meshes, the particle size of the cerium oxide particles is 5000 meshes, α -alumina particles play a role in a framework in the polishing layer, and the cerium oxide particles fill pores among α -alumina particles, so that the structural strength of the polishing layer is greatly increased, meanwhile, the α -alumina particles with large particle size can efficiently polish large protrusions on the surface of the cylindrical roller, the cerium oxide particles with small particle size can further improve the shape precision and the surface quality of the cylindrical roller, and at the moment, the chemical mechanical polishing effect is obvious, and the processing time can be further shortened.
Drawings
FIG. 1 is a schematic view of a double-plane polishing apparatus according to the present invention;
FIG. 2 is a schematic view of the working state of the planet wheel holder when the ultra-precision polishing method for the cylindrical surface of the cylindrical roller is implemented;
FIG. 3 is a schematic diagram of a polishing layer with semi-fixed abrasive particles according to the present invention.
The labels in the figures are: 1-upper polishing disc; 2-lower polishing disk; 3-external gear ring; 4-inner gear ring; 5-a planet wheel cage; 51-hole site.
Detailed Description
The present invention will be further described with reference to the drawings and the detailed description (examples), but the present invention is not limited thereto.
In the present invention, "positive" and "negative" of the rotation speed values indicate that the rotation directions are opposite. The terms "upper" and "lower" merely indicate positional relationships during machining.
As shown in fig. 1 to 3, the ultra-precision polishing method of a cylindrical roller of the present invention comprises: a step of roughly polishing the cylindrical surface of the cylindrical roller by adopting a biplane polishing device; and adopting a double-plane polishing device to perform fine polishing on the cylindrical surface of the cylindrical roller after the coarse polishing;
the double-plane grinding and polishing equipment comprises an upper polishing disk 1, a lower polishing disk 2, an outer gear ring 3, an inner gear ring 4 and a planet wheel retainer 5; the rotating shafts of the upper polishing disc 1, the lower polishing disc 2, the inner gear ring 4 and the outer gear ring 3 are all concentrically arranged and are driven independently; the inner ring and the outer ring of the planet wheel retainer 5 are respectively meshed with the inner gear ring 4 and the outer gear ring 3, and a flow channel for conveying polishing solution is arranged on the upper polishing disc 1; a hole 51 for placing a cylindrical roller is arranged on the planet wheel retainer 5, and the cylindrical roller is placed in the hole 51 during polishing;
in the polishing process, an upper polishing disk 1 and a lower polishing disk 2 which are arranged on the double-plane polishing equipment are semi-fixed abrasive particle polishing disks; the semi-fixed abrasive particle polishing disk consists of a base disk and a semi-fixed abrasive particle polishing layer adhered to the surface of the base disk;
the semi-fixed abrasive particle polishing layer comprises 31-36 wt% of α -alumina particles, 22-25 wt% of cerium oxide particles, 23-27 wt% of colloidal silica and the balance of a bonding agent, wherein the particle size of the α -alumina particles is 0.02-15 micrometers, the particle size of the cerium oxide particles is 0.01-5 micrometers, the bonding agent comprises an adhesive and an additive, the adhesive accounts for 40-60 wt%, the semi-fixed abrasive particle polishing disc is prepared according to the following steps that I, abrasive particles, the adhesive and the additive are mixed and stirred uniformly to prepare a mixed material, II, a base disc is placed in a mold, the prepared mixed material is poured into the mold and subjected to cold press molding, III, the semi-fixed abrasive particle polishing disc is prepared after cold press molding and heating and curing, the semi-fixed abrasive particle polishing disc is prepared after cooling, the formula of a polishing liquid used in the rough polishing process comprises 1-1.5 wt% of citric acid, 0.02-0.05 wt% of hydrogen peroxide and the balance of an anionic surface active water.
Preferably: during rough polishing, the rotating speed of the upper polishing disc 1 is-120 to-150 rpm, the rotating speed of the lower polishing disc 2 is 150 to 180rpm, the rotating speed of the inner gear ring 4 is-15 to-20 rpm, and the rotating speed of the outer gear ring 3 is 40 to 45 rpm; the down force of the upper polishing disk 1 is 25-40N/roller. At the moment, the machining quality can be guaranteed, and meanwhile the machining efficiency is further improved. As a further optimization, the components of the polishing solution used in the rough polishing process may be: 1 wt% citric acid, 0.025 wt% hydrogen peroxide and balance water. The content of the catalyst in the polishing solution for rough polishing is low, and the polishing solution is matched with equipment which runs at a high speed during rough polishing, so that the rough polishing has a high material removal rate, and meanwhile, the polishing solution provides cooling and lubricating effects, and the cylindrical roller is prevented from being damaged by abrasive particles in the high-speed rough polishing process.
Preferably: during fine polishing, the rotating speed of the upper polishing disc 1 is-90 to-120 rpm, the rotating speed of the lower polishing disc 2 is 120 to 140rpm, the rotating speed of the inner gear ring 4 is-10 to-15 rpm, and the rotating speed of the outer gear ring 3 is 30 to 45 rpm; the down force of the upper polishing disk 1 is 20-30N/roller. At the moment, the machining efficiency can be further improved while higher machining quality is ensured. As a further optimization, the components of the polishing solution used in the finish polishing process may be: 0.5 wt% citric acid, 1.5 wt% hydrogen peroxide, 0.01 wt% anionic surfactant and balance water. Compared with the polishing solution for rough polishing, the polishing solution for fine polishing is additionally provided with an anionic surfactant, so that the polishing solution plays a role in cleaning in the polishing process, prevents abrasive particles from damaging the cylindrical roller, and further ensures the processing precision.
The adhesive is formed by mixing a vegetable gum adhesive, a resin adhesive and a starch adhesive, and the mass ratio of each component in the adhesive is not less than 5 wt%; the additive is formed by mixing a waterproof agent, a filling agent and a defoaming agent, and the mass ratio of each component in the additive is not less than 15 wt%. The adhesives are soft bonding agents, can ensure that the polishing layer has the structural characteristic of semi-fixation, and have stronger bonding force to ensure the structural strength of the semi-fixation abrasive particle polishing layer; the waterproof agent, the filling agent and the defoaming agent can greatly reduce gaps and bubbles in the semi-fixed abrasive particle polishing layer, improve the structural strength and prolong the service life. Preferably, in the additive, the mass ratio of the waterproof agent is 25-35 wt%, and the mass ratio of the filler is 45-50 wt%; the bulking agent comprises xylitol; in the filler, the mass ratio of xylitol is 20-35 wt%. The waterproof agent prepared according to the proportion can prevent, reduce and delay the early plastic cracking of the semi-fixed abrasive grain polishing layer, greatly improve the toughness and prolong the service life; xylitol is added into the filling agent, and during high-speed polishing, the xylitol is gradually released along with the abrasion of the polishing disc and absorbs a large amount of heat after meeting water in the polishing liquid, so that the cooling effect is achieved, a deeper processing deterioration layer is prevented from being generated on the surface of the cylinder due to local overheating, and higher processing quality is facilitated.
The base plate may be made of silicon nitride ceramic; in the manufacturing process of the semi-fixed abrasive particle polishing disk, the semi-fixed abrasive particle polishing disk is solidified through microwave heating after being subjected to cold press molding. The silicon nitride ceramic contains Si3N4The ceramic is a high-temperature ceramic which has high-temperature strength, high hardness, wear resistance, corrosion resistance and self-lubrication, has extremely small linear expansion coefficient, and can effectively work for a long time in a corrosive environment (the polishing solution has certain corrosivity) as a base plate. By adopting microwave heating curing, the situation of cracking or warping caused by uneven heating in the heating process can be prevented, and the curing speed is high. Preferably, the thickness of the semi-fixed abrasive grain polishing layer is 10-20 mm; and controlling the surface temperature of the semi-fixed abrasive grain polishing layer to be 110 +/-5 ℃ during microwave heating. The thickness is not only uniformly heated and cured by utilizing microwave, but also is beneficial to obtaining higher polishing precision. During microwave heating and curing, an infrared temperature sensor can be arranged in the microwave heating device to detect the surface temperature of the semi-fixed abrasive particle polishing layer, and then the controller controls the power of the microwave generator to maintain the surface temperature of the semi-fixed abrasive particle polishing layer at 110 +/-5 ℃.
Preferably, the particle size of the α -aluminum oxide particles is 3000 meshes, the particle size of the cerium oxide particles is 5000 meshes, α -aluminum oxide particles play a role of a framework in the polishing layer, and the cerium oxide particles fill pores among α -aluminum oxide particles, so that the structural strength of the polishing layer is greatly increased, meanwhile, the α -aluminum oxide particles with large particle sizes can efficiently polish large protrusions on the surface of the cylindrical roller, the cerium oxide particles with small particle sizes can further improve the shape accuracy and the surface quality of the cylindrical roller, and at the moment, the chemical mechanical polishing effect is obvious, and the processing time can be further shortened.
In the step 1, after the abrasive particles, the adhesive and the additive are mixed, the mixture can be slowly stirred to be uniform by a vibration stirrer.
Example (b):
the processed cylindrical roller is made of GCr15 bearing steel, the diameter is 20mm, and the length is 30 mm.
The semi-fixed abrasive grain polishing layer is 15mm thick and comprises 32 wt% of α -aluminum oxide particles with 3000 meshes, 24 wt% of cerium oxide particles with 5000 meshes, 25 wt% of colloidal silicon dioxide and the balance of a bonding agent, wherein the bonding agent comprises an adhesive and an additive, the adhesive accounts for 60 wt%, the adhesive is formed by mixing a vegetable gum adhesive, a resin adhesive and a starch adhesive according to a mass ratio of 1:1:1, the additive is formed by mixing a waterproof agent, a filling agent and a defoaming agent, the mass ratio of the waterproof agent is 35 wt%, the mass ratio of the filling agent is 50 wt%, the mass ratio of the defoaming agent is 15 wt%, the filling agent comprises xylitol, and the mass ratio of the xylitol in the filling agent is 25 wt%.
The semi-fixed abrasive grain polishing disk is composed of a base disk and a semi-fixed abrasive grain polishing layer adhered to the surface of the base disk, wherein the base disk is made of silicon nitride ceramics.
The components of the polishing solution used in the rough polishing process are as follows: 1 wt% citric acid, 0.025 wt% hydrogen peroxide and balance water.
The polishing solution used in the fine polishing process comprises the following components: 0.5 wt% citric acid, 1.5 wt% hydrogen peroxide, 0.01 wt% anionic surfactant and balance water.
And (3) polishing:
during rough polishing, a cylindrical roller is placed in the hole position 51 of the planet wheel retainer 5, then the lower pressure is loaded on the upper polishing disc 1, the cylindrical roller is positioned between the upper polishing disc 2 and the lower polishing disc 2 and is in line contact with the upper polishing disc 1 and the lower polishing disc 2, and then the rotating speeds of the upper polishing disc 1, the lower polishing disc 2, the outer gear ring 3 and the inner gear ring 4 are set as follows: the rotating speed of the upper polishing disc 1 is-150 rpm, the rotating speed of the lower polishing disc 2 is 180rpm, the rotating speed of the inner gear ring 4 is-18 rpm, and the rotating speed of the outer gear ring 3 is 45 rpm; the lower pressure of the upper polishing disk 1 is 40N/roller, meanwhile, polishing liquid for rough polishing is conveyed to a processing area through a flow channel of the upper polishing disk 1 at the flow rate of 100 mL/min, and rough polishing lasts for 30 min.
During fine polishing, cleaning residual polishing solution and abrasive dust in a flow channel and a processing area by using clear water, and setting the rotating speeds of an upper polishing disk 1, a lower polishing disk 2, an outer gear ring 3 and an inner gear ring 4 as follows: the rotating speed of the upper polishing disc 1 is-100 rpm, the rotating speed of the lower polishing disc 2 is 120rpm, the rotating speed of the inner gear ring 4 is-10 rpm, and the rotating speed of the outer gear ring 3 is 30 rpm; the lower pressure of the upper polishing disc 1 is 30N/roller, meanwhile, polishing liquid for fine polishing is conveyed to a processing area through a flow channel of the upper polishing disc 1 at the flow rate of 100 mL/min, and the fine polishing lasts for 15 min.
The following table one is the test results after processing according to the above examples. As can be seen from the table I below, before polishing, the cylindrical surface of the cylindrical roller is rough and uneven, the average value of the surface roughness is 72.01nm, and the average value of the roundness is 0.96 μm; after 30min of rough polishing, the average roughness value is reduced to 38.42nm, the average roundness value is reduced to 0.41 mu m, and the batch consistency is greatly improved; after 20min of fine polishing, the average roughness value is further reduced to 15.54nm, the average roundness value is further reduced to 0.40 mu m, and the batch consistency is further improved. Therefore, the polishing method has high processing precision, only takes 45min in the whole polishing process, and has the advantages of quick material removal and high processing efficiency.
The detection data obtained by other specific embodiments formed after the test parameters of the embodiments are adjusted are consistent with the trend of the first table, and the same conclusion can be drawn, namely the method for polishing the cylindrical roller has the advantages of high processing precision, good batch consistency and high processing efficiency, so the method is not listed in the first table.
The above general description of the invention and the description of the specific embodiments thereof, as referred to in this application, should not be construed as limiting the technical solutions of the invention. Those skilled in the art can add, reduce or combine the technical features disclosed in the general description and/or the specific embodiments (including the examples) to form other technical solutions within the protection scope of the present application according to the disclosure of the present application without departing from the structural elements of the present invention.
Claims (10)
1. A method for ultra-precision polishing of a cylindrical roller, comprising:
a step of roughly polishing the cylindrical surface of the cylindrical roller by adopting a biplane polishing device;
and a step of finely polishing the cylindrical surface of the cylindrical roller after rough polishing by adopting a double-plane polishing device;
the double-plane grinding and polishing equipment comprises an upper polishing disk, a lower polishing disk, an outer gear ring, an inner gear ring and a planet wheel retainer; the rotating shafts of the upper polishing disc, the lower polishing disc, the inner gear ring and the outer gear ring are all concentrically arranged and are driven independently; the inner ring and the outer ring of the planet wheel retainer are respectively meshed with the inner gear ring and the outer gear ring, and a flow channel for conveying polishing liquid is arranged on the upper polishing disc; a hole site for placing a cylindrical roller is arranged on the planet wheel retainer, and the cylindrical roller is placed in the hole site during polishing;
the method is characterized in that:
in the polishing process, an upper polishing disk and a lower polishing disk which are arranged on the double-plane polishing equipment are both semi-fixed abrasive particle polishing disks; the semi-fixed abrasive particle polishing disk consists of a base disk and a semi-fixed abrasive particle polishing layer adhered to the surface of the base disk;
the semi-fixed abrasive particle polishing layer comprises 31-36 wt% of α -alumina particles, 22-25 wt% of cerium oxide particles, 23-27 wt% of colloidal silica and the balance of a bonding agent, wherein the particle size of the α -alumina particles is 0.02-15 micrometers, and the particle size of the cerium oxide particles is 0.01-5 micrometers;
the bonding agent consists of an adhesive and an additive, wherein the adhesive accounts for 40-60 wt%;
the semi-fixed abrasive grain polishing disk is prepared according to the following steps:
I. mixing the abrasive particles, the adhesive and the additive, and uniformly stirring to obtain a mixed material;
II, placing the basal disc in a mold, then pouring the prepared mixed material into the mold, and performing cold press molding;
III, performing cold press molding, heating and curing, and cooling to obtain a semi-fixed abrasive particle polishing disk;
the polishing solution used in rough polishing comprises the following components: 1-1.5 wt% of citric acid, 0.02-0.05 wt% of hydrogen peroxide and the balance of water;
the polishing solution used in the fine polishing comprises the following components: 0.5-0.8 wt% of citric acid, 1.2-1.5 wt% of hydrogen peroxide, 0.01-0.02 wt% of anionic surfactant and the balance of water.
2. The ultra-precision polishing method for a cylindrical roller according to claim 1, characterized in that: during rough polishing, the rotating speed of the upper polishing disc is-120 to-150 rpm, the rotating speed of the lower polishing disc is 150 to 180rpm, the rotating speed of the inner gear ring is-15 to-20 rpm, and the rotating speed of the outer gear ring is 40 to 45 rpm; the down force of the upper polishing disk is 25-40N/roller.
3. The ultra-precision polishing method for cylindrical rollers according to claim 2, characterized in that the polishing liquid used in the rough polishing process comprises: 1 wt% citric acid, 0.025 wt% hydrogen peroxide and balance water.
4. The ultra-precision polishing method for a cylindrical roller according to claim 2, characterized in that: during fine polishing, the rotating speed of the upper polishing disc is-90 to-120 rpm, the rotating speed of the lower polishing disc is 120 to 140rpm, the rotating speed of the inner gear ring is-10 to-15 rpm, and the rotating speed of the outer gear ring is 30 to 45 rpm; the down pressure of the upper polishing disk is 20-30N/roller.
5. The ultra-precision polishing method for cylindrical rollers according to claim 4, characterized in that the polishing liquid used in the finish polishing process comprises: 0.5 wt% citric acid, 1.5 wt% hydrogen peroxide, 0.01 wt% anionic surfactant and balance water.
6. The ultra-precision polishing method for a cylindrical roller according to claim 1, characterized in that: the adhesive is formed by mixing a vegetable gum adhesive, a resin adhesive and a starch adhesive, and the mass ratio of each component in the adhesive is not less than 5 wt%; the additive is formed by mixing a waterproof agent, a filling agent and a defoaming agent, and the mass ratio of each component in the additive is not less than 15 wt%.
7. The ultra-precision polishing method for a cylindrical roller according to claim 6, characterized in that: in the additive, the mass ratio of the waterproof agent is 25-35 wt%, and the mass ratio of the filler is 45-50 wt%; the bulking agent comprises xylitol; in the filler, the mass ratio of xylitol is 20-35 wt%.
8. The ultra-precision polishing method for a cylindrical roller according to any one of claims 1 to 7, characterized in that: the basal disc is made of silicon nitride ceramics; in the manufacturing process of the semi-fixed abrasive particle polishing disk, the semi-fixed abrasive particle polishing disk is solidified through microwave heating after being subjected to cold press molding.
9. The ultra-precision polishing method for a cylindrical roller according to claim 8, characterized in that: the thickness of the semi-fixed abrasive particle polishing layer is 10-20 mm; when the semi-fixed abrasive grain polishing layer is heated and cured by microwave, the surface temperature of the semi-fixed abrasive grain polishing layer is controlled to be 110 +/-5 ℃.
10. The method for ultra-precision polishing of a cylindrical roller as claimed in any one of claims 1 to 7, wherein the particle size of the α -alumina particles is 3000 mesh and the particle size of the cerium oxide particles is 5000 mesh.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328527.XA CN110039381B (en) | 2019-04-23 | 2019-04-23 | Ultra-precision polishing method for cylindrical roller |
| CN202010150346.5A CN111251078B (en) | 2019-04-23 | 2019-04-23 | Semi-fixed abrasive particle polishing disc for ultra-precision polishing of cylindrical surface of GCr15 bearing steel cylindrical roller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328527.XA CN110039381B (en) | 2019-04-23 | 2019-04-23 | Ultra-precision polishing method for cylindrical roller |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010150346.5A Division CN111251078B (en) | 2019-04-23 | 2019-04-23 | Semi-fixed abrasive particle polishing disc for ultra-precision polishing of cylindrical surface of GCr15 bearing steel cylindrical roller |
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| CN111216031B (en) * | 2020-02-26 | 2021-02-26 | 西南交通大学 | Ultraprecise flexible chemical mechanical polishing device and method for micro bearing core element |
| CN111592829A (en) * | 2020-05-11 | 2020-08-28 | 广东长盈精密技术有限公司 | Fine polishing additive, fine polishing composition and polishing method |
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| CN1197930C (en) * | 2000-07-19 | 2005-04-20 | 花王株式会社 | Polishing fluid composition |
| CN101134298A (en) * | 2007-08-30 | 2008-03-05 | 浙江工业大学 | Semi-fixing abrasive grain grinding tool and method of producing the same |
| CN100500375C (en) * | 2007-10-31 | 2009-06-17 | 浙江工业大学 | Semi-sessile abrasive grain polishing method of plane stainless steel |
| CN101148034B (en) * | 2007-11-06 | 2010-12-22 | 浙江工业大学 | Multi-level grain size abrasive grain mixed semi-fixation abrasive grain grinding tool |
| CN101148035A (en) * | 2007-11-06 | 2008-03-26 | 浙江工业大学 | Soft/hard abrasive grain mixed semi-fixation abrasive grain grinding tool |
| CN202271254U (en) * | 2011-07-07 | 2012-06-13 | 曹建青 | Planet type workpiece clamping device for double-end-face grinding machine |
| JP6002528B2 (en) * | 2011-09-28 | 2016-10-05 | Hoya株式会社 | Manufacturing method of glass substrate for mask blank, manufacturing method of mask blank, manufacturing method of mask, and manufacturing method of imprint mold |
| JP2013078808A (en) * | 2011-09-30 | 2013-05-02 | Sony Corp | Polishing apparatus and polishing method |
| CN104608046B (en) * | 2015-01-27 | 2016-09-21 | 清华大学 | The superfine processing method on the bearing roller face of cylinder |
| CN104669106B (en) * | 2015-02-10 | 2017-01-25 | 盐城工学院 | Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen |
| CN105150106B (en) * | 2015-09-21 | 2017-05-17 | 上海工程技术大学 | Cooling device and cooling method for double-sided chemical mechanical grinding and polishing of wafers |
| KR101690996B1 (en) * | 2015-11-05 | 2016-12-29 | 에프엔에스테크 주식회사 | Porous polishing pad and preparing method of the same |
| CN208645029U (en) * | 2018-08-14 | 2019-03-26 | 苏州久晶光电科技有限公司 | A kind of glass cylinder face polishing abrasive tool |
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| CN111251078A (en) | 2020-06-09 |
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