CN110022643A - Modular construction is welded and fixed - Google Patents
Modular construction is welded and fixed Download PDFInfo
- Publication number
- CN110022643A CN110022643A CN201910280582.6A CN201910280582A CN110022643A CN 110022643 A CN110022643 A CN 110022643A CN 201910280582 A CN201910280582 A CN 201910280582A CN 110022643 A CN110022643 A CN 110022643A
- Authority
- CN
- China
- Prior art keywords
- fixed
- welded
- circuit board
- rod
- modular construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention is that modular construction is welded and fixed in one kind, has a plating hole to be fixed on a circuit board, on the circuit board, and it includes: a body of rod, an annular abutment portion, a fixed glue and a ring projection that component, which is welded and fixed, in this.The body of rod one end is to pass through the plating hole.The annular abutment portion is set on the body of rod, and to be resisted against on the circuit board, the bottom surface in the annular abutment portion has a cyclic annular notch.The fixation glue is to be filled between the annular abutment portion and the circuit board and be filled between the circuit board and the body of rod.And the ring projection is set on the body of rod, and is set to the lower section in the annular abutment portion, to stop the fixation glue to overflow downwards.
Description
Technical field
The present invention is a kind of fixation kit structure, and espespecially a kind of plating hole to be fixed on circuit board can effectively increase
Be welded with connect fixation kit pulling force modular construction is welded and fixed.
Background technique
It presses, circuit board is the supporter of electronic building brick, throughout route to connect each electronic building brick on circuit board.And in order to
It connects each circuit board or connection circuit board and other electronic building bricks, circuit board then needs to be connected by component is welded and fixed
It connects.
This kind of circuit-board connecting structure includes usually plating hole on circuit boards, and component is welded and fixed by welding column
The plating hole is crossed in break-through, and has a circular pad on component is welded and fixed.When be welded and fixed component and circuit board connects
When connecing, material (tin cream) is connect by tin, round pad, welding column and circuit board are subjected to fusion connection.
However, such circuit-board connecting structure is relatively easy after carry out system verifying to be welded and fixed what component fell off
Problem, it is abnormal that this bad result causes part to loosen etc..Through investigation analysis result be welded and fixed component adhesive force it is insufficient, and
Because the excessive generation impact of strength falls and generates this undesirable result.
Therefore how to solve the problems, such as it is above-mentioned it is commonly using with missing, as the inventor of the present invention be engaged in the industry it
Relevant manufactures want the path place person of research improvement.
Summary of the invention
Therefore the inventor of the present invention is in view of the above-mentioned deficiency, is collecting related data, via multi-party assessment and consideration, and
To engage in many years of experience of the industry accumulation, through continuous trial and modification, the beginning designs such patent of invention person.
The plating hole that purpose of the present invention is to provide one kind to be fixed on circuit board, can effectively increase and be welded and fixed
Modular construction is welded and fixed in component pulling force.
In order to reach above-mentioned or other purposes, this is created one kind and modular construction is welded and fixed, to be fixed on a circuit board
On, there is a plating hole, it includes: a body of rod that component, which is welded and fixed, in this, and one end is to pass through the plating hole on the circuit board；
One annular abutment portion, is set on the body of rod, and to be resisted against on the circuit board, the bottom surface in the annular abutment portion has a ring-type
Notch；One fixed glue, to be filled between the annular abutment portion and the circuit board and be filled in the circuit board and the body of rod
Between；And a ring projection, it is set on the body of rod, and be set to the lower section in the annular abutment portion, to stop this
Fixed glue overflows downwards.
In a preferred embodiment, wherein the body of rod is cylindrical body.
In a preferred embodiment, wherein the annular abutment portion is annular shape.
In a preferred embodiment, wherein the ring-type notch is inclined-plane aspect.
In a preferred embodiment, wherein the fixation glue is tin cream.
In a preferred embodiment, it is in the plating hole that wherein the ring projection, which is set to the position on the body of rod,.
Detailed description of the invention
Fig. 1 is the perspective view one that modular construction preferred embodiment is welded and fixed according to the present invention；
Fig. 2 is the perspective view two that modular construction preferred embodiment is welded and fixed according to the present invention；
Fig. 3 is the cross-sectional view that modular construction preferred embodiment is welded and fixed according to the present invention；
Fig. 4 a is the implementation diagram one that modular construction preferred embodiment is welded and fixed according to the present invention；
Fig. 4 b is the implementation diagram two that modular construction preferred embodiment is welded and fixed according to the present invention；
Fig. 4 c is the implementation diagram three that modular construction preferred embodiment is welded and fixed according to the present invention；And
Fig. 4 d is the implementation diagram four that modular construction preferred embodiment is welded and fixed according to the present invention.
Appended drawing reference:
1 circuit board
11 plating holes
2 are welded and fixed component
21 bodies of rod
22 annular abutment portions
221 cyclic annular notches
23 fixed glue
24 ring projections
Specific embodiment
To reach above-mentioned purpose and effect, the technical means and structures that the present invention uses, the just present invention that hereby draws are preferable
Its feature and function of embodiment elaborate are as follows, understand completely in order to sharp.
It please refers to shown in Fig. 1~3, is the perspective view one, two that modular construction preferred embodiment is welded and fixed according to the present invention
And cross-sectional view.It can be clearly seen from the figure that modular construction is welded and fixed in one kind of the present invention, to be fixed on a circuit board 1,
So-called circuit board 1 can be printed circuit board 1 (Printed circuit board), for supporting electronic building brick, the circuit board
There is a plating hole 11 on 1.This be welded and fixed component 2 include: a body of rod 21, the fixed glue 23 in an annular abutment portion 22, one with
An and ring projection 24.
21 one end of the body of rod is to pass through the plating hole 11.In this present embodiment, which is cylindrical body, if it
His shape should also be feasible scheme.
The annular abutment portion 22 is set on the body of rod 21, to be resisted against on the circuit board 1, corresponding to being somebody's turn to do for cylindrical body
The body of rod 21, the annular abutment portion 22 can be annular shape, should also be feasible scheme if other shapes.The annular abutment portion 22 it
Bottom surface has a cyclic annular notch 221.And so-called cyclic annular notch 221, it is in this present embodiment inclined-plane aspect.
The fixation glue 23 is to be filled between the annular abutment portion 22 and the circuit board 1 and be filled in the circuit board 1
Between the body of rod 21.In this present embodiment, which is tin cream, and via high temperature contact, the fixation glue 23 is variable to be turned to
Molten condition.
The ring projection 24 is set on the body of rod 21, and is set to the lower section in the annular abutment portion 22, to hinder
The fixation glue 23 is kept off to overflow downwards.
It is designed by above-mentioned structure, composition, hereby being described as follows using actuation situation with regard to the present invention: please refer to figure
It is the implementation diagram one that modular construction preferred embodiment is welded and fixed according to the present invention shown in 4a.Firstly, when being intended to carry out this hair
When the bright connection that component 2 and circuit board 1 is welded and fixed, the fixed glue 23 of 11 edge filling of plating hole first on the circuit card 1.Please
It is the implementation diagram two that modular construction preferred embodiment is welded and fixed according to the present invention simultaneously refering to shown in Fig. 4 b.Then, will
One end of the body of rod 21 passes through the plating hole 11.Please refer to shown in Fig. 4 c, for component knot is welded and fixed according to the present invention
The implementation diagram three of structure preferred embodiment.When one of the body of rod 21 support it is continuous penetrate the plating hole 11 when, the annular abutment
The bottom surface in portion 22 can touch fixed glue 23, meanwhile, fixed glue 23 is also because be squeezed, so that fixing glue 23 towards circuit board
It is overflowed downwards between 1 and the body of rod 21.Please refer to shown in Fig. 4 d, preferably implement for modular construction is welded and fixed according to the present invention
The implementation diagram four of example.Due to the ring projection 24 be set to the position on the body of rod 21 be the plating hole 11 in, when
When fixed glue 23 overflows downwards, the blocking of the ring projection 24 will receive, and fixed glue 23 may make not continue to underflow
Out.
It should be strongly noted that the bottom surface in the present invention annular abutment portion 22 has cyclic annular notch 221, and the ring-type
Notch 221 is inclined-plane aspect.When the fixation glue 23 of molten condition, which is under pressure, to be overflowed around, the design of this inclined-plane aspect can
To force the fixation glue 23 of molten condition to be diffused towards center position.And due in the annular abutment portion 22 of the body of rod 21
Lower section there is ring projection 24, the position of the ring projection 24 is not less than 1 bottom of circuit board, can effectively increase
The uniformity of the fixation glue 23 and keep the fixation glue 23 will not downwards slime flux go out.It is verified by practical operation, present invention welding
Fixation kit structure can increase connection pulling force really, and have feasibility and practicability.
Therefore please refer to shown in whole attached drawings, there are following advantages really in use, comparing with located by prior art in the present invention: this
Invention is welded and fixed modular construction and can be used for being fixed on the plating hole 11 of circuit board 1, can effectively increase and component 2 is welded and fixed
Modular construction is welded and fixed in pulling force.
By above-mentioned detailed description, the progress that implementation is all had in the purpose and efficacy of the present invention can be sufficiently shown
Property, the usability value of great industry, and be new invention not seen before on the market at present, invention patent requirement is complied fully with,
It files an application in accordance with the law whence.Only the foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention
And protection scope should can appreciate that all with description of the invention and diagramatic content to those skilled in the art
Made equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (6)
1. modular construction is welded and fixed in one kind, to be fixed on a circuit board, it is characterised in that: have an electricity on the circuit board
Hole is plated, this is welded and fixed component and includes:
One body of rod, one end is to pass through the plating hole；
One annular abutment portion, is set on the body of rod, and to be resisted against on the circuit board, the bottom surface in the annular abutment portion has one
Cyclic annular notch；
One fixed glue, to be filled between the annular abutment portion and the circuit board and be filled in the circuit board and the body of rod it
Between；And
One ring projection is set on the body of rod, and is set to the lower section in the annular abutment portion, to stop the fixation glue
It overflows downwards.
2. modular construction is welded and fixed as described in claim the 1st, wherein the body of rod is cylindrical body.
3. modular construction is welded and fixed as described in claim the 1st, wherein the annular abutment portion is annular shape.
4. modular construction is welded and fixed as described in claim the 1st, wherein the ring-type notch is inclined-plane aspect.
5. modular construction is welded and fixed as described in claim the 1st, wherein the fixation glue is tin cream.
6. modular construction is welded and fixed as described in claim the 1st, wherein the ring projection is set to the body of rod
Upper position is in the plating hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910280582.6A CN110022643A (en) | 2019-04-09 | 2019-04-09 | Modular construction is welded and fixed |
| TW108114456A TWI698162B (en) | 2019-04-09 | 2019-04-25 | Welding fixing assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910280582.6A CN110022643A (en) | 2019-04-09 | 2019-04-09 | Modular construction is welded and fixed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110022643A true CN110022643A (en) | 2019-07-16 |
Family
ID=67190890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910280582.6A Pending CN110022643A (en) | 2019-04-09 | 2019-04-09 | Modular construction is welded and fixed |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110022643A (en) |
| TW (1) | TWI698162B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3980367A (en) * | 1975-03-19 | 1976-09-14 | Sealectro Corporation | Electrical connector for joining conductors attached to printed circuit boards |
| GB2019093A (en) * | 1978-03-23 | 1979-10-24 | Stettner & Co | Improvements in or relating to electrical assemblies or components having connecting wires for insertion into bores of circuit boards |
| US4526429A (en) * | 1983-07-26 | 1985-07-02 | Augat Inc. | Compliant pin for solderless termination to a printed wiring board |
| JPS63285961A (en) * | 1987-05-18 | 1988-11-22 | Ibiden Co Ltd | Semiconductor mounting substrate |
| US5024623A (en) * | 1989-08-11 | 1991-06-18 | Sanders Associates, Inc. | Electrical circuit board mounting method |
| JPH03190064A (en) * | 1989-12-19 | 1991-08-20 | Matsushita Electric Works Ltd | Terminal pin for semiconductor chip carrier |
| CN203879002U (en) * | 2014-04-25 | 2014-10-15 | 中国建筑第八工程局有限公司 | Plywood hole blocking cap |
| JP2015122406A (en) * | 2013-12-24 | 2015-07-02 | アスモ株式会社 | Circuit device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5085602A (en) * | 1987-02-18 | 1992-02-04 | Sanders Associates, Inc. | Electrical circuit board mounting apparatus and method |
| US9253910B2 (en) * | 2013-01-30 | 2016-02-02 | Texas Instruments Incorporated | Circuit assembly |
-
2019
- 2019-04-09 CN CN201910280582.6A patent/CN110022643A/en active Pending
- 2019-04-25 TW TW108114456A patent/TWI698162B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3980367A (en) * | 1975-03-19 | 1976-09-14 | Sealectro Corporation | Electrical connector for joining conductors attached to printed circuit boards |
| GB2019093A (en) * | 1978-03-23 | 1979-10-24 | Stettner & Co | Improvements in or relating to electrical assemblies or components having connecting wires for insertion into bores of circuit boards |
| US4526429A (en) * | 1983-07-26 | 1985-07-02 | Augat Inc. | Compliant pin for solderless termination to a printed wiring board |
| JPS63285961A (en) * | 1987-05-18 | 1988-11-22 | Ibiden Co Ltd | Semiconductor mounting substrate |
| US5024623A (en) * | 1989-08-11 | 1991-06-18 | Sanders Associates, Inc. | Electrical circuit board mounting method |
| JPH03190064A (en) * | 1989-12-19 | 1991-08-20 | Matsushita Electric Works Ltd | Terminal pin for semiconductor chip carrier |
| JP2015122406A (en) * | 2013-12-24 | 2015-07-02 | アスモ株式会社 | Circuit device |
| CN203879002U (en) * | 2014-04-25 | 2014-10-15 | 中国建筑第八工程局有限公司 | Plywood hole blocking cap |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202038690A (en) | 2020-10-16 |
| TWI698162B (en) | 2020-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190716 |
|
| RJ01 | Rejection of invention patent application after publication |