CN110033711A - A kind of transparency LED display screen - Google Patents
A kind of transparency LED display screen Download PDFInfo
- Publication number
- CN110033711A CN110033711A CN201910242564.9A CN201910242564A CN110033711A CN 110033711 A CN110033711 A CN 110033711A CN 201910242564 A CN201910242564 A CN 201910242564A CN 110033711 A CN110033711 A CN 110033711A
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- Prior art keywords
- pad
- lamp bead
- signal
- metal wire
- welding zone
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- 239000011324 bead Substances 0.000 claims abstract description 177
- 239000002184 metal Substances 0.000 claims abstract description 133
- 229910052751 metal Inorganic materials 0.000 claims abstract description 133
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 238000007639 printing Methods 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims description 122
- 238000000407 epitaxy Methods 0.000 claims description 87
- 230000005611 electricity Effects 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 5
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- -1 Polyethylene terephthalate Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
Small to overcome transparency LED display screen in the prior art the spacing between each LED lamp bead can not be made to do by the way of forming the transparent conductive material of power supply on the transparent substrate by printing technology as power supply circuit, the resolution ratio of transparency LED display screen can not improve；And transparent conductive material can also reduce the problem of transparency of transparent substrate to a certain extent, the present invention provides a kind of transparency LED display screens, it uses the transparent conductive material that can be substituted in such a way that the metal wire of more high current is combined with the pad being arranged on transparent substrate Yin Shua on the transparent substrate come for the power supply of each LED lamp bead, make it possible to the spacing further reduced between each LED lamp bead, promote its resolution ratio, simultaneously, the metal wire of small diameter is also smaller to the blocking of sight, can guarantee high penetrating degree.
Description
Technical field
The present invention relates to LED field, especially transparency LED field.
Background technique
Transparent LED display is gradually widely used in the market, and develops various products form.One kind exists
The transparency LED display screen technology of array distribution LED light starts to occur on transparent substrate.This technology generally uses transparent conduction
Material, such as metal grill (metal mesh), nano silver, ITO etc., but since above-mentioned material depends on the transparent substrate
Very thin thickness, while the current needs of LED operation are bigger, these materials are difficult to meet the power demands of LED, especially exist
When LED array arrangement is than comparatively dense (LED light spacing 10mm or less), it is difficult to meet the power supply needs of entire screen.LED light
Work in addition to power supply other than, it is also necessary to therefore, between LED light signal input control needs the connection of communication signal line, therefore
The route segmentation that will lead on substrate is more complicated, so that the route area of power pack be made to reduce, resistance increases.Although also having
Technical solution will drive IC package inside LED light, thus reduce the complexity of circuit, but the signal between LED light
Line also at least also needs 1 or 2, and the case where LED light is arranged than comparatively dense, circuitous pattern layer is after over-segmentation, still
It so can not meet the demand of power supply.
For example, as shown in Figure 1, existing provide a kind of improved transparency LED display screen comprising transparent substrate, it is described
Transparent substrate is equipped with printed circuit layer, and the LED lamp bead array for being packaged with chip is installed on the transparent substrate；As shown in Fig. 2,
Specifically, including lamp bead welding zone, power pad and signal pad etc. on the printed circuit layer, 4 use are equipped in the lamp bead welding zone
In the pad of mounted LED lamp bulb pin, in addition, setting in each lamp bead welding zone, there are two signal pins pads and two electrode pin welderings
Disk, signal pins pad is concatenated by printing signal route, and opposite polarity two electrode pin pads lead to respectively
The metal grill 30 of printing on the transparent substrate is crossed to be powered.
It is exactly the metal that can directly form power supply on the transparent substrate by printing technology that this kind of mode, which has certain benefit,
Grid 30 is used as power supply circuit；However, the thickness due to printing figures layer generally only has 35 microns, it is formed by metal mesh
The electric current very little that every wire can carry on lattice 30, particularly, when LED lamp bead spacing is less than 8mm, metal grill 30 is passed through
Width after over-segmentation only less than 4mm, power supply capacity is quite small and weak, the spacing between each LED lamp bead can not be made to do small,
The resolution ratio of transparency LED display screen can not improve；And in order to increase conductive capability, 30 mesh of metal grill makees small wire and does greatly
The transparency of transparent substrate can be reduced to a certain extent later.
Summary of the invention
The gold of power supply is formed on the transparent substrate by printing technology to overcome transparency LED display screen in the prior art to use
Belonging to grid, the spacing between each LED lamp bead can not to be made to do as the mode of power supply circuit small, the resolution ratio of transparency LED display screen without
Method improves；And metal grill can reduce the problem of transparency of transparent substrate to a certain extent, the present invention provides a kind of transparent
LED display.
The present invention provides a kind of transparency LED display screens, including transparent substrate and LED lamp bead；The LED lamp bead includes branch
Frame, the driving chip and luminescent wafer being formed on bracket；Several pins are additionally provided in the LED lamp bead, the pin includes
Electrode pin and signal pins；
Printed circuit layer is laid on the transparent substrate；The printed circuit layer include power pad, signal pad and
At the lamp bead welding zone of the mounted LED lamp bulb of array arrangement；
Each lamp bead welding zone is equipped with pin pad corresponding with the pin of LED lamp bead；The pin pad packet
Include signal pins pad and electrode pin pad；Epitaxy part is led on each electrode pin pad；
It between signal pins pad and goes together or the adjacent lamps bead weld area of same column in the signal pad and lamp bead welding zone
The signal wire for signal transmission is provided between interior signal pins pad；So that controlling the control letter of each LED lamp bead light on and off
It number can successively transmit after signal pad input through each LED lamp bead；
By on the lamp bead welding zone the epitaxy part of the electrode pin pad and the power pad of same polarity pass through metal
Wire bonding electrical connection.
Transparency LED display screen provided by the invention, due to it is used can be by the metal wire of more high current and transparent base
The mode that the pad being arranged on plate combines substitutes printing metal grill on the transparent substrate for the power supply of each LED lamp bead,
The spacing further reduced between each LED lamp bead is made it possible to, its resolution ratio is promoted, meanwhile, the metal wire pair of small diameter
The blocking of sight is also smaller, can guarantee high penetrating degree.
Further, the printed circuit layer is equipped with N row * M column lamp bead welding zone；
M signal pad is disposed on the printed circuit layer；N number of lamp bead on the M signal pad and its same column
It is sequentially connected in series between signal pins pad in welding zone by signal wire；
Alternatively, being disposed with N number of signal pad on the printed circuit layer；N number of signal pad with its go together on M
It is sequentially connected in series between signal pins pad in lamp bead welding zone by signal wire.
Further, M is disposed on the printed circuit layer to power pad or N to power pad；Each pair of electricity
Source pad includes opposite polarity first power pad and second source pad；
The electrode pin pad includes first electrode pin pad and second electrode pin pad；The first electrode is drawn
The first epitaxy part is led on foot pad；The second epitaxy part is led on the second electrode pin pad；
By the of the first epitaxy part of the first electrode pin pad on N number of lamp bead welding zone on same column and same polarity
One power pad is electrically connected by the first metal wire bonding；By the second electrode pin pad on the lamp bead welding zone on same column
The second epitaxy part be electrically connected with the second source pad of same polarity by the second metal wire bonding；Alternatively, by M on colleague
First epitaxy part of the first electrode pin pad on lamp bead welding zone and the first power pad of same polarity pass through the first gold medal
Belong to wire bonding electrical connection；By the second epitaxy part and same polarity of the second electrode pin pad on the lamp bead welding zone on same column
Second source pad pass through the second metal wire bonding be electrically connected.
Further, M+1 power pad or N+1 power pad are disposed on the printed circuit layer；
The M+1 power pad or N+1 power pad include spaced opposite polarity first power supply weldering
Disk and second source pad；
The electrode pin pad includes first electrode pin pad and second electrode pin pad；The first electrode is drawn
The first epitaxy part is led on foot pad；The second epitaxy part is led on the second electrode pin pad；
By the of the first epitaxy part of the first electrode pin pad on N number of lamp bead welding zone on same column and same polarity
One power pad is electrically connected by the first metal wire bonding；By the second electrode pin pad on the lamp bead welding zone on same column
The second epitaxy part be electrically connected with the second source pad of same polarity by the second metal wire bonding；First metal wire and institute
State the setting of the second metal wire interval；Alternatively, by first of the first electrode pin pad on M lamp bead welding zone on colleague
Epitaxy part is electrically connected with the first power pad of same polarity by the first metal wire bonding；By the institute on the lamp bead welding zone on same column
The second epitaxy part for stating second electrode pin pad is electrically connected with the second source pad of same polarity by the second metal wire bonding,
First metal wire and the setting of second metal wire interval.
Further, the lamp bead welding zone on first metal wire and second metal wire and each column is in parallel columns interval
Setting；The first epitaxy part and the second epitaxy part on each lamp bead welding zone respectively with outside its left and right sides the first metal wire and
The electrical connection of second metal wire；Wherein, the epitaxy part connection of same polar metal wire is shared between the lamp bead welding zone in adjacent column
It is integrated；
Alternatively, first metal wire and second metal wire are set with the lamp bead welding zone on each row in parallel row interval
It sets；The first epitaxy part and the second epitaxy part on each lamp bead welding zone respectively with the first metal wire and outside its upper and lower two sides
The electrical connection of two metal wires；Wherein, the epitaxy part that same polar metal wire is shared between the lamp bead welding zone in adjacent rows is connected as
One.
Further, it draws from same power pad with its same row or with the extension on the lamp bead welding zone in a line
The metal wire that portion is welded to connect has more.
Further, more wires include long metal wire and short metal wire；
The short metal wire is used to connect and the epitaxy part on the close lamp bead welding zone of corresponding power pad；The long metal
Line is used to connect and the epitaxy part on the farther away lamp bead welding zone of corresponding power pad；The long metal wire and power pad are close
The insulating layer for keeping its non-electric-connecting is provided between the epitaxy part of lamp bead welding zone.
Further, the signal pins pad on each lamp bead welding zone includes at least the first signal input pin pad and the
One signal output pin pad；
M signal pad is disposed on the printed circuit layer；N number of lamp bead on the M signal pad and its same column
It is sequentially connected in series between the first signal input pin pad and the first signal output pin pad in welding zone by signal wire；
Alternatively, being disposed with N number of signal pad on the printed circuit layer；M on N number of signal pad and its same column
It is sequentially connected in series between the first signal input pin pad and the first signal output pin pad in lamp bead welding zone by signal wire.
Further, the diameter of the metal wire is 0.1mm-1mm.
Further, the signal wire is printing signal line.
Further, the front of transparent substrate is arranged in the lamp bead welding zone, and lamp bead on the transparent substrate front is welded
Conductive through hole is set under pin pad in area, the epitaxy part is arranged in the back side of the transparent substrate, is led by described
Electric through-hole is electrically connected the epitaxy part and the pin pad；
The power pad is also disposed to the back side of the transparent substrate, the epitaxy part and the power supply of same polarity are welded
Disk is electrically connected by metal wire bonding.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view of the transparency LED display screen provided in the prior art；
Fig. 2 is the schematic top plan view of the transparency LED display screen provided in the prior art；
Fig. 3 is (before non-sealing) the broken section signal of the transparency LED display screen provided in the specific embodiment of the invention
Figure；
Fig. 4 is (after sealing) partial schematic sectional view of the transparency LED display screen provided in the specific embodiment of the invention；
Fig. 5 is the first the LED lamp bead schematic bottom view provided in the specific embodiment of the invention；
Fig. 6 is the first the LED lamp bead front schematic view provided in the specific embodiment of the invention；
Fig. 7 is second of the LED lamp bead schematic bottom view provided in the specific embodiment of the invention；
Fig. 8 is second of the LED lamp bead front schematic view provided in the specific embodiment of the invention；
Fig. 9 is that printed circuit layer and welded wire are printed on the transparent substrate provided in the specific embodiment of the invention
Schematic top plan view；
Figure 10 is enlarged diagram at A in Fig. 9；
Figure 11 is the partial schematic sectional view of welded wire on the transparent substrate provided in the specific embodiment of the invention；
Figure 12 is another broken section of welded wire on the transparent substrate provided in the specific embodiment of the invention
Schematic diagram；
Figure 13 is that the schematic top plan view after LED lamp bead is welded on the transparent substrate provided in the specific embodiment of the invention；
Figure 14 is enlarged diagram at B in Figure 13；
Figure 15 is to print printed circuit layer on the preferred transparent substrate of another kind provided in the specific embodiment of the invention
With the schematic top plan view of welded wire；
Figure 16 is enlarged diagram at C in Figure 15；
Figure 17 is to print printed circuit layer on the further preferred transparent substrate provided in the specific embodiment of the invention
With the schematic top plan view of welded wire；
Figure 18 is the office of welded wire on the further preferred transparent substrate provided in the specific embodiment of the invention
Portion's schematic cross-sectional view；
Figure 19 is printed on the transparent substrate for welding second of LED lamp bead provided in the specific embodiment of the invention
The partial schematic sectional view of printed circuit layer and welded wire；
Figure 20 be provided in the specific embodiment of the invention one kind preferably in transparent substrate back side welded wire
Partial schematic sectional view；
Figure 21 is another printing printed circuit layer and the weldering on the transparent substrate provided in the specific embodiment of the invention
Connect the schematic top plan view of metal wire.
Wherein, 1, transparent substrate；2, LED lamp bead；3, printed circuit layer；4, metal wire；5, adhesive layer；
20, bracket；21, pin；21a, first electrode pin；21b, second electrode pin；21c, the input of the first signal are drawn
Foot；21d, the first signal output pin；21e, second signal input pin；21f, second signal output pin；22, core is driven
Piece；23, luminescent wafer；23R, emitting red light chip；23G, green emitting chip；23B, blue emitting dies；
30, metal grill；31, lamp bead welding zone；32, power pad；33, signal pad；34, signal wire；31a, the first electricity
Pole pin pad；31b, second electrode pin pad；31c, the first signal input pin pad；31d, the first signal output pin
Pad；31e, second signal input pin pad；31f, second signal output pin pad；311, epitaxy part；312, it is electrically connected
Part；311a, the first epitaxy part；311b, the second epitaxy part；32a, the first power pad；32b, second source pad；33a, first
Signal pad；33b, second signal pad；34a, the first track；34b, the second track；
41, long metal wire；42, short metal wire；43, insulating layer；44, grid is printed；4a, the first metal wire；4b, the second gold medal
Belong to line.
Specific embodiment
In order to which the technical problems, technical solutions and beneficial effects solved by the present invention is more clearly understood, below in conjunction with
Accompanying drawings and embodiments, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
In the description of the present invention, it is to be understood that, term " longitudinal direction ", " radial direction ", " length ", " width ", " thickness ",
The orientation of instructions such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or
Positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without
It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore not
It can be interpreted as limitation of the present invention.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or two
More than.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Embodiment
As shown in Figure 3, Figure 4, this example discloses a kind of transparency LED display screen comprising transparent substrate 1 and LED lamp bead 2；
The LED lamp bead 2 includes bracket 20, the driving chip 22 and luminescent wafer 23 being formed on bracket 20.
The LED lamp bead 2 is known to the public, as shown in Fig. 5, Fig. 6, Fig. 7, Fig. 8, is additionally provided in the LED lamp bead 2 several
Pin 21, the pin 21 include electrode pin and signal pins；
For example, disclosing the LED lamp bead 2 for being packaged with driving chip 22 of 4 pins 21 in Fig. 5, Fig. 6, wherein its pin
21 include two electrode pins and two signal pins；The electrode pin includes first electrode pin 21a and second electrode pin
21b；For example, the polarity of two electrode pins is on the contrary, for example, first electrode pin 21a is as positive pin；Second electrode pin
21b is as negative pin.It is used to provide power supply for the luminescent wafer 23 in LED lamp bead 2；Two signal pins are referred to as
One signal input pin 21c and the first signal output pin 21d；Driving chip 22 is equipped with interface and is shone by binding line with each
Chip 23 and the electrical connection of each pin.
In this example, luminescent wafer 23 includes emitting red light chip 23R, green emitting chip 23G and blue emitting dies
23B；It is in rods arranged in horizontal line；Certainly, it can also arrange in isosceles triangle.
Certainly, according to the difference of control mode, it may be multiple for controlling the signal pins of signal input and output, such as
Shown in Fig. 7, Fig. 8, signal pins are defeated including the first signal input pin 21c, the first signal output pin 21d, second signal
Enter pin 21e, second signal output pin 21f.It is exported by two signal input pin input signals by two signals
Pin output signal.
Transparent substrate 1 can use the various rigid or flexible material of public domain, for example, transparent substrate 1 can be with
For glass substrate, PET (English name: Polyethylene terephthalate, Chinese: poly terephthalic acid second two
Alcohol ester) substrate, transparent PI (English name: polyimide, Chinese: polyimides) film etc..
As shown in Figure 3, Figure 4, printed circuit layer 3 is laid on the transparent substrate 1；The printed circuit layer 3 includes electricity
The lamp bead welding zone 31 of source pad 32, signal pad 33 and the mounted LED lamp bulb 2 at array arrangement；
Each lamp bead welding zone 31 is equipped with pin pad corresponding with the pin of LED lamp bead 2；The pin pad
Including signal pins pad and electrode pin pad；Epitaxy part 311 is led on each electrode pin pad；
It between signal pins pad and goes together or the adjacent lamp bead of same column in the signal pad 33 and lamp bead welding zone 31
The signal wire 34 for signal transmission is provided between signal pins pad in welding zone 31；So that controlling each 2 light on and off of LED lamp bead
Control signal can successively transmit after the input of signal pad 33 through each LED lamp bead 2；
Described power pad 32 is used to be connected with the DC power supply of external connection in this example, and by mentioning in the application
To metal wire 4 DC power supply is connected to each LED lamp bead 2 by the power pad 32；It includes opposite polarity first electricity
Source pad 32a and second source pad 32b；Such as in this example, the first power pad 32a is positive terminal pad；Second source pad
32b is negative terminal pad；
Opposite polarity two, such as a first power pad 32a, second electricity can be only arranged in power pad 32
Source pad 32b；The homopolarity on the power pad 32 of array distribution on lamp bead welding zone 31 can be implemented as by one metal wire 4
Property pin pad electrical connection.Perhaps power pad 32 may be set to be multiple lamp bead welderings that can be arranged with a line or one
The pin pad of same polarity in area 31 is electrically connected to a power pad 32 by metal wire 4.Some illustrate will be done below
It is bright.
Likewise, the signal pad 33 is used to be attached with external signal input sources, it is typically connected to upper level
Control chip；The number of the signal pad 33 is not particularly limited, for example, signal pad in the Fig. 2 mentioned in background technique
33 only have one, and by 33 input control signal of signal pad, the control signal is then passed through signal wire 34 successively
It is transferred to each LED lamp bead 2 of concatenation.Certainly, can also according to the I/O mouth on control chip number be configured.
For example perhaps the same signal pad 33 of use of LED lamp bead 2 or multirow of same row or the LED lamp bead 2 of multiple row use with a line
Same signal pad 33, is all allowed.
It, can be using the printing signal wire being printed on transparent substrate 1, the printing about defined herein signal wire 34
Signal wire can be ITO (Chinese name: tin indium oxide；Full name in English: Indium Tin Oxides) line or silver paste line or
Copper wire etc. is covered, in this example, be printed on transparent substrate 1 latticed is used to cover copper wire.Or metal wire is used using point-to-point
Machine stamps fly line and connects to form fly line network.Likewise, the pad and epitaxy part 311 on printed circuit layer 3 are also can
To do what printed circuit production was got on transparent conductive material, such as metal grill, ITO, nano silver etc..
It is emphasized that signal wire 34 and epitaxy part 311 in actual production as use cover copper product may be implemented it is small
To the line width of 0.1mm, the power demands and signal transmission of conductive capability LED lamp single enough are minimum to the blocking of sight,
The high transparency of monolith LED display may be implemented.
The epitaxy part 311 of the electrode pin pad on the lamp bead welding zone 31 is led to the power pad 32 of same polarity
Cross the welding electrical connection of metal wire 4.
As shown in figure 4, LED lamp bead 2 is welded to corresponding lamp bead welding zone 31 on transparent substrate 1 by surface mounting technology
Afterwards, one layer of adhesive layer 5 can be encapsulated in its 1 entire surface of transparent substrate again.It further, as needed, can also be in the sealing
A transparent protective cover is arranged in 5 top of layer.And harness is drawn from power pad 32 and signal pad 33, and in transparent protective cover and
Edge between transparent substrate 1 is sealed encapsulation, it is made to play waterproof effect.
It will be explained below further combined with specific preferred embodiment.
As shown in figure 9, the printed circuit layer 3 is equipped with N row * M column lamp bead welding zone 31；As an example, it is assumed that N=5；M
=5；5*5 lamp bead welding zone 31 has been printed in this example on a transparent substrate 1.To make those skilled in the art understand that the present invention
Design, the column that the lamp bead welding zone 31 in same a line is constituted are known as welding row；The column that lamp bead welding zone 31 in same row will be constituted
Referred to as weldering column.
As shown in Figures 9 and 10,5 signal pads 33 are disposed on the printed circuit layer 3；5 signal pads 33 with
It is sequentially connected in series between the signal pins pad in 5 lamp bead welding zones 31 on its same column by signal wire 34；Specifically, lamp bead is welded
The first signal input pin pad 31c and the first signal output pin pad 31d is equipped in area 31；The concatenation, the correspondence
The signal wire 34 (for the sake of difference, is known as the first track in this example by a signal wire 34 by the signal pad 33 on column
The first signal input pin pad 31c 34a) being connected in the upper first lamp bead welding zone 31 of the column；Then pass through first lamp
The first signal output pin pad 31d in bead weld area 31 (will be in the adjacent lamps bead weld area 31 in this example by signal wire 34
Signal wire 34 is known as the second track 34b) the first signal input pin weldering in second lamp bead welding zone 31 is connected on same column
Disk 31c by this method concatenates the 3rd, 4,5 lamp bead welding zone 31.Certainly, the mode concatenated is not necessarily limited to together
Capable or same column.Signal wire 34 in this example is all made of latticed form, can further increase transparency LED display screen
Crystalistic sense.
In this example, 5 pairs of power pads 32 are disposed on the printed circuit layer 3；Each pair of power pad 32 includes pole
Property opposite the first power pad 32a and second source pad 32b；
As shown in Fig. 9-Figure 10, the electrode pin pad in each lamp bead welding zone 31 includes first electrode pin
Pad 31a and second electrode pin pad 31b；The first epitaxy part 311a is led on the first electrode pin pad 31a；Institute
It states and leads to the second epitaxy part 311b on second electrode pin pad 31b；
By the first epitaxy part 311a of the first electrode pin pad 31a on 5 lamp bead welding zones 31 on same column with
First power pad 32a of same polarity passes through the first metal wire 4a welding electrical connection；By the institute on the lamp bead welding zone 31 on same column
The second source pad 32b of the second epitaxy part 311b and same polarity that state second electrode pin pad 31b pass through the second metal wire
4b welding electrical connection.
Weldering connection is given directions in welding described in this example.As shown in Figure 11, Figure 12, when spot welding connects, especially making
When high density product of the present invention, binding can be used between solder joint and solder joint using binding wire bonder as shown in Figure 11
Metal wire 4 is realized connection by the mode of routing between solder joint, therefore will form the arc of certain bending, in production low-density
It can also be pressed together on by the way of straight line as in Figure 12 on each solder joint when product of the present invention, be carried out by brush tin cream
Furnace welding.
After LED lamp bead 2 is installed on the transparent substrate 1 equipped with printed circuit layer 3, result as shown in figs. 13 and 14,
It is electric by the epitaxy part 311 extended on the electrode pin pad on metal wire 4 and lamp bead welding zone 31 by power pad 32
Electric current is electrically connected from the electrode pin of LED lamp bead 2 by the electrode pin pad, forms current supply circuit by connection.Meanwhile from
The control signal flowed on signal pad 33 is successively flowed through from the LED lamp bead 2 of each concatenation, is received simultaneously by previous LED lamp bead 2
Pass to next LED lamp bead 2.It has realized to the light on and off of luminescent wafer 23 in each LED lamp bead 2 and color change control.
About metal wire 4, its specific material etc. is not limited, as long as its conductive capability is met the requirements, it is usually preferred to
The high metal of conductivity.In this example, it is preferred to use copper wire.Preferably, the diameter of the metal wire 4 is 0.1mm-1mm.Metal
The diameter range of line 4 0.1mm-1mm range be it is more satisfactory, can be more satisfactory in this diameter range meet permutation
The power demands of LED lamp bead 2 are many times stronger than the conductive capability of other transparent conductive materials.Meanwhile the metal of small diameter
Line 4 is also smaller to the blocking of sight, can guarantee high penetrating degree.
This example provide transparency LED display screen, due to it is used can be by the metal wire 4 and transparent substrate of more high current
The mode that the pad being arranged on 1 combines substitute the metal grill being printed on transparent substrate 1 come for each LED lamp bead 2 power supply,
Such as: diameter is the copper wire of 0.5mm, and conductive capability is equivalent to width 5.6mm with a thickness of 35 μm of the meshed copper foil that do not have, such as
The metal grill of same sectional area is made in fruit, and width is bigger, and the light-blocking part of copper wire only has the width of 0.5mm, relative to using
For the metal grill of copper foil manufacture, transparency is greatly improved, so that it can further reduce each LED lamp bead 2
Between spacing, promote its resolution ratio, meanwhile, the metal wire 4 of small diameter is also smaller to the blocking of sight, for 0.5mm
The copper wire of diameter, human eye has been difficult to discover other than 1.5m, for LED display, generally will 2-3m viewing away from
From therefore, this scheme rightly meets the demand for guaranteeing screen transparency and conductive capability, can make transparency LED
The Penetration ration of display screen is more preferable.
If the size of the LED lamp bead 2 of built-in driving chip 22 is 1.2mm*1.2mm, the spacing of LED lamp bead 2 is 5mm*
5mm, the diameter of conducting wire are 0.3mm, then 90% or more Penetration ration may be implemented, and a kind of the saturating of high grade of transparency high-res is made
Bright LED display.
It can also be arranged on the printed circuit layer 3 as shown in Figure 15, Figure 16 as another preferred mode
There are M+1 power pad 32 or N+1 power pad 32；
It is still illustrated by taking N=M=5 as an example in this example.6 power pads 32 are disposed on the printed circuit layer 3.
6 power pads 32 include that spaced opposite polarity first power pad 32a and second source weld
Disk 32b；As shown in figure 15,6 power pads 32 are arranged on the top side of a column lamp bead welding zone 31, are followed successively by the first power supply
Pad 32a, second source pad 32b, the first power pad 32a, second source pad 32b, the first power pad 32a and second
Power pad 32b；
Likewise, the electrode pin pad includes first electrode pin pad 31a and second electrode pin pad 31b；
The first epitaxy part 311a is led on the first electrode pin pad 31a；It is led on the second electrode pin pad 31b
Second epitaxy part 311b；
Then by the first epitaxy part of the first electrode pin pad 31a on 5 lamp bead welding zones 31 on same column
311a is electrically connected with the first power pad 32a of same polarity by the first metal wire 4a welding；Also i.e. by the on same weldering column
One epitaxy part 311a is electrically connected by the first metal wire 4a with the first power pad 32a；It will be on the lamp bead welding zone 31 on same column
The second epitaxy part 311b of the second electrode pin pad 31b and the second source pad 32b of same polarity pass through the second metal
Line 4b welding electrical connection；Also the second epitaxy part 311b on same weldering column is passed through into the second metal wire 4b and second source pad
32b electrical connection；The first metal wire 4a and the interval the second metal wire 4b setting；The first metal wire 4a and described
Lamp bead welding zone 31 on two metal wire 4b and each column is arranged in parallel columns interval；The first epitaxy part on each lamp bead welding zone 31
311a and the second epitaxy part 311b respectively with its left and right sides outside the first metal wire 4a and the second metal wire 4b be electrically connected；This example
In, as preferred mode, wherein as shown in figure 16, same polar metal is shared between the lamp bead welding zone 31 in adjacent column
The epitaxy part 311 of line 4 is connected as one.For example, the top between two adjacent weldering column is equipped with one first power pad
32a draws from first power pad 32a and is welded with 3 with the first metal wire 4a；Lamp bead welding zone between two neighboring ranks
The first epitaxy part 311a on 31 is extended to one.As preferred mode, to prevent the first epitaxy part 311a and other
Signal wire 34 etc. form chiasma interference, as shown in the lamp bead welding zone 31 in left side in Figure 16, its first epitaxy part 311a can be made from 4
The inside of a pin-land passes through.
Certainly, it can also be arranged in line power pad 32 and signal pad 33, by the institute on M lamp bead welding zone 31 on colleague
The first power pad 32a of the first epitaxy part 311a and same polarity that state first electrode pin pad 31a pass through the first metal wire
4a welding electrical connection；By the second epitaxy part 311b of the second electrode pin pad 31b on the lamp bead welding zone 31 on same column
It is electrically connected with the second source pad 32b of same polarity by the second metal wire 4b welding, the first metal wire 4a and described the
The setting of two intervals metal wire 4b.
In this example, as preferred mode, draw from same power pad 32 with its same row or in a line
The metal wire 4 that epitaxy part 311 on lamp bead welding zone 31 is welded to connect has more.Such as in this example, the power supply arranged from left to right
In pad 32, the metal wire 4 being arranged on 2-5 power pad 32 is equipped with 3.3 wires 4 weldering adjacent thereto
The epitaxy part 311 of same polarity on column carries out spot welding connection.Metal wire 4 is divided into more root beads to connect, gold can be further decreased
The diameter for belonging to line 4, is observed so that metal wire 4 is more difficult.So that the crystalistic sense of transparency LED display screen enhances.
Further, as preferred mode, as shown in figure 17, more wires 4 include long metal wire 41 and short
Metal wire 42；
Short metal wire 42 is used to connect and the epitaxy part 311 on the close lamp bead welding zone 31 of corresponding power pad 32；Long gold
Belong to line 41 to be used to connect and the epitaxy part 311 on the farther away lamp bead welding zone 31 of corresponding power pad 32；
As shown in figure 18, between the long metal wire 41 and the epitaxy part 311 of the close lamp bead welding zone 31 of power pad 32
It is provided with the insulating layer 43 for keeping its non-electric-connecting.The purpose done so is being guaranteed as close to the LED lamp bead 2 of power pad 32
While power supply, it is no longer necessary to continue extension lead to the LED lamp bead 2 far from power pad 32, thus far from power pad
The quantity of metal wire 4 is reduced in 32 region, improves the penetrating degree of LED screen.Long metal wire 41 and short metal are used by this kind
The mode of line 42 can allow and respectively obtain just enough electric currents apart from different LED lamp beads 2, guarantee apart from power pad 32
Farther away LED light obtains enough voltage, while reducing blocking of the metal wire to sight, improves penetrating degree.
Certainly, above embodiment is mainly illustrated so that LED lamp bead 2 is 4 pins as an example, can also be as shown in figure 19,
Corresponding increase is done to the pad of its lamp bead welding zone 31 to design, and increases signal pins pad and signal pad in each lamp bead welding zone 31
Signal wire 34 between 33.For example, including the first signal input pin pad 31c, the first letter in the lamp bead welding zone 31
Number output pin pad 31d, second signal input pin pad 31e and second signal output pin pad 31f.It is corresponding, letter
Number pad 33 includes the first signal pad 33a and second signal pad 33b；First signal pad 33a is connected by signal wire 34
The first signal input pin pad 31c, second signal pad 33b to first lamp bead welding zone 31 is connected to by signal wire 34
The second signal input pin pad 31e of first lamp bead welding zone 31；First signal output pin of first lamp bead welding zone 31
Pad 31d is connected to the first signal input pin pad 31c of second lamp bead welding zone 31, first lamp bead by signal wire 34
The second signal output pin pad 31f of welding zone 31 is defeated by the second signal that signal wire 34 is connected to second lamp bead welding zone 31
Enter pin pad 31e, and so on.
As preferred mode, as shown in figure 20, if definition install the LED lamp bead 2 face be transparent substrate 1 just
Face, the then face for not installing the LED lamp bead 2 that it is opposite with the front are the back side；The lamp bead welding zone 31 is arranged in transparent base
Conductive through hole 312 will be arranged under the pin pad on the upper lamp bead welding zone 31 in 1 front of transparent substrate in the front of plate 1, will be described
The back side of the transparent substrate 1 is arranged in epitaxy part 311, is electrically connected the epitaxy part 311 and institute by the conductive through hole 312
State pin pad；This conductive through hole is easy to realize by copper plating of printed circuit board technique.
The power pad 32 is also disposed to the back side of the transparent substrate 1, by the epitaxy part 311 and same polarity
Power pad 32 passes through the welding electrical connection of metal wire 4.The beneficial effect of the program is that metal wire 4 may be mounted at LED lamp bead 2
Underface, especially to the production of highdensity transparency LED display screen in the case of, allow 2 weight of part metals line 4 and LED lamp bead
It closes, can further enhance the transparency.
Certainly, it is not limited to metal wire 4 can only be used to connect power pad 32 and epitaxy part 311 in this example, such as Figure 21
It is shown, can also be using metal wire 4 as main electric current transfer mode, then assist through metal grill (for the sake of difference, originally
The metal grill named in example and be labeled as printing grid 44) connect epitaxy part 311；The reticular density of the printing grid 44
It is required that can reduce, effectiveness is also equivalent to this epitaxy part 311 just invented, and can phase for the width of the printing grid 44
To relatively narrow, to reduce the gap between LED lamp bead 2, its resolution ratio is improved.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (11)
1. a kind of transparency LED display screen, including transparent substrate and LED lamp bead；It is characterized in that, the LED lamp bead include bracket,
The driving chip and luminescent wafer being formed on bracket；Several pins are additionally provided in the LED lamp bead, the pin includes electrode
Pin and signal pins；
Printed circuit layer is laid on the transparent substrate；The printed circuit layer includes power pad, signal pad and Cheng Zhen
Arrange the lamp bead welding zone of the mounted LED lamp bulb of arrangement；
Each lamp bead welding zone is equipped with pin pad corresponding with the pin of LED lamp bead；The pin pad includes letter
Number pin pad and electrode pin pad；Epitaxy part is led on each electrode pin pad；
In the signal pad and lamp bead welding zone between signal pins pad and go together or the adjacent lamps bead weld area of same column in
The signal wire for signal transmission is provided between signal pins pad；So that the control signal for controlling each LED lamp bead light on and off can
Successively to be transmitted through each LED lamp bead after being inputted from signal pad；
The epitaxy part of the electrode pin pad on the lamp bead welding zone and the power pad of same polarity are passed through into metal wire bonding
Connect electrical connection.
2. transparency LED display screen according to claim 1, which is characterized in that the printed circuit layer is arranged equipped with N row * M
Lamp bead welding zone；
M signal pad is disposed on the printed circuit layer；N number of lamp bead welding zone on the M signal pad and its same column
It is sequentially connected in series between interior signal pins pad by signal wire；
Alternatively, being disposed with N number of signal pad on the printed circuit layer；N number of signal pad with its go together on M lamp bead
It is sequentially connected in series between signal pins pad in welding zone by signal wire.
3. transparency LED display screen according to claim 2, which is characterized in that be disposed with M on the printed circuit layer to electricity
Source pad or N are to power pad；Each pair of power pad includes opposite polarity first power pad and second source weldering
Disk；
The electrode pin pad includes first electrode pin pad and second electrode pin pad；The first electrode pin weldering
The first epitaxy part is led on disk；The second epitaxy part is led on the second electrode pin pad；
By the first electricity of the first epitaxy part of the first electrode pin pad on N number of lamp bead welding zone on same column and same polarity
Source pad is electrically connected by the first metal wire bonding；By of the second electrode pin pad on the lamp bead welding zone on same column
Two epitaxy parts are electrically connected with the second source pad of same polarity by the second metal wire bonding；Alternatively, by M lamp bead on colleague
First epitaxy part of the first electrode pin pad on welding zone and the first power pad of same polarity pass through the first metal wire
Welding electrical connection；By the of the second epitaxy part of the second electrode pin pad on the lamp bead welding zone on same column and same polarity
Two power pads are electrically connected by the second metal wire bonding.
4. transparency LED display screen according to claim 2, which is characterized in that be disposed with M+1 on the printed circuit layer
Power pad or N+1 power pad；
The M+1 power pad or N+1 power pad include spaced opposite polarity first power pad and
Second source pad；
The electrode pin pad includes first electrode pin pad and second electrode pin pad；The first electrode pin weldering
The first epitaxy part is led on disk；The second epitaxy part is led on the second electrode pin pad；
By the first electricity of the first epitaxy part of the first electrode pin pad on N number of lamp bead welding zone on same column and same polarity
Source pad is electrically connected by the first metal wire bonding；By of the second electrode pin pad on the lamp bead welding zone on same column
Two epitaxy parts are electrically connected with the second source pad of same polarity by the second metal wire bonding；First metal wire and described
The setting of two metal wire intervals；Alternatively, by the first extension of the first electrode pin pad on M lamp bead welding zone on colleague
Portion is electrically connected with the first power pad of same polarity by the first metal wire bonding；By described on the lamp bead welding zone on same column
Second epitaxy part of two electrode pin pads is electrically connected with the second source pad of same polarity by the second metal wire bonding, described
First metal wire and the setting of second metal wire interval.
5. transparency LED display screen according to claim 4, which is characterized in that first metal wire and second gold medal
The lamp bead welding zone belonged on line and each column is arranged in parallel columns interval；The first epitaxy part and the second extension on each lamp bead welding zone
Portion respectively with its left and right sides outside the first metal wire and the second metal wire be electrically connected；Wherein, the lamp bead welding zone in adjacent column it
Between share the epitaxy part of same polar metal wire and be connected as one；
Alternatively, first metal wire and second metal wire are arranged with the lamp bead welding zone on each row in parallel row interval；Institute
State the first epitaxy part on each lamp bead welding zone and the second epitaxy part respectively with the first metal wire and the second gold medal outside its upper and lower two sides
Belong to line electrical connection；Wherein, the epitaxy part that same polar metal wire is shared between the lamp bead welding zone in adjacent rows is connected as one.
6. the transparency LED display screen according to any one of claim 3,4,5, which is characterized in that welded from same power supply
Drawing on disk has more with its same row or the metal wire being welded to connect with the epitaxy part on the lamp bead welding zone in a line.
7. transparency LED display screen according to claim 6, which is characterized in that more wires include long metal wire
With short metal wire；
The short metal wire connection and the epitaxy part on the close lamp bead welding zone of corresponding power pad；The long metal wire connection with
Epitaxy part on the farther away lamp bead welding zone of corresponding power pad；The long metal wire is outer with the close lamp bead welding zone of power pad
Prolong the insulating layer for being provided between portion and keeping its non-electric-connecting.
8. transparency LED display screen according to claim 2, which is characterized in that the signal pins weldering on each lamp bead welding zone
Disk includes at least the first signal input pin pad and the first signal output pin pad；
M signal pad is disposed on the printed circuit layer；N number of lamp bead welding zone on the M signal pad and its same column
It is sequentially connected in series between interior the first signal input pin pad and the first signal output pin pad by signal wire；
Alternatively, being disposed with N number of signal pad on the printed circuit layer；M lamp bead on N number of signal pad and its same column
It is sequentially connected in series between the first signal input pin pad and the first signal output pin pad in welding zone by signal wire.
9. transparency LED display screen according to claim 1, which is characterized in that the diameter of the metal wire is 0.1mm-
1mm。
10. transparency LED display screen according to claim 1, which is characterized in that the signal wire is printing signal line.
11. transparency LED display screen according to claim 1, which is characterized in that the lamp bead welding zone is arranged in transparent substrate
Front, conductive through hole will be set under the pin pad on the transparent substrate front on lamp bead welding zone, the epitaxy part is set
It sets at the back side of the transparent substrate, the epitaxy part and the pin pad is electrically connected by the conductive through hole；
The power pad is also disposed to the back side of the transparent substrate, the power pad of the epitaxy part and same polarity is led to
Cross the electrical connection of metal wire bonding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910242564.9A CN110033711A (en) | 2019-03-28 | 2019-03-28 | A kind of transparency LED display screen |
| PCT/CN2019/082824 WO2020191826A1 (en) | 2019-03-28 | 2019-04-16 | Transparent led display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910242564.9A CN110033711A (en) | 2019-03-28 | 2019-03-28 | A kind of transparency LED display screen |
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| Publication Number | Publication Date |
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| CN110033711A true CN110033711A (en) | 2019-07-19 |
Family
ID=67236807
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910242564.9A Pending CN110033711A (en) | 2019-03-28 | 2019-03-28 | A kind of transparency LED display screen |
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| CN (1) | CN110033711A (en) |
| WO (1) | WO2020191826A1 (en) |
Cited By (5)
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| CN112713230A (en) * | 2020-12-29 | 2021-04-27 | 安徽黑洞科技有限公司 | Manufacturing method of LED transparent screen |
| WO2022109875A1 (en) * | 2020-11-25 | 2022-06-02 | 京东方科技集团股份有限公司 | Light-emitting substrate and manufacturing method therefor, and array substrate |
| WO2022218060A1 (en) * | 2021-04-13 | 2022-10-20 | 珠海华萃科技有限公司 | Flexible transparent led display screen |
| WO2023020476A1 (en) * | 2021-08-19 | 2023-02-23 | 深圳市晶泓科技有限公司 | Transparent led display screen |
| WO2023020562A1 (en) * | 2021-08-19 | 2023-02-23 | 深圳市晶泓科技有限公司 | Bare lamp bead and led display screen |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN217382611U (en) * | 2022-06-01 | 2022-09-06 | 江西奥赛光电有限公司 | Direct insertion type point control lamp and lamp string structure |
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Also Published As
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| WO2020191826A1 (en) | 2020-10-01 |
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